CN1328194C - 切割装置 - Google Patents

切割装置 Download PDF

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Publication number
CN1328194C
CN1328194C CNB031459129A CN03145912A CN1328194C CN 1328194 C CN1328194 C CN 1328194C CN B031459129 A CNB031459129 A CN B031459129A CN 03145912 A CN03145912 A CN 03145912A CN 1328194 C CN1328194 C CN 1328194C
Authority
CN
China
Prior art keywords
mentioned
cutting
brittle substrate
line
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031459129A
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English (en)
Chinese (zh)
Other versions
CN1472032A (zh
Inventor
松本真人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN1472032A publication Critical patent/CN1472032A/zh
Application granted granted Critical
Publication of CN1328194C publication Critical patent/CN1328194C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
CNB031459129A 2002-07-11 2003-07-11 切割装置 Expired - Fee Related CN1328194C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP202578/02 2002-07-11
JP202578/2002 2002-07-11
JP2002202578A JP2004042423A (ja) 2002-07-11 2002-07-11 スクライブ装置

Publications (2)

Publication Number Publication Date
CN1472032A CN1472032A (zh) 2004-02-04
CN1328194C true CN1328194C (zh) 2007-07-25

Family

ID=30437330

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031459129A Expired - Fee Related CN1328194C (zh) 2002-07-11 2003-07-11 切割装置

Country Status (4)

Country Link
JP (1) JP2004042423A (enExample)
KR (1) KR20040007251A (enExample)
CN (1) CN1328194C (enExample)
TW (1) TW200400863A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100573259B1 (ko) * 2004-06-28 2006-04-24 주식회사에스엘디 열유발 크랙 전파를 이용한 레이저 절단 장치
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
TWI454433B (zh) * 2005-07-06 2014-10-01 Mitsuboshi Diamond Ind Co Ltd A scribing material for a brittle material and a method for manufacturing the same, a scribing method using a scribing wheel, a scribing device, and a scribing tool
JP4675786B2 (ja) * 2006-01-20 2011-04-27 株式会社東芝 レーザー割断装置、割断方法
CN101108446A (zh) * 2006-07-21 2008-01-23 富士迈半导体精密工业（上海）有限公司 激光切割装置及方法
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
JP2009242184A (ja) * 2008-03-31 2009-10-22 Nippon Electric Glass Co Ltd 脆性板状物の切断方法及び切断装置
JP5193294B2 (ja) * 2008-05-30 2013-05-08 三星ダイヤモンド工業株式会社 レーザ加工装置およびレーザ加工方法
JP5332344B2 (ja) * 2008-06-30 2013-11-06 三星ダイヤモンド工業株式会社 チップホルダ及びホルダユニット
KR100958745B1 (ko) * 2009-11-30 2010-05-19 방형배 레이저를 이용한 스크라이빙 장치, 방법 및 스크라이빙 헤드
JP6424652B2 (ja) * 2015-02-02 2018-11-21 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
TWI543834B (zh) * 2015-04-24 2016-08-01 納諾股份有限公司 脆性物件切斷裝置及其切斷方法
CN107378908A (zh) * 2017-09-08 2017-11-24 广州市盛吉成智能科技有限公司 一种高端的剪切线速成器
CN111055256A (zh) * 2019-12-30 2020-04-24 湖南三一快而居住宅工业有限公司 双头划线装置和双头划线系统
CN113246089A (zh) * 2021-06-11 2021-08-13 中庆建设有限责任公司 一种测量划线装置
CN114734153B (zh) * 2022-03-31 2023-02-14 武汉华日精密激光股份有限公司 一种用于激光器加工脆性材料的裂片方法及系统
CN116352293B (zh) * 2023-06-02 2023-08-25 沧州领创激光科技有限公司 一种激光切割机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
CN1203202A (zh) * 1997-04-14 1998-12-30 肖特玻璃制造厂 分割易碎的平面工件、特别是平面玻璃制品的方法和装置
WO2001032349A1 (de) * 1999-10-29 2001-05-10 Schott Spezialglas Gmbh Verfahren und vorrichtung zum schnellen schneiden eines werkstücks aus sprödbrüchigem werkstoff

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
CN1203202A (zh) * 1997-04-14 1998-12-30 肖特玻璃制造厂 分割易碎的平面工件、特别是平面玻璃制品的方法和装置
US5984159A (en) * 1997-04-14 1999-11-16 Schott Glas Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass
WO2001032349A1 (de) * 1999-10-29 2001-05-10 Schott Spezialglas Gmbh Verfahren und vorrichtung zum schnellen schneiden eines werkstücks aus sprödbrüchigem werkstoff

Also Published As

Publication number Publication date
TW200400863A (en) 2004-01-16
KR20040007251A (ko) 2004-01-24
TWI292352B (enExample) 2008-01-11
CN1472032A (zh) 2004-02-04
JP2004042423A (ja) 2004-02-12

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070725

Termination date: 20130711