CN1310733C - 激光加工装置 - Google Patents

激光加工装置 Download PDF

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Publication number
CN1310733C
CN1310733C CNB038023687A CN03802368A CN1310733C CN 1310733 C CN1310733 C CN 1310733C CN B038023687 A CNB038023687 A CN B038023687A CN 03802368 A CN03802368 A CN 03802368A CN 1310733 C CN1310733 C CN 1310733C
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China
Prior art keywords
laser
laser beam
polarization
laser beams
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038023687A
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English (en)
Chinese (zh)
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CN1617784A (zh
Inventor
H·J·迈尔
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Hitachi Via Mechanics Ltd
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Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1617784A publication Critical patent/CN1617784A/zh
Application granted granted Critical
Publication of CN1310733C publication Critical patent/CN1310733C/zh
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Expired - Fee Related legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CNB038023687A 2002-01-16 2003-01-07 激光加工装置 Expired - Fee Related CN1310733C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10201476A DE10201476B4 (de) 2002-01-16 2002-01-16 Laserbearbeitungsvorrichtung
DE10201476.0 2002-01-16

Publications (2)

Publication Number Publication Date
CN1617784A CN1617784A (zh) 2005-05-18
CN1310733C true CN1310733C (zh) 2007-04-18

Family

ID=7712285

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038023687A Expired - Fee Related CN1310733C (zh) 2002-01-16 2003-01-07 激光加工装置

Country Status (7)

Country Link
US (1) US6727462B2 (https=)
EP (1) EP1465747B1 (https=)
JP (1) JP2005514212A (https=)
KR (1) KR20040073563A (https=)
CN (1) CN1310733C (https=)
DE (2) DE10201476B4 (https=)
WO (1) WO2003059567A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4299185B2 (ja) * 2004-04-27 2009-07-22 株式会社ディスコ レーザー加工装置
DE102004040068B4 (de) * 2004-08-18 2018-01-04 Via Mechanics, Ltd. Verfahren zum Laserbohren eines mehrschichtig aufgebauten Werkstücks
US7396706B2 (en) * 2004-12-09 2008-07-08 Electro Scientific Industries, Inc. Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
WO2006063153A2 (en) * 2004-12-09 2006-06-15 Electro Scientific Industries, Inc. Multiple-wavelength laser micromachining of semiconductor devices
DE102006013929A1 (de) 2006-03-21 2007-09-27 Hauni Maschinenbau Ag Perforationsvorrichtung der tabakverarbeitenden Industrie zum Perforieren einer Umhüllung eines stabförmigen Artikels
TWI308880B (en) * 2006-11-17 2009-04-21 Chunghwa Picture Tubes Ltd Laser cutting apparatus and laser cutting method
KR100761238B1 (ko) * 2007-03-13 2007-09-27 에스엔유 프리시젼 주식회사 레이저빔 가공장치
US8116341B2 (en) * 2007-05-31 2012-02-14 Electro Scientific Industries, Inc. Multiple laser wavelength and pulse width process drilling
DE102007032903A1 (de) * 2007-07-14 2009-01-15 Schepers Gmbh + Co. Kg Verfahren zum Betreiben einer Lasergravureinrichtung
CN100493814C (zh) * 2007-10-10 2009-06-03 厦门大学 带有测量装置的多功能激光加工刀具
DE502008001155D1 (de) * 2008-05-02 2010-09-30 Leister Process Tech Verfahren und Laservorrichtung zum Bearbeiten und/oder Verbinden von Werkstücken mittels Laserstrahlung mit Leistungswirk- und Pilotlaser und mindestens einem diffraktiven optischen Element
EP2208568A1 (en) * 2009-01-20 2010-07-21 Synova S.A. Apparatus and method for processing material by means of laser
WO2011018989A1 (ja) * 2009-08-11 2011-02-17 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
US8525073B2 (en) * 2010-01-27 2013-09-03 United Technologies Corporation Depth and breakthrough detection for laser machining
KR101283557B1 (ko) * 2010-05-20 2013-07-15 (주)미래컴퍼니 레이저 가공장치
KR101290519B1 (ko) * 2011-09-07 2013-07-26 주식회사 이오테크닉스 레이저 가공 장치
US9287987B2 (en) * 2011-12-01 2016-03-15 Futurewei Technologies, Inc. Self-seeded colorless burst-mode transmitter using reflective semiconductor optical amplifier and injection locked Fabry-Perot laser
US20130153552A1 (en) * 2011-12-14 2013-06-20 Gwangju Institute Of Science And Technology Scribing apparatus and method for having analysis function of material distribution
KR101497763B1 (ko) * 2012-04-05 2015-03-02 삼성전기주식회사 레이저 가공 장치
JP6451420B2 (ja) * 2015-03-11 2019-01-16 オムロン株式会社 接合構造体の製造方法
CN105562947B (zh) * 2016-02-19 2017-09-15 武汉铱科赛科技有限公司 一种旋转对称轴平行的旋转光束组钻孔系统及钻孔方法
FR3063929B1 (fr) * 2017-03-15 2019-03-22 Poietis Equipement pour le transfert de bio-encre
CN107470786A (zh) * 2017-09-14 2017-12-15 深圳市牧激科技有限公司 多激光头装置
CN108572061B (zh) * 2018-07-23 2023-10-13 中国工程物理研究院激光聚变研究中心 全口径谐波转换效率测量系统及其测量方法
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
DE102019115554A1 (de) * 2019-06-07 2020-12-10 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
CN111856768B (zh) * 2020-07-31 2025-04-15 陕西精耀光电技术有限公司 一种基于双色镜的双光同轴模组
WO2025122611A1 (en) * 2023-12-04 2025-06-12 Ipg Photonics Corporation Systems and methods for simulation of laser fuence on a surface of a part during a laser treatment process
DE102024128858A1 (de) * 2024-10-07 2026-04-09 Krones Aktiengesellschaft Verfahren und Vorrichtung zum Lasermarkieren von Objekten mit einer gekrümmten Fläche

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE299702C (https=) *
US4993837A (en) * 1988-01-25 1991-02-19 Hitachi, Ltd. Method and apparatus for pattern detection
US5293213A (en) * 1992-08-12 1994-03-08 Klein Uwe K A Utilization of a modulated laser beam in heterodyne interferometry
JP2000190087A (ja) * 1998-12-25 2000-07-11 Sumitomo Heavy Ind Ltd ２軸レ―ザ加工機
US6229940B1 (en) * 1998-11-30 2001-05-08 Mcdonnell Douglas Corporation Incoherent fiber optic laser system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4789770A (en) * 1987-07-15 1988-12-06 Westinghouse Electric Corp. Controlled depth laser drilling system
JPH0810970A (ja) * 1994-06-22 1996-01-16 Sony Corp レーザ加工装置及び方法
DE19910880A1 (de) * 1999-03-11 2000-09-14 Deckel Maho Gmbh Werkzeugmaschine für die Werkstückbearbeitung mit spanenden Werkzeugen und Laserstrahl
DE19955383A1 (de) * 1999-10-29 2001-05-03 Orga Kartensysteme Gmbh Verfahren zum Aufbringen von farbigen Informationen auf einen Gegenstand
DE19959862A1 (de) * 1999-12-10 2001-06-13 Forschungszentrum Juelich Gmbh Lasersystem mit steuerbarer Pulsdauer
JP2001170788A (ja) * 1999-12-10 2001-06-26 Canon Inc レーザー加工方法およびその装置
JP2001196665A (ja) * 2000-01-13 2001-07-19 Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai 二波長レーザ加工光学装置およびレーザ加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE299702C (https=) *
US4993837A (en) * 1988-01-25 1991-02-19 Hitachi, Ltd. Method and apparatus for pattern detection
US5293213A (en) * 1992-08-12 1994-03-08 Klein Uwe K A Utilization of a modulated laser beam in heterodyne interferometry
US6229940B1 (en) * 1998-11-30 2001-05-08 Mcdonnell Douglas Corporation Incoherent fiber optic laser system
JP2000190087A (ja) * 1998-12-25 2000-07-11 Sumitomo Heavy Ind Ltd ２軸レ―ザ加工機

Also Published As

Publication number Publication date
DE10201476B4 (de) 2005-02-24
EP1465747B1 (de) 2007-02-07
WO2003059567A1 (de) 2003-07-24
JP2005514212A (ja) 2005-05-19
DE10201476A1 (de) 2003-07-31
KR20040073563A (ko) 2004-08-19
CN1617784A (zh) 2005-05-18
DE50306459D1 (de) 2007-03-22
US6727462B2 (en) 2004-04-27
US20030141288A1 (en) 2003-07-31
EP1465747A1 (de) 2004-10-13

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: JAPAN VIA MACHINE CO., LTD.

Free format text: FORMER OWNER: SIEMENS AG

Effective date: 20060623

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20060623

Address after: Kanagawa

Applicant after: Japan VIA machinery KK

Address before: Munich, Germany

Applicant before: Siemens AG

C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070418

Termination date: 20120107