CN1408898A - 真空涂层设备 - Google Patents

真空涂层设备 Download PDF

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CN1408898A
CN1408898A CN02144430A CN02144430A CN1408898A CN 1408898 A CN1408898 A CN 1408898A CN 02144430 A CN02144430 A CN 02144430A CN 02144430 A CN02144430 A CN 02144430A CN 1408898 A CN1408898 A CN 1408898A
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magnetron
cold roll
treatment chamber
coating device
magnetron cavity
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CN100427640C (zh
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沃尔夫冈·埃尔比克姆
汉斯·克里斯蒂安·黑希特
迈克尔·霍夫曼
法尔克·米尔德
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VON ADNA EQUIPMENT AG
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Treatment Of Fiber Materials (AREA)

Abstract

本发明涉及到一种真空涂层设备,用于在处理室中对带形材料涂层,其中安排有解卷装置和卷取装置,在其间被涂层的带形材料穿过至少一个处于处理室真空下的可抽真空的处理室,其中在处理室中安排至少一个冷轧辊,在所述冷轧辊的表面上方至少有两个磁控管喷涂源,所述磁控管喷涂源彼此分开地安排在磁控管腔内,本发明旨在降低清洁磁控管腔时的保养费用,并且改善磁控管腔壁与处理室之间的气体分离。所述的任务的解决一方面是通过:磁控管腔由分开的磁控管腔壁构成,所述磁控管腔壁在其离冷轧辊表面而去的侧面包围各个磁控管喷涂源,其中磁控管腔壁,与磁控管喷涂源一样,至少间接地固定在一个公共的小车上,所述小车可以平行于冷轧辊轴线驶开,另一方面是通过:分开地为处理室和磁控管腔抽真空,在此磁控管腔中的工艺压力高于处理室中的工艺压力。

Description

真空涂层设备
本发明涉及一种真空涂层设备,用于在处理室中对带形材料进行涂层,其中安排有解卷装置和卷取装置,在其间受涂层的带形材料穿过至少一个处于处理室真空下的可真空的处理室,其中在处理室中安排至少一个冷轧辊,在所述冷轧辊的表面上方至少有两个磁控管喷涂源,所述磁控管喷涂源彼此分开地安排在磁控管腔内。
由DE9735603C1公知由两个处理室组成的带形材料的真空涂层设备。在每个处理室中各设有一个辊轧台,在辊轧台中装有引导装置和冷轧辊。
依加工技术不同,通过磁控管腔壁把每个处理室分成不同的磁控管腔。在这种磁控管腔中至少安排一个磁控管喷涂源,用于对带形材料涂层。冷轧辊的所有磁控管喷涂源及所属的磁控管外围都与可移开的室腔凸缘连接,用此凸缘它们可以从冷轧辊离开。
在对带形材料涂层时也出现不希望的因此需要不时地除掉的对磁控管腔壁的涂层。所述的磁控管腔是与处理室壁连接的。为了能够清洁磁控管腔壁,必须把它们逐个地从处理室中拆出。从而保养成本较高。
磁控管腔中的真空主要取决于从属于各个磁控管腔的真空泵以及磁控管腔壁与冷轧辊之间的气流阻力。
本发明旨在降低清洁磁控管腔时的保养费用,并且改善磁控管腔壁与处理室之间的气体分离。
根据本发明,所述的任务由本文开头所述技术的真空涂层设备解决,这是通过:磁控管腔各自一方面以冷轧辊为界另一方面以磁控管腔壁为界,从而磁控管腔借助于气流阻力部分地包围冷轧辊,并且磁控管腔在外部完全地由处理室腔包围,并且每个磁控管腔和处理室真空之间有可以调节的压差。
从而构成与处理室没有直接连接的涂层处理所必须的磁控管腔。通过调节磁控管腔与处理室之间的压差,本发明阻止气体进入磁控管腔内。
在本发明的一个扩展中提出,每个磁控管都连接真空产生装置。
换言之,每个磁控管腔要么有一个仅属于它的真空产生装置,要么所有的磁控管腔连接一个公共的真空产生装置。
在本发明的另一个扩展中提出,气流阻力可以从冷轧辊驶开。
由此磁控管腔可以平行于冷轧辊轴线运动而不损伤冷轧辊的表面,其中在移动总的单元之前扩大气流阻力与冷轧辊之间的间距。
本发明的一个优选实施例中提出,磁控管腔壁至少间接地固定在一个公共的小车上,所述小车可以平行于冷轧辊轴线驶开。
从而不论是磁控管喷涂源还是磁控管腔壁都可以为清洁及保养从冷轧辊驶开,为此自动地断开与真空泵的连接。
在本发明的另一个优选实施例提出,在冷轧辊轴线所处水平面上方安排的磁控管腔可以从冷轧辊摆开。
通过这个措施,可以扩大所述的磁控管腔与冷轧辊的间距,并且可以在驶出前降低整个小车。
在本发明的另一个优选实施例中提出,磁控管可以与公共的小车一起下降。
首先把在冷轧辊轴线所处水平面上方安排的磁控管腔从冷轧辊摆开,接着下降整个小车,从而现在可以从冷轧辊驶离了。
在本发明的另一个优选实施例中,在由小车、磁控管喷涂源和磁控管腔组成的单元与辊轧台之间安排定位装置。
借助于所述的定位装置,可以重复产生曾经进行过的,磁控管喷涂源和磁控管腔壁包括气流阻力与相应冷轧辊的准确对齐,而不必重新花费时间。
在本发明的另一个扩展中提出,补充于磁控管腔并且与磁控管腔分开地,处理室可以抽真空。
在本发明的另一个扩展中,在处理室中的压力小于磁控管腔中的压力。
采用分开的处理室真空和可达到的处理室与磁控管腔之间的压力比,可以保证各个喷涂源较高质量的气体分开,因为气体不能够进入任意的磁控管腔内了。
附图说明
下面借助于附图详细地说明本发明。附图示出处理室结构的原理。
标号:
1    处理室
2    辊轧台
3    冷轧辊
4    磁控管喷涂源
5    磁控管腔壁
6    气流阻力
7    磁控管腔
8    小车
9    额侧真空泵接头
10   真空泵
11   定位装置
在真空涂层设备的处理室1中安排辊轧台2,将冷轧辊3安装在辊轧台2上。在冷轧辊表面上方,磁控管喷涂源4安排在不同的位置上。为了可以把磁控管喷涂源4和冷轧辊3之间的空间抽真空,该空间由磁控管腔壁5包围,该磁控管腔壁5向着冷轧辊3用气流阻力封闭。由此而构成各个磁控管腔7。这些磁控管腔2在其额面端具有接头9,各用于图中所未示的真空泵。从而可以分开且独立地对磁控管腔7抽真空。
在处理室1上同样地接有真空泵10,通过该真空泵与磁控管腔7无关地对处理室1抽真空。由于在磁控管腔7中放入工艺气体,磁控管腔7中的压力高于处理室1中的压力,从而阻止外来气体透入磁控管腔7。
所述的磁控管喷涂源4和磁控管腔7都固定在一个公共的小车8上,通过小车可以把它们从冷轧辊3驶离。此外,气流阻力6允许所有的磁控管7驶离冷轧辊3。把安排在冷轧辊轴线上方的可摆的磁控管腔7从冷轧辊3摆开,然后下降整个小车。通过这些准备措施避免在驶离小车时损坏冷轧辊的表面。磁控管喷涂源4、磁控管腔7包括气流阻力6的定位必须准确地对冷轧辊轴线进行。为了重复产生在小车8驶离前调节了的位置而不重新花费时间,装入了定位装置11。

Claims (9)

1.一种真空涂层设备,用于在处理室中对带形材料涂层,其中安排有解卷装置和卷取装置,在其间被涂层的带形材料穿过至少一个处于处理室真空下的可抽真空的处理室,其中在处理室中安排至少一个冷轧辊,在所述冷轧辊的表面上方至少有两个磁控管喷涂源,所述磁控管喷涂源彼此分开地安排在磁控管腔内,其特征在于,磁控管腔(7)各自一方面以冷轧辊(3)为界另一方面以磁控管腔壁(5)为界,从而磁控管腔(7)借助于气流阻力(6)部分地包围冷轧辊(3),并且磁控管腔壁(5)在外部完全地由处理室真空包围,并且每个磁控管腔(7)和处理室真空之间有可以调节的压差。
2.如权利要求1所述的真空涂层设备,其特征在于,每个磁控管(7)都连接真空产生装置。
3.如权利要求1或2所述的真空涂层设备,其特征在于,气流阻力(6)可以从冷轧辊(3)驶开。
4.如权利要求1至3之任何一项所述的真空涂层设备,其特征在于,磁控管腔壁(5)至少间接地固定在一个公共的小车(8)上,所述小车可以平行于冷轧辊轴线驶开。
5.如权利要求1至4之任何一项所述的真空涂层设备,其特征在于,在冷轧辊轴线所处水平面上方安排的磁控管腔(7)可以从冷轧辊(3)摆开。
6.如权利要求1至5之任何一项所述的真空涂层设备,其特征在于,可以把磁控管腔(7)与公共的小车(8)一起下降。
7.如权利要求4至6之任何一项所述的真空涂层设备,其特征在于,在由小车(8)、磁控管喷涂源(4)和磁控管腔(7)组成的单元与辊轧台(2)之间安排定位装置(11)。
8.如权利要求1至7之任何一项所述的真空涂层设备,其特征在于,除了对磁控管腔(7)抽真空外,处理室(1)独立于磁控管腔(7)抽真空。
9.如权利要求8所述的真空涂层设备,其特征在于,在处理室(1)中的压力小于磁控管腔(7)中的压力。
CNB021444307A 2001-09-27 2002-09-27 真空涂层设备 Expired - Fee Related CN100427640C (zh)

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DE10147708A DE10147708C5 (de) 2001-09-27 2001-09-27 Targetanordnung
DE10147708.2 2001-09-27

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DE (1) DE10147708C5 (zh)

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CN1878887B (zh) * 2003-11-04 2010-05-26 冯阿德纳设备有限公司 用于涂覆细长基底的真空涂覆系统
CN101405432B (zh) * 2006-03-21 2011-04-13 山特维克知识产权股份有限公司 连续沉积生产线中的边缘涂布

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DE102009011495B4 (de) * 2009-03-06 2013-07-18 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Behandlung von Substraten unter Verwendung einer Gasseparation
WO2014060468A1 (de) * 2012-10-16 2014-04-24 Von Ardenne Gmbh Mehrfachbeschichtungseinrichtung für bandsubstrate und bandsubstrat-vakuumbeschichtungsanlage
DE102015104039B4 (de) * 2015-03-18 2018-06-21 Von Ardenne Gmbh Bandsubstratbeschichtungsanlage mit einer Magnetronanordnung

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1878887B (zh) * 2003-11-04 2010-05-26 冯阿德纳设备有限公司 用于涂覆细长基底的真空涂覆系统
CN101405432B (zh) * 2006-03-21 2011-04-13 山特维克知识产权股份有限公司 连续沉积生产线中的边缘涂布

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US6942768B2 (en) 2005-09-13
KR20030028401A (ko) 2003-04-08
JP2003147523A (ja) 2003-05-21
DE10147708C1 (de) 2002-11-14
DE10147708C5 (de) 2005-03-24
US20030057090A1 (en) 2003-03-27
CN100427640C (zh) 2008-10-22

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