CN1386244A - 具有防止弯曲或扭曲的保护装置的数据载体 - Google Patents

具有防止弯曲或扭曲的保护装置的数据载体 Download PDF

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CN1386244A
CN1386244A CN01801971A CN01801971A CN1386244A CN 1386244 A CN1386244 A CN 1386244A CN 01801971 A CN01801971 A CN 01801971A CN 01801971 A CN01801971 A CN 01801971A CN 1386244 A CN1386244 A CN 1386244A
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module
data carrier
protective device
substrate devices
conductor structure
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CN1193317C (zh
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M·托思
J·H·肖伯
P·施马勒格
V·索尔
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Cathay Yinen Enterprise Co Ltd
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Koninklijke Philips Electronics NV
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Abstract

一种包含IC模块(3)的数据载体(1),包括衬底装置(4),与衬底装置(4)连接的导体结构(5),与衬底装置(4)连接的IC(2),在导体结构(5)和IC(2)之间的连接导线(10,11),和电绝缘物质构成的覆盖层(12),覆盖着IC(2),连接导线(10,11),导体结构(5)的部分(13,14,15),此数据载体(1)具有一保护装置(20),可在IC(3)模块被弯曲或扭曲时,保护IC模块(3)的至少一部分不受损坏,所述保护装置(20)形成了IC模块(3)的一部分,此保护装置(20)由可延展物质构成,且由层形、最好是网状的罩形成,此罩被包围在所述衬底装置上(4)的覆盖层(12)中。

Description

具有防止弯曲或扭曲的保护装置的数据载体
本发明涉及一种具有IC模块的数据载体,所述IC模块包括以下的部分,即,衬底装置,与衬底装置连接的导体结构,与衬底装置连接的IC,在导体结构和IC之间的连接导线,和电绝缘物质构成的覆盖层,覆盖着IC,连接导线,与连接导线电连接的导体结构部分,此数据载体具有一保护装置,可在IC模块被弯曲或扭曲时,保护IC模块的至少一部分不受损坏。
本发明还涉及一种用于数据载体的IC模块,所述IC模块包括以下的部分,即衬底装置,与衬底装置连接的导体结构,与衬底装置连接的IC,在导体结构和IC之间的连接导线,和电绝缘物质构成的覆盖层,覆盖着IC,连接导线,与连接导线电连接的导体结构部分。
如本文开头段落定义的这种数据载体,和本文第二段定义的这种IC模块可从,例如专利文献EO211360 B1中得知。依据已知技术的具有保护装置的数据载体,其保护装置是与数据载体的IC模块相分离的,这种保护装置是一种加固装置,可能包含多种物质并且随数据载体的额外变形而增加其阻抗,从而达到对数据载体和包含于其中的IC模块的保护功能。根据已知技术的这种保护装置的保护功能只有在IC模块被插入数据载体中时才能实现,但在IC模块还未插入数据载体中时,就不能保证实现对IC模块和IC模块中的部分的保护功能。
本发明的目的是为了解决上述问题并提供一种改进的数据载体和改进的IC模块。
根据本发明,为了实现上述目的,一种如本文开头段落定义的数据载体,其特征在于,此保护装置形成IC模块的一部分,且此保护装置包含一种可延展物质。
并且,根据本发明,为了达到上述目的,一种如本文第二段定义的IC模块,其特征在于,此IC模块具有一保护装置,可以在IC模块弯曲或扭曲时保护IC模块的至少一部分不被损坏,此保护装置包含一种可延展物质,且此保护装置是由一种层状的罩形成的,此罩被包围在衬底装置上的覆盖层中。
借助于本发明的方法可实现,通过使用很容易实现的简易装置,数据载体的IC模块和IC模块的部分能够在IC模块插入数据载体之前就被有效地保护防止其弯曲或扭曲。其优越性在于,在IC模块插入数据载体之前就已提供了保护,从而使非插入式的IC模块也能被保护防止出现不希望的负面效应。
根据本发明的构造,作为保护装置的所述罩包围着衬底装置上的覆盖层。这里要强调的是,罩可以这种方式构成,即其不仅能够覆盖所述覆盖层,还能覆盖与覆盖层相邻的衬底装置的一部分。此外,作为保护装置的罩并不是完全覆盖在衬底装置上,与衬底装置相邻的覆盖层的一狭窄部分并没有被罩覆盖住。
当根据本发明的数据载体和根据本发明的IC模块分别具有如权利要求2和4所定义的技术特征时,其优越性已被证明。这种结构的优点是可以节省材料,并且,这种结构可以保证在不同方向上的变形压力能够被有效的吸收。
本发明的上述方面和进一步的方面,将在以下用举例的方式参照例子的说明中变得更为明显。
本发明将参照附图进行详细的说明,但本发明并不局限于以下用举例的方式给出的实施例。
图1示出了包含现有技术IC模块的现有技术数据载体的一部分,所述部分是沿切面方向按比例放大示出的。
图2以与图1相似的方式示出了,根据本发明实施例的数据载体的一部分,此数据载体包括根据本发明实施例的IC模块。
图1示出了数据载体的一部分,其中与本文相关的部分以点划线标出。数据载体1用于提供与读/写配置的无接点通信。为此,数据载体1包括一个图1中未示出的传送线圈,其与集成电路(IC)2以导电方式连接,IC2以转发器IC的形式形成IC模块3的部分,在图1中以实线示出。
IC模块3具有以下部分,即,由带状基底形成的衬底装置4,此基底是由玻璃纤维加固的环氧树脂制成的;与衬底装置4相连的铜制的导体结构5,此结构中的三个导体部分6,7和8可由图1看出;IC2,位于衬底装置4的第一凹槽4A中,IC2在粘合层9的作用下与导体结构5的导体部分7机械连接,并通过导体结构5与衬底装置4连接;两根连接导线10和11,位于导体结构5,即导体部分6,8与IC2之间,并分别穿过衬底装置4中的凹槽4B和4C;电绝缘物质构成的覆盖层12,覆盖着IC2和两个连接导线10,11以及导体结构5的两个部分13,14,这两个部分与连接导线10,11电连接,并封住凹槽4B和4C,同时导体结构5的部分15封住了凹槽4A。
已知的数据载体1和已知的IC模块3的问题在于,当IC模块3被弯曲或扭曲时,不论是在插入数据载体1之前还是插入数据载体1之后,都很有可能在IC模块相对较易坏的区域形成断裂带,即,例如在覆盖层12区域中,或在衬底装置4区域中。图1示出了这种断裂带16,17,18,19。这种断裂带的出现会危及IC模块3的正常操作,进而影向到数据载体1的正常操作,很明显,这是非常不利的而且是不希望出现的。
图2示出了根本发明的数据载体1,其具有根据本发明的IC模块3。图2所示的数据载体1及其IC模块3与图1所示的数据载体1的设计大致相同。
图2所示的数据载体1与图1所示的数据载体的本质区别在于,图2所示的数据载体1具有一保护装置20,能够在IC模块3被弯曲或扭曲的情况下保护IC模块3的至少一部分。最好,保护装置20形成IC模块3的一部分,从而可在IC模块3还未插入数据载体1时实现其对IC模块3的保护功能。保护装置20是由可延展物质构成的,即本实施例中的铜。保护装置20是由层状的罩形成的,此罩被包围在衬底装置4上的覆盖层12中。在最佳实施方式中,保护装置20是由网状的罩形成的。所述网状可能是具有方形网孔的网的形状,但也可能是蜂窝状的类型。然而,保护装置20也可能包含由可延展物质,例如银或金或铝,构成的无孔层。
作为保护装置的罩的可延展性,使得当数据载体1和IC模块3被弯曲或扭曲时,可防止在IC模块3的易坏部分形成断裂带。当然,这是在IC模块被弯曲或扭曲的一定程度的范围之内,因为过度的弯曲负载或扭曲负载将导致IC模块3的易坏部分被损坏。然而,由于提供了可延展的罩,出现损坏的局限值将显然变得比在已知数据载体和已知IC模块的情况下要高。

Claims (4)

1.一种数据载体(1)具有IC模块(3),此IC模块(3)包括下述部分,即,衬底装置(4),与衬底装置(4)连接的导体结构(5),与衬底装置(4)连接的IC(2),在导体结构(5)和IC(2)之间的连接导线(10,11),和电绝缘物质构成的覆盖层(12),覆盖着IC(2),连接导线(10,11),与连接导线(10,11)电连接的导体结构(5)的部分(13,14),此数据载体(1)具有一保护装置(20),可在IC(3)模块被弯曲或扭曲时,保护IC模块(3)的至少一部分不受损坏,其特征在于,所述保护装置(20)由可延展物质构成,且保护装置(20)由层状的罩形成,此罩被包围在所述衬底装置上(4)的覆盖层(12)中。
2.如权利要求1所述的数据载体(1),其特征在于所述保护装置(20)由网状结构的罩形成。
3.一个用于数据载体(1)的IC模块(3),所述IC模块(3)包括下述部分,即,衬底装置(4),与衬底装置(4)连接的导体结构(5),与衬底装置(4)连接的IC(2),在导体结构(5)和IC(2)之间的连接导线(10,11),和电绝缘物质构成的覆盖层(12),覆盖着IC(2),连接导线(10,11),与连接导线(10,11)电连接的导体结构(5)的部分(13,14),此数据载体(1)具有一保护装置(20),可在IC(3)模块被弯曲或扭曲时,保护IC模块(3)的至少一部分不受损坏,其特征在于,所述IC模块(3)具有一保护装置(20),可在IC(3)模块被弯曲或扭曲时,保护IC模块(3)的至少一部分不受损坏,所述保护装置(20)由可延展物质构成,且保护装置(20)由层状的罩形成,此罩被包围在所述衬底装置上(4)的覆盖层(12)中。
4.如权利要求3所述的数据载体(3),其特征在于所述保护装置(20)由网状结构的罩形成。
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