CN1400637A - Chip cleaning device and method - Google Patents

Chip cleaning device and method Download PDF

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Publication number
CN1400637A
CN1400637A CN 01124015 CN01124015A CN1400637A CN 1400637 A CN1400637 A CN 1400637A CN 01124015 CN01124015 CN 01124015 CN 01124015 A CN01124015 A CN 01124015A CN 1400637 A CN1400637 A CN 1400637A
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China
Prior art keywords
chip
cleaning
electrical property
water
clean
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Granted
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CN 01124015
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Chinese (zh)
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CN1165075C (en
Inventor
蔡荣辉
曾素玲
庄娟茹
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Silicon Integrated Systems Corp
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Silicon Integrated Systems Corp
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Priority to CNB011240156A priority Critical patent/CN1165075C/en
Publication of CN1400637A publication Critical patent/CN1400637A/en
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Publication of CN1165075C publication Critical patent/CN1165075C/en
Anticipated expiration legal-status Critical
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Abstract

A chip cleaning device and its method is to monitor the wafer cleaners on-line by continuously monitoring electricity performance of wafer after cleaning. The cleaning device contains wafer supply device, electricity performance monitor device and a signal transfer device. The water supply device provides water on the surface of a chip, electricity monitor device detects continuously the electricity performance of the water after clenaing, to send out signals to be received by signal transfer device. When electricity signals do not reach the designed value, a continuous clenaing signal is sent out or the water supply device, or the signal reaches the designed value, a stop cleaning signal is sent to be water supply device.

Description

Chip cleaning device and method
Technical field
The present invention relates to a kind of chip cleaning device and method, particularly a kind of relevant for by monitoring as the electrical property of the water after cleaning, and the directly chip cleaning device and the method for the cleanliness factor of chip monitoring on line.
Background technology
In very lagre scale integrated circuit (VLSIC) (ULSI) processing procedure, chip enter that high temperature furnace pipe spreads or heat of oxidation processing procedure before, carry out chemical vapour deposition film before or carry out film etching after, all necessary process chemistry is cleaned (chemical cleaning), deionization cleans (DI water rinse), reaches drying (drying) step, just can make chip surface reach the requirement of high-cleanness, high (cleanliness), therefore, the chip cleaning technology is one of key factor that influences the plant-manufactured accepted product percentage of chip (yield), element quality and reliability.Wherein the purpose of Xi Jinging mainly is dirty (contamination) that is used for removing chip surface, as particulate (particle), and organic substance (organic) and inorganic matter metal ion (metal ions) etc.
The cleaning technology that uses can roughly be divided into two kinds of wet chemistry cleaning technology and physics cleaning technologies at present.The most commonly used with RCA chemistry cleaning technology processing procedure in the wet chemistry cleaning technology, its clean formula is: clean → QDR (quick dump rinse with the SC1 prescription; Get express developed) → clean → QDR → flushing (final rinse) at last with the SC2 prescription.
The physics cleaning technology then mainly is to clean chip with physical action, and does not use any chemicals.Chip is fixed in the scrubbing unit via vacuum cup (vacuum chuck), comes backwash to wash with brush on the chip surface of high speed rotating, and deionized water hydro-peening chip surface is arranged simultaneously, mainly can remove the pollution of particulate.
In the clean processing procedure of said chip, the program of using deionized water rinsing or hydro-peening chip is arranged all.All be cleanliness factor traditionally, promptly with deionized water rinsing or one period set time of hydro-peening chip with the time control chip.Therefore situation not enough or that excessively clean might take place to clean.Clean deficiency then can't reach the cleanliness factor of expection, excessively cleans the waste that then can cause on the cost.
Summary of the invention
The objective of the invention is for addressing the above problem, and a kind of chip cleaning device and method be provided, but its nationality by continuous monitoring as the electrical property of the water after cleaning, and the cleanliness factor of chip monitoring on line.
In order to finish purpose of the present invention, the invention provides a kind of chip cleaning device, comprising:
One the first arm and one second arm;
One water supply installation is in order to be supplied to the surface of a chip with water via this second arm, to clean the surface of chip;
One electrical property monitoring device has been used as the electrical property of the water after cleaning in order to continuous detecting, and has sent an electrical property signal;
One device for signalling, in order to receive this electrical property signal, when this electrical property signal does not reach a set value, send one and continue to clean chip signal to this water supply installation, when this electrical property signal reaches a set value, send one and stop to clean chip signal to this water supply installation; And
One brushing device is arranged on this first arm, in order to when cleaning this chip surperficial with water, scrubs this chip.
Comprising a hydro-peening head, be arranged on this second arm, be connected with this water supply installation.
Comprising a high sonic nozzle, be arranged on this second arm, be connected with this water supply installation.
Comprising an oscillator, be arranged on this second arm and and be connected with this high sonic nozzle; And the fast controller of a high pitch, be connected with this oscillator.
Wherein this water is deionized water.
Wherein this electrical property is an electrical conductivity.
Wherein this electrical property is a resistance value.
The present invention also provides a kind of chip method of cleaning, comprising:
Clean the surface of a chip with water; And
Continuous monitoring as the electrical property of the water after cleaning, when this electrical property does not reach a set value, continues to clean chip, and when this electrical property reaches a set value, stops to clean chip
When cleaning this chip surperficial with water, scrub this chip with a brushing device simultaneously.
This water is deionized water.
This electrical property is an electrical conductivity.
This electrical property is a resistance value.
Advantage of the present invention and characteristics are: chip cleaning device provided by the invention and method are compared with prior art, not only can clean chip effectively, and, in the program of using deionized water rinsing or hydro-peening chip, overcome cleanliness factor with the time control chip, promptly the defective of bringing with deionized water rinsing or the mode of one period set time of hydro-peening chip avoids taking place to clean situation not enough or that excessively clean.Can reach the cleanliness factor of expection, save cost.Chip cleaning device of the present invention is simple in structure, and method is reliably effective.
Description of drawings
Fig. 1 is the schematic appearance of first embodiment of expression chip cleaning device of the present invention;
Fig. 2 is the schematic internal view of expression chip cleaning device of the present invention;
The method flow diagram that Fig. 3 cleans for expression chip of the present invention;
Fig. 4 is the schematic appearance of second embodiment of expression chip cleaning device of the present invention.
The label declaration 10 of accompanying drawing, ablution groove 12, vacuum cup 14, rotating shaft 16, brushing device 20, chip 30, water supply installation 32, hydro-peening head 40, electrical property monitoring device 50, device for signalling 61, right arm 62, left arm 71, oscillator 72, high sonic nozzle 73, high pitch speed controller 80, pedestal 100,200, chip cleaning device S, electrical property signal R1, continuation are cleaned chip signal R2, are stopped to clean chip signal
Embodiment
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.First embodiment
See also Fig. 1,2, they represent the schematic diagram of first embodiment of chip cleaning device 100 of the present invention.Wherein Fig. 1 shows the schematic appearance of the chip cleaning device 100 of present embodiment, and Fig. 2 shows the schematic internal view of the chip cleaning device 100 of present embodiment.
With reference to figure 1,2, label 80 is represented a pedestal, and the element of chip cleaning device 100 can be set in pedestal 80; Ablution groove 10 is arranged in the pedestal 80, and in ablution groove 10, be provided with a vacuum cup (vacuumchuck) 12, a rotating shaft 14 (as shown in Figure 2), rotating shaft 14 is connected with vacuum cup 12, can place a chip 20 on the vacuum cup 12, by the high speed rotating of rotating shaft 14 so that chip 20 high speed rotating on vacuum cup 12.
Be respectively equipped with a right arm 61 and a left arm 62 in the pedestal 80, at right arm 61 front ends one brushing device 16 arranged, brushing device 16 can rotate as arrow E, and contacts with chip 20 on being arranged at vacuum cup 12, in order to scrub the surface of chip 20 back and forth.And in right arm 61, keep stepper motor, adjustable spring mechanism and cylinder (not shown), brushing device 16 connects with not shown stepper motor, adjustable spring mechanism and cylinder, and not shown thus stepper motor, adjustable spring mechanism and the cylinder of nationality and can freely moving and rotate.
One hydro-peening head 32 is arranged at left arm 62 front ends, and keeps stepper motor (not shown) in left arm 62, and not shown thus stepper motor go up to rotate left arm 62 and is arranged at hydro-peening head 32 on the left arm 62 in arrow D direction (as shown in Figure 1).
One water supply installation 30 can be supplied to deionized water hydro-peening head 32, and the deionized water of ejection is advanced with the direction of arrow A, B (as shown in Figure 2) in the hydro-peening head 32 then, with the surface of hydro-peening chip 20.In ablution groove 10, the chip 20 of high speed rotating is scrubbed by the deionized water hydro-peening and by brushing device 16 simultaneously.
As shown in Figure 2, the chip cleaning device 100 of present embodiment comprises above-mentioned water supply installation 30, one electrical property monitoring devices 40, and a device for signalling 50.Electrical property monitoring device 40 is located at the below of ablution groove 10.Can discharge by the below of ablution groove 10 along the direction of arrow C as the water behind the cleaning chip 20, and arrive electrical property monitoring device 40.But 40 continuous monitorings of electrical property monitoring device have been used as the electrical property of the water after cleaning, and send an electrical property signal S.50 of device for signalling can receive electrical property signal S, when electrical property signal S does not reach a set value, send one and continue to clean chip signal R1, when electrical property signal S reaches a set value, send one and stop to clean chip signal R2 to water supply installation 30 to water supply installation 30.
Fig. 3 shows the flow chart of the chip method of cleaning of present embodiment.At first chip is imported.Then clean the surface of chip with water, continuous monitoring has been used as the electrical property of the water after cleaning.When electrical property does not reach a set value,, continue to clean chip then along " deficiency " route (FAIL).And when electrical property reaches a set value, then along " by " (PASS) route, stop to clean chip, chip is exported.
As the electrical property of the water after cleaning, with the principle of the cleanliness factor of chip monitoring, the water that pollution level is different can have different electrical properties to present embodiment by monitoring.The electrical property that is suitable as monitoring does not have certain limitation, so long as pollution level is big and the little water of pollution level, its electrical property is variant to get final product.For example can monitor the electrical conductivity and the resistance value of water.
The foregoing description is general physics cleaning technology program, and the pollutant that institute's desire is removed generally is a particulate.Owing to contain what of particulate in the water, can cause the difference of its electrical property, therefore, if set a set value, whether monitoring reaches this set value as the electrical property of the water that cleans, can judge thus whether the particulate that contains in the water reaches requirement, thereby can learn whether the particle number on the chip surface reaches requirement, and the cleanliness factor of chip as can be known.
In the general wet chemistry cleaning technology, the step that washes chip is carried out, after using the clean chip of chemicals to remove chemicals residual on the chip.According to above-mentioned similar principle, contain what of chemical concentration in the water, can cause the difference of electrical property.Therefore, if set a set value, whether monitoring reaches this set value as the electrical property of the water that cleans, can judge thus whether the concentration that contains chemicals in the water reaches requirement, thereby can learn whether the chemical concentration on the chip surface reaches requirement, and the cleanliness factor of chip as can be known.Chip cleaning method and device by present embodiment, owing to installed electrical property monitoring device and device for signalling additional, but continuous monitoring has been used as the electrical property of the water after cleaning, and with electrical property signal feedback (feedback) to water supply installation, whether continue to supply water to clean chip with decision, perhaps stop to supply water and stopping to clean chip.So, the present embodiment nationality by monitoring as the electrical property of the water after cleaning, can be on line the direct cleanliness factor of chip monitoring.In this way, can avoid chip that situation not enough or that excessively clean takes place to clean, can reach the highest economic benefit.Second embodiment
Fig. 4 shows the schematic appearance of second embodiment of chip cleaning device 200 of the present invention, wherein the formation of elements such as the ablution groove in the present embodiment 10, vacuum cup 12, rotating shaft 14, brushing device 16, chip 20, water supply installation 30, electrical property monitoring device 40, device for signalling 50, right arm 61, left arm 62, pedestal 80 is all identical with first embodiment with set-up mode, is marked with identical symbol and omits its explanation at this.
Present embodiment is different with first embodiment be in: set up an oscillator (oscillator) 71, one high sonic nozzle (megasonic nozzle) 72 and one high pitch speed controller (megasoniccontroller) 73.
High pitch speed controller 73 excites the molecule of deionized water and can carry out ultrasonic waves and clean (ultrasonic cleaning) when cleaning chip 20 surfaces at deionized water; Oscillator 71 is arranged on the left arm 62, and it is as the concussion transfer device of high sonic nozzle 72 with high pitch speed controller 73; The hydro-peening head 32 that high sonic nozzle 72 replaces among first embodiment, it is arranged on the left arm 62 and via oscillator 71 and is connected with high pitch speed controller 73.
By above-mentioned formation,, can carry out ultrasonic waves to chip 20 surfaces and clean from the deionized water of high sonic nozzle 72 ejections; Because other formations of present embodiment are all identical with first embodiment, therefore can discharge by the below of ablution groove 10 as the water behind the cleaning chip 20, and arrive electrical property monitoring device 40.Electrical property monitoring device 40 can be detected the electrical property as the water after cleaning continuously, and as first embodiment, send an electrical property signal S.50 of device for signalling can receive electrical property signal S, when electrical property signal S does not reach a set value, send one and continue to clean chip signal R1, when electrical property signal S reaches a set value, send one and stop to clean chip signal R2 to water supply installation 30 to water supply installation 30.
The chip method of cleaning of present embodiment is identical with first embodiment, as shown in Figure 3, omits its explanation at this.
As above-mentioned, present embodiment also can reach the effect of first embodiment.
Though the present invention with the preferred embodiment explanation as above; but it is not that any this area those of ordinary skill is not in breaking away from design of the present invention and scope in order to qualification the present invention; when can doing to change and modify, so protection scope of the present invention is as the criterion with the scope that claims were defined.

Claims (12)

1, a kind of chip cleaning device is characterized in that:
Comprise:
One the first arm and one second arm;
One water supply installation is in order to be supplied to the surface of a chip with water via this second arm, to clean the surface of chip;
One electrical property monitoring device has been used as the electrical property of the water after cleaning in order to continuous detecting, and has sent an electrical property signal;
One device for signalling, in order to receive this electrical property signal, when this electrical property signal does not reach a set value, send one and continue to clean chip signal to this water supply installation, when this electrical property signal reaches a set value, send one and stop to clean chip signal to this water supply installation; And
One brushing device is arranged on this first arm, in order to when cleaning this chip surperficial with water, scrubs this chip.
2. chip cleaning device as claimed in claim 1 is characterized in that: comprising a hydro-peening head, be arranged on this second arm, be connected with this water supply installation.
3. chip cleaning device as claimed in claim 1 is characterized in that: comprising a high sonic nozzle, be arranged on this second arm, be connected with this water supply installation.
4. chip cleaning device as claimed in claim 3 is characterized in that: comprising an oscillator, be arranged on this second arm and with this high sonic nozzle and be connected; And the fast controller of a high pitch, be connected with this oscillator.
5. chip cleaning device as claimed in claim 1 is characterized in that: wherein this water is deionized water.
6. chip cleaning device as claimed in claim 1 is characterized in that: wherein this electrical property is an electrical conductivity.
7. chip cleaning device as claimed in claim 1 is characterized in that: wherein this electrical property is a resistance value.
8. chip method of cleaning is characterized in that:
Comprise:
Clean the surface of a chip with water; And
Continuous monitoring as the electrical property of the water after cleaning, when this electrical property does not reach a set value, continues to clean chip, and when this electrical property reaches a set value, stops to clean chip.
9. chip method of cleaning as claimed in claim 8 is characterized in that: when cleaning this chip surperficial with water, scrub this chip with a brushing device simultaneously.
10. chip method of cleaning as claimed in claim 8 is characterized in that: this water is deionized water.
11. chip method of cleaning as claimed in claim 8 is characterized in that: this electrical property is an electrical conductivity.
12. chip method of cleaning as claimed in claim 8 is characterized in that: this electrical property is a resistance value.
CNB011240156A 2001-08-06 2001-08-06 Chip cleaning device and method Expired - Fee Related CN1165075C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB011240156A CN1165075C (en) 2001-08-06 2001-08-06 Chip cleaning device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB011240156A CN1165075C (en) 2001-08-06 2001-08-06 Chip cleaning device and method

Publications (2)

Publication Number Publication Date
CN1400637A true CN1400637A (en) 2003-03-05
CN1165075C CN1165075C (en) 2004-09-01

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Application Number Title Priority Date Filing Date
CNB011240156A Expired - Fee Related CN1165075C (en) 2001-08-06 2001-08-06 Chip cleaning device and method

Country Status (1)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102318053B (en) * 2007-10-18 2014-12-24 朗姆研究公司 Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus
CN106334685A (en) * 2016-10-19 2017-01-18 湖州数康生物科技有限公司 Automatic cleaning system for biological chips
CN106475331A (en) * 2016-11-21 2017-03-08 无锡市伟丰印刷机械厂 A kind of automobile sealing gasket high efficiente callback equipment
CN108648989A (en) * 2018-05-16 2018-10-12 福建北电新材料科技有限公司 A kind of single crystal silicon carbide substrate wafer cleaning method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102318053B (en) * 2007-10-18 2014-12-24 朗姆研究公司 Methods of and apparatus for correlating gap value to meniscus stability in processing of a wafer surface by a recipe-controlled meniscus
CN106334685A (en) * 2016-10-19 2017-01-18 湖州数康生物科技有限公司 Automatic cleaning system for biological chips
CN106475331A (en) * 2016-11-21 2017-03-08 无锡市伟丰印刷机械厂 A kind of automobile sealing gasket high efficiente callback equipment
CN108648989A (en) * 2018-05-16 2018-10-12 福建北电新材料科技有限公司 A kind of single crystal silicon carbide substrate wafer cleaning method
CN108648989B (en) * 2018-05-16 2020-12-25 福建北电新材料科技有限公司 Method for cleaning single crystal silicon carbide substrate wafer

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