CN1392816A - Coating method and device for solder material - Google Patents
Coating method and device for solder material Download PDFInfo
- Publication number
- CN1392816A CN1392816A CN 01803060 CN01803060A CN1392816A CN 1392816 A CN1392816 A CN 1392816A CN 01803060 CN01803060 CN 01803060 CN 01803060 A CN01803060 A CN 01803060A CN 1392816 A CN1392816 A CN 1392816A
- Authority
- CN
- China
- Prior art keywords
- brazing material
- sounding head
- work piece
- coating
- inside groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000165971A JP3319740B2 (en) | 2000-06-02 | 2000-06-02 | Brazing material coating device |
JP165971/2000 | 2000-06-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1392816A true CN1392816A (en) | 2003-01-22 |
CN1193855C CN1193855C (en) | 2005-03-23 |
Family
ID=18669361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01803060 Expired - Fee Related CN1193855C (en) | 2000-06-02 | 2001-03-23 | Coating method and device for solder material |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3319740B2 (en) |
CN (1) | CN1193855C (en) |
TW (1) | TW524866B (en) |
WO (1) | WO2001094068A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101396751B (en) * | 2007-09-27 | 2011-03-02 | 比亚迪股份有限公司 | Solder-reflow soldering method |
CN101768723B (en) * | 2009-12-30 | 2012-05-09 | 宁波江丰电子材料有限公司 | Large-size target ultrasonic treatment device and treatment method thereof |
CN103128390A (en) * | 2011-11-30 | 2013-06-05 | 亚企睦自动设备有限公司 | Prefixing device for welding ring and prefixing method for welding ring |
CN103842120A (en) * | 2011-05-17 | 2014-06-04 | 弗劳恩霍弗实用研究促进协会 | Method for the cohesive connection of elements |
CN103921499A (en) * | 2014-04-22 | 2014-07-16 | 刘建忠 | Metal material with excellent soldering performance |
CN103521871B (en) * | 2012-07-05 | 2016-12-28 | 贝思瑞士股份公司 | For the method and apparatus distributing fluxless solder on substrate |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100785208B1 (en) * | 2005-06-15 | 2007-12-11 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Solder Alloy for Manufacturing Sputtering Target and Sputtering Target Using the same |
TWI496621B (en) * | 2010-10-26 | 2015-08-21 | Prologium Technology Co | Coating head and coating machine using the same |
JP6689309B2 (en) | 2018-03-26 | 2020-04-28 | Jx金属株式会社 | Sputtering target member, sputtering target assembly, and method for manufacturing sputtering target member |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0753808Y2 (en) * | 1991-07-16 | 1995-12-13 | 黒田電気株式会社 | Jet type ultrasonic brazing device |
US5230462A (en) * | 1992-07-08 | 1993-07-27 | Materials Research Corporation | Method of soldering a sputtering target to a backing member |
-
2000
- 2000-06-02 JP JP2000165971A patent/JP3319740B2/en not_active Expired - Fee Related
-
2001
- 2001-03-23 WO PCT/JP2001/002409 patent/WO2001094068A1/en active Application Filing
- 2001-03-23 CN CN 01803060 patent/CN1193855C/en not_active Expired - Fee Related
- 2001-05-01 TW TW90110388A patent/TW524866B/en not_active IP Right Cessation
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101396751B (en) * | 2007-09-27 | 2011-03-02 | 比亚迪股份有限公司 | Solder-reflow soldering method |
CN101768723B (en) * | 2009-12-30 | 2012-05-09 | 宁波江丰电子材料有限公司 | Large-size target ultrasonic treatment device and treatment method thereof |
CN103842120A (en) * | 2011-05-17 | 2014-06-04 | 弗劳恩霍弗实用研究促进协会 | Method for the cohesive connection of elements |
CN103128390A (en) * | 2011-11-30 | 2013-06-05 | 亚企睦自动设备有限公司 | Prefixing device for welding ring and prefixing method for welding ring |
CN103521871B (en) * | 2012-07-05 | 2016-12-28 | 贝思瑞士股份公司 | For the method and apparatus distributing fluxless solder on substrate |
CN103921499A (en) * | 2014-04-22 | 2014-07-16 | 刘建忠 | Metal material with excellent soldering performance |
CN103921499B (en) * | 2014-04-22 | 2017-02-15 | 刘建忠 | Metal material with excellent soldering performance |
Also Published As
Publication number | Publication date |
---|---|
TW524866B (en) | 2003-03-21 |
CN1193855C (en) | 2005-03-23 |
JP3319740B2 (en) | 2002-09-03 |
WO2001094068A1 (en) | 2001-12-13 |
JP2001340959A (en) | 2001-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: NIPPON MINING AND METALS CO., LTD. Free format text: FORMER NAME OR ADDRESS: NIKKO MATERIALS CO. LTD |
|
CP03 | Change of name, title or address |
Address after: Tokyo, Japan Patentee after: Nippon Mining & Metals Co., Ltd. Address before: Tokyo, Japan Patentee before: Nikko Materials Company, Limited |
|
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: JX Nippon Mining & Metals Corporation Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050323 Termination date: 20130323 |