CN1319905C - 氧化镁-氧化锆砖的应用 - Google Patents

氧化镁-氧化锆砖的应用 Download PDF

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CN1319905C
CN1319905C CNB038085054A CN03808505A CN1319905C CN 1319905 C CN1319905 C CN 1319905C CN B038085054 A CNB038085054 A CN B038085054A CN 03808505 A CN03808505 A CN 03808505A CN 1319905 C CN1319905 C CN 1319905C
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T·维歇尔特
B·施马伦巴赫
M·盖斯
C·马伊切诺维克
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Abstract

本发明涉及一种氧化镁-氧化锆砖在玻璃熔融槽再生室中的应用,该熔融槽至少是部分地在还原气氛下操作。

Description

氧化镁-氧化锆砖的应用
耐火材料和产品大体上可分为基本产品和非基本产品。
基本类(烧制的)产品包括氧化镁-氧化锆产品(下面将被称作MZA)和以氧化镁-锆石为基础的产品(下面将被称作MZ)。
MZA产品通常是以烧结和/或熔融的氧化镁和二氧化锆(ZrO2)为基础制成的。从矿物学上看,它们包括方镁石(MgO)和稳定的或不稳定的二氧化锆,同时,它们还常常包括,有时是少量的锆酸钙,以及少量的硅酸盐相。
如果二氧化锆是部分或完全稳定的,通过扩散方法可产生直接键合的哦MgO-ZrO2。通过这种方法可改善其机械热特性。
MZA砖具有很高的散裂抵抗力和很高的折射能力。因此,它们主要用于煅烧石灰、白云石、菱镁石,或水泥的旋转管式窑或竖式窑。
典型的一批MZ产品包括烧结的和/或熔融的氧化镁和硅酸锆(ZrO2 xSiO2)。硅酸锆与氧化镁反应生成镁橄榄石和稳定的二氧化锆。通常并不是所有的氧化镁组份都转化成镁橄榄石。因此,矿物学上的方镁石组份仍留在砖中。由于它们良好的耐化学性,特别是耐碱、碱盐和/或SO2/SO3的特性,MZ制品可用于玻璃熔融炉的再生室。
这种MZA/MZ制品的相关技术和典型配方,可见于Gerald Routschka:(ISBN 3-8027-3146-8)的“Taschenbuch feuerfeste Werkstoffe”[防火材料手册]。
本发明涉及本身是已知的产品氧化镁-氧化锆,但也涉及氧化镁-氧化锆产品在玻璃熔融炉再生室中的应用,上述熔融炉至少是暂时地或定期地在一种还原的气氛下操作。
正如前言和Routschka所引用的文献中所述,到目前为止,氧化镁-硅酸锆产品一直都用在玻璃熔融槽的包封中,特别是用在这种包封材料的碱金属硫酸盐的冷凝区。该区的温度为800-1100℃。
为了减少废气中NOx的含量,有人建议玻璃熔融槽应在还原气氛下操作。在这种情况下,废气中NOx的含量可以减少2/3-5/6。
其缺点是,在再生室中的废气一侧发生“束”(”skeins”)的还原,
这会对氧化镁-硅酸锆砖的使用寿命产生不利的影响。材料中至少有部分的镁橄榄石(Mg2SiO4)分解成钠/镁硅酸盐。含CaO的硅酸盐相也会转化。结果,包封材料不再具有所需的稳定性。
令人惊奇的是,现在人们已经确定,如果不使用已知建议用于玻璃槽再生室的MZ产品,而使用以氧化镁-氧化锆(MZA)为基础的产品,就可避免这类问题。
人们对其具有决定性意义的优点表示怀疑的地方在于:这些产品的硅酸盐比例要比MZ产品低得多,因此不会发生上述显微结构的破坏,或发生破坏的程度很小。
ZrO2对碱冷凝区的腐蚀物质具有极好的耐腐蚀性,即使玻璃熔融罐是在还原气氛下操作,而且还原气氛相应地达到再生室。即使玻璃熔融槽只是暂时在还原气氛下操作,情况也是如此。
对要求保护的应用而言,砖(包封砖)的导热系数(MLF)是一个重要的参数,同时,比热容量(C)或相关体积热容量(比热容量c和表观密度R的产品)也是重要的。此外,导热系数与比热容量或体积相关热容量的比例也是值得关注的。
使用所述的MZA产品可以使各种参数得到理想的数值,即:
-高的导热系数可以确保热量理想地快速通过砖,
-比氧化锆砖的比热容量高大约50%的比热容量,例如,可以储存更多的热量。
-理想的/更快的温度平衡使得有可能得到更高的热扩散系数值(超过1m2/秒)。
与C2S键合的氧化镁砖相比,MZA制品也具有显著的优点。C2S产品的硅酸二钙相中的方镁石和CaO会被废气中的SO3分别转化成硫酸盐或硫化物。这又会使砖的显微结构受到破坏。
对所列的应用而言,SiO2的含量(硅酸盐相)越低,砖的特性就越理想。按照一个实施方案,SiO2的含量要低于1.0重量%,按照另一个实施方案,其含量要低于0.5重量%(相对于总批量和/或总的模制部件)。
按照一个实施方案,CaO的含量(例如,CaO可以锆酸钙的形式提供)低于2重量%。
MZA制品的矿物学组成可在已知范围内变动(Routschka,op.Cit.)。
该产品包括5-35重量%ZrO2、65-95重量%MgO和其它组份最多为5重量%。按照另一个实施方案,产品中包括最多2%的其它组份。
按DIN EN 993-第1章测定的开口孔隙率为11-15体积%,或按照一个实施方案为12-14体积%之间。
在1700℃以上温度下烧制之后,表观密度可以达到3.20-3.60g/cm3,或按照一个实施方案可以达到3.25-3.40g/cm3。在这种情况下,表观密度是按DIN EN 993-第1章进行测定。
按DIN EN 993-第5章关于烧制制品的条款进行测定,冷耐压强度为50-150N/mm2,或按照一个实施方案为70-85N/mm2
导热系数(按Ber.Dtsch.Keram.Ges.[德国陶瓷协会报告]34(1957),183-189中的其它物品中间的“分类”进行测定)在3-4W/Km(1000℃)的范围内。
一批材料的粒度大小原则上不受限制。可通过二氧化锆矿引入二氧化锆,作为商业生产的二氧化锆(不稳定的、部分稳定的或完全稳定的)的比例在<0.5mm的范围内,例如,可分成(大约)一半,按照一个实施方案为<0.1和0.1-0.5mm之间。
按照一个实施方案,烧结氧化镁或熔融氧化镁组份使用的粒度范围达6mm。在这种情况下,>1mm的组份可能构成2/3氧化镁总加料量的一半。下面将详述两种配方/批次的内容,包括烧制之后所达到的特性特点。
用这种方法制成的砖,成功地在一个工程实验中进行了试验,改善了(玻璃熔融槽)包封操作中所发生的状况。上述砖特别在还原气氛下进行了试验,其本身表明优于传统的氧化镁-硅酸锆砖。
  样品1   样品2
  氧化镁(MgO)<1mm   30%   20%
  氧化镁(MgO)<1-6mm   50%   50%
  ZrO2 0.1-0.5mm   0   15
  ZrO2<0.1mm   20   15
  格林表观密度(g/cm3)   3.32   3.46
  烧制(℃)   1750   1750
  烧制后的表观密度(g/cm3)   3.35   3.50
  开口孔隙率(%)   12.5   14
  冷耐压强度(N/mm2)   55   80

Claims (6)

1.一种氧化镁-氧化锆砖在玻璃熔融炉再生室中的应用,该熔融炉至少是部分地在还原气氛下操作,上述氧化镁-氧化锆砖中,包括5-35重量%ZrO2、65-95重量%MgO和最多5重量%的其它组份,其中SiO2的含量<1.0重量%。
2.权利要求1的应用,其中的砖的CaO含量<2.0重量%。
3.权利要求1的应用,其中的砖包括最多2%的其它组份。
4.权利要求1的应用,其中砖的开口孔隙率为11-15体积%。
5.权利要求1的应用,其中烧制后的砖的表观密度为3.20-3.60g/cm3
6.权利要求1的应用,其中烧制后的砖的冷耐压强度为50-150N/mm2
CNB038085054A 2002-04-17 2003-03-06 氧化镁-氧化锆砖的应用 Expired - Fee Related CN1319905C (zh)

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DE10216879A DE10216879B4 (de) 2002-04-17 2002-04-17 Verwendung eines Magnesiazirkoniasteins

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US20070213198A1 (en) * 2006-03-08 2007-09-13 Harbison-Walker Refractories Company Refractory composition
EP2190792A1 (en) * 2007-09-03 2010-06-02 Vitro Global, S.A. Method for melting glass
US20090272150A1 (en) * 2007-11-02 2009-11-05 Lawrence Henry Kotacska Corrosion-resistant cradle and castable materials for glass production
FR2977661B1 (fr) * 2011-07-07 2015-05-08 Saint Gobain Ct Recherches Installation thermique a regenerateur et son procede de fabrication
CN107266085B (zh) * 2017-06-09 2020-04-17 西安建筑科技大学 一种锆酸铁钡蓄热材料、制备方法及其应用

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