CN106028667A - Method for improving contact performance of PCB bonding pad - Google Patents
Method for improving contact performance of PCB bonding pad Download PDFInfo
- Publication number
- CN106028667A CN106028667A CN201610457852.2A CN201610457852A CN106028667A CN 106028667 A CN106028667 A CN 106028667A CN 201610457852 A CN201610457852 A CN 201610457852A CN 106028667 A CN106028667 A CN 106028667A
- Authority
- CN
- China
- Prior art keywords
- pcb
- osp
- bonding pad
- pcb board
- sheet metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
Abstract
The invention specifically relates to method for improving contact performance of a PCB bonding pad. According to the method for improving the contact performance of the PCB bonding pad, the PCB is subjected to surface treatment by a full-board OSP process in the production and processing of the PCB to fully keep the OSP film on the surface of the PCB; a layer of tin paste is paved on the electronic component bonding pad which needs to be mechanically assembled in a tiled manner before the electronic component is subjected to mounting so as to carry out tin-paste-brushing treatment; and a metal sheet is mounted on the tin paste, and the metal sheet and the PCB are welded together through the tin paste after backflow processing. By adoption of the method for improving the contact performance of the PCB bonding pad, good contact performance of the bonding pad can be ensured while the OSP process is adopted for surface treatment of the PCB; the problem of overhigh connecting resistance in the surface treatment of the PCB bonding pad by the OSP can be solved while the production cost is controlled, and environmental pollution caused by chemical immersion nickel gold can be reduced as well; and in addition, the metal sheet has high conduction property and anti-oxidation property, so that electronic component bonding pad of the PCB is switched on through the metal sheet and the positive electrode and the negative electrode of the power supply when the positive electrode and the negative electrode of the power supply are locked again in the subsequent process.
Description
Technical field
The present invention relates to PCB surface processing technology field, particularly to a kind of method improving PCB contact pads performance.
Background technology
PCB(printed circuit board or printed board) undertake the function that electrical property connects and part carries in the electronic device.Before PCB shipment after PCB factory manufactures carries out being welded of part to PCBA factory, in order to ensure that be welded is smoothed out, PCB factory can carry out surface process to PCB.This flow process can simply be interpreted as: PCB cleaning solder side (copper face)---surface process---PCBA welding.
Surface process have multiple, immersion Ni/Au, OSP(organic coat), spray stannum, Immersion Ag etc. is multiple.Immersion Ni/Au and OSP are two kinds of surface treatment modes that server industries is conventional when using PCB.Immersion Ni/Au is at one layer of nickel of solder side elder generation chemical plating, plates one layer of gold the most again, and Gold plated Layer is as welding protective layer, and during welding, layer gold can be dissolved in scolding tin, and scolding tin can directly be welded on nickel dam.OSP is at one layer of organic membrane of solder side chemical plating, and this layer of organic membrane can protect solder side not to be contaminated, and when welding, organic membrane can be dissolved in Colophonium simultaneously, and scolding tin can directly be welded in copper face.
But, there is problem in actual applications at present conventional surface treatment method:
Immersion Ni/Au has good protective effect to solder side, and protective effect is lasting.But immersion Ni/Au is expensive, and must use aurous cyanide in immersion Ni/Au, gold potassium cyanide is toxic articles.So immersion Ni/Au not only cost is high, and pollute the environment.
OSP is one layer of organic membrane, and low price is nontoxic.But OSP is owing to being a kind of Organic substance, and this organic conductive capability is the most weak, and in needs solder pad, OSP film can be dissolved in Colophonium and be removed.But on the pad needing contact, owing to OSP film retains after PCBA always, this layer of OSP can cause contact resistance excessive and cause and generate heat at contact area.
The such as PCB of certain OSP technique, after PCBA completes, the pad needing contact is to retain OSP film.Pad A is the negative pole needing to connect power supply, and pad B is the positive pole needing to connect power supply.Pad A and pad B can connect the both positive and negative polarity of power supply by the way of lock screw.But, owing to all having OSP film on pad A and pad B, causing connecting resistance excessive, in design and operation, heating is serious, brings potential safety hazard to equipment.
If as connecting, pad OSP contact resistance is excessive and whole PCB is changed into the process of surface treatment of immersion Ni/Au, will cause cost increase, and immersion Ni/Au can cause environmental pollution simultaneously.
If needing the bond pad surface print solder paste that connects, owing to there is Colophonium in tin cream, tin cream surface upon reflowing has one layer of Colophonium and exists, and it is excessive that this layer of Colophonium also results in contact resistance.
Based on the problems referred to above, the present invention proposes a kind of method improving PCB contact pads performance.
Summary of the invention
The present invention is in order to make up the defect of prior art, it is provided that a kind of method simply improving PCB contact pads performance efficiently.
The present invention is achieved through the following technical solutions:
A kind of method improving PCB contact pads performance, it is characterised in that comprise the following steps:
(1) when production and processing pcb board, use full plate OSP technique that pcb board is carried out surface process, make pcb board surface all retain OSP film；
(2) before components and parts attachment, on the electronic devices and components pad need mechanical package, one layer of tin cream is printed in tiling, carries out brush tin cream process；
(3) mounting a sheet metal on tin cream again, after backflow, sheet metal and pcb board are welded together by tin cream.
In described step (1), described full plate OSP technique is that the surface treatment mode of test point set on the electronic devices and components pad to pcb board and pcb board all uses OSP PROCESS FOR TREATMENT.
In described step (3), described sheet metal is that immersion Ni/Au processes the sheet metal obtained, and after backflow, sheet metal and pcb board are welded together by tin cream.
The invention has the beneficial effects as follows: the method for this improvement PCB contact pads performance, in the case of OSP can being used on pcb board surface processes, ensure that the contact performance of pad is good, both solved that PCB bond pad surface OSP process causes connects the problem that resistance is excessive, control again production cost, decrease the environmental pollution that immersion Ni/Au causes；And owing to sheet metal has good conduction property and antioxygenic property, when rear operation locks power positive cathode again, the electronic devices and components pad of pcb board will be turned on by the both positive and negative polarity of sheet metal and power supply.
Accompanying drawing explanation
Accompanying drawing 1 improves the method schematic diagram of PCB contact pads performance for the present invention.
Detailed description of the invention
In order to make the technical problem to be solved, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the present invention will be described in detail.It should be noted that, specific embodiment described herein is only in order to explain the present invention, it is not intended to limit the present invention.
The method of this improvement PCB contact pads performance, comprises the following steps:
(1) when production and processing pcb board, use full plate OSP technique that pcb board is carried out surface process, make pcb board surface all retain OSP film；
(2) before components and parts attachment, on the electronic devices and components pad need mechanical package, one layer of tin cream is printed in tiling, carries out brush tin cream process；
(3) mounting a sheet metal on tin cream again, after backflow, sheet metal and pcb board are welded together by tin cream.
In described step (1), described full plate OSP technique is that the surface treatment mode of test point set on the electronic devices and components pad to pcb board and pcb board all uses OSP PROCESS FOR TREATMENT.
In described step (3), described sheet metal is that immersion Ni/Au processes the sheet metal obtained, and after backflow, sheet metal and pcb board are welded together by tin cream.
The method of this improvement PCB contact pads performance, in the case of OSP can being used on pcb board surface processes, ensure that the contact performance of pad is good, both solved that PCB bond pad surface OSP process causes connects the problem that resistance is excessive, control again production cost, decrease the environmental pollution that immersion Ni/Au causes；And owing to sheet metal has good conduction property and antioxygenic property, when rear operation locks power positive cathode again, the electronic devices and components pad of pcb board will be turned on by the both positive and negative polarity of sheet metal and power supply.Applying of OSP process of surface treatment is made to have had the biggest extension on the premise of not increasing cost.
Claims (3)
1. the method improving PCB contact pads performance, it is characterised in that comprise the following steps:
(1) when production and processing pcb board, use full plate OSP technique that pcb board is carried out surface process, make pcb board surface all retain OSP film；
(2) before components and parts attachment, on the electronic devices and components pad need mechanical package, one layer of tin cream is printed in tiling, carries out brush tin cream process；
(3) mounting a sheet metal on tin cream again, after backflow, sheet metal and pcb board are welded together by tin cream.
The method improving PCB contact pads performance the most according to claim 1, it is characterized in that: in described step (1), full plate OSP technique is that the surface treatment mode of test point set on the electronic devices and components pad to pcb board and pcb board all uses OSP PROCESS FOR TREATMENT.
The method improving PCB contact pads performance the most according to claim 1, it is characterised in that: in described step (3), described sheet metal is that immersion Ni/Au processes the sheet metal obtained, and after backflow, sheet metal and pcb board are welded together by tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457852.2A CN106028667A (en) | 2016-06-21 | 2016-06-21 | Method for improving contact performance of PCB bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610457852.2A CN106028667A (en) | 2016-06-21 | 2016-06-21 | Method for improving contact performance of PCB bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106028667A true CN106028667A (en) | 2016-10-12 |
Family
ID=57086551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610457852.2A Pending CN106028667A (en) | 2016-06-21 | 2016-06-21 | Method for improving contact performance of PCB bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106028667A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874237A (en) * | 2019-03-11 | 2019-06-11 | 深圳市海能达通信有限公司 | SMT welding procedure and steel mesh for SMT welding procedure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102187232A (en) * | 2008-10-14 | 2011-09-14 | 惠普开发有限公司 | Circuit board testing using a probe |
| TW201143560A (en) * | 2010-05-18 | 2011-12-01 | Darfon Electronics Corp | Circuit board and forming method of connection portion thereof |
| CN103025074A (en) * | 2012-12-11 | 2013-04-03 | 广东欧珀移动通信有限公司 | Method for improving contact reliability of printed circuit board (PCB) testing points |
-
2016
- 2016-06-21 CN CN201610457852.2A patent/CN106028667A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102187232A (en) * | 2008-10-14 | 2011-09-14 | 惠普开发有限公司 | Circuit board testing using a probe |
| TW201143560A (en) * | 2010-05-18 | 2011-12-01 | Darfon Electronics Corp | Circuit board and forming method of connection portion thereof |
| CN103025074A (en) * | 2012-12-11 | 2013-04-03 | 广东欧珀移动通信有限公司 | Method for improving contact reliability of printed circuit board (PCB) testing points |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109874237A (en) * | 2019-03-11 | 2019-06-11 | 深圳市海能达通信有限公司 | SMT welding procedure and steel mesh for SMT welding procedure |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161012 |