JP2003258158A - Method for producing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a multiple wiring board for use in MAP from warping. <P>SOLUTION: After pellets 1 are bonded to a plurality of unit wiring boards 11 of the multiple wiring board 10 and a group of pellets 1 is sealed in batch with a resin-sealing body 23, the multiple wiring board 10 and the resin-sealing body 23 are cut into individual unit wiring boards 11. In this method of producing individual BGA ICs by MAP, a large number of warpage-preventing holes 20 are made along the border line of the unit wiring boards 11 of the multiple wiring board 10. Since thermal stresses, acting on the multiple wiring board in pellet bonding process, or the like, can be absorbed by the large number of warpage-preventing holes, the multiple wiring board can be prevented from warping. Consequently, splitting or cracking of the multiple wiring board, open circuit or short circuit of the inner terminal, outer terminal and electric wiring of the unit wiring board, underfilling of the resin-sealing body, generation of voids, and the like, can be prevented and the yield, quality and reliability can be enhanced in the method for producing a BGA IC using MAP. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly to a mold array process (mold).
array process. Hereinafter referred to as MAP. ) And a method for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art A method of manufacturing a semiconductor device by MAP is
A plurality of semiconductor pellets (hereinafter referred to as pellets) in which an integrated circuit including a semiconductor element is built, and a plurality of unit wiring boards on which electric wiring for electrically taking out the integrated circuit is formed are connected. After bonding the multiple wiring boards to each other and encapsulating these pellets with a resin encapsulant in a lump, the multiple wiring board and the resin encapsulant are cut into unit wiring boards, that is, pellets, and individual semiconductor devices Is a method of manufacturing.

An MCM (multi-chip module) in which a plurality of chips (pellets) are mechanically and electrically connected to an electric wiring board and these pellets are collectively sealed on the electric wiring board. As an example that mentions, "VLS" issued by Nikkei BP Co., Ltd. on May 31, 1993.
I packaging technology (bottom) "P213 to P253. However, the method of manufacturing a semiconductor device by MAP is
This MCM and package are drastically different in that they are made into individual products by cutting them into pellets.

[0004]

In the method of manufacturing a semiconductor device by MAP, when the pellets are bonded to the unit wiring board of the multiple wiring board by silver paste, the multiple wiring board is cured (heated) after the pellet bonding. It will be cured). However, it has been clarified by the inventor of the present invention that when the multiple wiring board is heated in this manner, the multiple wiring board is warped. When a warp occurs in the multiple wiring board as described above, not only the electric wiring of the multiple wiring board is disconnected or short-circuited, but also defective wire bonding, defective molding of the resin encapsulant, and defective separation of each product are caused. Cause

An object of the present invention is to provide a method of manufacturing a semiconductor device by MAP which can prevent the occurrence of warpage of a multiple wiring board.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0007]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, semiconductor pellets are respectively bonded to a plurality of unit wiring boards of the multiple wiring board, and these semiconductor pellets are collectively resin-sealed by a resin sealing body, and then the multiple wiring board and resin sealing are carried out. A method for manufacturing a semiconductor device, in which a stopper is cut into the unit wiring boards to manufacture individual semiconductor devices, wherein a warp occurs along any of the boundary lines of the plurality of unit wiring boards in the multiple wiring board. The feature is that the prevention hole is opened.

Further, semiconductor pellets are respectively bonded to a plurality of unit wiring boards of the multiple wiring board, and these semiconductor pellets are collectively resin-sealed by a resin sealing body, and then the multiple wiring board and the resin sealing are carried out. A method of manufacturing a semiconductor device in which a stopper is cut into the unit wiring boards to manufacture individual semiconductor devices, wherein a boundary line of the plurality of unit wiring boards in an insulating film formed on the multiple wiring board is formed. It is characterized in that the warp prevention groove is sunk along any one of them.

According to the above-mentioned means, since the thermal stress at the time of heating the multiple wiring board can be absorbed by the warp prevention hole or the warp prevention groove, it is possible to prevent the multiple wiring board from warping.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

In this embodiment, a semiconductor device manufacturing method according to the present invention is applied to a BGA (Ball Grid Array Package).
Integrated circuit device (hereinafter, BGA / IC)
Say. ) Is manufactured by MAP. As shown in FIG. 1, B by MAP
GA / IC manufacturing method includes pellet preparation step, multiple wiring board preparation step, pellet bonding step, wire bonding step, resin encapsulant molding step, resin encapsulant cutting step, solder ball attaching step and electrical characteristic inspection. It has a process. Hereinafter, BG by MAP according to the present embodiment
The manufacturing method of the A / IC will be described in the order of each step.

The pellet preparation process is constituted by a so-called pre-process of the semiconductor device manufacturing method. That is, in a so-called pre-process in the method for manufacturing a semiconductor device, an integrated circuit including semiconductor elements is built in each pellet portion defined in a matrix shape in a state of a semiconductor wafer.
The semiconductor wafer is diced into each pellet portion in the dicing step, whereby the pellet 1 shown in FIG. 2 is manufactured. As shown in FIG. 2, the passivation film 3 is formed on the active area side main surface of the substrate 2 in which the integrated circuit of the pellet 1 is formed.
Are deposited over the entire surface, and a plurality of electrode pads 4 are provided in the periphery of the passivation film 3 in a square frame shape. A back surface coating 5 is applied over the entire main surface of the pellet 1 opposite to the active area side main surface of the substrate 2. The pellet 1 thus configured is supplied to the pellet bonding process.

A multiple wiring substrate 10 for collectively forming a plurality of unit wiring substrates 11 is manufactured in the multiple wiring substrate preparing step to have the configuration shown in FIGS. 3 and 4.
It is supplied to the pellet bonding process. That is, as shown in FIGS. 3 and 4, the plurality of unit wiring boards 11 are laid out in a matrix on the multiple wiring board 10 formed in a rectangular flat plate shape.

The multiple wiring board 10 is provided with a base 12 formed in a rectangular flat plate shape, and the base 12 uses a glass / epoxy resin substrate in which glass fibers are impregnated with an epoxy resin and has a multilayer structure (not shown). Formed). A plurality of unit wiring boards 11 are laid out in a matrix on the base 12, and a central portion of an area where each unit wiring board 11 is laid out on one main surface (hereinafter, referred to as an upper surface) of one of the bases 12. In each of the above, a pellet bonding land (hereinafter, referred to as a land) 13 for bonding the pellet 1 is formed in a square having a diameter slightly larger than the outer diameter of the pellet 1. A plurality of internal terminals 14 are arranged outside the four sides of each land 13 on the upper surface of the base 12 in parallel with the respective sides, and each internal terminal 14 is formed in a quadrangular shape having a size capable of wire bonding. ing.

On the other hand, on the lower surface of the base 12, a plurality of external terminals 15 are arranged in a two-row rectangular frame shape inside and outside the peripheral portion of the laid-out area of each unit wiring board 11, respectively. The terminals 15 are each formed in a circular shape having a small diameter. Land 13, internal terminal 14
The external terminal 15 is formed by patterning a copper foil attached to the surface of the base 12 by lithography and etching. The internal terminal 14 arranged on the upper surface of the base 12 and the external terminal 15 arranged on the lower surface of the base 12 are electrically connected to each other by an electric wiring 16 arranged inside the base 12. Electric wiring 1 in which a large number of wires are arranged in an electrically insulated state
6 is formed into a so-called multi-layer wiring structure by patterning each layer of the base 12 formed in the multi-layer structure and then connecting the upper layer and the lower layer to each other by through-hole conductors.

At the end of one of the long sides on the upper surface of the base 12, a plurality of injection port portions 17 are formed so as to correspond to the gates of the transfer molding apparatus described later. The inlet metal part 17 includes the land 13 and the internal terminal 1.
4 and the external terminal 15 are formed.

An insulating film (hereinafter referred to as a surface insulating film) 18 made of a solder resist film is deposited on the entire upper surface of the base 12, and the surface insulating film 18 has lands 13 of each unit wiring board 11 and The internal terminal 14 and each injection port 17 are exposed. An insulating film (hereinafter referred to as a back surface insulating film) 19 made of a solder resist film is uniformly deposited on the lower surface of the base 12, and the back surface insulating film 19 is provided with the external terminals 15 of each unit wiring board 11. Each is exposed. The front surface insulating film 18 and the back surface insulating film 19 are formed by applying a solder resist to the upper and lower surfaces of the base 12 by a screen printing method, so that the land 13 and the internal terminals 14 and the injection cap portion 17 can be formed on the base 12 at the same time. And the external terminal 15 can be patterned.

Among the boundary lines of the unit wiring boards 11 in the multiple wiring board 10, on the boundary lines parallel to the long sides of the multiple wiring board 10, warping of the multiple wiring board 10 due to thermal stress is prevented. A large number of warp prevention holes 20 are arranged at equal intervals and penetrated in the thickness direction. Warp prevention hole 20
Is composed of a circular small hole (through hole) formed by a drill or the like, and is set so as not to interfere with the internal terminals 14, external terminals 15, electric wiring 16 and the like of the adjacent unit wiring board 11. .

In the pellet bonding process, the pellets 1 having the above-described structure are connected to the multiple wiring boards 10 having the above-described structure as shown in FIG.
It is pellet-bonded to the land 13 of No. 1. That is, the back coating 5 side of the pellet 1 is adhered to the land 13 of each unit wiring board 11 by the silver paste layer 21. The multiple wiring board 10 to which the pellets 1 are bonded by the silver paste layer 21 is thermally cured in the curing step which is a part of the pellet bonding step. At this time, since thermal stress acts on the multiple wiring board 10, deformation such as warping tends to occur. However, among the boundary lines of the unit wiring boards 11 in the multiple wiring board 10, a boundary parallel to the long side is provided. A large number of warp prevention holes 2 aligned on the line
Since 0 absorbs the thermal stress, deformation such as warpage of the multiple wiring board 10 is prevented.

Subsequently, in the wire bonding step, as shown in FIG. 6, the wire 22 is wire bonded between the electrode pad 4 of the pellet 1 of each unit wiring board 11 and the internal terminal 14. For example, when a thermocompression-bonding type wire bonding device is used, thermal stress acts on the multiple wiring board 10, and thus the multiple wiring board 1
Deformation such as warpage tends to occur in 0, but in this case as well, a large number of warpage prevention holes 20 absorb thermal stress, so that the warpage is prevented from occurring.

A resin encapsulant is molded in the resin encapsulant molding process on the multiple wiring substrate 10 on which the wire bonding process has been performed. This resin encapsulant molding step is carried out by the transfer molding apparatus 50 shown in FIGS.

As shown in FIG. 7, the transfer molding apparatus 50 includes a pair of upper mold 51 and lower mold 52 which are clamped together by a cylinder device or the like (not shown). A plurality of sets of upper mold cavity recesses 53a and lower mold cavity recesses 53b (however, only two sets are shown in FIG. 8) and a pair of mating surfaces of the upper mold 51 and the lower mold 52. The objects are submerged so as to cooperate with each other to form one cavity 53. The lower mold cavity recess 53b is formed in a rectangular flat plate hole shape having a size to accommodate the multiple wiring board 10, and the upper mold cavity recess 53a is a rectangular flat plate slightly smaller than the lower mold cavity recess 53b. It is formed in the shape of a board hole and is arranged concentrically.

A pot 54 is provided on the mating surface of the lower mold 52, and a cylinder device (not shown) is provided in the pot 54.
The plunger 55 pushed forward and backward is crushed by a tablet as a molding material, and the tablet is inserted so as to deliver a liquid resin obtained by melting the tablet.

On the mating surface of the upper die 51, a cull 56 is disposed so as to face the pot 54 and is recessed.
One end of each of the plurality of runners 57 is connected to. The other end of each runner 57 has an upper mold cavity recess 53a.
Of the runner 57 and the upper mold cavity recess 53a of each runner 57 are provided with gates 58 so that the resin 59 can be injected into the cavity 53. .

Although not shown for ease of understanding, an upper heat block and a lower heat block are provided outside the upper mold 51 and the lower mold 52, respectively. An electric heater is provided on the upper and lower heat blocks.
And the pots, culls, runners, and tablets and resins in the cavities of the lower mold 52 are laid to heat. By this heating, the tablets are melted, and the resin formed by melting the tablets is reduced to a predetermined viscosity.

Next, a resin encapsulant molding process using the transfer molding apparatus having the above-described structure will be described.

During transfer molding, the multiple wiring board 10 after wire bonding as a work is housed in each lower die 52. Then, the upper mold 51 and the lower mold 5
2. The resin 59, which is obtained by clamping the mold 2 and heating and melting the tablet, is fed by the plunger 55 from the pot 54 and the cull 56 to the respective cavities 53 through the respective runners 57 and the respective gates 58 to be filled therein. become. At this time, since the multiple wiring board 10 is not warped, even if the multiple wiring board 10 is clamped by the upper die 51 and the lower die 52, the multiple wiring board 10 is cracked or cracked. In addition, defective resin injection and generation of voids are prevented. Further, even if a deformation such as a warp occurs in the multiple wiring board 10 due to the thermal stress due to the heating by the heat block, the thermal stress is absorbed by the warp prevention hole 20, so that the deformation such as the warp is prevented.

After the resin 59 is filled in the respective cavities 53 and the liquid resin 59 is thermoset to form a resin sealing body, the upper mold 51 and the lower mold 52 are opened, and The multiple wiring board 10 on which the resin sealing body 23 shown in FIG. 9 is molded is released from the cavity 53 by an ejector pin (not shown). Then, the multiple wiring board 10 on which the resin sealing body 23 is molded is removed from the transfer molding device 50 by a handler (not shown).

As shown in FIG. 9, the resin sealing body 2
3 is resin-molded so that the upper surface of the multiple wiring board 10 is substantially covered, and the internal terminals 1 of all the unit wiring boards 11 are
4, the pellet 1 and the wire 22 are collectively resin-sealed. At this time, since the multiple wiring board 10 is not warped, insufficient filling of the resin 59 and generation of voids are also prevented, so that defective molding of the resin sealing body 23 is prevented in advance. become.

The multiple wiring board 10 whose upper surface is substantially entirely resin-sealed by the resin sealing body 23 as described above,
In the resin sealing body cutting step, as shown in FIG. 10, each unit wiring board 11, that is, the pellet 1 is divided. In this resin encapsulation body cutting step, the warp prevention holes 20 of the multiple wiring board 10 are adjacent to each other in the unit wiring boards 11 and 11.
Since it is aligned with the boundary line of, it will be cut off at the same time as the division. At this time, since the multiple wiring board 10 is not warped, the internal terminals 14 and the external terminals 15 in the multiple wiring board 10 are divided by dividing the unit wiring boards 11 and 11 along the boundary line. Also, the occurrence of disconnection or short circuit of the electric wiring 16 is prevented in advance.

As shown in FIG. 11, solder balls 24 are soldered to the external terminals 15 of the unit wiring board 11 in the solder ball soldering process, so that the BGA
・ IC25 is now manufactured.

BGA / IC manufactured as described above
25, an electric characteristic inspection is carried out in the electric characteristic process. At this time, disconnection and short circuit in the wiring board (unit wiring board) of the BGA / IC25 and generation of bubbles in the resin sealing body are prevented, so that the manufacturing yield is improved.

According to the above embodiment, the following effects can be obtained.

1) By forming a large number of warp prevention holes on the boundary line of each unit wiring board in the multiple wiring board used in the BGA / IC manufacturing method by MAP, a pellet bonding step, a wire bonding step, etc. In this case, when thermal stress acts on the multiple wiring board, the thermal stress can be absorbed by a large number of warp prevention holes, so that the multiple wiring board can be prevented from being deformed such as warping. it can.

2) By preventing deformation such as warpage due to thermal stress in the multiple wiring board, cracks and cracks in the multiple wiring board, disconnection of internal terminals and external terminals of the unit wiring board, and electric wiring. Since it is possible to prevent molding defects such as short circuit, short circuit, insufficient filling of resin encapsulant, and generation of voids, it is possible to improve the manufacturing yield, quality and reliability of BGA / IC by the manufacturing method by MAP.

FIG. 12 shows another embodiment M of the present invention.
The multiple wiring board used for the manufacturing method of BGA * IC by AP is shown, (a) is a top view, (b) is (a).
3 is a cross-sectional view taken along line bb of FIG.

The present embodiment is different from the above embodiments in that each warp along the boundary line of a plurality of unit wiring boards in the front surface insulating film 18 and the back surface insulating film 19 formed on the multiple wiring board 10. That is, the prevention grooves 26 are respectively recessed.

Also in this embodiment, when thermal stress acts on the multiple wiring substrate 10 in the pellet bonding process, the wire bonding process, or the like, this thermal stress can be absorbed by the plurality of warp prevention grooves 26. Therefore, it is possible to prevent deformation such as warpage of the multiple wiring board 10. By preventing deformation such as warpage due to thermal stress in the multiple wiring board 10, cracks and cracks in the multiple wiring board 10, the internal terminals 14 and the external terminals 15 of the unit wiring board 11, and the electrical wiring 16 are prevented. Since it is possible to prevent disconnection, short circuit, defective molding such as insufficient filling of the resin sealing body 23 and generation of voids, it is possible to improve the manufacturing yield, quality and reliability of the BGA / IC by the manufacturing method by MAP. it can.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, the warp prevention hole and the warp prevention groove are not limited to be arranged along the boundary line along the long side of the multiple wiring board among the boundary lines of the respective unit wiring boards, but may be formed along the boundary line along the short side. It may be arranged along the boundary line, or may be arranged along the boundary line of both the long side and the short side.

The warp prevention hole is a circular small hole (through hole).
It is not limited to the above configuration, but may be configured by an elongated hole (slit) or the like.

In the above description, the invention made by the present inventor is the field of application which is the background of the invention.
・ I explained the case where it is applied to the IC manufacturing method.
The present invention is not limited to this, and can be applied to all methods of manufacturing semiconductor devices having other packages.

[0044]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

When thermal stress acts on the multiple wiring board by forming a large number of warp prevention holes on the boundary line of each unit wiring board in the multiple wiring board used in the semiconductor device manufacturing method by MAP. Moreover, since this thermal stress can be absorbed by the large number of warp prevention holes, it is possible to prevent deformation such as warpage of the multiple wiring board.

By arranging the warp prevention groove along the boundary line between the plurality of unit wiring boards in the insulating film formed on the multiple wiring board, when the thermal stress acts on the multiple wiring board, Since the thermal stress can be absorbed by the plurality of warp prevention grooves, it is possible to prevent deformation such as warpage of the multiple wiring board.

[Brief description of drawings]

FIG. 1 is a BG according to MAP, which is an embodiment of the present invention.
It is process drawing which shows the manufacturing method of A * IC.

FIG. 2 shows a pellet, (a) is a plan view,
(B) is a partially cut front view.

FIG. 3 is a partially omitted plan view showing a multiple wiring board.

4A is a side sectional view taken along the line aa in FIG.
4B is a side sectional view taken along the line bb in FIG. 3, and FIG. 4C is a detailed view of a portion c in FIG. 4A.

FIG. 5 shows after the pellet bonding process,
(A) is a partially omitted plan view and (b) is a partially cut side view.

6A and 6B show a unit wiring board after a wire bonding step, wherein FIG. 6A is a plan view and FIG. 6B is a sectional view taken along line bb of FIG.

FIG. 7 is a side view of the transfer molding apparatus used in a resin encapsulation body molding step, in which some parts are omitted.

FIG. 8 is a plan sectional view in which a cutting line passes through an upper die of the transfer molding apparatus.

9A and 9B are views showing a state after a resin sealing body molding step, wherein FIG. 9A is a plan view and FIG. 9B is a partially cut side view.

FIG. 10 shows a step of cutting a resin sealing body, (a) is a plan view, and (b) is a partially cut side view.

FIG. 11 shows a manufactured BGA / IC,
(A) is a partially cut front view, (b) is an upper half plan view and a lower half bottom view.

12A and 12B show a multiple wiring board used in a method for manufacturing a BGA / IC by MAP, which is another embodiment of the present invention, in which FIG. 12A is a plan view and FIG. It is sectional drawing which follows the bb line.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Pellet (semiconductor pellet), 2 ... Substrate, 3 ... Passivation film, 4 ... Electrode pad, 5 ... Backside coating, 10 ... Multiple wiring board, 11 ... Unit wiring board, 1
2 ... Base, 13 ... Land (pellet bonding land), 14 ... Internal terminal, 15 ... External terminal, 16 ... Electrical wiring, 17 ... Injection base part, 18 ... Insulating film (surface insulating film) made of solder resist film, 19 ... Insulating film (back surface insulating film) made of solder resist film, 20 ... Warp prevention hole, 21 ...
Silver paste layer, 22 ... Wire, 23 ... Resin sealing body, 24
... Solder balls, 25 ... BGA / IC (semiconductor device), 2
6 ... Warp prevention groove, 50 ... Transfer molding device, 51 ...
Upper mold, 52 ... Lower mold, 53 ... Cavity, 53a ... Upper mold cavity recess, 53b ... Lower mold cavity recess, 5
4 ... Pot, 55 ... Plunger, 56 ... Cull, 57 ... Lanna, 58 ... Gate, 59 ... Resin.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Mikako Kimura             5-22-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company Hitachi Cho-LS System             Within (72) Inventor Michiaki Sugiyama             5-22-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company Hitachi Cho-LS System             Within (72) Inventor Koichi Kanemoto             5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company within Hitachi Semiconductor Group (72) Inventor Masachika Masuda             5-20-1 Kamimizuhonmachi, Kodaira-shi, Tokyo Stock             Ceremony Company within Hitachi Semiconductor Group

Claims (5)

[Claims] 1. A semiconductor pellet is bonded to each of a plurality of unit wiring boards of a multiple wiring board, and the semiconductor pellets are collectively resin-sealed by a resin sealing body, and then the multiple wiring board and the resin sealing are formed. A method for manufacturing a semiconductor device, in which a stopper is cut into the unit wiring boards to manufacture individual semiconductor devices, wherein a warp occurs along any of the boundary lines of the plurality of unit wiring boards in the multiple wiring board. A method for manufacturing a semiconductor device, characterized in that a prevention hole is opened. 2. The method for manufacturing a semiconductor device according to claim 1, wherein the warp prevention holes are a plurality of through holes arranged along the boundary line. 3. The warp prevention hole is formed in one or both of the vertical and horizontal of the boundary line set in the vertical and horizontal directions on the multiple wiring board, or both. 2. The method for manufacturing a semiconductor device according to 2. 4. A semiconductor pellet is bonded to each of a plurality of unit wiring boards of the multiple wiring board, and these semiconductor pellets are collectively resin-sealed by a resin sealing body, and then the multiple wiring board and the resin sealing are formed. A method of manufacturing a semiconductor device in which a stopper is cut into the unit wiring boards to manufacture individual semiconductor devices, wherein a boundary line of the plurality of unit wiring boards in an insulating film formed on the multiple wiring board is formed. A method of manufacturing a semiconductor device, characterized in that a warp prevention groove is formed along any one of them. 5. The warp prevention groove is laid in one of the vertical and horizontal directions of the boundary line which is set in the vertical and horizontal directions on the multiple wiring board, or both of the vertical and horizontal directions. A method for manufacturing a semiconductor device as described above.