CN1416264A

CN1416264A - Camera Shooting device

Info

Publication number: CN1416264A
Application number: CN02146969A
Authority: CN
Inventors: 小林一也
Original assignee: Olympus Optical Co Ltd
Current assignee: Olympus Corp
Priority date: 2001-10-29
Filing date: 2002-10-29
Publication date: 2003-05-07
Anticipated expiration: 2022-10-29
Also published as: CN1217534C

Abstract

An LCD having a backlight is inserted in a shield for protecting various types of electronic components used in an electronic camera by shielding static electricity applied to the LCD, and the LCD is held by the shield. In this structure, thermal conductive rubber is interposed between a substrate on which an image capturing element is arranged, and the shield, so that the image capturing unit composed of the image capturing element and the substrate, and the shield are thermally bonded.

Description

Camera head

Technical field

The present invention relates to the technology used in the electron camera camera heads such as (カメラ), particularly relate to the technology of the picture quality that improves photographed images.

Background technology

In recent years, as the imaging apparatus that shot object image is transformed into the signal of telecommunication, used the camera head of CCD solid-state imagers such as (charge coupled devices) just extensively to popularize.

Because solid-state imager generally constitutes with semiconductor, produce because the noise of heat at element internal.(be also referred to as " dark noise dark noise " etc.) is along with the rising of component temperature increases monotonously because this thermal noise, the temperature of imaging apparatus is made a video recording in the lowland as far as possible, the generation of thermal noise is tailed off, and it is good that the image quality of the photographed images of acquisition becomes.Therefore, for the camera head that for example is used to take the celestial body photo, in order to obtain images with high image quality, what have has a device that is used to cool off imaging apparatus.

Like this, making solid-state imager is desirable on the image quality this point of action in photographed images under the alap temperature, and but then, solid-state imager is the kinetic energy element, be accompanied by heating during action, and the very big of element heating that is installed in the solid-state imager periphery influences.Therefore, most of camera heads have radiators such as making metallic plate and are connected with imaging apparatus, the structure that the heat that heat that element self is produced or the element that is installed in periphery produce leaves.

Therefore but recent widely used digital camera is emphasized shape miniaturization, slimming, lightweight more, produces the problem in the space of the heating panel that can not guarantee to be provided with specially imaging apparatus in framework inside.

Summary of the invention

In view of the above problems, the objective of the invention is not to be provided with special-purpose radiator, be suitable for the heat radiation of solid-state imager of miniaturization, the slimming of device.

In order to achieve the above object, constitute as one camera head in the form of the present invention: comprise the image pickup part that shot object image is transformed into the solid-state imager of the signal of telecommunication is installed, and keep image displaying part---show image as record object or playback object, with the display box body of this image pickup part thermal coupling.

And so-called thermal coupling is meant that thermal conduction characteristic is well with both combinations.

According to said structure, the heat that solid-state imager produces or be transferred to the display box body to the heat that solid-state imager brings the element of thermal impact to produce and distribute, solid-state imager is cooled.Therefore, the radiator of solid-state imager special use is not set, can obtains the photographed images of good image quality yet.

In addition, in the camera head relevant, can make it constitute the rear side that also comprises at this image displaying part, the display lighting portion that is arranged between this image displaying part and this display box body, carries out the illumination of this image displaying part with the invention described above.

If adopt this structure, not during using from illuminated member as image displaying part, even under the surrounding environment of dark, also can see the image that is presented in the above-mentioned image displaying part clearly.

And in the camera head relevant with the invention described above, this display box body can constitute the static that shielding applies this display part.

If adopt this structure, improved ability to bear to the static that imposes on image displaying part, be difficult for producing misoperation or the fault that causes because of static.

And the camera head relevant with the invention described above can constitute, and this display box body improves the physical strength of this display part by keeping this display part.

This structure if adopt this structure, has improved the ability to bear of image displaying part to physical impact by the physical strength of display box body reinforcement display part.

And the camera head relevant with the invention described above can constitute, and this image pickup part comprises the substrate that this solid-state imager is installed, and the display box body is relative disposes with this for this substrate.

If adopt this structure, because substrate is relative with the display box body, obtain big thermal coupling area easily, can make the heat of image pickup part convey to the display box body more well.

And the camera head relevant with the invention described above can constitute, and this display box body is by having the lead thermal conductivity member of this display box body of the heat that this image pickup part is produced between this image pickup part and this display box body, and with this image pickup part thermal coupling.

In this structure, this display box body can constitute by and this image pickup part between sandwich thermal conductivity member and this image pickup part thermal coupling.

And so-called thermal conductivity member is meant the member that thermal conduction characteristic is good, and for example metal is arranged, and is purpose member of containing silicon etc. to obtain good thermal conduction characteristic perhaps.

If adopt this structure, the heat that solid-state imager produces can convey to the display box body well.

And, if this moment, this thermal conductivity member had elasticity, can make the physical location of image pickup part and display box body concern the degree of freedom that has to a certain degree, even make it become the structure that for example to adjust the position of image pickup part owing to the reason of optics, owing to adopted such structure, the heat that solid-state imager produces also can convey to the display box body well.And, as rubber-like thermal conductivity member, for example metal spring is arranged, be purpose thermal conductivity rubber of containing silicon etc. perhaps to obtain good thermal conduction characteristic.

And, can make this moment it become this display box body, this solid-state imager and this thermal conductivity member and be configured in structure on the same axis.

If adopt this structure, because therefore the solid-state imager of heating or shorten to solid-state imager element that brings thermal impact and the physical distance of distributing the display box body of this heat has improved radiating efficiency.

And can constitute this moment, and this image pickup part comprises the substrate that this solid-state imager is installed, and this display box body is by having this thermal conductivity member and this image pickup part thermal coupling between this substrate and this display box body.

If adopt this structure, be equipped with between the substrate and display box body of solid-state imager because the thermal conductivity member is configured in, the degree of freedom of the position relation of solid-state imager that is installed on the substrate and the display part that is shown the frame maintenance is improved.

And can constitute this moment, and this display part and this substrate that remain on this display box body dispose side by side, and the installed surface of this solid-state imager of this thermal conductivity member and this substrate or the back side of installed surface are bonding.

If adopt this structure because the substrate that solid-state imager is installed disposes side by side with being shown the display part that frame keeps, therefore with substrate is compared with display box body overlay configuration, make the slimming of camera head become possibility.

And, the camera head relevant with the invention described above can constitute, this display box body not only distributes the heat of this solid-state imager generation that is installed in this image pickup part, perhaps bring the heat of the element generation of thermal impact, and distribute the heat of the semiconductor element generation that is installed in this image pickup part to solid-state imager.

If adopt this structure, can prevent to be installed in the misoperation that heat that the semiconductor element on the image pickup part produces causes.

And, as one camera head in other forms of the present invention, can comprise by it is become: the image pickup part that shot object image is transformed into the solid-state imager of the signal of telecommunication is installed, the static that shielding applies the image displaying part that shows as the image of record object or playback object, achieves the above object with the structure of the electrostatic screen portion of this image pickup part thermal coupling.

If the employing said structure because the heat that solid-state imager produces has been passed to the electrostatic screen portion that is used to improve for the ability to bear of the static that is applied to image displaying part, is distributed at there, therefore do not want the radiator of solid-state imager special use.

And the camera head relevant with the invention described above can constitute, and sandwiches thermal conductivity member and this image pickup part thermal coupling between this electrostatic screen portion utilization and this image pickup part.

If adopt this structure, the heat that solid-state imager produces can convey to electrostatic screen portion well.

Description of drawings

Fig. 1 is a pie graph of implementing electron camera of the present invention

Fig. 2 A, 2B and 2C are the structure diagrams of implementing electron camera of the present invention

Fig. 3 is the schematic diagram that makes the first method of image pickup part and shielding thermal coupling

Fig. 4 A and 4B are the schematic diagrames that makes the second method of image pickup part and shielding thermal coupling

Fig. 5 A and 5B are the schematic diagrames that makes the third method of image pickup part and shielding thermal coupling

Fig. 6 A and 6B are the schematic diagrames that makes the 4th kind of method of image pickup part and shielding thermal coupling

Fig. 7 A and 7B are the schematic diagrames that makes the 5th and the 6th kind of method of image pickup part and shielding thermal coupling

Fig. 8 is the schematic diagram of variation that makes image pickup part and the 6th kind of method of shielding thermal coupling

Embodiment

Below in conjunction with description of drawings example of the present invention.

Fig. 1 is the circuit diagram of the electron camera of enforcement camera head of the present invention.

Electron camera shown in Figure 1 (hereinafter referred to as " this device ") comprising: the lens 1 that make shot object image imaging on the sensitive surface of imaging apparatus 2; Inject the aperture 12 of the amount of the light in this device through lens 1 according to necessity restriction; Be used for mobile lens 1 or adjust the lens stop drive motors 8 of aperture 12 in order to obtain suitable exposure for focusing; The motor-drive circuit 9 of control lens stop drive motors 8; To be transformed into the imaging apparatus 2 of the signal of telecommunication by the shot object image of lens 1 imaging; To amplify from the signal of telecommunication of imaging apparatus 2 outputs to take a sample and keep the shooting treatment circuit 3 of processing such as analog/digital conversion briliancy/chromaticity transformation; Produce picture signal and handle the SG circuit (pulse-generating circuit) 4 of necessary reference signal (various pulse signals such as level and vertical synchronizing signal); The video recording/reproducing system that does not illustrate in figure carries the image record efferent 5 of the picture signal that shows shot object image; In order to estimate shot object image in the focus level of the position of imaging apparatus 2 and band pass filter (BPF) circuit of extracting out in the luminance signal of radio-frequency component from picture signal 6; Arithmetic processing circuit 7 by formations such as CPU (central processing unit) ROM (read-only memory) RAM (random asccess memory); The display part 13 that shows various information such as the corresponding photography conditions of indication that sends with arithmetic processing circuit 7 or photographs; Obtain the release SW (switch) 10 of cameraman with the indication of the recording image signal of push expression; And obtain the cameraman by the indication of the change setting photography conditions of operation expression and the operating portion 11 of changed content thereof.

Below, the action of this device that brief description is shown in Figure 1.

At first, object light is injected this device through lens 1, on as the sensitive surface of the imaging apparatus 2 of charge coupled device as the shot object image imaging.The signal of telecommunication of shot object image as the output of expression imaging apparatus 2 is a picture signal, in shooting treatment circuit 3, be subjected to processing such as amplifying sampling maintenance analog/digital conversion briliancy/chromaticity transformation, be fed to image record efferent 5, band pass filter circuit 6 and arithmetic processing circuit 7 then.

The picture signal that is transported to image record efferent 5 is fed to the input part of the video recording/reproducing system that does not illustrate among the figure.

And, in band pass filter circuit 6, be drawn out of as the radio-frequency component of a part in the frequency in the luminance signal (Y) in the picture signal of input.The size of the amount of this radio-frequency component can be regarded as with the height of the picture contrast of representing with its picture signal corresponding.And, in band pass filter circuit 6, this radio-frequency component is carried out integral processing, the value of this integral processing is fed to arithmetic processing circuit 7.

Can think that generally the image focusing that contrast is high more is accurate more.Like this, arithmetic processing circuit 7 control motor-drive circuits 9, drive lens stop drive motors 8 and lens 1 are seen from imaging apparatus 2 move forward and backward, the set positions of lens 1 is a focal position when will be from the above-mentioned integrated value that band pass filter circuit 6 obtains maximum.Above action is automatic focus AF mode a kind of who is commonly referred to as " climbing formula " etc.

Arithmetic processing circuit 7 also carries out integral processing to briliancy (Y) signal the picture signal of obtaining from shooting treatment circuit 3 when carrying out above-mentioned automatic focus processing, promptly carry out photometry and handle.Then, according to its photometry result, carry out the electric charge accumulating time of imaging apparatus 2, i.e. the setting of the shutter speed of so-called shutter elements control, and the setting control of controlling the aperture 12 of motor-drive circuit 9, driving lens stop drive motors 8, promptly carry out the AE processing of (exposing automatically).

And arithmetic processing circuit 7 also carries out the processing of WB (white balance) according to the aberration in its picture signal (C) signal.

Here, arithmetic processing circuit 7 at first set frame synchronization (VD) signal that utilizes from the picture signal that SG circuit 4 obtains and row synchronously (HD) signal obtain information from which zone of image frame as the basis of automatic focus, automatic exposure, the various control and treatment of white balance, carry out various control and treatment then.This setting also can constitute can be by user's change of this device.

And arithmetic processing circuit 7 also carries out with the user of this device the various variations of parameter of the setting of the corresponding photography conditions of operation of operating portion 11 being handled.

Below in conjunction with Fig. 2 A, 2B and 2C explanation.These figure schematic representation implement the structure of electron camera of the present invention.And Fig. 2 A is the front view of this electron camera, and Fig. 2 B is the rearview of this electron camera, this electron camera in-built perspective view of Fig. 2 C for seeing above this electron camera.

In addition, in Fig. 2 A, 2B and 2C, with the identical numbering of member use identical in the device shown in Figure 1.

Shown in Fig. 2 A, the central portion of keeping right a little in the framework front of electron camera 100 is provided with picture frame 21, and picture frame 21 is keeping lens 1.And, being provided with the lens baffle plate 22 of protecting lens 1 when being used for not photographing in the front of framework, this lens baffle plate 22 can move left and right.Fig. 2 A is lens baffle plate 22 open modes, and promptly lens baffle plate 22 is by the state when the photography that moves on to the left side is seen in the framework front.This lens baffle plate 22 is seen that from the framework front lens baffle plate 22 is in closed condition when moving to right, and protection lens 1 are avoided outside impact.

In addition, from the framework front, left end is provided with release-push 10 on the framework of electron camera 100, and the top in framework front is provided with the flash of light window 23 of the scintillation of night photography use.

Shown in Fig. 2 B, be provided with the LCD 24 of function at the framework back side of electron camera 100 with display part 13.

And shown in Fig. 2 C, the right-hand member in the framework inside of electron camera 100 is provided with the battery container portion 25 of accommodating as the battery of the power supply of electron camera 100, accommodates the storage card resettlement section 26 of record from the storage card of the picture signal of image record efferent 5 outputs.And the left end in the framework inside of electron camera 100 has disposed and has been used for obtaining flash of light that night photography uses and moves the big capacity main capacitor 27 that necessary high-tension booster circuit uses.

Be positioned at the lens 1 that kept by picture frame 21 position for the sensitive surface that makes imaging apparatus 2, disposed the image pickup part 28 that imaging apparatus 2 is installed the shot object image imaging.And, have the shielding 29 that is used to shield static that LCD 24 is applied, various electronic components that protection electron camera 100 uses round the back side of LCD 24.And for the function of the radiator of the heat that shielding 29 had be used to distribute image pickup part 28 to produce, cooling imaging apparatus 2, it is constituted: make image pickup part 28 and shielding 29 thermal couplings, the heat that image pickup part 28 produces conveys to shielding 29 well.

The following describes and make this image pickup part 28 and the several method that shields 29 thermal couplings (combination).And, in the following description, with the identical numbering of member use identical in Fig. 1 and Fig. 2 A, 2B or the 2C shown device.

Fig. 3 has represented to make the first method of image pickup part 28 and shielding 29 thermal couplings, and the state of seeing from the bottom surface side of electron camera 100 under the situation that has electron camera 100 has promptly at length been represented image pickup part 28 among Fig. 2 C and shielded the structure that amplify 29 part.

Here, the display element of LCD 24 for having light transmission, as shown in the drawing, the inside of display frame is the back light 30 that rear side is provided with the picture demonstration of illumination LCD 24 on LCD 24.And, make the LCD 24 that has this back light 30 become the structure of the inboard of the shielding 29 that embeds concave shape, shielding 29 not only keeps LCD 24, and has strengthened LCD 24 for the physical strength that impacts.And, as this shielding material of 29 thermal conductivity good metal preferably.For example aluminium is because good, the in light weight and handling ease of thermal conductivity, and low price, and is very good as the material of shielding 29, but the height of paying attention to thermal conductivity also can be with for example copper.

On the other hand, in the figure, image pickup part 28 is made of imaging apparatus 2 and the substrate 31 that this imaging apparatus 2 is installed.And, between substrate 31 that disposes relatively and shielding 29, having sandwiched thermal conductivity rubber 32, image pickup part 28 is by this thermal conductivity rubber 32 and shielding 29 thermal couplings.As the high material of these thermal conductivity rubber 32 usefulness thermal conductivity silicon rubber for example.And in the example shown in this figure, though,, wish to have elasticity in order to absorb the configuration error of shielding 29 and image pickup part 28 in the electron camera 100 as the characteristic of thermal conductivity rubber 32 elasticity of demand not necessarily.And, have insulation processing such as insulating coating if implement coating on the surface of substrate 31, also not necessarily need electric insulating quality as the characteristic of thermal conductivity rubber 32.

In addition, the through hole of a plurality of copper wirings can be set on substrate 31 also, improve on the substrate 31 from the installed surface of imaging apparatus 2 thermal conductivity to its inside.

Be illustrated below in conjunction with Fig. 4 A and 4B.These figure have represented to make image pickup part 28 and the second method that shields 29 thermal couplings.And, Fig. 4 A represented under the situation that has electron camera 100 image pickup part of seeing from the face side of electron camera 100 28 and shielded the state of 29 configuration structure, and Fig. 4 B has represented their state of configuration structure seen from the bottom surface side of electron camera 100 under similar circumstances.

In Fig. 4 A and Fig. 4 B, with the difference of first method shown in Figure 3 be: image pickup part 28 is made of imaging apparatus 2, flexible base, board 36 and posting 33, sandwiched thermal conductivity rubber 32 between this image pickup part 28 and shielding 29, image pickup part 28 is by this thermal conductivity rubber 32 and shielding 29 thermal couplings.

Here, flexible base, board 36 electrically is connected with the various input/output terminals that imaging apparatus 2 has, by flexible base, board 36 to imaging apparatus 2 supply capabilities and and the circuit that has of electron camera 100 between carry out various electrical communication.

The bonding imaging apparatus 2 that is equipped with on the posting 33.Posting 33 is connected with picture frame 21 with screws 34 are fixing by its four jiaos, and the sensitive surface that degree of the tightening difference by making screw 34 can inching imaging apparatus 2 is with respect to the position or the direction of picture frame 21.By this adjustment, can make the shot object image imaging on the sensitive surface of imaging apparatus 2 more exactly of lens 1 imaging that remains on the picture frame 21.

Shown in Fig. 4 B, image pickup part 28 and shielding 29 thermal couplings that this second method will constitute like this by thermal conductivity rubber 32.The thermal conductivity rubber 32 that this image pickup part 28 and shielding sandwich between 29 is routine the same with Fig. 3 also, and the high material of usefulness thermal conductivity is silicon rubber for example.And in the example of representing with Fig. 4 A and 4B, image pickup part 28 remains on the picture frame 21, and the member that shielding 29 remains on other is for example on the framework of electron camera 100.Therefore, owing to can prevent to bring bad influence to the location adjustment of above-mentioned imaging apparatus 2, so the elasticity that thermal conductivity rubber 32 is had is preferable characteristic.

Be illustrated below in conjunction with Fig. 5 A and 5B.These figure have represented to make image pickup part 28 and the third method that shields 29 thermal couplings.And, Fig. 5 A represented under the situation that has electron camera 100 image pickup part of seeing from the face side of electron camera 100 28 and shielded the state of 29 configuration structure, and Fig. 5 B has represented their state of configuration structure seen from the bottom surface side of electron camera 100 under similar circumstances.

In Fig. 5 A and Fig. 5 B, and the difference of the second method of representing with Fig. 4 A and 4B is: between image pickup part 28 and the shielding 29 is not to sandwich thermal conductivity rubber 32, carries out thermal coupling but clip the spring 35 that is formed by metal sheet.Like this, make image pickup part 28 and the thermal conductivity member that shields 29 thermal couplings, can use resilient metal spring as being used to.

Be illustrated below in conjunction with Fig. 6 A and 6B.These figure have represented to make image pickup part 28 and the 4th kind of method that shields 29 thermal couplings.And, Fig. 6 A represented under the situation that has electron camera 100 image pickup part of seeing from the face side of electron camera 100 28 and shielded the state of 29 configuration structure, and Fig. 6 B has represented their state of configuration structure seen from the bottom surface side of electron camera 100 under similar circumstances.

If will compare with the first method of representing with Fig. 3 with the 4th kind of method that Fig. 6 A and 6B represent, the substrate 31 that imaging apparatus 2 is installed and shielding be 29 relative, as the substrate 31 of image pickup part 28 and sandwich thermal conductivity rubber 32 between shielding 29 and make both thermal couplings, be identical in this.But, the 4th kind of method exists: thermal conductivity rubber 32 contacts with substrate 31 in the position at the positive back side of leaving the installation site of imaging apparatus 2 on substrate 31, imaging apparatus 2, thermal conductivity rubber 32, shielding 29 be not be configured on the same axis different on this point with first method.

Though the 4th kind of method not as above-mentioned first method, is effective in the few occasion of imaging apparatus 2 caloric values or obtaining the occasion that heat that imaging apparatus 2 produces only distributes desirable shooting characteristic on a small quantity for the radiating effect of imaging apparatus 2.And it on the other hand, needn't be configured on the same straight line with LCD 24 owing to compare imaging apparatus 2 with first method, correspondingly can keep the high-freedom degree of the framework design of electron camera 100.

And, on substrate 31, set from the mounting portion of imaging apparatus 2 to the copper wiring of the contact portion of thermal conductivity rubber 32 by through hole, also can improve on the substrate 31 from the installation portion of imaging apparatus 2 thermal conductivity to the contact portion of thermal conductivity rubber 32.And also can sandwich the position big conducting rubber 32 like that of positive back, installation site of the imaging apparatus 2 of covered substrate 31 between 29 in substrate 31 and shielding.

In Fig. 6 A and 6B, the IC element (integrated circuit) 37 that generates heat during action is installed on the substrate 31.In the structure shown in this Fig. 6 A and the 6B, with imaging apparatus 2, the heat radiation of this IC element 37 is also undertaken by shielding 29, thus, the heating that not only prevents IC element 37 brings bad influence for imaging apparatus 2, and has prevented that IC element 37 is owing to heating produces misoperation.And, this moment is shown in Fig. 6 B, if make thermal conductivity rubber 32 thermal coupling like that between imaging apparatus 2 and IC element 37 at least, then can suppress to distribute to shielding 29 to the heat conduction of imaging apparatus 2, the heat that IC element 37 is produced from IC element 37.

Be illustrated below in conjunction with Fig. 7 A, 7B and 7C.These figure have represented to make image pickup part 28 and the 5th and the 6th kind of method of shielding 29 thermal couplings.And, Fig. 7 A has represented under the situation that has electron camera 100 to implement the 5th or the image pickup part 28 seen from the face side of electron camera 100 during the 6th kind of method and shield the state of 29 configuration structure, Fig. 7 B has represented when implementing the 5th kind of method to see from the bottom surface side of electron camera 100 first example of state of their configuration structure, and Fig. 7 C has represented when implementing the 6th kind of method to see from the bottom surface side of electron camera 100 second example of state of their configuration structure.And Fig. 7 C does not describe shielding 29 and thermal conductivity rubber 32.

If the 5th shown in Fig. 7 A, 7B and the 7C and the 6th kind of method and first method shown in Figure 3 are compared, the substrate 31 that uses thermal conductivity rubber 32, imaging apparatus 2 will be installed with shield 29 thermal coupling this point on be identical.But, the 5th shown in Fig. 7 A, 7B and the 7C and the 6th kind of method as the substrate 31 (being the shooting face of imaging apparatus 2) of image pickup part 28 and the configuration side by side of shielding 29 (they being the display surface of LCD 24), both are not different with first method on configuration this point relatively.Here, the 5th kind of method shown in Fig. 7 B is bonding with the back side of the installed surface of the imaging apparatus 2 of substrate 31 with thermal conductivity rubber 32, and heat is simultaneously gone in the shielding 29 from this.On the other hand, the 6th kind of method shown in Fig. 7 C is bonding with the installed surface of the imaging apparatus 2 of substrate 31 with thermal conductivity rubber 32, and heat is gone in the shielding 29 from this installed surface.

Though the 5th and the 6th kind of method for the radiating effect of imaging apparatus 2 not as above-mentioned first method, be effective in the few occasion of imaging apparatus 2 caloric values or obtaining the occasion that heat that imaging apparatus 2 produces only distributes desirable shooting characteristic on a small quantity.Its on the other hand owing to dispose side by side with the LCD 24 that conductively-closed 29 keeps as the substrate 31 of image pickup part 28, the framework of electron camera 100 can slimming.

In addition, in the 6th kind of method, not to make the flat shape of thermal conductivity rubber 32 be the simple rectangular shape shown in Fig. 7 B, but become the shape of band concave portions, as shown in Figure 8, imaging apparatus 2 can be configured in the sunk part of this spill.By the flat shape that makes thermal conductivity rubber 32 is such shape, owing to enlarged the contact area of substrate 31 with thermal conductivity rubber 32, uprises from the thermal conductivity of substrate 31 to shielding 29, can improve the radiating efficiency for imaging apparatus 2.

And, the 5th and the 6th kind of method in, the same with the 4th kind of method, the heat radiation of the IC element that is installed on the substrate 31 is undertaken by shielding 29, can prevent the misoperation of IC element in advance.

In addition, the present invention is not limited to above-mentioned example, can do all change improvement.For example in above-mentioned first, second, third each method, though the rear side in LCD 24 is provided with back light 30, if but in the occasion of the illumination of not carrying out LCD 24 or do not use LCD 24 and use from illuminated display element, owing to do not need back light 30, can only LCD 24 or such display element embedding be remained in the shielding 29 yet.

And the effect of the static that shielding applies LCD 24 also can not be brought into play in shielding 29, can be only to be used to strengthen the member of LCD 24 for the physical strength that impacts.

And, though above-mentioned example has illustrated the embodiment of the present invention in electron camera, but the mobile phone or the personal digital assistant (portable personal information communication apparatus) that also can for example have camera function at other equipment are promptly implemented the present invention in the so-called notebook-PC etc.

As above-mentioned detailed description, the present invention is transformed into the image pickup part of the solid-state imager of the signal of telecommunication, the electrostatic screen portion that keep to show the static that display box body as the image displaying part of the image of record object or playback object, shielding apply above-mentioned image displaying part or the member thermal coupling that improves the physical strength of display part by being equipped with shot object image, and the heat that solid-state imager is produced can be communicated to display box body or electrostatic screen portion well.Its result, even because special-purpose radiator is not set, solid-state imager also can dispel the heat, and therefore can play the effect of keeping the photographed images high image quality.

Claims

1. camera head, comprising: image pickup part is equipped with the solid-state imager that shot object image is transformed into the signal of telecommunication; And the display box body, keep to show image displaying part as the image of record object or playback object, and with above-mentioned image pickup part thermal coupling.

2. camera head according to claim 1 also comprises the rear side at above-mentioned image displaying part, the display lighting portion that is arranged between this image displaying part and the above-mentioned display box body, carries out the illumination of this image displaying part.

3. camera head according to claim 1, the static that above-mentioned display box body shielding applies above-mentioned display part.

4. camera head according to claim 1, the structure of above-mentioned display box body are by keeping above-mentioned display part that the physical strength of this display part is improved.

5. camera head according to claim 1, above-mentioned image pickup part comprises the substrate that above-mentioned solid-state imager is installed, and aforesaid substrate and relative configuration of above-mentioned display box body.

6. camera head according to claim 1, above-mentioned display box body comes and this image pickup part thermal coupling by have the lead thermal conductivity member of this display box body of the heat that above-mentioned image pickup part is produced between this image pickup part and this display box body.

7. camera head according to claim 6, above-mentioned display box body by and above-mentioned image pickup part between the above-mentioned thermal conductivity member of clamping and with this image pickup part thermal coupling.

8. camera head according to claim 6, above-mentioned thermal conductivity member has elasticity.

9. camera head according to claim 7, above-mentioned thermal conductivity member has elasticity.

10. camera head according to claim 6, above-mentioned display box body, above-mentioned solid-state imager and above-mentioned thermal conductivity member are configured on the same axle.

11. camera head according to claim 6, above-mentioned image pickup part comprises the substrate that above-mentioned solid-state imager is installed, and, above-mentioned display box body by between aforesaid substrate and this display box body, having above-mentioned thermal conductivity member with this image pickup part thermal coupling.

12. camera head according to claim 11, the above-mentioned display part and the aforesaid substrate that remain on above-mentioned display box body dispose side by side, and the back side of the installed surface of the above-mentioned solid-state imager of above-mentioned thermal conductivity member and aforesaid substrate is bonding.

13. camera head according to claim 11, the above-mentioned display part and the aforesaid substrate that remain on above-mentioned display box body dispose side by side, and the installed surface of the above-mentioned solid-state imager of above-mentioned thermal conductivity member and aforesaid substrate is bonding.

14. camera head according to claim 1, above-mentioned display box body distribute the heat of the above-mentioned solid-state imager generation that is installed in above-mentioned image pickup part, and distribute the heat of the semiconductor element generation that is installed in above-mentioned image pickup part.

15. a camera head comprises: the image pickup part that shot object image is transformed into the solid-state imager of the signal of telecommunication is installed; And shielding static that the image displaying part that shows as the image of record object or playback object is applied and with the electrostatic screen portion of above-mentioned image pickup part thermal coupling.

16. camera head according to claim 15 sandwiches thermal conductivity member and this image pickup part thermal coupling between above-mentioned electrostatic screen portion's utilization and the above-mentioned image pickup part.