CN1305331A

CN1305331A - Condenser microphone

Info

Publication number: CN1305331A
Application number: CN00121165A
Authority: CN
Inventors: 金钟圭
Original assignee: WONI COMMUNICATIONS CO Ltd
Current assignee: WONI COMMUNICATIONS CO Ltd
Priority date: 1999-12-13
Filing date: 2000-07-28
Publication date: 2001-07-25
Also published as: JP2001186595A; EP1109422A2; KR20000012565A; KR100341564B1; TW486917B

Abstract

In the present invention, two through holes are drilled in the printed circuit board, the connection pins are respectively inserted to the through holes with one end being exposed to the exterior and then each connection pin is connected to the drain and source of the FET. Accordingly, the present invention can reduce the thickness of the condenser microphone and mount the condenser microphone on the printed circuit board installed in the microphone and the like without using additional connector.

Description

Electrostatic microphone

The present invention relates to a kind of electrostatic microphone, especially relate to a kind of electrostatic microphone, wherein integral type is inserted each terminals electrostatic microphone and is connected to a connector on the outside line in this electrostatic microphone, so just can reduce the thickness of electrostatic microphone and simplify installation procedure.

Common electrostatic microphone can be divided into two types of pin type electrostatic microphone and SMD (surface-mount devices) formula electrostatic microphones.

SMD formula electrostatic microphone has a smooth lower surface, and it just can be at an easy rate by adopting a kind of welding paste to be fixed on the printed circuit board (PCB) like this.In addition, as depicted in figs. 1 and 2, because shell 101, the 111 folding parcel printed circuit board (PCB)s of electrostatic microphone, so the height of the height of shell and printed circuit board (PCB) is different.

Thereby when when these electrostatic microphone 101,111 solderings or built-up welding are to printed circuit board (PCB), perhaps the printed circuit that is formed on this printed circuit board (PCB) can correctly not connect.

Therefore, as illustrated in fig. 1 and 2, in a kind of prior art, be provided with one in addition and be used for connector 102,112 that the printed circuit of electrostatic microphone 101,111 is linked to each other with an external circuit, so just can prevent to break down owing to connection error makes electrostatic microphone.

Yet, in this case,, and also can increase the integral thickness of this electrostatic microphone owing to the reason of the additional thickness of connector because the cause of additional connector not only causes economy/temporal loss.Also have, being used to install the required operating time of electrostatic microphone with described connector has also increased.

Therefore, one object of the present invention is to provide a kind of electrostatic microphone, and this electrostatic microphone can reduce it and connect fault and can not increase its thickness, and can also reduce and produce and assembling the time required in the process of this electrostatic microphone.

In order to reach this purpose, the invention provides a kind of electrostatic microphone, it comprises: the lower surface that a shell, the upper surface of this shell are drilled with a sound wave input hole and shell is an opening; A rear electrode plate ring, this ring are inserted in the shell and by means of this shell and link to each other with a FET (field-effect transistor) power supply; A vibrating membrane, this vibrating membrane are fixed on the lower surface of described rear electrode plate ring and vibrate under the effect of the sound wave that passes the sound wave input hole; A liner that makes vibrating membrane and the insulation of rear electrode plate; The rear electrode plate, this battery lead plate has a plurality of through holes, and the change of the electric capacity that is caused by vibrating membrane is changed into an electrical potential difference and this electrical potential difference is supplied to the control gate of FET by a becket; Becket, this becket have one be located at its circumference the place and basic ring that described rear electrode plate is electrically connected with the control gate of FET; A printed circuit board (PCB), the printed circuit of this plate is electrically connected with each terminals of FET, and becket and shell are formed on its both sides; And be drilled with a plurality of through holes that wherein are used to insert attachment plug; Described attachment plug is inserted in the through-holes of printed circuit boards, and its end is exposed and had a kind of pooling feature.

Described printed circuit board (PCB) comprises: a substrate, this substrate have a preset thickness and are made by insulating material; One first connects printed circuit, and this circuit is formed on the upper surface of described substrate and with each terminals of described becket, attachment plug and PET and is electrically connected; One second connects printed circuit, and this circuit is formed on the lower surface of substrate to be electrically connected with power supply and the shell of FET; And a plurality of substrate through holes up and down that pass.

Described attachment plug comprises: a retaining element, this retaining element have an inwardly folding folded end part at the place, end that inner space and of a direction opening are formed on open space; A moving element, this moving element have the inner space of opening and the grip flange at the circumference place, end that is formed on described open space in one direction; And a spring, this spring is inserted in the inner space between described retaining element and moving element.

Here, described retaining element, moving element and spring are preferably gold-plated.In addition, a fixed jaw that links to each other with the printed circuit at the circumference place that is formed on through hole also preferably is horizontally formed on the circumference of retaining element.

Brief Description Of Drawings

Fig. 1 is a decomposition diagram that part is removed, and shows a common electrostatic microphone and an embodiment of the connector that combines with it;

Fig. 2 is a decomposition diagram that part is removed, and shows a common electrostatic microphone and another embodiment of the connector that combines with it;

Fig. 3 is a decomposition diagram that part is removed, and shows according to an electrostatic microphone of the present invention and the connector that combines with it;

Fig. 4 a is a plane graph, shows a printed circuit board that is applied in according to electrostatic microphone of the present invention;

Fig. 4 b is a front view, shows a printed circuit board that is applied in according to electrostatic microphone of the present invention;

Fig. 5 is a cutaway view, shows the attachment plug that is applied in according to electrostatic microphone of the present invention;

Fig. 6 is a cutaway view, shows the bonding state according to electrostatic microphone of the present invention and attachment plug.

With reference to the accompanying drawings a preferred embodiment of the present invention is elaborated.

As shown in Figure 3, an electrostatic microphone 1 of the present invention comprises a shell 18, rear electrode plate ring 19, vibrating membrane 20, liner 21, rear electrode plate 22, becket 23, basic ring 24, a printed circuit board (PCB) 2 and a FET5.

Be drilled with one on the top of the shell of making by electric conducting material 18 and be used for the sound wave input hole that sound wave passes through.The lower end of shell is an opening, and other element just can insert in manufacture process like this, and inwardly folding with the fixing element that is inserted after completing.Shell 18 is electrically connected rear electrode plate ring 19 with printed circuit on the lower surface that is formed on printed circuit board (PCB) 2.

The annular rear electrode plate ring of being made by electric conducting material 19 is inserted in the upper end of inner surface of shell 18, and is fixed on the lower surface of rear electrode plate ring 19 by the Round Membranes 20 of acoustic vibration.That is to say that vibrating membrane 20 vibrates and changed electric capacity, produces electrical potential difference at rear electrode plate 22 places that are drilled with a plurality of through holes like this under the effect of sound wave.

Be used to make the liner 21 of vibrating

membrane

20 and 22 insulation of rear electrode plate to be located between them, and becket 23 is inserted in the liner lower surface so that rear electrode plate 22 is electrically connected with the printed circuit of the upper surface that is formed on printed circuit board (PCB) 10, promptly is electrically connected with the control gate of FET5.

In this case, the basic ring of being made by insulating material 24 is inserted in the outer shroud of becket 23 to prevent that rear electrode plate 22 or becket 23 are electrically connected with shell 18.

At last, printed circuit board (PCB) 2 and attachment plug 10 with FET5 are inserted in the shell 18, and the lower end of shell is inwardly folding to fix these elements then.

As shown in Figs. 4a and 4b, as for printed circuit board (PCB) 2, all be formed on the upper surface of the substrate 7 that has a predetermined thickness and made by insulating material with each terminals that is connected printed

circuit

6a, 6b and 6c, plug 10 and FET5 that becket 23 is electrically connected, and a printed circuit that is electrically connected with power supply and the shell of FET5 is formed on the lower surface of substrate 7.Substrate 7 is drilled with a plurality of through holes and can be inserted and secured on the there so that have a plurality of plugs of pooling feature.Especially, fixing printed

circuit

4a and 4b form round through hole 3a and 3b, and they are by fixing attachment plug 10 and be electrically connected with attachment plug 10.

Being inserted and secured on through hole 3a here, links to each other with the drain electrode of power supply and FET5 accordingly with attachment plug among the 3b.

Figure 5 shows that the cutaway view that is inserted and secured on the attachment plug among through-holes of printed circuit boards 3a and the 3b.Here, attachment plug 10 is made up of a retaining element 11, a moving element 12 and a spring 13.

Retaining element 11 has the inner space 14a and a folded end 16 inwardly folding after assembling moving element 12 of opening in one direction, and the spring in the 14a of this inner space is located at the open end of this inner space 14a.In addition, one is horizontally formed on the circumference of retaining element 11 with the fixing printed circuit 4a of printed circuit board (PCB) 2, the fixed jaw 15 that 4b links to each other in the through hole 3a, the 3b that attachment plug 10 are inserted and secured on printed circuit board (PCB) 2.

Moving element 12 with the grip flange 17 among the inner space 14a that inserts and be combined in described retaining element 11 also has an inner space 14b, and spring 13 is inserted among inner space 14a, the 14b between retaining element and the moving element 11,12, assembling forms an attachment plug 10 thus, and makes attachment plug 10 have pooling feature.

By retaining element 11, moving element 12 and spring 13 plated with gold all, can improve its electric conductivity.

Because the attachment plug 10 that has pooling feature and link to each other with the drain electrode of power supply and FET accordingly is exposed to the outside of electrostatic microphone 1, so just might be installed in electrostatic microphone 1 of the present invention in microphone, sounding or imaging device and the similar device, and need not adopt additional connector.

Therefore, the present invention can reduce the connection fault of electrostatic microphone and can not increase the thickness of electrostatic microphone, and can reduce and make and assembling the time required in the process of this electrostatic microphone.

That is to say that the present invention can reduce the thickness of electrostatic microphone, and the connector that need not add just can be installed in electrostatic microphone of the present invention on the printed circuit board (PCB) that is arranged in microphone and the similar device.

Though the present invention is illustrated in accordance with the embodiments illustrated; but to those skilled in the art; under the prerequisite that does not break away from the essence that limits by claim of the present invention and protection range, can carry out various improvement and variation to the present invention.

Claims

1. electrostatic microphone comprises:

The lower surface that a shell, the upper surface of this shell are drilled with a sound wave input hole and shell is an opening;

A rear electrode plate ring, this plate ring are inserted in the described shell and by means of described shell and link to each other with a FET power supply;

A vibrating membrane, this vibrating membrane are fixed on the lower surface of described rear electrode plate ring and vibrate under the effect of the sound wave that passes the sound wave input hole;

A liner that makes described vibrating membrane and the insulation of rear electrode plate;

Described rear electrode plate has a plurality of through holes, the control gate that the change of the electric capacity that it is caused by described vibrating membrane changes into an electrical potential difference and this electrical potential difference is supplied to described FET by a becket;

Described becket have one be located at its circumference the place and basic ring that described rear electrode plate is electrically connected with the control gate of described FET;

A printed circuit board (PCB), the printed circuit of this printed circuit board (PCB) is electrically connected with each terminals of described FET, and described becket and described shell are arranged on the both sides of described printed circuit board (PCB); And be drilled with and a plurality ofly wherein be used to insert and the through holes of fixedly connected plug; And

Described attachment plug is inserted and secured in the through-holes of printed circuit boards, and its end is exposed and had a pooling feature.

2. an electrostatic microphone as claimed in claim 1 is characterized in that, described printed circuit board (PCB) comprises:

A substrate that has a predetermined thickness and make by insulating material;

One first connects printed circuit, and this circuit is formed on the upper surface of described substrate and with each terminals of described becket, attachment plug and PET and is electrically connected;

One second connects printed circuit, and this circuit is formed on the lower surface of substrate to be electrically connected with power supply and the shell of FET; And

A plurality of substrate through holes up and down that pass.

3. electrostatic microphone as claimed in claim 1, it is characterized in that, described attachment plug comprises: a retaining element, this retaining element have an inwardly folding folded end part at the place, end that inner space and of a direction opening are formed on open space; A moving element, this moving element have the inner space of opening and the grip flange at place, end that one is formed on described open space in one direction; And a spring, in this spring insertion inner space between retaining element and moving element.

4. an electrostatic microphone as claimed in claim 3 is characterized in that, described retaining element, described moving element and described spring are gold-plated.

5. an electrostatic microphone as claimed in claim 3 is characterized in that, a fixed jaw that is connected with the printed circuit at the circumference place that is formed on described through hole is horizontally formed on the circumference of described retaining element.