CN1383203A - Heat sink using phase state conversion of fluid - Google Patents
Heat sink using phase state conversion of fluid Download PDFInfo
- Publication number
- CN1383203A CN1383203A CN 01117424 CN01117424A CN1383203A CN 1383203 A CN1383203 A CN 1383203A CN 01117424 CN01117424 CN 01117424 CN 01117424 A CN01117424 A CN 01117424A CN 1383203 A CN1383203 A CN 1383203A
- Authority
- CN
- China
- Prior art keywords
- heat
- working fluid
- radiating
- heat abstractor
- heater element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
A radiating device includes a hollow part and an operation fluid in it. The hollow part is composed of good heat-conductive materials with heat-absorbing and radiating ends. The heat-absorbing end has a base to be connected with a heating element and the radiating end forms multi-convex surface components for increasing contact with air outside. The operation fluid at the absorbing end absorbs heat conducted by the heating elements to evaporate the liquid to the gas-state therefore going up to the convex components and radiating heat at the same time. The gas is condensed into liquid to flow back to the absorption end. This radiating device reaches the radiation effectiveness desired by the computer system with limited volume.
Description
The present invention relates to a kind of heat abstractor, particularly relate to a kind of heat abstractor that utilizes the phase conversion of fluid.
In recent years, along with development of science and technology, electronic product on the market also constantly upgrades thereupon and is progressive, and the employed large-scale integrated circuit of electronic product also becomes complicated day by day.In order to promote the function of product, need to increase contained number of transistors and its frequency of operation of unit are in the large-scale integrated circuit, but, this kind high-frequency integrated circuit inevitably can produce high heat in the process of running, also therefore, the important topic that how to dispel the heat and be the stable of holding circuit and prolong component life.
The practice in the past is that metal fin is connected on the heater element, utilizes metal fin to absorb earlier the heat that heater element produced, and this heat is emitted in the surperficial contacted air with metal fin, to reach radiating effect again.Also therefore, when the surface area that contacts with air when metal fin was big more, its radiating efficiency was just good more.So, when the heat production power of heater element increases,, just must increase the volume of metal fin in order to promote the radiating efficiency of metal fin.But because the heat dissipation characteristics of metal itself, so its radiating efficiency can't form the increase of equal proportion along with the increasing of volume.Therefore, when being used in high-frequency circuit, its volume of the needed metal fin of this kind practice and weight all can become the burden of system.
The object of the present invention is to provide the heat abstractor that a kind of volume is little and radiating efficiency is high, to address the above problem.
The object of the present invention is achieved like this, a kind of heat abstractor promptly is provided, being installed in one has in the electronic system of a heater element, this heat abstractor comprises: a ducted body, the material good by a capacity of heat transmission constituted, this ducted body comprises: a heat absorbing end has a bottom and this bottom and this heater element and joins; And a radiating end, forming a plurality of protrusion members, this each protrusion member is in order to increase the surface area that contacts with outside air; And a working fluid, be positioned at this ducted body; Wherein, the working fluid that is positioned at this heat absorbing end absorbs from the heat that this heater element conducted and is evaporated to gaseous state by liquid state, thereby rises to the protrusion member of this radiating end, and sheds this heat and condense into liquid state by gaseous state, thereby flows back into this heat absorbing end.
The present invention also provides a kind of heat abstractor, be installed in one and have in the electronic system of a heater element, this heat abstractor comprises: a ducted body, and the material good by a capacity of heat transmission constituted, this ducted body comprises: a heat absorbing end has a bottom and this bottom and this heater element and joins; One radiating end forms a plurality of protrusion members, and this each protrusion member is in order to increase the surface area that contacts with outside air; And a connection channel, in order to be communicated with this heat absorbing end and this radiating end; And a working fluid, this working fluid is positioned at this ducted body; Wherein, the working fluid that is positioned at this heat absorbing end absorbs from the heat that this heater element conducted and is evaporated to gaseous state by liquid state, rise to the protrusion member of this radiating end again via this interface channel, and shed this heat and condense into liquid state, thereby flow back into this heat absorbing end by gaseous state.
Furtherly, heat abstractor proposed by the invention is installed in the electronic system, and this electronic system has heater element.Heat abstractor comprises ducted body and is arranged at the interior working fluid of ducted body that above-mentioned ducted body is made of the good material of capacity of heat transmission, and has heat absorbing end and radiating end.Wherein, bottom and heater element that heat absorbing end has join, and radiating end forms a plurality of in order to increase the protrusion member of the surface area that contacts with outside air.Again, the working fluid that is positioned at heat absorbing end absorbs the heat that the spontaneous heating element conducted and is evaporated to gaseous state by liquid state, thereby rises to protrusion member and shed heat and condense into liquid state by gaseous state, and flows back into heat absorbing end.In addition, heat absorbing end and radiating end can produce via interface channel and be communicated with, so that the employed environment of the form fit of heat abstractor and do suitable adjustment.
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Fig. 1 is the cutaway view of the heat abstractor of a preferred embodiment of the present invention;
The cutaway view that Fig. 2 uses on notebook for the heat abstractor of Fig. 1.
Heat abstractor of the present invention is installed in a kind of electronic system, and this electronic system can be desktop computer or notebook.Please refer to Fig. 1, it illustrates the cutaway view according to the heat abstractor of a preferred embodiment of the present invention.As shown in Figure 1, heat abstractor 100 of the present invention comprises a ducted body 110 and a working fluid 150.This heat abstractor 100 is used for a desktop computer.Wherein, working fluid 150 is positioned at ducted body 110.The material that constitutes ducted body 110 is the good material of a heat conductivity, for example is metal.And the end that ducted body 110 and heater element 10 join is a heat absorbing end 120, and the other end is a radiating end 130, and the position of radiating end 130 must be higher than heat absorbing end 120.Heat absorbing end 120 has a bottom 122 and bottom 122 joins with heater element 10.The part of radiating end 130 forms some protrusion members 132, and these protrusion members 132 can increase the surface area that radiating end 130 contacts with outside air, thereby promotes the efficient of heat radiation.Working fluid 150 is positioned on the bottom 122, and working fluid 150 can be a kind of volatile liquid.
The heat that heater element 10 is produced conducts the working fluid of giving in the ducted body 110 150 via the bottom 122 of heat absorbing end 120.And heat that working fluid 150 meeting absorption heater elements 10 are produced and the phase of utilizing this heat change working fluid 150 make working fluid 150 convert gaseous state to by original liquid state.The working fluid 150 of this gaseous state can rise to the protrusion member 132 of radiating end 130, thereby heat is dissipated in the air, after losing heat, can condense into liquid state so rise to the gaseous working fluid 150 of protrusion member 132, and because resorption hot junction 120 falls in the effect of gravity again.And liquid working fluid 150 can absorb the heat that heater element 10 produced and convert gaseous state once again to, and rises to radiating end 130.Heat abstractor 100 of the present invention promptly is to utilize above-mentioned process to reach the purpose of heat radiation.
Characteristics of the present invention are that heat abstractor does suitable adjustment cooperating employed environment in shape.For instance since notebook make every effort in design gently, thin, short, little, so the element of notebook reaches also relative more of suffered in shape restriction at volume.And heat abstractor of the present invention will come flexiblely at more in the past metal fin in shape.
Please refer to Fig. 2, it illustrates the application cutaway view of the heat abstractor of Fig. 1 at notebook.As shown in Figure 2, this heat abstractor 200 comprises a ducted body 210 and a working fluid 250.Wherein, working fluid 250 is positioned at ducted body 210.The material that constitutes ducted body 210 is the good material of a heat conductivity, for example is metal.The end that ducted body 210 and heater element 10 join is a heat absorbing end 220, and the other end is a radiating end 230, and heat absorbing end 220 is connected by a connection channel 240 with radiating end 230.Heat absorbing end 220 has a bottom 222 and bottom 222 joins with heater element 10.The part of radiating end 230 forms some protrusion members 232, and these protrusion members 232 can increase the surface area that radiating end 230 contacts with outside air, thereby promotes the efficient of heat radiation.Working fluid 250 is positioned on the bottom 222, and working fluid 250 can be a kind of volatile liquid.
Different being in heat abstractor 200 of heat abstractor 200 and heat abstractor 100 has an interface channel 240, this interface channel 240 is communicated with heat absorbing end 220 and radiating end 230 passes through in order to working fluid 250, and, even can not make radiating efficiency produce too big change the reduced cross-sectional area of interface channel 240 yet.This is because radiating efficiency depends on the evaporation rate and the rate of setting of working fluid.Therefore, when the present invention is used in notebook, the interface channel 240 of heat abstractor 200 can be done lessly, and do radiating end 230 bigger, to increase rate of heat dispation with the saving space.In addition, the structural design of interface channel 240 makes notebook have more elasticity in the configuration of inner space.
On the other hand, because the action that existing metal fin utilizes metal to absorb heat, conduct heat and dispel the heat, so, will lower its radiating efficiency as long as reduce a part of sectional area of metal fin, also therefore the adjustable of metal fin on shape and volume is also lower than the present invention.
The advantage of apparatus of the present invention exists, and its occupied space is less and radiating efficiency is high; Can cooperate employed environment to do suitable adjustment in shape.
In sum; though disclosed the present invention in conjunction with an above preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (8)
1. a heat abstractor is installed in one and has in the electronic system of a heater element, and this heat abstractor comprises:
One ducted body, the material good by a capacity of heat transmission constituted, and this ducted body comprises:
One heat absorbing end has a bottom and this bottom and this heater element and joins; And
One radiating end forms a plurality of protrusion members, and this each protrusion member is in order to increase the surface area that contacts with outside air; And
One working fluid is positioned at this ducted body; Wherein, the working fluid that is positioned at this heat absorbing end absorbs from the heat that this heater element conducted and is evaporated to gaseous state by liquid state, thereby rises to the protrusion member of this radiating end, and sheds this heat and condense into liquid state by gaseous state, thereby flows back into this heat absorbing end.
2. heat abstractor as claimed in claim 1, wherein this material is a metal.
3. heat abstractor as claimed in claim 1, wherein this working fluid is a volatile liquid.
4. heat abstractor as claimed in claim 1, wherein this electronic system is a desktop computer.
5. a heat abstractor is installed in one and has in the electronic system of a heater element, and this heat abstractor comprises:
One ducted body, the material good by a capacity of heat transmission constituted, and this ducted body comprises:
One heat absorbing end has a bottom and this bottom and this heater element and joins;
One radiating end forms a plurality of protrusion members, and this each protrusion member is in order to increase the surface area that contacts with outside air; And
A connection channel is in order to be communicated with this heat absorbing end and this radiating end; And
One working fluid, this working fluid is positioned at this ducted body; Wherein, the working fluid that is positioned at this heat absorbing end absorbs from the heat that this heater element conducted and is evaporated to gaseous state by liquid state, rise to the protrusion member of this radiating end again via this interface channel, and shed this heat and condense into liquid state, thereby flow back into this heat absorbing end by gaseous state.
6. heat abstractor as claimed in claim 5, wherein this material is a metal.
7. heat abstractor as claimed in claim 5, wherein this working fluid is a volatile liquid.
8. heat abstractor as claimed in claim 5, wherein this electronic system is a notebook.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011174242A CN1168141C (en) | 2001-04-27 | 2001-04-27 | Heat sink using phase state conversion of fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011174242A CN1168141C (en) | 2001-04-27 | 2001-04-27 | Heat sink using phase state conversion of fluid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1383203A true CN1383203A (en) | 2002-12-04 |
| CN1168141C CN1168141C (en) | 2004-09-22 |
Family
ID=4662709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011174242A Expired - Fee Related CN1168141C (en) | 2001-04-27 | 2001-04-27 | Heat sink using phase state conversion of fluid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1168141C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100445684C (en) * | 2005-08-19 | 2008-12-24 | 鸿富锦精密工业（深圳）有限公司 | Liquid cooling type cooling unit of heat pipe |
| CN105698141A (en) * | 2016-03-16 | 2016-06-22 | 南京航空航天大学 | Cooling device |
| CN111987058A (en) * | 2019-05-24 | 2020-11-24 | 宁波飞芯电子科技有限公司 | Heat sink device |
| TWI809848B (en) * | 2021-04-28 | 2023-07-21 | 日商古河電氣工業股份有限公司 | Evaporating portion structure and heat transfer member having the evaporating portion structure |
-
2001
- 2001-04-27 CN CNB011174242A patent/CN1168141C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100445684C (en) * | 2005-08-19 | 2008-12-24 | 鸿富锦精密工业（深圳）有限公司 | Liquid cooling type cooling unit of heat pipe |
| CN105698141A (en) * | 2016-03-16 | 2016-06-22 | 南京航空航天大学 | Cooling device |
| CN111987058A (en) * | 2019-05-24 | 2020-11-24 | 宁波飞芯电子科技有限公司 | Heat sink device |
| TWI809848B (en) * | 2021-04-28 | 2023-07-21 | 日商古河電氣工業股份有限公司 | Evaporating portion structure and heat transfer member having the evaporating portion structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1168141C (en) | 2004-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3169627U (en) | Cooling device heat dissipation structure | |
| CN2694359Y (en) | Heat pipe radiator | |
| US20040050534A1 (en) | Heat sink with heat pipe in direct contact with component | |
| US9342120B2 (en) | Mounting structure and method for dissipating heat from a computer expansion card | |
| US20040052051A1 (en) | Heat sink with heat pipe and base fins | |
| US20040163796A1 (en) | Circulative cooling apparatus | |
| US20040050535A1 (en) | Heat sink with angled heat pipe | |
| CN201111626Y (en) | Hot pipe heat conduction heat radiator | |
| US20030192669A1 (en) | Micro-loop heat pipe | |
| US20070151712A1 (en) | Heat sink for distributing a thermal load | |
| CN1168141C (en) | Heat sink using phase state conversion of fluid | |
| US20070119583A1 (en) | Heat sink for distributing a thermal load | |
| CN110621144A (en) | Heat dissipation assembly and electronic equipment | |
| CN204042816U (en) | A kind of LED radiator based on vapor chamber heat dissipation technology | |
| CN201583886U (en) | Radiator system of computer | |
| CN111864335A (en) | Five-tube fin antenna radiator | |
| CN101296600A (en) | Radiating assembly and electronic device using the same | |
| CN207083355U (en) | Using the communication apparatus of heat-pipe radiator | |
| CN109462968A (en) | A kind of radiator of multi-surface heat-producing device | |
| CN214384718U (en) | Heat radiator for be used for memory disc | |
| CN204498550U (en) | Radiating subassembly | |
| CN112105231A (en) | Pulsating heat pipe type blade server heat management system | |
| CN208058740U (en) | A kind of cooling fin, radiator and LED automobile head lamp | |
| US8783333B1 (en) | Cooling system | |
| CN2599641Y (en) | Vacuum heat-conducting pipe type heat sink for computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040922 Termination date: 20160427 |