CN1319889A - 以高导热率模压嵌入件封装电源 - Google Patents

以高导热率模压嵌入件封装电源 Download PDF

Info

Publication number
CN1319889A
CN1319889A CN01101668.XA CN01101668A CN1319889A CN 1319889 A CN1319889 A CN 1319889A CN 01101668 A CN01101668 A CN 01101668A CN 1319889 A CN1319889 A CN 1319889A
Authority
CN
China
Prior art keywords
thermally conductive
insert
electronic circuit
recited
conductive insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN01101668.XA
Other languages
English (en)
Chinese (zh)
Inventor
陈肖炯(音译)
罗杰·J·胡伊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of CN1319889A publication Critical patent/CN1319889A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
CN01101668.XA 2000-02-01 2001-01-19 以高导热率模压嵌入件封装电源 Pending CN1319889A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/496,121 US6317324B1 (en) 2000-02-01 2000-02-01 Encapsulated power supply with a high thermal conductivity molded insert
US09/496,121 2000-02-01

Publications (1)

Publication Number Publication Date
CN1319889A true CN1319889A (zh) 2001-10-31

Family

ID=23971323

Family Applications (1)

Application Number Title Priority Date Filing Date
CN01101668.XA Pending CN1319889A (zh) 2000-02-01 2001-01-19 以高导热率模压嵌入件封装电源

Country Status (4)

Country Link
US (1) US6317324B1 (enExample)
EP (1) EP1122991A3 (enExample)
JP (1) JP2001251076A (enExample)
CN (1) CN1319889A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102377922A (zh) * 2010-08-16 2012-03-14 佳能株式会社 能够有效地散热的摄像设备
CN104284559A (zh) * 2013-07-12 2015-01-14 Tdk株式会社 电源装置和电源装置的制造方法
CN112653299A (zh) * 2019-10-11 2021-04-13 株式会社捷太格特 控制装置和马达装置

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6491528B1 (en) * 1998-12-24 2002-12-10 At&T Wireless Services, Inc. Method and apparatus for vibration and temperature isolation
USD465199S1 (en) 2002-03-22 2002-11-05 Densei-Lambda Kabushiki Kaisha Power supply
USD464317S1 (en) 2002-03-22 2002-10-15 Densei-Lambda Kabushiki Kaisha Power supply
US7200011B2 (en) * 2003-05-02 2007-04-03 Astec International Limited Thermal interface adapter plate conversion kit and method
US7259971B1 (en) * 2003-08-04 2007-08-21 Z-Axis, Inc. Encapsulated electronic power converter with embedded AC components
US7095615B2 (en) * 2003-11-13 2006-08-22 Honeywell International, Inc. Environmentally tuned circuit card assembly and method for manufacturing the same
WO2005069462A1 (ja) * 2004-01-13 2005-07-28 Taisei Plas Co., Ltd. ジャンクション用電装品とその製造方法
US20050213305A1 (en) * 2004-03-24 2005-09-29 Patton Electronics, Co. Integrated internal power supply
JP2006203086A (ja) * 2005-01-24 2006-08-03 Citizen Electronics Co Ltd 電子部品パッケージ及びその製造方法
US20060286845A1 (en) * 2005-06-20 2006-12-21 Hinze Lee R Sealed fastenerless multi-board electronic module and method of manufacture
KR100677620B1 (ko) * 2005-11-22 2007-02-02 삼성전자주식회사 전자기기의 냉각 방법 및 냉각 효율이 향상된 전자기기
JP2008061399A (ja) * 2006-08-31 2008-03-13 Mitsumi Electric Co Ltd Ａｃアダプタ
ATE452052T1 (de) * 2007-05-21 2010-01-15 Magneti Marelli Spa Elektronische steuereinheit mit erweiterten blöcken
DE102007041419B4 (de) * 2007-08-31 2022-03-31 Sew-Eurodrive Gmbh & Co Kg Anordnung zum Kühlen von elektrischen Bauelementen sowie Umrichter und Kompaktantrieb damit
US20100202111A1 (en) * 2007-10-29 2010-08-12 Chien-Kuo Liang Hermetic modular power supply
JP4638923B2 (ja) * 2008-03-31 2011-02-23 日立オートモティブシステムズ株式会社 制御装置
USD794644S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD795261S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD795262S1 (en) * 2009-01-07 2017-08-22 Samsung Electronics Co., Ltd. Memory device
USD794643S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794641S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794642S1 (en) * 2009-01-07 2017-08-15 Samsung Electronics Co., Ltd. Memory device
USD794034S1 (en) * 2009-01-07 2017-08-08 Samsung Electronics Co., Ltd. Memory device
US8059411B2 (en) * 2009-07-29 2011-11-15 GM Global Technology Operations LLC Vehicular electronics assembly
WO2011069533A1 (en) * 2009-12-07 2011-06-16 Telefonaktiebolaget Lm Ericsson (Publ) An electronics arrangement
FR2956254B1 (fr) * 2010-02-09 2012-12-14 Peugeot Citroen Automobiles Sa Connecteur electrique a elements de connexion couples thermiquement par thermo-conduction
WO2012034190A1 (en) * 2010-09-17 2012-03-22 Intervention Technology Pty Ltd A power supply device and components thereof
CN102892277B (zh) * 2011-07-20 2016-08-03 光宝电子(广州)有限公司 电路板装置及其制造方法及具有该电路板装置的电源供应器
AU2011301708B2 (en) * 2011-09-16 2017-03-02 Intervention Technology Pty Ltd A power supply device and components thereof
US9561604B2 (en) * 2012-02-28 2017-02-07 Dialight Corporation Method and apparatus for sky-line potting
US10244644B2 (en) * 2015-12-04 2019-03-26 Continental Automotive Systems, Inc. Automotive electronic device having a cover with fins to reduce gel vibration
GB2564188B (en) 2017-04-24 2022-02-09 Fuji Polymer Ind Silicone sheet and mounting method using the same
DE102019219230A1 (de) * 2019-12-10 2021-06-10 Robert Bosch Gmbh Verfahren zur Ausbildung eines Elektronikmodules

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3590327A (en) * 1969-04-24 1971-06-29 Transmation Inc System for maintaining uniform temperature conditions throughout a body
US4029999A (en) * 1975-04-10 1977-06-14 Ibm Corporation Thermally conducting elastomeric device
US5060113A (en) * 1987-04-09 1991-10-22 Raychem Corporation Connector assembly
US5381304A (en) * 1993-06-11 1995-01-10 Honeywell Inc. Reworkable encapsulated electronic assembly and method of making same
EP0926939B1 (en) * 1997-12-24 2003-03-26 Denso Corporation Electronic circuit apparatus and method for assembling the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102377922A (zh) * 2010-08-16 2012-03-14 佳能株式会社 能够有效地散热的摄像设备
CN104284559A (zh) * 2013-07-12 2015-01-14 Tdk株式会社 电源装置和电源装置的制造方法
CN104284559B (zh) * 2013-07-12 2017-09-22 Tdk株式会社 电源装置和电源装置的制造方法
CN112653299A (zh) * 2019-10-11 2021-04-13 株式会社捷太格特 控制装置和马达装置

Also Published As

Publication number Publication date
US6317324B1 (en) 2001-11-13
EP1122991A3 (en) 2003-08-27
JP2001251076A (ja) 2001-09-14
EP1122991A2 (en) 2001-08-08

Similar Documents

Publication Publication Date Title
CN1319889A (zh) 以高导热率模压嵌入件封装电源
CN205452265U (zh) 电子功率模块
US3706840A (en) Semiconductor device packaging
US6886625B1 (en) Elastomeric heat sink with a pressure sensitive adhesive backing
CN109935574B (zh) 半导体模块和用于生产半导体模块的方法
JP4479121B2 (ja) 半導体装置の製造方法
JP3605547B2 (ja) 放熱基板及びその製造方法
US5615087A (en) Insulated surface mount circuit board construction
US5139973A (en) Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet
EP1722612A1 (en) Component mounting board structure and production method thereof
EP0936671A1 (en) Resin-moulded semiconductor hybrid module and manufacturing method thereof
US20030122232A1 (en) Semiconductor power device
JP2004500718A (ja) オプションで窓となる蓋を備えるリードレス半導体製品パッケージング装置とその組み立て方法
EP0884828A3 (en) Drive package for a dynamoelectric machine
US6128195A (en) Transfer molded PCMCIA standard cards
CN1129964C (zh) 耐热性优异的固态传感器件及其制造方法
CN1110089C (zh) 一种半导体器件
CN1130767C (zh) 具有高辐射特性的半导体器件及其制造方法
CN216145606U (zh) 半导体电路
US6758200B2 (en) Ignition coil driver chip on printed circuit board for plughole coil housing
JP3169578B2 (ja) 電子部品用基板
JP2000174203A (ja) 半導体装置及びその製造方法
EP4205942B1 (en) Injection mold and injection molding method
CN215911397U (zh) 包封针翅型功率模块的模具
CN85104878A (zh) 电子线路器件的封装及其制造方法和设备

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication