JP2000032307A - Electronic camera - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain heat generated in side an electronic camera from being enclosed within a easing. SOLUTION: A solid-state imaging device 5 is fixed through a bracket 6 of high heat conductivity onto a easing 1. The inside of the easing 1 is divided into small spaces 1c and 1d by a partition wall 1a. A heat pipe 7 is arranged through a hole 1b into the easing 1. A heat absorbing part 7a of the heat pipe 7 is fixed on the bracket 6 and a radiating part 7b is fixed on the inner wall of a grip part 1e. A battery 8 is press-contacted to the radiating part 7b and heat radiated from the radiating part 7b is transferred to the battery 8.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic camera, and more particularly, to an electronic camera capable of radiating heat generated from a heat source inside the electronic camera into and out of the electronic camera.

[0002]

2. Description of the Related Art The size of pixels constituting a solid-state imaging device used in an electronic camera tends to be reduced. When the pixel size is reduced, the sensitivity of the solid-state imaging device is reduced because the amount of light incident on each pixel is reduced. For this reason, it is difficult to secure the S / N ratio of the signal output from the solid-state imaging device particularly when photographing under low luminance. This S /
It is known that the N ratio generally tends to decrease as the temperature of the solid-state imaging device increases.

[0003] Among the above-mentioned electronic cameras, there is known an electronic camera having an image display section capable of displaying a scene to be shot or an image obtained by completing shooting.
Further, among such electronic cameras, there has been known an electronic camera in which components such as a photographing lens, a solid-state imaging device, an electronic circuit, and a liquid crystal display substrate are integrally housed in a single housing (cover). Hereinafter, this is referred to as an integrated electronic camera in this specification.

[0004]

However, in the case where a solid-state image pickup device with a high pixel count and a small size is used for the above-mentioned integrated electronic camera, the solid-state image pickup device is heated by heat generated in the housing, and the solid-state image pickup device is heated. S / N of signal output from element
In some cases, the image quality of a recorded image is reduced due to a decrease in the ratio.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and heat generated inside an integrated electronic camera is provided in a housing in which components such as a photographic lens, a solid-state imaging device, an electronic circuit, and a liquid crystal display substrate are disposed. It is an object of the present invention to provide an electronic camera capable of suppressing a muffled body.

[0006]

FIG. 1 shows an embodiment of the present invention.
The following invention will be described in association with. (1) The invention according to claim 1 includes a plurality of small spaces 1c and 1d formed in the housing 1; and a plurality of small spaces 1c and 1d.
A heat source 5 disposed in at least one small space
And the heat generated by the heat source 5 is absorbed by the heat absorbing portion 7a,
Small space 1d different from small space 1c in which heat source 5 is arranged
The above-mentioned object is attained by having the heat radiating means 7 for radiating heat by the heat radiating portion 7b disposed in the radiating section. (2) According to the second aspect of the invention, the heat radiating means 7 is constituted by a heat pipe. (3) Explaining in connection with FIG. 4 showing one embodiment, the invention according to claim 3 is a photoelectric conversion element 5 which captures an optical image formed by a photographing lens and converts it into an electric signal; It further includes a heat shield member 16 disposed between the photoelectric conversion element 5 and the heat source 93, and the heat absorbing portion 7Aa is interposed between the heat shield member 16 and the heat source 93. (4) Explaining in connection with FIG. 3 showing one embodiment, the invention according to claim 4 includes a photoelectric conversion element 5 that captures an optical image formed by the photographing lens 2 and converts it into an electric signal. Further comprising at least electronic circuits 11, 12, and 15 for processing electric signals; and the heat source is at least one of the photoelectric conversion element 5 and the electronic circuits 11, 12, and 15. (5) Explained in association with FIGS. 3 and 4 showing an embodiment, the invention according to claim 5 includes a display unit 91 for displaying an image captured by the photoelectric conversion element 5;
Lighting means 93 for illuminating the display means 91; the heat sources include the photoelectric conversion element 5, the electronic circuits 11, 1;
2, 15 and / or the illumination means 93. The following invention will be described in association with FIG. 6 showing an embodiment. (6) The invention according to claim 6 is characterized in that the radiator 7b or 7
Bb is arranged at a position higher than the arrangement position of the heat absorbing portions 7a and 7Ba regardless of the photographing posture in the vertical position or the horizontal position. (7) According to the invention described in claim 7, the heat radiated from the heat radiating portion 7Bb causes inconvenience to the photographing result due to the photographer's finger being caught when the photographer holds the electronic camera during photographing. This is transmitted to the portion 1g in the vicinity of the portions 20, 21 on the surface of the casing 1 that occurs. (8) In the invention described in claim 8, the heat radiating portion 7b radiates heat to the battery 8.

In the section of the means for solving the above-mentioned problems, which explains the configuration of the present invention, the drawings of the embodiments of the present invention are used to make the present invention easy to understand. However, the present invention is not limited to this.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIG. 1 shows a schematic configuration of an electronic camera according to a first embodiment, and FIG. 1A shows a photographing lens of the electronic camera. 2 shows a cross section along the optical axis, and FIG.
The cross section BB of (a) is shown. Note that the upper side of FIG. 1B is the upper side of the electronic camera. The solid-state imaging device 5 is fixed to the housing 1 via a bracket 6, and a circuit board 1 on which a driving IC and the like for the solid-state imaging device 5 are mounted on the back surface of the bracket 6.
5 is fixed. The bracket 6 is made of a material having a high thermal conductivity such as aluminum. The taking lens 2 and the optical low-pass filter 3 are fixed to the lens barrel 4.

The internal space of the housing 1 is divided into a small space 1c and a small space 1d by a partition 1a. Circuit board 11,
The circuit board 12 and the display unit 9 are fixed to the housing 1 in the small space 1c. On the circuit board 11, a CPU for controlling an operation sequence of the electronic camera, a processor for processing an image signal output from an IC on the circuit board 15, and the like are mounted. An external storage unit 10 for storing image data obtained by shooting is detachably mounted on the circuit board 12. The external storage unit 10 can be replaced by a user of the electronic camera as needed. The display unit 9 is for displaying an image captured by the solid-state imaging device 5 before photographing, and an image based on image data stored in the external storage unit 10. The display unit 9 is a unit formed by combining a liquid crystal display panel (not shown) and an illumination unit (not shown) for illuminating the liquid crystal display panel from the back. Circuit board 1 described above
1, 12, and 15 are connected to each other via a connector (not shown) or a flexible printed circuit (FPC).

The heat pipe 7 penetrates a hole 1b formed in the partition wall 1a, and a heat absorbing portion 7a is formed in the small space 1c.
b is disposed so as to be located in the small space 1d. Heat absorbing part 7
a is fixed to the bracket 6 with a silicone adhesive having a high thermal conductivity, while the heat radiating portion 7b is fixed to the inner wall of the grip portion 1e. The small space 1d forms a battery chamber, and a battery 8 is loaded therein. At this time, the battery 8 is
The pressing member is pressed by a pressing member (not shown) so as to be in close contact with b.

The heat pipe 7 has a hollow pipe made of copper or the like in a state close to a vacuum and is filled with a small amount of water or a working fluid (liquid for transmitting heat) such as a substitute for chlorofluorocarbon. Have. The transfer of heat from the heat absorbing section 7a to the heat radiating section 7b by the heat pipe 7 is performed as follows. That is, the heat from the heat source is transmitted to the heat absorbing portion 7a, the temperature rises, the working fluid near the heat absorbing portion 7a evaporates, and the heat absorbing portion 7a is cooled by latent heat of vaporization during the evaporation of the working fluid, and the vaporized working fluid is cooled. The steam moves to the heat radiating section 7b, and the steam of the working fluid cooled in the heat radiating section 7b emits heat and returns to the liquid phase, travels along the inner wall of the heat pipe 7, and returns to the heat absorbing section 7a. The working fluid circulates inside the heat pipe 7 while changing the phase as described above, and releases the heat of the heat absorbing portion 7a at the heat radiating portion 7b. As is apparent from the heat radiation effect of the heat pipe 7 described above, the position of the heat absorbing portion 7a is
If the heat pipe 7 is arranged so that the position of b becomes higher, the efficiency of heat radiation is improved. In the electronic camera of the present embodiment, as shown in FIG. 1B, the position of the heat radiating portion 7b is arranged to be higher than the position of the heat absorbing portion 7a.

The heat radiating portion 7b will be further described. As described above, the heat radiating portion 7b is fixed to the inner wall of the small space 1d formed by dividing the inside of the housing 1 by the partition 1a, and comes into contact with the battery 8. Thus, the heat released from the heat radiating portion 7b is absorbed by the inner wall of the grip portion 1e and the battery 8. However, in the electronic camera according to the present embodiment, the grip 1e is formed of a material having a low thermal conductivity, or a heat insulating layer (not shown) is provided on the inner wall of the grip 1e.
Therefore, most of the heat released from the heat radiating portion 7b is absorbed by the battery 8 and the inner wall of the grip portion 1e, and the grip portion 1e
The outer surface does not get hot. Further, the heat emitted from the heat radiating portion 7b does not return to the small space 1c by the partition 1a, and the cooling efficiency of the solid-state imaging device 5 disposed in the small space 1c can be increased. At this time, a portion not involved in the heat absorption of the heat pipe 7 in the small space 1c (FIG. 1)
In (b), it is desirable to make the portion from the upper end of the heat absorbing portion 7a to the hole 1b) as short as possible, or to prevent heat radiation in the small space 1c using a heat insulating material or the like.

It is generally known that the discharge performance of a battery decreases as the temperature decreases. Therefore, when the electronic camera according to the present embodiment is used in a low-temperature environment, the battery 8 is warmed by the heat released from the heat radiating portion 7b, and a decrease in the discharge performance of the battery 8 is suppressed.

Referring to FIG. 2 showing the appearance of the electronic camera according to the first embodiment, two release buttons 13 and 14 are provided on the grip portion 1e of the housing 1. A grip 1f for vertical position photographing is provided at a lower portion of the housing 1, that is, at a bottom of the electronic camera. A second battery, a circuit board, and the like for assisting the battery 8 are arranged inside the grip portion 1f for vertical shooting.

In the case of taking a picture in the horizontal position with the electronic camera configured as described above, the photographer holds the grip portion 1e,
Press the release button 13. Focusing on the heat pipe 7 in this photographing posture, the heat radiating portion 7b is located higher than the heat absorbing portion 7a as shown in FIG. Therefore, the solid-state imaging device 5 can be efficiently cooled as described above.

When performing vertical position photographing, the photographer grips the grip portion 1f, holds the grip portion 1e upward, and presses the release button 14. Even in this shooting posture, as shown in FIG.
Are located higher than the heat absorbing portion 7a. Therefore, the solid-state imaging device 5 can be efficiently cooled regardless of the shooting posture of the horizontal position shooting and the vertical position shooting.

In the description of the first embodiment, the case where the heat source is the solid-state imaging device 5 is assumed and the solid-state imaging device 5 is cooled. However, the present invention is not limited to this. That is, if a circuit (such as an IC) mounted on the display unit 9 or the circuit board 11 or 15 is a heat source, it may be cooled. In particular,
In an electronic camera in which the number of pixels of the solid-state imaging device 5 exceeds one million pixels, an enormous amount of image data is processed at the time of photographing or the like. Therefore, a higher processing speed is required for the processing circuit. Along with this, the amount of heat generated by the processing circuit increases, and this heat is transmitted to the solid-state imaging device 5, and the S / N ratio of a signal output from the solid-state imaging device 5 may decrease. In such a case, it is effective to cool the processing circuit.

Further, the position and configuration of the partition 1a are not limited to the example shown in FIG. That is, the air in the small space 1d warmed by the heat released from the heat radiating portion 7b gathers above the small space 1d because the specific gravity is reduced. Therefore, even if the small spaces 1a and 1b are not completely divided, even if the small spaces 1a and 1b communicate with each other near the bottom of the electronic camera, the cooling effect is not significantly impaired. Also, housing 1
Alternatively, the partition wall 1a may be formed of a member different from the above, for example, the circuit board 11 or the like.

Second Embodiment A second embodiment of the present invention will be described with reference to FIG. 3 and FIG. In the electronic camera according to the first embodiment, the solid-state imaging device 5 as a heat source is connected to a heat pipe 7.
The above (see FIG. 1) described an example of cooling. In the second embodiment, as described below, the light source 93 (FIG. 4) for the display unit 9 as another heat source is cooled together with the solid-state imaging device 5 as one heat source.
In FIG. 3 showing a schematic configuration of the electronic camera according to the second embodiment and FIG. 4 showing a method of arranging heat pipes, the same components as those shown in FIG. 1 or FIG. The description thereof will be omitted, and the description will focus on the differences from the electronic camera according to the first embodiment.

FIG. 3 differs from the electronic camera according to the first embodiment in that a shielding plate 16 and a heat pipe 7A are further added to the small space 1c. That is, the heat pipe 7 radiates the heat generated from the solid-state imaging device 5 in the small space 1d, while the heat pipe 7A radiates the heat generated from the backlight light source 93 (FIG. 4) of the display unit 9 in the small space 1d. As shown in these heat pipes 7 and 7A
Is arranged. Both heat pipes 7 and 7A
It is disposed so as to penetrate a partition 1a that divides the space inside the housing 1 into small spaces 1c and 1d.

4, the display unit 9 guides the liquid crystal display panel 91, the light source 93, and the light emitted from the light source 93 to the rear surface of the liquid crystal display panel 91. And a light guide 92 for illuminating the light uniformly. Heat absorbing portion 7Aa of heat pipe 7A
Is bonded to the light source 93 with a silicone adhesive having a high thermal conductivity. The heat radiating portion 7Ab of the heat pipe 7A is fixed to the inner wall of the grip portion 1e (FIG. 3) together with the heat radiating portion 7b of the heat pipe 7, and the battery 8 is connected to the heat radiating portion 7b in the same manner as described in the first embodiment. And 7Ab. A shielding plate 16 is provided between the display unit 9 and the bracket 6 (solid-state imaging device 5). The shielding plate 16 is provided for the purpose of shielding heat and electrically shielding.

The efficiency of illumination of the light source 93 is generally about 15
%, And the remaining 85% is released as heat. When this heat is transmitted to the solid-state imaging device 5, the image quality is deteriorated as described above. On the other hand, in order to reduce the size of the electronic camera, it is necessary to reduce the distance between the light source 93 and the solid-state imaging device 5. Therefore, in the present embodiment, the heat emitted from the light source 93 is radiated by the heat pipe 7A, and the heat emitted from the solid-state imaging device 5 is radiated by the heat pipe 7 to increase the cooling capacity. Further, by disposing the shielding plate 16 and interposing the heat absorbing portion 7Aa between the light source 93 and the shielding plate 16, the heat from the light source 93 that cannot be absorbed by the heat absorbing portion 7Aa is shielded by the shielding plate 16. It is possible to increase the cooling efficiency of the solid-state imaging device 5.

A material having high thermal conductivity, for example, a copper foil is stretched on the surface of the shielding plate 16 facing the display unit 9.
The heat absorbing portion 7Aa can be brought into contact with both the light source 93 and the shielding plate 16. By doing so, it is possible to further suppress the heat emitted from the light source 93 from being transmitted to the solid-state imaging device 5.

When it is desired to reduce the thickness of the electronic camera, the heat absorbing portion 7Aa is connected to the light source 93 and the shielding plate 1.
6 without the light source 93 shown in FIG.
May be provided with a heat absorbing portion 7Aa below.
Even if the heat absorbing portion 7Aa is provided in this manner, the heat from the light source 93 that could not be absorbed by the heat absorbing portion 7Aa can be used.
To the shield plate 16 can be suppressed.

As described above, according to the electronic camera according to the second embodiment, the heat source that needs cooling, such as the light source 93, and the device that dislikes heat, such as the solid-state image sensor 5, are used. Since the shielding plate 16 is interposed, the distance between the light source 93 and the solid-state imaging device 5 can be reduced, and the electronic camera can be reduced in size. At the same time, the heat that cannot be absorbed by the heat pipe 7A is removed. The transmission to the solid-state imaging device 5 can be suppressed, and a decrease in image quality can be suppressed.

In the above-described second embodiment, an example in which the two heat pipes 7 and 7A are fixed to the two heat sources has been described. However, depending on the degree to which cooling is required, three or more heat pipes may be provided, or only one heat pipe may be provided and the heat pipe 7 may be omitted in the example shown in FIG. Is also good.

Although the case where the light source 93 is a heat source has been described above, for example, if an IC or the like mounted on the circuit board 16 (FIG. 3) is a heat source requiring cooling, the heat absorbing portion 7Aa of the heat pipe 7A is used. It may be fixed to this IC or the like.

Third Embodiment A description will be given of an electronic camera according to a third embodiment with reference to FIGS. In FIGS. 5 and 6, the same components as those in FIGS. 1 to 4 showing the electronic camera according to the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted. I do.

In FIG. 5, the heat absorbing portion 7a of the heat pipe 7 is provided at the left end of the bracket 6, and the heat pipe 7 is provided at the right end.
Each of the heat absorbing portions 7Ba of B is fixed with a silicone adhesive having a large thermal conductivity. The heat pipe 7 is guided to a small space forming a battery chamber similarly to the electronic cameras according to the first and second embodiments, and the heat radiating portion 7 b is pressed against the battery 8. On the other hand, the heat pipe 7B is guided below the light emission window 20 of an electronic flash (hereinafter, simply referred to as “flash”).

In FIG. 6, the casing 1 is formed by molding a thermoplastic plastic or the like.
An opening is formed in a portion surrounding the. A panel 1g having a high thermal conductivity such as aluminum is fixedly provided in the opening, and a light emitting window 20 and a light receiving window 21 for dimming a flash are formed in the panel 1g. The heat radiating portion 7Bb of the heat pipe 7B is fixed to the panel 1g. That is, the heat released from the heat radiating portion 7Bb is transmitted to the panel 1g and is radiated outside the electronic camera. However, since the housing 1 is made of a thermoplastic plastic or the like as described above, it is difficult for heat to diffuse to portions other than the panel 1g. Heat is radiated from such a part of the electronic camera for the following reason.

When the photographer holds and holds the miniaturized electronic camera, the finger of the left hand may hang unconsciously on the light emitting window 20 or the light receiving window. When shooting is performed using a flash in such a state, a shadow may be generated in a shot image, or overexposure may occur. Therefore, in the electronic camera according to the present embodiment, the heat pipe 7B
By transferring the heat released from the heat radiating portion 7Bb to the panel 1g, it is possible to make the photographer feel the heat when the photographer's finger touches these parts, thereby giving the photographer a pre- A warning can be issued (before shooting).

In the electronic camera according to the third embodiment, the heat radiating portions 7b and 7Bb are located above and below the electronic camera. For this reason, it is a matter of course that the photographing attitude in the horizontal position is not limited.
At least one of the heat absorbing portions 7a and 7Ba
, The cooling efficiency of the heat pipes 7 and 7B can be increased.

In the above description, when a photographer holds an electronic camera during photographing, the photographer's finger hangs on the electronic camera, which causes an inconvenience in the photographing result. Has described an example in which heat from the solid-state imaging device 5) is transmitted, but heat may be transmitted to other portions. As an example, heat may be transmitted to a part where the photographer does not feel heat when holding and holding the electronic camera, that is, a part that is difficult for a finger to reach. For example, since it is unlikely that a finger is located near the finder window 22 in FIG. 6, heat can be transmitted to a portion around the finder window 22. Accordingly, the photographer can perform photographing without feeling uncomfortable, and at the same time, it is possible to effectively release the heat generated from the heat source in the housing.

In the description of the third embodiment, the solid-state imaging device 5 is assumed as a heat source, but the heat source is limited to the solid-state imaging device 5 as in the first and second embodiments. Not something.

In the above description of the first to third embodiments, an example has been described in which the heat generated by the heat source is absorbed by the heat absorbing portion of the heat pipe and the heat is radiated by the heat radiating portion. Alternatively, another material having a large thermal conductivity may be used. In the above, an example in which the present invention is applied to an electronic still camera has been described. However, the present invention can be applied to an electronic camera such as a video camera.

In the correspondence between the above-described embodiments and the claims, the solid-state imaging device 5, the circuit board 11, the circuit board 1
2. The circuit board 15 and the light source 93 are heat sources, the heat pipes 7, 7A and 7B are radiating means, the shielding plate 16 is a shielding member, the solid-state imaging device 5 is a photoelectric conversion element, and the circuit board 11 is an electronic circuit. The liquid crystal display panel 91 constitutes display means, and the light source 93 constitutes illumination means.

[0037]

As described above, (1) According to the first aspect of the present invention, the heat generation provided in at least one of the plurality of small spaces formed in the housing. The heat generated by the heat source is absorbed by the heat absorbing portion, and is radiated from the heat radiating portion provided in a small space different from the small space in which the heat generating source is provided. Heat can be efficiently released from the space. (2) According to the second aspect of the invention, by using a heat pipe having a large thermal conductivity as the heat radiating means,
Further, heat can be efficiently released from the heat source and the small space in which the heat source is disposed. (3) According to the third aspect of the present invention, it is possible to prevent the heat that has not been absorbed by the heat absorbing portion of the heat radiating means from being transmitted to the photoelectric conversion element. The N ratio can be increased. (4) According to the invention described in claim 4, heat generated from the photoelectric conversion element or an electronic circuit for processing an electric signal output from the photoelectric conversion element can be efficiently released, and the photoelectric conversion element Temperature rise can be suppressed.
Thereby, the S / N ratio of the signal output from the photoelectric conversion element can be increased. (5) According to the invention as set forth in claim 5, heat generated from illumination means for illuminating display means for displaying an image captured by the photoelectric conversion element can be efficiently released. Thereby, the S / N ratio of the signal output from the photoelectric conversion element can be increased. (6) According to the invention as set forth in claim 6, the position of the heat radiating portion is disposed at a position higher than the position of the heat absorbing portion regardless of the vertical and horizontal shooting postures of the electronic camera. Thus, the efficiency of heat radiation by the heat radiation means can be maintained high regardless of the photographing posture. (7) According to the seventh aspect of the present invention, when the photographer holds the electronic camera at the time of photographing, a portion of the surface of the housing that causes inconvenience in the photographing result due to the finger of the photographer being hung. By radiating heat in the vicinity, a warning can be issued to the photographer. (8) According to the invention as set forth in claim 8, it is possible to heat the battery by dissipating heat to the battery, thereby improving the discharge performance of the battery.

[Brief description of the drawings]

FIGS. 1A and 1B are diagrams illustrating a schematic configuration of an electronic camera according to a first embodiment of the present invention, in which FIG. 1A is a cross-sectional view along an optical axis of a photographing lens, and FIG. Section BB of (a)
Is shown.

FIGS. 2A and 2B are diagrams illustrating an appearance of the electronic camera according to the first embodiment of the present invention, wherein FIG.
(B) shows the state at the time of vertical position shooting.

FIG. 3 is a diagram illustrating a schematic configuration of an electronic camera according to a second embodiment of the present invention, and is a cross-sectional view along an optical axis of a taking lens.

FIG. 4 is a diagram illustrating a connection state of a heat pipe in an electronic camera according to a second embodiment of the present invention.

FIG. 5 is a diagram illustrating a schematic configuration of an electronic camera according to a third embodiment of the present invention.

FIG. 6 is a diagram illustrating a connection state of a heat pipe in an electronic camera according to a third embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case 1a Partition wall 1c, 1d Small space 1e Grip part 1g Panel 2 Photographing lens 5 Solid-state image sensor 6 Bracket 7, 7A, 7B Heat pipe 7a, 7Aa, 7Ba Heat absorption part 7b, 7Ab, 7Bb Heat radiation part 8 Battery 9 Display unit 11, 12, 15 circuit board 20 light emitting window 21 light receiving window

Claims (8)

[Claims] A plurality of small spaces formed in a housing; a heat source disposed in at least one of the plurality of small spaces; and a heat absorbing portion for transferring heat generated from the heat source. An electronic camera, comprising: heat radiating means for absorbing heat and radiating heat by a heat radiating portion provided in a small space different from the small space in which the heat source is provided. 2. The electronic camera according to claim 1, wherein said heat radiating means is a heat pipe. 3. The electronic camera according to claim 1, wherein a photoelectric conversion element that captures an optical image formed by a photographing lens and converts the optical image into an electric signal, and between the photoelectric conversion element and the heat source. An electronic camera, further comprising a heat shielding member disposed in the electronic camera, wherein the heat absorbing portion is interposed between the heat shielding member and the heat source. 4. The electronic camera according to claim 1, wherein the photoelectric conversion element captures an optical image formed by a photographing lens and converts the optical image into an electric signal, and at least an electronic circuit for processing the electric signal. An electronic camera, further comprising: the heat source is at least one of the photoelectric conversion element and the electronic circuit. 5. The electronic camera according to claim 4, further comprising: display means for displaying an image picked up by said photoelectric conversion element; and illumination means for illuminating said display means. An electronic camera, wherein the heat source is at least one of the photoelectric conversion element, the electronic circuit, and the lighting unit. 6. The electronic camera according to claim 1, wherein the heat radiating portion is higher than a position where the heat absorbing portion is disposed, regardless of a photographing posture in a vertical position or a horizontal position. An electronic camera, which is disposed at a position. 7. The electronic camera according to claim 1, wherein the heat radiated from the heat radiating portion is a finger of the photographer when the photographer holds the electronic camera when photographing. The electronic camera is transmitted to the vicinity of a part on the surface of the housing, which causes inconvenience in a photographing result due to the application of the image. 8. The electronic camera according to claim 1, wherein the heat radiating unit radiates heat to a battery.