CN1392998A - 安装在金属物品上的rfid合成物 - Google Patents
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Abstract
一种包含RFID的合成物，可以安装在一个金属物品上或与其邻近而不会干扰RFID的天线。该合成物(12)包括含有RFID或EAS设备的第一层(14)，以及邻近第一层的可起泡材料层(17)。可起泡材料层遇到外在刺激(比如加热或者微波)，其尺寸扩大、密度减小。可起泡层可由膨胀材料构成，也可含有RF辐射吸收材料填充物。当该合成物以标签形式出现时，压力感应粘合剂(19)在印刷完该合成物可印刷表面(12)后，可以将其安装在金属物品(22)上或与其邻近。在印刷完后以及在安装在金属物品(22)上或其附近之后或之前，使可起泡材料层(17)受到外部刺激。
Description
发明概述及背景
自从无线频率设备(RFID)或类似物(比如EAS设备)在很多情况下表现出很多实际优势，RFID的使用越来越普及。结果导致RFID设备融合到许多产品中(包括标签或标号)，比如可参见待审的2000年2月8日申请的系列号为09/499,347专利申请(代理案号263-2198；9945US)和1999年9月10日申请的系列号为09/393,291的专利申请(代理案号263-2076；9913US)，以及美国专利5,206,626、5,497,140、5,448,110(它们所公开的内容在这里作为参考)。然而当用于金属物品时，使用传统的包含RFID的设备非常困难。比如，如果不采用特别的预防措施，包含RFID的标签或标记贴在金属物品上，该金属很可干扰(de-tune)RFID的天线。如果大量采用RF吸收材料，或者将天线放置在金属物品之外，这种现象将会大大缓解。然而，如果标签足够厚到可以将RFID天线置于贴在下面的金属物品之外，那么该标签是大而不灵巧的。这会减小分配效率，其中使得该装置上的印刷不能采用印刷文件的传统印刷机。
按照本发明的标签或者其他合成物将会克服以上所述缺陷。根据本发明，将有可生产一种合成物(比如标签或标记)，可以贴在金属物品上，并且可以基本上避免干扰天线，其中也不会不灵巧或使用困难。此外，还可以在该合成物上压印图象，包括采用传统的用于印刷文件的印刷机。根据现在的发明，通过加一层可起泡材料层在合成物(比如标签或标记)里面，就可以获得这种性能优良的结果。该可起泡材料层受到膨胀触发激活时，将会扩大尺寸、减小密度。比如，可起泡材料层可由膨胀材料构成，因此当受热时，它会分解和/或形成气体，以及/或者经历材料相变。因此，在印刷之后，该层要经过加热、微波或者其他膨胀刺激然后才能真正用于金属物品，或者在合成物(比如当处于标签形式时，自带的压力敏感粘合剂)用于金属物品上时，要进行加热或其他方式的膨胀激活。
根据本发明的一个方面，合成物包括：包含RFID或者EAS设备的第一层，以及近邻于第一层的可起泡材料层，其中可起泡材料层遇到膨胀激活时，将会扩大尺寸、减小密度。
可起泡材料层可包括一个膨胀类材料，比如遇热分解的聚氮化合物、和/或遇热成形成成气体的化合物和/或遇热时发生相变的化合物。微波也会激活可起泡材料。除了微波激活类材料和起泡类材料外，其他在一定条件下起泡的材料也可以采用。
可起泡材料层也可包括RF辐射吸收材料，典型的如填充剂。大量这种类型材料已经商用，包括在美国专利5,202.688和5,691,667中公开的。
该合成物还可包括多种其他层。比如粘合层，它将各种其他不同层彼此粘合起来。比如在第一层和可起泡层之间有一层粘合剂，它或者直接连接这两层、或者连接其中一层与一个中间层、或者连接两个中间层。该合成物也可更可取地包括一层可压印的表面层，比如纸张，位于第一层的反面(从可起泡材料层看)。一种粘合类材料，比如常规构成的压力敏感粘合剂，可以将RFID设备和纸张层直接粘合、或者经过一到多个中间层。同样该合成物，尤其是具有可压印的表面层的合成物，可呈标签形式并且包括压力敏感粘合剂层，该粘合剂层连接到可起泡材料层的反面(从第一层来看)，或者直接连接到可起泡材料层或连接到一个或多个中间层。该标签可以无内衬的，或者以纸或类似物作涂层的传统硅内衬。
典型地，标记被成像在可压印表面层，并且，只有压印成象后(举例来说，在传统印刷机中)合成物才能受膨胀刺激。压力敏感粘合剂可以将合成物与金属物品粘合或连接。但由于起泡层(或多层)和可能有的辐射吸收材料的存在，尤其是可起泡层里的填充剂的存在，RFID的天线在RFID的寿命期内不会受到干扰。
根据本发明的另一方面，它提供了一种利用RFID的方法：(a)制造一个合成物，该合成物包括RFID和至少一层可受外在刺激激活的可起泡材料层；(b)将该合成物与金属物品有效关联；(c)应用外在刺激，让可起泡材料层膨胀，使得RFID与金属物品间隔开。
在该方法中，(a)可实践成合成物可包含一个可压印层；该方法可以进一步包括(d)：在(c)之前成像可压印层(比如使用传统的文件印刷机)。在该方法中，(c)在实际操作中可以早于或者晚于(b)。可起泡材料层的一种体现是膨胀类材料；(c)在实践中可采用加热的方法，比如使用吹风机、焊枪(并不真正接触合成物)、或者其他传统设备。(a)还可以进一步通过给可起泡材料增加RF辐射吸收材料，象添加剂而实现。
这一发明的主要目标就是提供一种与金属物品相关联的且容易使用、适用性强、包含RFID的合成物(比如标签或标记)，并且不会在RFID寿命期内干扰其天线。通过审查下面详细的发明描叙和附加权利如权利要求，本发明的主要目标和其他目标会得到清楚体现。
附图的简要描叙
图1是一个根据本发明的一种示范性化合物的侧视图，其中为了清楚的展示，各层的尺寸和比例都已经放大。
图2是一个图1合成物横截面的侧视图。它删除了内衬，粘合在金属物品上，并且起泡层膨胀。
图3是图1合成物的顶层平面视图。
图4是一个方框图，它展示了本发明的一个典型方法。
附图的详细描叙
图1图解展示了本发明的一种合成物10。尽管出于展示的目的，图1中表示出了某些特定层，还可以提供包括多个起泡层的或多或少的层，这将在下面详细描述。
对于图1中的特别实施例，从顶层开始讨论。层11具有一个可压印的表面层12，比如用作标签具有传统结构的纸张层。可压印的表面层12可使标记成像在其上，正象图3中13所示，这可以通过使用传统的文件印刷机实现。
合成物10也包括含有RFID(或EAS设备)的层，附图1和图2中14所示，15表示一部分RFID设备。层14可以包括任何传统的RFID层，比如可参见以上提及待审的申请，以及上文提及的专利。层11、14彼此相连，比如通过层16压力敏感粘合剂(或者在一些环境下其他类粘合剂)直接将层11、14粘合，或者通过一个或多个中间层粘合到它们中的一个或二者。
合成物10也包含一个可起泡材料层17。层17至少包含一个遇到外在刺激就会膨胀的材料，比如热塑或热固或与泡沫形成成份混合的、其中该泡沫形成成份在受到刺激时形成气体的混合材料。比如可起泡材料层17可包含膨胀类材料，如叠氮化物。或者包含其他任何用于这一目的的各种材料，比如遇热或者其他刺激会分解、形成气体、发生材料相变的化合物。
可起泡材料层17也包含其他材料，如传统类型的填加剂，象RF辐射吸收材料，如美国专利5,202,688和5,691,667所示。还有一些材料也可利用，这要视特定可起泡材料和特定辐射吸收填充剂或类似物的情形而定。
可起泡层17可通过传统方式与层14相连，比如粘合剂(如压力敏感粘合剂)层18直接连接层14和17，或者直接结合其一并将一个中间层与另一层连接，或者形成两层或多层中间层。
当合成物10还包含一个标签，它也包含一个压力敏感粘合剂层19。层19直接粘附在层17上，或者通过中间物粘附在层17上，或者与层17可操作地相连。当一个无内衬标签作为合成物10提供时，所以无内衬的传统结构是必要的，并且在表面12上涂有硅或者其他类似物。然而在图1的实施例中，有一个传统释放(release)内衬20，比如传统的覆盖硅纸张。
图2表示从粘合层19删除了内衬20的图1中的合成物10，并且层17受加热或其他膨胀刺激影响。粘合剂19粘贴或连接在金属物品22的表面层21上。这一金属物品有可是杆、盘、箱等等。由于层17的膨胀运动，RFID14比膨胀前更加远离金属物品22(见图1)。如果RF辐射吸收材料作为起泡层17的填充剂，那么金属物品22更不能在RFID15寿命期内被干扰。
图4说明了本发明的典型方法。方框25表示采用传统技术制造了一个RFID标签或其他合成物，比如合成物10。如26所示，因为合成物10相对比较薄，采用传统文件印刷机来成像合成物10，其中标记13(见图3)压印在合成物10的可压印表面层12。附图4中方框27表示将合成物10应用于金属物品22，就象图2所图解的那样，在操作中，过程27可以在加热(见方框28)或者其他膨胀刺激前或后发生。
由此可见，本发明提出了一种有效、多样化的合成物，并提供了使用这些合成物的方法，允许直接在金属物体的上面、里面、旁边连接该合成物。这里表示和描述的本发明是最实际最优选的实施例，因此对于本领域的普通技术人员来说，在本发明的范围中可作出多种变化，该范围是按照附加权利要求的宽泛的解释，以便包括所有等价的结构和方法。
Claims (20)
1.一种合成物，包括：
一个包含RFID或EAS设备的第一层；以及
与第一层邻接的一个可起泡材料层，当其遇到膨胀激活时，可起泡材料层将扩大尺寸、减小密度。
2.如权利要求1中所述的合成物，其中可起泡层包含一个膨胀类材料。
3.如权利要求1中所述的合成物，其中可起泡材料层包含吸收RF辐射材料的填充剂。
4.如权利要求1中所述的合成物进一步包含一层粘合剂，用于第一层与可起泡材料层相连。
5.如权利要求1中所述的合成物进一步包含一个可压印表面层，从可膨胀材料层来看，该表面层位于第一层的反面。
6.如权利要求5中所述的合成物进一步包含一个压力敏感粘合层，从第一层来看，该粘合层位于可起泡层的反面并与可起泡层相连。
7.如权利要求6中所述的合成物，其中压力敏感粘合层粘贴在金属物品上。
8.如权利要求6中所述的合成物，其中压力敏感粘合层被一个释放内衬所覆盖。
9.如权利要求5中所述的合成物，进一步包含成像在可压印表面层的标记。
10.如权利要求7中所述的合成物，其中可起泡材料层起泡。
11.如权利要求10中所述的合成物，在可起泡层进一步包含RF辐射吸收材料。
12.一种使用RFID的方法，包括：
(a)制造一个合成物材料，其中该合成物具有RFID和至少一个可由外在刺激激活的可起泡材料层；
(b)将该合成物与金属物品有效连接；以及
(c)应用外在刺激，以便让可起泡材料层膨胀，使得RFID与金属物品间隔开。
13.如权利要求12所述的方法，其中实施(a)以便合成物包含一个可压印层；并且进一步包含(d)：在(c)之前成像可压印层。
14.如权利要求12所述的方法，其中(c)在(b)之后实施。
15.如权利要求13所述的方法，其中(c)在(b)之后操作。
16.如权利要求12所述的方法，其中可起泡材料层是一个膨胀类材料，并且(c)通过加热方式来实施。
17.如权利要求12所述的方法，其中通过增加RF辐射吸收材料到可起泡层作为填充剂来进一步实现(a)。
18.如权利要求13所述的方法，其中通过增加RF辐射吸收材料到可起泡层作为填充剂来进一步实现(a)。
19.如权利要求15所述的方法，其中可起泡材料是膨胀类材料，并且(c)采用加热方式实现。
20.如权利要求16所述的方法，其中通过增加RF辐射吸收材料到可起泡层作为填充剂来进一步实现(a)。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/665,311 US6486783B1 (en) | 2000-09-19 | 2000-09-19 | RFID composite for mounting on or adjacent metal objects |
| US09/665,311 | 2000-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1392998A true CN1392998A (zh) | 2003-01-22 |
| CN1202493C CN1202493C (zh) | 2005-05-18 |
Family
ID=24669591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB018028195A Expired - Fee Related CN1202493C (zh) | 2000-09-19 | 2001-06-26 | 射频识别合成物 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6486783B1 (zh) |
| EP (1) | EP1327225A1 (zh) |
| JP (1) | JP2004510190A (zh) |
| KR (1) | KR20020064315A (zh) |
| CN (1) | CN1202493C (zh) |
| AU (1) | AU773941B2 (zh) |
| BR (1) | BR0107235A (zh) |
| CA (1) | CA2391628C (zh) |
| MX (1) | MXPA02004968A (zh) |
| WO (1) | WO2002025584A1 (zh) |
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| CN101099167B (zh) * | 2004-11-23 | 2010-04-14 | 传感电子公司 | 集成eas/rfid设备和其失效设备 |
| CN1920901B (zh) * | 2005-07-21 | 2011-06-22 | 西德尔卡有限公司 | 包括金属管和射频识别(rfid)标签的装置 |
| CN101288085B (zh) * | 2005-07-20 | 2012-02-22 | 因特莱弗莱克斯公司 | 选择性rf设备激活 |
| CN101271532B (zh) * | 2007-03-22 | 2012-09-05 | 兄弟工业株式会社 | 标贴卷带、标贴卷带带盒和标贴生产设备 |
| US8807438B2 (en) | 2006-02-22 | 2014-08-19 | Toyo Seikan Kaisha, Ltd. | RFID tag substrate for metal component |
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-
2000
- 2000-09-19 US US09/665,311 patent/US6486783B1/en not_active Expired - Lifetime
-
2001
- 2001-06-26 KR KR1020027006369A patent/KR20020064315A/ko not_active Application Discontinuation
- 2001-06-26 BR BR0107235-8A patent/BR0107235A/pt not_active IP Right Cessation
- 2001-06-26 EP EP01957530A patent/EP1327225A1/en not_active Withdrawn
- 2001-06-26 JP JP2002529709A patent/JP2004510190A/ja active Pending
- 2001-06-26 CN CNB018028195A patent/CN1202493C/zh not_active Expired - Fee Related
- 2001-06-26 WO PCT/US2001/041122 patent/WO2002025584A1/en active IP Right Grant
- 2001-06-26 MX MXPA02004968A patent/MXPA02004968A/es active IP Right Grant
- 2001-06-26 CA CA002391628A patent/CA2391628C/en not_active Expired - Fee Related
- 2001-06-26 AU AU79265/01A patent/AU773941B2/en not_active Ceased
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101099167B (zh) * | 2004-11-23 | 2010-04-14 | 传感电子公司 | 集成eas/rfid设备和其失效设备 |
| CN100412897C (zh) * | 2005-04-15 | 2008-08-20 | 富士通株式会社 | 射频识别标签组件、射频识别标签以及射频识别标签部件 |
| CN101288085B (zh) * | 2005-07-20 | 2012-02-22 | 因特莱弗莱克斯公司 | 选择性rf设备激活 |
| CN1920901B (zh) * | 2005-07-21 | 2011-06-22 | 西德尔卡有限公司 | 包括金属管和射频识别(rfid)标签的装置 |
| US8807438B2 (en) | 2006-02-22 | 2014-08-19 | Toyo Seikan Kaisha, Ltd. | RFID tag substrate for metal component |
| CN102514827B (zh) * | 2006-02-22 | 2015-02-25 | 东洋制罐株式会社 | 带rfid标签的金属物品 |
| US8973833B2 (en) | 2006-02-22 | 2015-03-10 | Toyo Seikan Kaisha Ltd. | RFID tag substrate for metal component |
| CN101271532B (zh) * | 2007-03-22 | 2012-09-05 | 兄弟工业株式会社 | 标贴卷带、标贴卷带带盒和标贴生产设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| MXPA02004968A (es) | 2002-09-18 |
| US6486783B1 (en) | 2002-11-26 |
| AU773941B2 (en) | 2004-06-10 |
| CA2391628C (en) | 2007-08-21 |
| CA2391628A1 (en) | 2002-03-28 |
| CN1202493C (zh) | 2005-05-18 |
| EP1327225A1 (en) | 2003-07-16 |
| WO2002025584A1 (en) | 2002-03-28 |
| KR20020064315A (ko) | 2002-08-07 |
| JP2004510190A (ja) | 2004-04-02 |
| AU7926501A (en) | 2002-04-02 |
| BR0107235A (pt) | 2002-07-09 |
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