CN1316611C - Wafer-level semiconductor package having lamination structure and making method thereof - Google Patents
Wafer-level semiconductor package having lamination structure and making method thereof Download PDFInfo
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- CN1316611C CN1316611C CNB2004100294891A CN200410029489A CN1316611C CN 1316611 C CN1316611 C CN 1316611C CN B2004100294891 A CNB2004100294891 A CN B2004100294891A CN 200410029489 A CN200410029489 A CN 200410029489A CN 1316611 C CN1316611 C CN 1316611C
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- reinforced structure
- stereoplasm frame
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000003475 lamination Methods 0.000 title 1
- 239000011521 glass Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 claims description 62
- 239000003822 epoxy resin Chemical group 0.000 claims description 14
- 229920000647 polyepoxide Chemical group 0.000 claims description 14
- 229920001721 polyimide Chemical group 0.000 claims description 7
- 239000009719 polyimide resin Chemical group 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
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- 239000007769 metal material Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 230000032798 delamination Effects 0.000 abstract description 8
- 239000003292 glue Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
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- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Abstract
The present invention relates to a wafer-grade semiconductor package piece with a layer increased structure, which comprises a glass frame, at least one chip, buffer materials with a low module, a layer increased structure and a plurality of conducting assembles, wherein the glass frame is provided with a through hole; the chip is contained in the through hole of the glass frame; the buffer materials with a low module is filled in a gap formed between the chip and the glass frame; the layer increased structure is formed on the chip and the glass frame and is electrically connected with the chip; the conducting assembles are welded on the layer increased structure for being electrically connected with the chip and external devices. Through using the glass frame and the buffer materials with a low module, the wafer-grade semiconductor package piece of the present invention has no problems of warpage, chipping and delamination of the structure and can be effectively thinned so as to conform to the demand of thin products. In addition, the present invention can reduce the package cost without the need of using a glue injection mould and is not easy to absorb moisture, and the reliability degree of the product can be raised. The present invention also further provides a method for manufacturing the wafer-grade semiconductor package piece.
Description
Technical field
The invention relates to a kind of wafer level semiconductor packaging part and method for making thereof, particularly go up and form layer reinforced structure, make for soldered ball and plant wafer level semiconductor packaging part and the method for making thereof that contact (External Contacts) extends out out this chip action face that expose that connects about a kind of action face (Active Surface) at chip.
Background technology
Along with electronic product to compact development, the semiconductor package part of electronic product core component also develops towards miniaturization (Miniaturization) direction.A kind of form that the miniaturization semiconductor package part that is developed in this area is that (Chip Scale Package, CSP), the size that it is characterized in that this chip scale package equals or approximately greater than 1.2 times of chip size chip scale package.
Semiconductor package part also must improve integrated level and electrically connect the quantity of the I/O end (I/O Contact) of usefulness with external device such as circuit board on size the miniaturization, just can meet the demand of electronic product on high-performance and high processing rate.And the mode of increase I/O terminal number amount, generally be the weld pad of on the action face of chip, laying as much as possible (Bond Pads), but the weld pad quantity of laying on the action face of chip must be subject to the area and the spacing between weld pad (Pitch) of action face; For further lay the I/O end of greater number on limited area, the wafer-level packaging part has appearred, as wafer stage chip level packaging part (Wafer Level CSP).
The wafer-level packaging part uses a kind of lead rerouting technology (Redistribution LayerTechnology, RDL), it forms dielectric layer (DielectricLayer) on the action face of chip, the weld pad on the action face of exposed chip beyond the perforate on the dielectric layer again, on this dielectric layer, form many leads then, make an end of this lead respectively be electrically connected to weld pad on the chip, the other end then forms contact (contact), then, on dielectric layer, lay solder mask layer (Solder Mask Layer), to cover this lead and weld pad, at last, in this solder mask layer, form a plurality of perforates (opening), the contact of this lead can be exposed outside from the perforate of correspondence, for the soldered ball welding.The layer reinforced structure (Build-up Layer) that this utilization lead rerouting technology forms though can effectively increase chip and the extraneous I/O terminal number amount that electrically connects, but it still is subject to the limited area on the action face of chip.
Be further to increase the I/O terminal number amount that chip externally electrically connects, solution is that the laying scope with the I/O end extends out (Fan-out) zone to the action face of chip.This kind makes layer reinforced structure extend to the semiconductor package part of chip with exterior domain, see the U.S. the 6th, 271, No. 469 patents, as shown in Figure 7, the 6th, 271, the semiconductor package part 6 that No. 469 patent disclosed is that chip 60 is coated in the colloid 62 that mold pressing program (Molding Process) forms, the action face 602 of this chip 60 exposes outside the surface 622 of this colloid 62 after colloid 62 forms, layer reinforced structure 64 is (by dielectric layer 642, lead 644 and solder mask layer 646 constitutes) then be formed on the surface 622 of the action face 602 of this chip 60 and colloid 62, this layer reinforced structure 64 electrically connects by the weld pad 604 of lead 644 with chip 60, with plant at soldered ball 66 be connected on this layer reinforced structure 64 and electrically connect with lead 644 after, this chip 60 can be by soldered ball 66 and extraneous electric connection.
Though the structure of this semiconductor package part 6 can provide the laying area of bigger I/O end, thereby can increase I/O terminal number amount, but this colloid 62 is not to be formed on the higher substrate of hardness (Substrate), and the position that middle position ratio of setting chip 60 is not set chip on every side is thin, so warpage easily takes place in the temperature cycles of successive process, and the stress influence of concentrating, be that 624 place often has cracked (Crack) phenomenon to produce at label; Simultaneously, because chip 60 is roughly coated by colloid 62, (Coefficient ofThermal Expansion, difference CTE) is big, causes the delamination (Delamination) between chip 60 and colloid, and influences the quality of manufactured goods because of both thermal coefficient of expansions in meeting.
Be the shortcoming of the semiconductor package part that solves the 6th, 271, No. 469 patents of the aforementioned U.S., the U.S. the 6th, 498, No. 387 patent provides a kind of semiconductor package part with the glass plate carries chips.As shown in Figure 8, this semiconductor package part 7 is with chip 70 sticking putting on glass plate 71, then, epoxy resin coating layer (Epoxy) 72 on chip 70, after these chip 70 coatings, the weld pad 702 on the exposed chip 70 beyond the perforate in this epoxy resin layer 72, then, on this epoxy resin layer 72, form the many leads 73 that electrically connect with this weld pad 702, on this epoxy resin layer 72, lay solder mask layer 74 again to cover this lead 73, then, the lead 73 of exposed portions serve beyond the perforate on this solder mask layer 74 supplies soldered ball 75 to plant and is connected on the lead 72 that exposes.
This U.S. the 6th, 498, No. 387 patents are with the bearing part of glass plate 71 as chip 70, utilize the hard characteristic of these glass plate 71 matter, can solve the colloid warpage of the 6th, 271, No. 469 patents and cracked problem, and, cause the problem of delamination so also there is not above-mentioned CTE difference because of glass plate 71 is close with the CTE of chip 70; Yet, this chip 70 is sticking putting on glass plate 71, makes the 6th, 498, the integral thickness of the semiconductor package part 7 of No. 387 patents is chip 70, glass plate 71 and the thickness sum that is formed at the layer reinforced structure on this chip 70, make semiconductor package part 7 effectively thinning to meet the requirements.In addition, this chip 70 is coated fully by epoxy resin layer 72, tend to because of chip 70 and epoxy resin layer 72 in the temperature cycles of difference on the thermal coefficient of expansion (CTE Mismatch) in successive process, cause chip 70 to be heated stress influence and rhegma take place.Simultaneously, the side 720 of this epoxy resin layer 72 directly is exposed in the atmosphere, can be because of the moisture absorption height of epoxy resin itself, cause extraneous aqueous vapor to accumulate on the action face of chip 70 via epoxy resin layer 72, so can cause gas explosion (Popcorn) problem, the reliability of manufactured goods can't be improved.
As from the foregoing, the 6th, 271,469 and 6,498, the semiconductor package part of No. 387 patents all has some urgency problem to be solved.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of wafer level semiconductor packaging part with layer reinforced structure that does not have warpage, cracked and delamination problems and can improve reliability.
Another object of the present invention is to provide the wafer level semiconductor packaging part with layer reinforced structure of a kind of effectively thinning to satisfy the demands.
A further object of the present invention is to provide a kind of and need not uses the injecting glue mould and can reduce the method for making of the wafer level semiconductor packaging part with layer reinforced structure of packaging cost.
Another purpose of the present invention is to provide a kind of and is difficult for moisture absorption and can improves the wafer level semiconductor packaging part with layer reinforced structure of production reliability.
For reaching above-mentioned and other purpose, the invention provides a kind of wafer level semiconductor packaging part with layer reinforced structure, it comprises: the stereoplasm frame that offers at least one through hole; At least one is installed with the chip in this stereoplasm frame, and is formed with the gap between this chip and stereoplasm frame; Be used to fill the low modulus padded coaming in this gap; Be formed at the layer reinforced structure on this chip and the stereoplasm frame, make this layer reinforced structure and chip form electrical connection; And conductive component a plurality of and that this layer reinforced structure electrically connects.
When the thickness of this chip and stereoplasm frame is identical, non-action face (the InactiveSurface of this chip, action face with respect to chip and layer reinforced structure electric connection) exposes outside this semiconductor package part, can supply fin (Heat Sink or Heat Spreader) and this non-action face bonding, with the direct loss of heat that produces during with chip operation by this fin to extraneous, thereby can improve radiating effect.When the thickness of this chip was slightly less than stereoplasm frame, this low modulus padded coaming then can cover the non-action face of this chip, to provide this chip preferable protection effect.
This layer reinforced structure such as the above-mentioned the 6th, 271,469 and 6,498, No. 387 United States Patent (USP) discloses, be by at least one dielectric layer, a plurality of leads that are formed on this dielectric layer and electrically connect with weld pad on the action face of chip, and be coated on this dielectric layer and the lead and be formed with for the solder mask layer formation of conductive component with the perforate of lead electric connection.
The present invention provides a kind of method for making with wafer level semiconductor packaging part of layer reinforced structure simultaneously, and it comprises the following steps: to prepare to have and a plurality ofly is the stereoplasm frame of the through hole that array way arranges and is placed in the jig of carrying usefulness; At least one chip is seated in via the through hole of correspondence on the jig of this carrying usefulness, and maintains default gap between all sides of this chip and stereoplasm frame; In this gap, fill low modulus padded coaming, this chip and stereoplasm frame should be separated by low modulus padded coaming; After toasting this fender, the jig of this carrying usefulness is separated with hard substrate; Form the layer reinforced structure that electrically connects with this chip; In this layer reinforced structure, plant a plurality of conductive components that electrically connect with this layer reinforced structure, electrically connect by this conductive component and external device for this chip; And cut one way preface (Singulation) to form a plurality of wafer level semiconductor packaging parts with layer reinforced structure.
Another method for making provided by the invention may further comprise the steps: will insert carrying with in the accommodating groove of jig by the module board that stereoplasm frame constituted with through hole that a plurality of one-tenth array way are arranged, and make this carrying with on the jig bonding a plurality of chips be accommodated in the through hole of this corresponding stereoplasm frame and the gap that formation is preset between this chip and corresponding stereoplasm frame respectively; To hang down the modulus padded coaming and be filled in this gap, this chip and stereoplasm frame should be separated by low modulus padded coaming; This module board of taking in chip is separated with jig with carrying; Form layer reinforced structure on this module board and chip, and this chip and layer reinforced structure are electrically connected, and make a plurality of conductive components be electrically connected to this layer reinforced structure; And cut single job to form the wafer level semiconductor packaging part that this has layer reinforced structure.
In addition, " stereoplasm frame " of notice among the present invention is defined as the framework made from existing chemical materials, at high temperature or can not produce the phenomenon of buckling deformation in the temperature cycles (Temperature Cycle); Low modulus padded coaming then is defined as has thermoelasticity effect (Thermoelastic) and the low material of thermal coefficient of expansion.
In sum, wafer level semiconductor packaging part of the present invention and method for making thereof, the packaging part with layer reinforced structure that no warpage, no cracked and no delamination problems can be provided and can improve reliability, the product that can effectively produce thinning is to satisfy the demands, need not use the injecting glue mould and can reduce packaging cost, have the characteristics that are difficult for moisture absorption and can improve production reliability simultaneously.
Description of drawings
Fig. 1 is the cutaway view of the wafer level semiconductor packaging part of the embodiment of the invention 1;
Fig. 2 A to Fig. 2 G is the steps flow chart schematic diagram of the method for making of wafer level semiconductor packaging part shown in Figure 1;
Fig. 3 A to Fig. 3 D is the schematic flow sheet of another example of wafer level semiconductor packaging part shown in Figure 1 step before forming layer reinforced structure;
Fig. 4 is the cutaway view of the wafer level semiconductor packaging part of the embodiment of the invention 3;
Fig. 5 is the cutaway view of the wafer level semiconductor packaging part of the embodiment of the invention 4;
Fig. 6 is the front view of another example of the employed stereoplasm frame of wafer level semiconductor packaging part of the present invention;
Fig. 7 is the cutaway view of the 6th, 271, No. 469 patents of the U.S.; And
Fig. 8 is the cutaway view of the 6th, 498, No. 387 patents of the U.S..
Embodiment
Embodiment 1
Following conjunction with figs. describes wafer level semiconductor packaging part and the method for making thereof with layer reinforced structure of the present invention in detail.
As shown in Figure 1, the wafer level semiconductor packaging part with layer reinforced structure 1 of the present invention mainly by the stereoplasm frame 10 with through hole 100, be placed in this stereoplasm frame 10 through hole 100 in chip 11, be filled in 11 of this stereoplasm frame 10 and chips low modulus padded coaming 12, be formed at the layer reinforced structure 13 on this stereoplasm frame 10 and the chip 11 and plant a plurality of soldered balls (being above-mentioned conductive component) 14 that are connected on this layer reinforced structure 13 and constitute.
This stereoplasm frame 10 is by glass material, metal material (as copper metal etc.), thermosets is (as polyimide resin (Polyimide Resin), BT resin (Bismaleimide Triazine Resin), and material such as FR-4 is made, this stereoplasm frame 10 is not owing to can produce buckling deformation under the temperature cycles in hot environment or processing procedure, so with its main body (Primary Structured body) as wafer level semiconductor packaging part 1, the wafer level semiconductor packaging part that encapsulation is finished does not just have warpage issues, and its rigid nature can not take place as the 6th, 271, No. 469 described colloids of United States Patent (USP) easily produce the problem of rhegma (Crack) at the angle of ccontaining chip groove end.The through hole 100 of this stereoplasm frame 10 runs through the first surface 101 and the opposing second surface 102 of this stereoplasm frame 10, and should be formed at the central part of this stereoplasm frame 10.
11 of this chips have the action face 110 that is formed with electronic building brick (Electronic Components) and electronic circuit (Electronic Circuits) and with respect to the non-action face 111 of this action face 110, when this chip 11 is accommodated in the through hole 100 of stereoplasm frame 10, make first surface 101 coplines of its action face 110 and stereoplasm frame 10, make second surface 102 coplines of its non-action face 111 and stereoplasm frame 10, just, this moment, chip 11 had identical thickness with stereoplasm frame 10; Simultaneously, when this chip 11 placed the through hole 100 of this stereoplasm frame 10, this chip 11 was separated with a gap mutually with stereoplasm frame 10, made both unlikely contacts.Also be formed with a plurality of weld pads 112 on the action face 110 of this chip 11 in addition.
Should low modulus padded coaming 12 be low modulus as polyimide resin, silica gel, materials such as epoxy resin, behind the gap that is filled in 10 of this chip 11 and stereoplasm frames, its rubber-like characteristics, can become the buffer medium of 10 of chip 11 and stereoplasm frames, with in the temperature cycles of processing procedure, thermal stress because of 11 generations of the 10 pairs of chips of the stereoplasm frame that difference produced on stereoplasm frame 10 and 11 thermal coefficient of expansions of chip, can should effectively be discharged by low modulus padded coaming 12, make the problem of the no cracked and delamination of chip 11, so can improve the acceptance rate and the reliability of wafer level semiconductor packaging part 1 manufactured goods of the present invention.
This layer reinforced structure 13 mainly is by the lead 131 that is laid in that dielectric layer 130 on this chip 11 and the stereoplasm frame 10, many are formed on this dielectric layer 130 and electrically connects with weld pad 112 on the chip 11 and the solder mask layer 132 that is used to cover this dielectric layer 130 and lead 131 constitutes.Because this layer reinforced structure 13 and generation type thereof are prior art, so do not repeat them here.Simultaneously, this layer reinforced structure 13 can form at least one dielectric layer and many leads (figure is mark not) as required again on this dielectric layer 130 and lead 131.
Fig. 2 A to Fig. 2 G is the step schematic diagram of above-mentioned wafer level semiconductor packaging part 1 method for making.
With reference to Fig. 2 A, the first step of the wafer level semiconductor packaging part method for making of the embodiment of the invention 1 be prepare the module board 10 made by glass material ', it includes the stereoplasm frame 10 (separating with dotted line) that a plurality of central authorities have rectangle through hole 100, and each stereoplasm frame 10 has first surface 101 and opposing second surface 102.
With reference to Fig. 2 B, with this module board 10 ' storing to the accommodating groove 160 of the jig 16 that carries usefulness, the jig 16 of this carrying usefulness offers the through hole 161 that leads to its accommodating groove 160, each this through hole 161 offer the position be respective modules plate 10 ' the central authorities of through hole 100.
With reference to Fig. 2 C, in each through hole 100, place a chip 11, the storing mode of chip 11 is to make the action face 110 of chip 11 down in the face of the through hole 161 of jig 16, its 111 of non-action face exposes in the atmosphere up.Simultaneously, the thickness of this chip 11 be made as with this module board 10 ' thickness identical, be carried on this module board 10 ' when going up so chip 11 is inserted in the through hole 100, this non-action face 111 is second surface 102 coplines with each stereoplasm frame 10.In addition, the sectional area of this through hole 100 is greater than the area of this chip 11, thereby, when chip 11 is inserted through hole 100, can not contact between all sides of this chip 11 and the hole wall of through hole 100, but be formed with default gap S.Have again, chip 11 is carried on the precalculated position of jig 16 via through hole 100 after, discharges and make respectively these chip 11 vacuum suction on this carrying usefulness jig 16 with being about to air in the through hole 161.
With reference to Fig. 2 D, because this module board 10 ' have a function as the web plate of screen printing (Screen Printing) usefulness, so need not use under the situation of web plate separately, scraper 15 with stencil printing will be as the low modulus padded coaming 12 of silica gel, epoxy resin or polyimides etc., be packed into the gap S of 10 of each chip 11 and stereoplasm frames, just, this chip 11 is promptly separated with stereoplasm frame 10 by low modulus padded coaming 12.
With reference to Fig. 2 E, after suitable baking should low modulus padded coaming 12 (figure is mark), be about to this module board 10 of taking in chip 11 ' separate with jig 16.
With reference to Fig. 2 F, coating dielectric layer 130 on the action face 110 of the first surface 101 of this stereoplasm frame 10 respectively and chip 11, again in existing mode, include but not limited to as photolithographic techniques (Photolithographic Technique) and laser drill (Laser Drilling) etc., offering perforation (figure is mark not) corresponding to weld pad 112 positions on the action face 110 of chip 11; Then, in any existing mode, include but not limited to as photolithographic techniques, on this dielectric layer 130, form multiple bar chart caseization (Patterned) lead 131, an end that makes this lead 131 respectively electrically connects via the perforation and the weld pad on the chip 11 112 of dielectric layer 130, with all sides of this chip 11 that extends outwardly out from this weld pad 112, and make respectively the other end of this lead 131 forms link (ContactTerminal) (figure is mark); Then, on this lead 131 and dielectric layer 130, lay solder mask layer 132, offer a plurality of perforates (figure is mark not) to expose outside the respectively link of this lead 131 in any existing mode again, plant respectively on the link that is connected to this lead 131 for a plurality of soldered balls 14, making respectively, this soldered ball 14 forms electrical connection with the layer reinforced structure 13 that is made of this dielectric layer 130, lead 131 and solder mask layer 132.The material of this soldered ball 14 itself and to plant the mode that is connected on the layer reinforced structure 13 all be prior art is so no longer narrate.
At last, shown in Fig. 2 G, cut single job (Singulation), to form wafer level semiconductor packaging part 1 as shown in Figure 1 with any existing mode.
From the above, the low modulus padded coaming 12 of 10 quilts of the chip 11 of wafer level semiconductor packaging part 1 of the present invention and stereoplasm frame is separated, so the thermal stress that this stereoplasm frame 10 is produced in the temperature cycles of processing procedure can should effectively be discharged by low modulus padded coaming 12.Simultaneously, with the main structure assembly of stereoplasm frame 10 as this wafer level semiconductor packaging part 1, need not be as prior art with potting compound (Molding Compound) coating chip, can simplify encapsulation procedure, avoid the existing colloid that forms by potting compound (Encapsulant) easily to produce warpage and cause the problem of the cracked and delamination of chip; This stereoplasm frame 10 can also as with the screen painting mode when the gap S of 10 of chip 11 and stereoplasm frames fills low modulus padded coaming 12 the web plate of palpus, make method for making of the present invention can save the use of web plate, so cost of manufacture and the goods, materials and equipments management cost that can save web plate, and then reduce packaging cost.
In addition, the chip 11 of wafer level semiconductor packaging part 1 of the present invention is accommodated in this stereoplasm frame 10, so the height of this wafer level semiconductor packaging part 1 is the height sum of stereoplasm frame 10, layer reinforced structure 13 and soldered ball 14, obviously than the 6th, 498, the height of No. 387 packaging parts that United States Patent (USP) disclosed (its be glass slide, chip, layer reinforced structure and soldered ball height and) little, make wafer level semiconductor packaging part 1 of the present invention can meet the demand of thinning.Thereby, if want further thinning wafer level semiconductor packaging part 1 of the present invention, then can be after the step shown in Fig. 2 D be finished, to the second surface 102 of this stereoplasm frame 10 respectively, the non-action face 111 of chip 11 and the surface that low modulus padded coaming 12 exposes, in any existing mode, include but not limited to mode, carry out grinding operation (Grinding), reduce with thickness with stereoplasm frame 10, chip 11 and low modulus padded coaming 12 as mechanical lapping.Because grinding operation is a prior art, so be not described in detail at this.
Embodiment 2
The method for making of the method for making that the embodiment of the invention 2 will disclose and the foregoing description 1 is roughly the same, so the conjunction with figs. that only will not exist together describes.
With reference to Fig. 3 A, the module board 20 that the stereoplasm frame 20 that preparation is arranged by a plurality of one-tenth array way constitutes ', each stereoplasm frame 20 also has rectangle through hole 200, first surface 201 and opposing second surface 202; Simultaneously, preparation has the carrying jig 26 of accommodating groove 260, stickup film 27 on the bottom surface of this accommodating groove 260, and the predeterminated position on this film 27 is sticking puts a plurality of chips 21, and the material of this film 27 select for use and carry with the adhesion strength of 26 of jigs greater than and chip 21 and module board 20 ' the material of adhesion strength.
With reference to Fig. 3 B, with this carrying of this module board 20 ' insert with in accommodating groove 260 of jig 26, so that this module board 20 ' sticking putting on this film 27, simultaneously, make chip 21 on the film 27 corresponding respectively and be accommodated in the through hole 200 of each stereoplasm frame 20, and make 20 formation of chip 21 and stereoplasm frame gap S.
With reference to Fig. 3 C, with this module board 20 ', will hang down among the gap S that modulus padded coaming material 22 is packed into chip 21 and stereoplasm frame 20 with the scraper 15 of stencil printing as web plate, separated by low modulus padded coaming 22 to make this chip 21 and stereoplasm frame 20.Simultaneously, the adhesion strength of 27 on the material of employed low modulus padded coaming 22 and film must be less than the adhesion strength of carrying with 27 on jig 26 and film.
With reference to Fig. 3 D, after these low modulus padded coaming 22 bakings are finished, this is taken in the module board 20 of chip 21 ' separate with jig 26 with this carrying, because the adhesion strength that this carrying usefulness jig 26 and film are 27, greater than this module board 20 ', the adhesion strength of 27 on chip 21 and low modulus padded coaming 22 and film, so module board 20 ' with after carrying separates with jig 26, this film 27 still can stick on this carrying usefulness jig 26, can be with module board 20 ' disengaging.
All the other form layer reinforced structures, plant ball, cut step such as single identical with described in the embodiment 1, and manufactured goods are also identical, so other narrates.
Embodiment 3
Fig. 4 is the cutaway view of the wafer level semiconductor packaging part of the embodiment of the invention 3.Structure and the foregoing description 1 of the wafer level semiconductor packaging part 3 of this embodiment 3 are roughly the same, its difference be in, the thickness of its chip 31 is less than the thickness of stereoplasm frame 30, so in the time will hanging down modulus padded coaming 32 with stencil printing and be packed into the gap of chip 31 and stereoplasm frame 30, should hang down the non-action face 311 that modulus padded coaming 32 will cover chip 31, this chip 31 is all coated by this low modulus padded coaming 32 except that its action face 310.So, can reduce stereoplasm frame 30 and the precision requirement of chip 31 on consistency of thickness, so the thickness that will make chip 31 during less than the thickness of stereoplasm frame 30, both gaps should be 0.05 to 0.5mm, but better with 0.1mm.
Embodiment 4
Fig. 5 is the cutaway view of the wafer level semiconductor packaging part of the embodiment of the invention 4.The structure and the embodiment 1 of the wafer level semiconductor packaging part 4 of this embodiment 4 are roughly the same, its difference be in, for promoting radiating efficiency, coating thermal conductivity viscose glue 48 on the second surface 402 of non-action face 411 that this chip 41 exposes and stereoplasm frame 40, with fin 49 sticking putting on this thermal conductivity viscose glue 48, the heat that produces for chip 41 passes through these fin 49 direct loss to atmosphere then.
Embodiment 5
Fig. 6 is the front view of another example of the employed stereoplasm frame of wafer level semiconductor packaging part of the present invention.Roughly the same in stereoplasm frame 50 that this embodiment 5 is disclosed and the various embodiments described above, its difference be in, for further avoiding stress to concentrate causing stereoplasm frame 50 at the angle of through hole 500 end 500 ' chipping, to the angle end 500 of this through hole 500 ' carry out corners to handle, with the concentration effect of effective release stress, avoid stereoplasm frame 50 that rhegma (Crack) takes place.
Claims (27)
1. wafer level semiconductor packaging part with layer reinforced structure is characterized in that this semiconductor package part comprises:
Stereoplasm frame, it has a through hole;
At least one chip, it is accommodated in the through hole of this stereoplasm frame, and and this stereoplasm frame between be formed with the gap;
Low modulus padded coaming, it is filled between this chip and stereoplasm frame in the formed gap;
Layer reinforced structure, it is formed on this stereoplasm frame and the chip, and forms electrical connection with this chip; And
A plurality of conductive components, it is electrically connected to this layer reinforced structure, electrically connects for this chip and external device.
2. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that the thickness of this stereoplasm frame is identical with the thickness of this chip.
3. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that the thickness of this stereoplasm frame is greater than the thickness of this chip.
4. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 3 is characterized in that the thickness difference of this stereoplasm frame and chip chamber is preferably 0.05 to 0.5mm.
5. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 3 is characterized in that the thickness difference of this stereoplasm frame and chip chamber is preferably 0.1mm.
6. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that the non-action face of this chip exposes in the atmosphere.
7. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 6 is characterized in that, also can connect on the non-action face of this chip and establish fin.
8. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that, the non-action face of this chip is covered by this low modulus padded coaming.
9. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that this through hole is a rectangular opening.
10. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 9 is characterized in that the angle end of this through hole is by corners.
11. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that, a kind of the making in the cohort that this stereoplasm frame is made up of glass material, metal material and thermosets.
12. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that, this low modulus padded coaming is to be selected from a kind of in the cohort that silica gel, epoxy resin and polyimide resin form.
13. the wafer level semiconductor packaging part with layer reinforced structure as claimed in claim 1 is characterized in that this conductive component is a soldered ball.
14. the method for making with wafer level semiconductor packaging part of layer reinforced structure is characterized in that this method for making comprises the following steps:
Prepare a module board of arranging by a plurality of one-tenth array way that stereoplasm frame constituted with through hole;
This module board is inserted carrying with in the formed accommodating groove of jig;
In each through hole, insert at least one chip, make it to be carried on this carrying, and make between the corresponding stereoplasm frame of this chip and module board and be formed with default gap with on the jig;
To hang down the modulus padded coaming and be filled in this gap, this chip and stereoplasm frame should be separated by low modulus padded coaming;
This module board is separated with jig with carrying;
Form layer reinforced structure on this module board and chip, and make this layer reinforced structure be electrically connected to this chip, and make a plurality of conductive component conductions be connected to this layer reinforced structure; And
Cut single job to form the wafer level semiconductor packaging part that this has layer reinforced structure.
15. method for making as claimed in claim 14 is characterized in that, this low modulus padded coaming is to be web plate with this module board, inserts gap between chip and stereoplasm frame with stencil printing.
16. method for making as claimed in claim 14 is characterized in that, when the thickness of chip and stereoplasm frame was identical, the non-action face of this chip exposed outside this low modulus padded coaming.
17. method for making as claimed in claim 14 is characterized in that, during less than the thickness of this stereoplasm frame, the non-action face of this chip should be covered by low modulus padded coaming at the thickness of chip.
18. method for making as claimed in claim 14 is characterized in that, a kind of the making in the cohort that this stereoplasm frame is made up of glass material, metal material and thermosets.
19. method for making as claimed in claim 14 is characterized in that, this low modulus padded coaming is a kind of in the cohort formed of silica gel, epoxy resin and polyimide resin.
20. method for making as claimed in claim 14 is characterized in that, this conductive component is a soldered ball.
21. the method for making with wafer level semiconductor packaging part of layer reinforced structure is characterized in that this method for making comprises the following steps:
To insert carrying with in the accommodating groove of jig by the module board that stereoplasm frame constituted that a plurality of one-tenth array way are arranged with through hole, and make this carrying with on the jig bonding a plurality of chips be accommodated in the through hole of this corresponding stereoplasm frame and the gap that formation is preset between this chip and corresponding stereoplasm frame respectively;
To hang down the modulus padded coaming and be filled in this gap, this chip and stereoplasm frame should be separated by low modulus padded coaming;
This module board of taking in chip is separated with jig with carrying;
Form layer reinforced structure on this module board and chip, and this chip and layer reinforced structure are electrically connected, and make a plurality of conductive components be electrically connected to this layer reinforced structure; And
Cut single job to form the wafer level semiconductor packaging part that this has layer reinforced structure.
22. method for making as claimed in claim 21 is characterized in that, this low modulus padded coaming is to be web plate with this module board, inserts gap between chip and stereoplasm frame with stencil printing.
23. method for making as claimed in claim 21 is characterized in that, when the thickness of chip and stereoplasm frame was identical, the non-action face of this chip exposed outside this low modulus padded coaming.
24. method for making as claimed in claim 21 is characterized in that, during less than the thickness of this stereoplasm frame, the non-action face of this chip should be covered by low modulus padded coaming at the thickness of chip.
25. method for making as claimed in claim 21 is characterized in that, a kind of the making in the cohort that this stereoplasm frame is made up of glass material, metal material and thermosets.
26. method for making as claimed in claim 21 is characterized in that, this low modulus padded coaming is selected from a kind of in the cohort of being made up of silica gel, epoxy resin and polyimide resin.
27. method for making as claimed in claim 21 is characterized in that, this conductive component is a soldered ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100294891A CN1316611C (en) | 2004-03-19 | 2004-03-19 | Wafer-level semiconductor package having lamination structure and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100294891A CN1316611C (en) | 2004-03-19 | 2004-03-19 | Wafer-level semiconductor package having lamination structure and making method thereof |
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| Publication Number | Publication Date |
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| CN1670952A CN1670952A (en) | 2005-09-21 |
| CN1316611C true CN1316611C (en) | 2007-05-16 |
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| CNB2004100294891A Expired - Fee Related CN1316611C (en) | 2004-03-19 | 2004-03-19 | Wafer-level semiconductor package having lamination structure and making method thereof |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100452330C (en) * | 2006-01-06 | 2009-01-14 | 日月光半导体制造股份有限公司 | The encapsulation structure of the optical component semiconductor and its encapsulation method |
| CN101567322B (en) * | 2008-04-21 | 2010-11-17 | 南茂科技股份有限公司 | Encapsulating structure and encapsulating method of chip |
| DE112012006656B4 (en) * | 2012-07-05 | 2021-08-05 | Mitsubishi Electric Corporation | Semiconductor device |
| US9373604B2 (en) * | 2014-08-20 | 2016-06-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structures for wafer level package and methods of forming same |
| TWI543320B (en) * | 2014-08-29 | 2016-07-21 | 矽品精密工業股份有限公司 | Semiconductor package and a method for fabricating the same |
| TWI652774B (en) * | 2017-03-03 | 2019-03-01 | 矽品精密工業股份有限公司 | Electronic package manufacturing method |
| WO2020103147A1 (en) * | 2018-11-23 | 2020-05-28 | 北京比特大陆科技有限公司 | Chip heat dissipation structure, chip structure, circuit board and supercomputing device |
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| US20020070443A1 (en) * | 2000-12-08 | 2002-06-13 | Xiao-Chun Mu | Microelectronic package having an integrated heat sink and build-up layers |
| US6455926B2 (en) * | 1999-09-03 | 2002-09-24 | Thin Film Module, Inc. | High density cavity-up wire bond BGA |
| US20030133274A1 (en) * | 2002-01-16 | 2003-07-17 | Kuo-Tso Chen | Integrated circuit package and method of manufacture |
| CN2591779Y (en) * | 2002-12-20 | 2003-12-10 | 台湾典范半导体股份有限公司 | Non-pin semiconductor assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6455926B2 (en) * | 1999-09-03 | 2002-09-24 | Thin Film Module, Inc. | High density cavity-up wire bond BGA |
| US20020070443A1 (en) * | 2000-12-08 | 2002-06-13 | Xiao-Chun Mu | Microelectronic package having an integrated heat sink and build-up layers |
| US20030133274A1 (en) * | 2002-01-16 | 2003-07-17 | Kuo-Tso Chen | Integrated circuit package and method of manufacture |
| CN2591779Y (en) * | 2002-12-20 | 2003-12-10 | 台湾典范半导体股份有限公司 | Non-pin semiconductor assembly |
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| CN1670952A (en) | 2005-09-21 |
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