CN1961610B - Parallelepiped type directional capacitance microphone - Google Patents
Parallelepiped type directional capacitance microphone Download PDFInfo
- Publication number
- CN1961610B CN1961610B CN2004800012997A CN200480001299A CN1961610B CN 1961610 B CN1961610 B CN 1961610B CN 2004800012997 A CN2004800012997 A CN 2004800012997A CN 200480001299 A CN200480001299 A CN 200480001299A CN 1961610 B CN1961610 B CN 1961610B
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- backboard
- sound
- condenser microphone
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
- E05C17/00—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith
- E05C17/60—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith holding sliding wings open
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05B—LOCKS; ACCESSORIES THEREFOR; HANDCUFFS
- E05B65/00—Locks or fastenings for special use
- E05B65/08—Locks or fastenings for special use for sliding wings
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
- E05C17/00—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith
- E05C17/02—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith by mechanical means
- E05C17/46—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith by mechanical means in which the wing or a member fixed thereon is engaged by a movable fastening member in a fixed position; in which a movable fastening member mounted on the wing engages a stationary member
- E05C17/48—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith by mechanical means in which the wing or a member fixed thereon is engaged by a movable fastening member in a fixed position; in which a movable fastening member mounted on the wing engages a stationary member comprising a sliding securing member
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
- E05C17/00—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith
- E05C17/60—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith holding sliding wings open
- E05C17/62—Devices for holding wings open; Devices for limiting opening of wings or for holding wings open by a movable member extending between frame and wing; Braking devices, stops or buffers, combined therewith holding sliding wings open using notches
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- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05C—BOLTS OR FASTENING DEVICES FOR WINGS, SPECIALLY FOR DOORS OR WINDOWS
- E05C3/00—Fastening devices with bolts moving pivotally or rotatively
- E05C3/12—Fastening devices with bolts moving pivotally or rotatively with latching action
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
A directional condenser microphone having a shape of parallelepiped is disclosed. The condenser microphone comprises a case; a diaphragm member; a thin spacer; a cylindrical insulating ring; a back plate; an annular conductive ring; and a PCB. Here, the diaphragm member, the spacer, the insulating ring, the back plate, the conductive ring, and the PCB are sequentially arranged in the case and then the condenser microphone is integrally assembled by curling an end of the case. The condenser microphones of the present invention provides directivity. Further, because the direction of components can be confirmed during a process of SMD, terminal connections of the component can be easily adjusted each other. Accordingly, this can prevent connection surfaces of connection terminals of a main PCB and connection terminals of the condenser microphone from being deviated, and also decrease a failure of connection that may be resulted from change of connection or direction (polarity) of the connection terminals.
Description
Technical field
The present invention relates to a kind of condenser microphone, relate more specifically to a kind of directional capacitance microphone with parallelepiped shape, it is used for easily confirming the direction of parts when processing SMD, even this microphone has two or more electronics splicing ears.
Background technology
Typical condenser microphone comprises a biasing member, it usually by electret, JFET (junction field effect transistor) formation that forms a pair of diaphragm/back-plate of the capacitor C that can change and be used for buffer output signal in response to acoustic pressure.
Fig. 1 is the schematic diagram of traditional general condenser microphone.
As shown in Figure 1, the condenser microphone 10 of allusion quotation shape has the cylindrical metal shell, second substrate that it comprises polar ring, diaphragm, pad, backboard therein, has first substrate of the annular of being made by insulating material, made by electric conducting material and PCB (printed circuit board (PCB)) etc.This typical condenser microphone has cylindrical exterior and be formed with two splicing ears in this PCB.
Simultaneously, in the mounted on surface process, the terminal of main PCB must correctly be connected with the terminal of condenser microphone.But above-mentioned its structure of traditional cylindrical condenser microphone is unsuitable for surface-mount devices (SMD).Because terminal surfaces forms to such an extent that be lower than the curved surface of shell, so may produce solder failure in the mounted on surface process.Especially, if be provided with a plurality of terminals therein, then be difficult to confirm the direction of splicing ear.Therefore, produce such problem, that is, in the mounted on surface process, changed or had only under the situation that the part on splicing ear surface links to each other because the surface of splicing ear is departed from the polarity of splicing ear, therefore this splicing ear is increased the connection fault by insufficient connection.
Summary of the invention
The present invention is with solving aforesaid problem.The object of the present invention is to provide a kind of provider of being used for tropism's parallelepiped condenser microphone, wherein when processing SMD, can confirm easily that the direction of parts and this process can be applied to this microphone, even this microphone has a plurality of splicing ears.
In order to realize this purpose of the present invention, condenser microphone according to one embodiment of the present invention comprises: form the shell of square box shape, this shell has the sealing bottom surface that an open surfaces and being formed with is used to collect the sound hole of sound; The diaphragm member of annular, it is inserted in the described shell; Form the shim liner of annular; Cylindrical dead ring, it has open top and bottom; Backboard, it forms plate-like and has the sound hole that therefrom passes; Annular conductive rings is used to make described backboard to be electrically connected with PCB; And the described PCB of the side's of forming plate shape, described PCB has the lip-deep electronic unit that is installed on this PCB and is formed on its another lip-deep terminal that stretches out, and described PCB part place in the central is formed with the sound hole that is used for back sound.Here, diaphragm member, pad, dead ring, backboard, conducting ring and PCB sequentially are arranged in the described shell, curl by the end that makes described shell then and assemble out integratedly this condenser microphone.Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts (IC, MLCC) is installed towards described conducting ring.
In order to realize purpose of the present invention, condenser microphone according to another embodiment of the invention comprises: form the shell of square box shape, this shell has an open surfaces and is formed with the sealing bottom surface of the sound hole that is used to collect front sound; The diaphragm member of annular, this diaphragm member is inserted in the described shell; Form the shim liner of annular; The shading ring of annular, it is used to isolate backboard; Backboard, it forms plate-like and has the sound hole that therefrom passes; Whole substrate, it has the cylindrical insulator that has open top and bottom and conductive layer in the inner surface that is electrically connected and is formed on described insulator is provided between described backboard and PCB; And the PCB of the side's of forming plate shape, described PCB has the lip-deep electronic unit that is installed in this PCB and is formed on its another lip-deep terminal that stretches out, and this PCB part place in the central is formed with the sound hole that is used for back sound.Here, described diaphragm member, pad, shading ring, backboard, whole substrate and PCB sequentially are arranged in the described shell, curl by the end that makes described shell then and assemble out integratedly this condenser microphone.Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts (IC, MLCC) is installed towards described whole substrate.
Described microphone also comprises acoustic resistor, is used to weaken or postpones at the back of described backboard rear side sound, and described acoustic resistor is configured in the sound hole of described PCB.
Description of drawings
From below in conjunction with will understand the accompanying drawing description of a preferred embodiment thereof of the present invention above and other purpose and feature, wherein:
Fig. 1 is the schematic diagram of traditional general condenser microphone;
Fig. 2 is the stereogram according to parallelepiped condenser microphone of the present invention;
Fig. 3 is the exploded perspective view according to first embodiment of bi-directional condenser microphone of the present invention;
Fig. 4 is the exploded perspective view according to second embodiment of bi-directional condenser microphone of the present invention;
Fig. 5 is the exploded perspective view according to the 3rd embodiment of bi-directional condenser microphone of the present invention;
Fig. 6 is the sectional view of the assembly of first, second and the 3rd embodiment of the present invention;
Fig. 7 is the exploded perspective view according to the 4th embodiment of bi-directional condenser microphone of the present invention;
Fig. 8 is the exploded perspective view according to the 5th embodiment of bi-directional condenser microphone of the present invention;
Fig. 9 is the exploded perspective view according to the 6th embodiment of bi-directional condenser microphone of the present invention; With
Figure 10 is the sectional view of the 4th, the 5th and the 6th embodiment of the present invention;
Figure 11 is the exploded perspective view according to first embodiment of unidirectional condenser microphone of the present invention;
Figure 12 is the exploded perspective view according to second embodiment of unidirectional condenser microphone of the present invention;
Figure 13 is the exploded perspective view according to the 3rd embodiment of unidirectional condenser microphone of the present invention;
Figure 14 is the sectional view of the assembly of first, second and the 3rd embodiment of the present invention;
Figure 15 is the exploded perspective view according to the 4th embodiment of unidirectional condenser microphone of the present invention;
Figure 16 is the exploded perspective view according to the 5th embodiment of unidirectional condenser microphone of the present invention;
Figure 17 is the exploded perspective view according to the 6th embodiment of unidirectional condenser microphone of the present invention;
Figure 18 is the sectional view of the assembly of the 4th, the 5th and the 6th embodiment of the present invention.
Embodiment
With reference to these accompanying drawings the preferred embodiments of the invention are elaborated below.
Fig. 2 is the stereogram according to parallelepiped condenser microphone of the present invention.
As shown in Figure 2, condenser microphone 100～600 according to the present invention comprises the shell of a parallelepiped-shaped, and it is used for parts being inserted into wherein and being connected with main PCB by being formed on the lip-deep terminal that stretches out of its PCB.This PCB is formed with sound hole 114a.This condenser microphone 100～600 of the present invention forms parallelepiped shape.Therefore, can easily regulate the direction of parts, and this can solve the problem that the surface can be departed from or its direction can be offset that is connected of the splicing ear of main PCB and condenser microphone according to mounted on surface.This parallelepiped type condenser microphones of the present invention can be made of various parts.To be elaborated to first to the 6th embodiment now.
[first embodiment (two-way)]
Fig. 3 is the exploded perspective view according to first embodiment of two-way parallelepiped condenser microphone of the present invention.
With reference to Fig. 3, condenser microphone 100 according to the present invention comprises: shell 102, it have open surfaces and being formed be used to collect sound sound hole 102a the sealing bottom surface and form the square box shape; Ring film member 104, it is inserted in the described shell that forms the square box shape; Form the shim liner 106 of annular; Cylindrical dead ring 108, it has open top and bottom; Form the backboard 110 of plate-like, it has the sound hole 110a that therefrom passes; Annular conductive rings 112, it is used to make backboard 110 and printed circuit board (PCB) (PCB; 114) be electrically connected; And the PCB114 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 116 that stretches out, this PCB114 part place in the central is formed with the sound hole 114a that is used for back sound.Here, diaphragm member 104 comprises and is used for the polar ring 104a that is electrically connected with shell 102 and the diaphragm 104b by oscillation of sound pressure.Backboard 110 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.
[second embodiment (two-way)]
Fig. 4 is the exploded perspective view according to second embodiment of parallelepiped bi-directional condenser microphone of the present invention.
With reference to Fig. 4, condenser microphone 200 according to the present invention comprises: shell 202, it have open surfaces and being formed be used to collect sound sound hole 202a the sealing bottom surface and form the square box shape; Diaphragm member 204, it has square outer surface that is inserted in the described shell that forms the square box shape and the circular film that is formed on its inboard; Pad 206, it has square outer surface and circular inner circumferential surface; Square box shaped dead ring 208, it has open top and bottom; Backboard 210, it forms square and has the sound hole 210a that passes wherein; Conducting ring 212 has and is used to square outer surface and circular inner circumferential surface that backboard 210 is electrically connected with PCB214; And the PCB214 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 216 that stretches out, this PCB214 part place in the central is formed with the sound hole 214a that is used for back sound.Here, diaphragm member 204 comprises and is used for the polar ring 204a that is electrically connected with shell 202 and the diaphragm 204b by oscillation of sound pressure.Backboard 210 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.
[the 3rd embodiment]
Fig. 5 is the exploded perspective view according to the 3rd embodiment of parallelepiped bi-directional condenser microphone of the present invention.
With reference to Fig. 5, condenser microphone 300 according to the present invention comprises: shell 302, it have open surfaces and being formed be used to collect sound sound hole 302a the sealing bottom surface and form the square box shape; Diaphragm member 304, it has square outer surface that is inserted in the described shell that forms the square box shape and the circular film that is formed on its inboard; Pad 306, it has square outer surface and square inner circumferential surface; Square box shaped dead ring 308, it has open top and bottom; Backboard 310, it forms square and has the sound hole 310a that therefrom passes; Conducting ring 312 has and is used to square outer surface and square inner circumferential surface that backboard 310 is electrically connected with PCB314; And the PCB314 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 316 that stretches out, this PCB314 part place in the central is formed with the sound hole 314a that is used for back sound.Here, diaphragm member 304 comprises and is used for the polar ring 304a that is electrically connected with shell 302 and the diaphragm 304b by oscillation of sound pressure.Backboard 310 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.
[operation of first to the 3rd embodiment (two-way)]
Fig. 6 is the sectional view of the assembly of first, second and the 3rd embodiment of the present invention.Adopt those Reference numerals of first embodiment to represent the Reference numeral of these parts typically.
With reference to Fig. 6, the condenser microphone 100～300 of first to the 3rd embodiment has the shell 102 of a square box shape respectively, wherein is furnished with the PCB114 of diaphragm member 104, pad 106, dead ring 108, backboard 110, conducting ring 112 and the side's of forming plate shape successively.Afterwards, curl by the end that makes shell 102 and assemble this condenser microphone.
On the exposed surface of PCB114, be formed with and stretch out terminal, and these to stretch out terminal more outstanding than curved surface, thereby this condenser microphone 100～300 can be installed on the main PCB (for example cellular PCB) in the SMD method.These terminals 116 can be for being used for terminal and earth terminal and the terminal required according to additional function that Vdd connects.
In addition, the square part of first to the 3rd embodiment can have the circular edge that forms that is in contact with one another according to the manufacturing of these parts and the convenience of assembling.Be installed in that IC among the PCB comprises junction field effect transistor (JFET), amplifier, analog to digital (A/D) transducer or as the ASIC of the IC that is used to customize this amplifier and analog to digital (A/D) transducer.
To carry out the operation of the condenser microphone of first to the 3rd embodiment below.
Will stretching out on the splicing ear that terminal 116 is connected to main PCB according to condenser microphone 300 of the present invention.Stretch out terminal to these and apply Vdd and GND energy.Therefore, in condenser microphone 100～300 according to the present invention, diaphragm 104b is electrically connected with PCB114 by shell 102 and polar ring 104a, and backboard 104 is electrically connected with PCB114 by conducting ring 112.
In this case, flow into the inside of microphone and pass to diaphragm 104b from the front sound of outside sound source sound hole 102a by described shell.Back sound passes to diaphragm 104b by the sound hole 114a of described PCB and the sound hole 110a of backboard 110.
Therefore, diaphragm 104b has bidirectional characteristic in vibration, because the offset effect of the horizontal sound that the compound acoustic pressure by front sound and back sound produces, this characteristic only shows the response to front side and rear side sound.As a result, can change gap between diaphragm 104b and backboard 110.The electrostatic capacitance that is produced by diaphragm 104b and backboard 110 will change, and therefore can realize the variation of the signal of telecommunication (voltage) according to sound wave.This signal sends the IC that is installed among the PCB114 to along above-mentioned electrical connection path, thereby is exaggerated and exports to external circuit by stretching out terminal 116 subsequently.
[the 4th embodiment (two-way)]
Fig. 7 is the exploded perspective view according to the 4th embodiment of bi-directional condenser microphone of the present invention.
With reference to Fig. 7, condenser microphone 400 of the present invention comprises: shell 402, it have open surfaces and being formed be used to collect front sound sound hole 402a the sealing bottom surface and form the square box shape; Diaphragm member 404, it forms annular and is inserted in the described shell that forms the square box shape; Form the shim liner 406 of annular; Ring shielding ring 408, it is used to isolate backboard 410; Described backboard 410, it forms plate-like and has the sound hole 410a that therefrom passes; Whole substrate 412, it has the conductive layer 412b that is used for providing electrical connection between backboard 410 and PCB414, and this conductive layer is formed in the inner surface of the cylindrical insulator 412a with open top and bottom; And the PCB414 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 416 that stretches out, this PCB has the formation sound hole 414a that is used for back sound in the part in the central.
Here, diaphragm member 404 comprises and is used for the polar ring 404a that is electrically connected with shell 402 and the diaphragm 404b by oscillation of sound pressure.Backboard 410 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.In addition, wish that shell 402 does not have sound hole at its bottom central part branch, because the central authorities of this shell bottom surface are used for from band-reel package (tape ﹠amp when processing SMD; Reel package) picks up the position of this microphone in.
This integral body substrate 412 has a kind of like this structure, thereby adopt the PCB technology with hollow cylindrical insulator 412a as PCB, in the both sides of this hollow cylindrical insulator 412a and inner circumferential surface, form the conductive layer 412b of external diameter then less than the metallic plate of its peripheral external diameter.
Equally, whole substrate 412 according to the present invention so constitutes, thereby first substrate of carrying out conventional insulation function and second substrate of carrying out conducting function can be made of a whole substrate.Thereby the external diameter of metallic plate should less than the external diameter of insulator not can with housing contacts.Here, insulator 412a can be preferably constitutes by glass epoxy resin substrate, resin base or based on the insulated printed circuit board of PVC.
Though specifically do not demonstrate, insulator 412a carries out insulation function, thereby and can by its with a side of diaphragm member 410 contact on and with the opposite side of PCB414 contact on form electrodeposition of metals and utilize through hole or via hole to be connected top and bottom metal electrodeposited coating then electrodeposition of metals to be electrically connected fetch conducting function is provided.
[the 5th embodiment (two-way)]
Fig. 8 is the exploded perspective view according to the 5th embodiment of bi-directional condenser microphone of the present invention.
With reference to Fig. 8, condenser microphone 500 according to the present invention comprises: shell 502, it have open surfaces and being formed be used to collect sound sound hole 502a the sealing bottom surface and form the square box shape; Diaphragm member 504, it has square outer surface and the square diaphragm that is formed on its inboard in the described shell that is inserted into the square box shape; Pad 506, it has square outer surface and square inner circumferential surface; The shading ring 508 of the side's of forming annular, it is used for isolating backboard 510; Described backboard 510, it forms square and has the sound hole 510a that therefrom passes; Whole substrate 512, it has the conductive layer 512b that is used for providing electrical connection between backboard 510 and PCB514, and this conductive layer is formed in the inner surface of insulator 512a of the square box shape with open top and bottom; And the PCB514 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 516 that stretches out, this PCB part place in the central is formed with the sound hole 514a that is used for back sound.
[the 6th embodiment (two-way)]
Fig. 9 is the exploded perspective view according to the 6th embodiment of bi-directional condenser microphone of the present invention.
With reference to Fig. 9, condenser microphone 600 according to the present invention comprises: shell 602, it have open surfaces and being formed be used to collect sound sound hole 602a the sealing bottom surface and form the square box shape; Diaphragm member 604, it has the square outer surface in the described shell that is inserted into the square box shape and is formed on its inner circular film; Pad 606, it has square outer surface and circular inner circumferential surface; Shading ring 608, it has square outer surface and the circular inner circumferential surface that is used for isolating backboard 610; Described backboard 610, it forms plate-like and has the sound hole 610a that therefrom passes; Whole substrate 612, it has insulator 612a and conductive layer 612b, this insulator has open top and bottom, square outer surface and circular inner circumferential surface, this conductive layer provides the conductive layer 612b of electrical connection between backboard 610 and PCB614, and this conductive layer is formed in the inner surface of insulator 512a; And the PCB614 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 616 that stretches out, this PCB part place in the central is formed with the sound hole 614a that is used for back sound.
[operation of the 4th to the 6th embodiment (two-way)]
To carry out the operation of the condenser microphone of the 4th to the 6th embodiment below.
Figure 10 is the sectional view of the assembly of the 4th to the 6th embodiment of the present invention.Adopt those Reference numerals of the 4th embodiment to represent the Reference numeral of these parts typically.
With reference to Figure 10, the bi-directional condenser microphone 400～600 of the 4th to the 6th embodiment has the shell 102 of square box shape respectively, wherein is furnished with the PCB414 of diaphragm member 404, pad 406, shading ring 408, backboard 410, whole substrate 412 and the side's of forming plate shape successively.Afterwards, curl by the end that makes shell 402 and assemble this condenser microphone.
On the exposed surface of PCB414, be formed with and stretch out terminal, and these to stretch out terminal more outstanding than curved surface, thereby this condenser microphone 400～600 can be installed on the main PCB (for example cellular PCB) in the SMD method.These terminals 416 can be for being used for terminal and earth terminal and the terminal required according to additional function that Vdd connects.
In addition, the square part of the 4th to the 6th embodiment can have the circular edge that forms that is in contact with one another according to the manufacturing of these parts and the convenience of assembling.Be installed in that IC among the PCB comprises junction field effect transistor (JFET), amplifier, analog to digital (A/D) transducer or as the ASIC of the IC that is used to customize this amplifier and analog to digital (A/D) transducer.
To carry out the operation of the condenser microphone of the 4th to the 6th embodiment below.
Will stretching out on the splicing ear that terminal 416 is connected to main PCB according to condenser microphone of the present invention.Stretch out terminal to these and apply Vdd and GND energy.Therefore, in condenser microphone 400～600 according to the present invention, diaphragm 404b is electrically connected with PCB414 by shell 402 and polar ring 404a, and the conductive layer 412b of backboard 410 by whole substrate 412 is electrically connected with PCB414.
In this case, flow into the inside of microphone and pass to diaphragm 404b from the front sound of outside sound source sound hole 402a by shell.Back sound passes to diaphragm 404b by the sound hole 414a of PCB and the sound hole 410a of backboard 410.
Therefore, diaphragm 404b has bidirectional characteristic in vibration, and owing to the offset effect of the living horizontal sound of cutting down output by the complex sound of front sound and back sound, this characteristic only shows the response to front side and rear side sound.As a result, can change gap between diaphragm 404b and backboard 410.The electrostatic capacitance that is produced by diaphragm 404b and backboard 410 will change, and therefore can realize the variation of the signal of telecommunication (voltage) according to sound wave.This signal is transmitted to the IC that is installed among the PCB414 along above-mentioned electrical connection path, thereby is exaggerated and exports to external circuit by stretching out terminal 416 subsequently.
Unidirectional condenser microphone 100 to 600 according to the present invention except also comprise be positioned at the backboard rear side by the micropore sintered metal acoustic resistor (sound resistor), identical with the bi-directional condenser microphone of said structure.Parallelepiped unidirectional condenser microphone of the present invention can realize by polytype parts.Describe this different type in detail with reference to following first to the 6th embodiment.
[first embodiment (unidirectional)]
Figure 11 is the exploded perspective view according to first embodiment of parallelepiped unidirectional condenser microphone of the present invention.
With reference to Figure 11, condenser microphone 100 according to the present invention comprises: shell 102, it have open surfaces and being formed be used to collect sound sound hole 102a the sealing bottom surface and form the square box shape; The diaphragm member 104 of annular, it is inserted in the described shell that forms the square box shape; Form the shim liner 106 of annular; Cylindrical dead ring 108, it has open top and bottom; Form the backboard 110 of plate-like, it has the sound hole 110a that therefrom passes; Acoustic resistor 111; Annular conductive rings 112, it is used to make backboard 110 by acoustic resistor 111 and printed circuit board (PCB) (PCB; 114) be electrically connected; And the PCB114 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 116 that stretches out, this PCB114 part place in the central is formed with the sound hole 114a that is used for back sound.
[second embodiment (unidirectional)]
Figure 12 is the exploded perspective view according to second embodiment of parallelepiped unidirectional condenser microphone of the present invention.
With reference to Figure 12, condenser microphone 200 according to the present invention comprises: shell 202, it have open surfaces and being formed be used to collect sound sound hole 202a the sealing bottom surface and form the square box shape; Diaphragm member 204, it has square outer surface that is inserted in the described shell that forms the square box shape and the circular film that is formed on its inboard; Pad 206, it has square outer surface and circular inner circumferential surface; Square box shaped dead ring 208, it has open top and bottom; Backboard 210, it forms square and has the sound hole 210a that passes wherein; Acoustic resistor 211; Conducting ring 212, it has square outer surface and the circular inner circumferential surface that is used to make backboard 210 to be electrically connected with PCB214 by acoustic resistor 211; And the PCB214 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 216 that stretches out, this PCB214 part place in the central is formed with the sound hole 214a that is used for back sound.Here, diaphragm member 204 comprises and is used for the polar ring 204a that is electrically connected with shell 202 and the diaphragm 204b by oscillation of sound pressure.Backboard 210 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.
[the 3rd embodiment (unidirectional)]
Figure 13 is the exploded perspective view according to the 3rd embodiment of parallelepiped unidirectional condenser microphone of the present invention.
With reference to Figure 13, condenser microphone 300 according to the present invention comprises: shell 302, it have open surfaces and being formed be used to collect sound sound hole 302a the sealing bottom surface and form the square box shape; Diaphragm member 304, it has square outer surface that is inserted in the described shell that forms the square box shape and the circular film that is formed on its inboard; Pad 306, it has square outer surface and square inner circumferential surface; Square box shaped dead ring 308, it has open top and bottom; Backboard 310, it forms square and has the sound hole 310a that therefrom passes; Acoustic resistor 311; Conducting ring 312 has the square outer surface and the square inner circumferential surface that are used to make backboard 310 to be electrically connected with PCB314 by acoustic resistor 311; And the PCB314 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 316 that stretches out, this PCB314 is formed with the sound hole 314a that is used for back sound in the part in the central.Here, diaphragm member 304 comprises and is used for the polar ring 304a that is electrically connected with shell 302 and the diaphragm 304b by oscillation of sound pressure.Backboard 310 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.
[operation of first to the 3rd embodiment (unidirectional)]
Figure 14 is the sectional view of the assembly of first, second and the 3rd embodiment of the present invention.Adopt those Reference numerals of first embodiment to represent the Reference numeral of these parts typically.
With reference to Figure 14, the condenser microphone 100～300 of first to the 3rd embodiment has the shell 102 of a square box shape respectively, wherein is furnished with the PCB114 of diaphragm member 104, pad 106, dead ring 108, backboard 110, acoustic resistor 111, conducting ring 112 and the side's of forming plate shape successively.Afterwards, curl by the end that makes shell 102 and assemble this condenser microphone.
On the exposed surface of PCB114, be formed with and stretch out terminal, and these to stretch out terminal more outstanding than curved surface, thereby this condenser microphone 100～300 can be installed on the main PCB (for example cellular PCB) in the SMD method.These terminals 116 can be for being used for terminal and earth terminal and the terminal required according to additional function that Vdd connects.
In addition, the square part of first to the 3rd embodiment can have the circular edge that forms that is in contact with one another according to the manufacturing of these parts and the convenience of assembling.Be installed in that IC among the PCB comprises junction field effect transistor (JFET), amplifier, analog to digital (A/D) transducer or as the ASIC of the IC that is used to customize this amplifier and analog to digital (A/D) transducer.
To carry out the operation of the condenser microphone of first to the 3rd embodiment below.
Will stretching out on the splicing ear that terminal 116 is connected to main PCB according to condenser microphone 300 of the present invention.Stretch out terminal to these and apply Vdd and GND energy.Therefore, in condenser microphone 100～300 according to the present invention, diaphragm 104b is electrically connected with PCB114 by shell 102 and polar ring 104a, and backboard 104 is electrically connected with PCB114 by acoustic resistor 111 and conducting ring 112.
In this case, flow into the inside of microphone and pass to diaphragm 104b from the front sound of outside sound source sound hole 102a by shell.Back sound is by sound hole 114a and weakened by acoustic resistor 111 subsequently or change over and have different phase places.Sound by acoustic resistor 111 is transferred into diaphragm 104b by the sound hole 110a of backboard 110.At this moment, owing to back sound is weakened by acoustic resistor 111, so diaphragm 104b only responds the front sound generating.
Therefore, the diaphragm 104b acoustic pressure effect vibration down of sound in front.As a result, can change gap between diaphragm 104b and backboard 110.The electrostatic capacitance that is produced by diaphragm 104b and backboard 110 will change, and therefore can realize the variation of the signal of telecommunication (voltage) according to sound wave.This signal is transmitted to the IC that is installed among the PCB114 along top electrical connection path, thereby is exaggerated and exports to external circuit by stretching out terminal 116 subsequently.
[the 4th embodiment (unidirectional)]
Figure 15 is the exploded perspective view according to the 4th embodiment of unidirectional condenser microphone of the present invention.
With reference to Figure 15, condenser microphone 400 of the present invention comprises: shell 402, it have open surfaces and being formed be used to collect front sound sound hole 402a the sealing bottom surface and form the square box shape; Diaphragm member 404, it forms annular and is inserted in the described shell that forms the square box shape; Form the shim liner 406 of annular; Ring shielding ring 408 is used to isolate backboard 410; Acoustic resistor 411; Backboard 410, it forms plate-like and has the sound hole 410a that therefrom passes; Whole substrate 412, it has the conductive layer 412b that is used for forming electrical connection between backboard 410 and PCB414, and this conductive layer is formed in the inner surface of the cylindrical insulator 412a with open top and bottom; And the PCB414 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 416 that stretches out, this PCB has the formation sound hole 414a that is used for back sound at part place in the central.
Here, diaphragm member 404 comprises and is used for the polar ring 404a that is electrically connected with shell 402 and the diaphragm 404b by oscillation of sound pressure.Backboard 410 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.This integral body substrate 412 has a kind of like this structure, thereby adopt the PCB technology with hollow cylindrical insulator 412a as PCB, in the both sides of this hollow cylindrical insulator 412a and inner circumferential surface, form the conductive layer 412b of external diameter then less than the metallic plate of its peripheral external diameter.
[the 5th embodiment (unidirectional)]
Figure 16 is the exploded perspective view according to the 5th embodiment of unidirectional condenser microphone of the present invention.
With reference to Figure 16, condenser microphone 500 according to the present invention comprises: shell 502, it have open surfaces and being formed be used to collect sound sound hole 502a the sealing bottom surface and form the square box shape; Diaphragm member 504, it has square outer surface and the square diaphragm that is formed on its inboard in the described shell that is inserted into the square box shape; Pad 506, it has square outer surface and square inner circumferential surface; Square shading ring 508 is used for isolating backboard 510; Backboard 510, it forms square and has the sound hole 510a that therefrom passes; Acoustic resistor 511; Whole substrate 512, it has and is used for forming the conductive layer 512b that is electrically connected between backboard 510 and PCB514, and this conductive layer is formed in the inner surface of insulator 512a of the square box shape with open top and bottom; And the PCB514 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 516 that stretches out, this PCB is formed with the sound hole 514a that is used for back sound in the part in the central.
Here, diaphragm member 504 comprises and is used for the polar ring 504a that is electrically connected with shell 502 and the diaphragm 504b by oscillation of sound pressure.Backboard 510 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.Whole substrate 512 has a kind of like this structure, thereby adopt the PCB technology with hollow cylindrical insulator 512a as PCB, in the both sides of this hollow cylindrical insulator 512a and inner circumferential surface, form the conductive layer 512b of external diameter then less than the metallic plate of its peripheral external diameter.
[the 6th embodiment (unidirectional)]
Figure 17 is the exploded perspective view according to the 6th embodiment of unidirectional condenser microphone of the present invention.
With reference to Figure 17, condenser microphone 600 according to the present invention comprises: shell 602, it have open surfaces and being formed be used to collect sound sound hole 602a the sealing bottom surface and form the square box shape; Diaphragm member 604, it has square outer surface and the circular film that is formed on its inboard in the described shell that is inserted into the square box shape; Pad 606, it has square outer surface and circular inner circumferential surface; Shading ring 608, it has square outer surface and the circular inner circumferential surface that is used for isolating backboard 610; Backboard 610, it forms plate-like and has the sound hole 610a that therefrom passes; Acoustic resistor 611; Whole substrate 612, it has insulator 512a and conductive layer 612b, this insulator has open top and bottom, square outer surface and cylindrical inner circumferential surface, this conductive layer forms electrical connection between backboard 610 and PCB614, and this conductive layer is formed in the inner surface of insulator 512a; And the PCB614 of the side's of forming plate shape, described PCB has a lip-deep parts (IC who is installed in this PCB, MLCC) and be formed on its another lip-deep terminal 616 that stretches out, this PCB part place in the central is formed with the sound hole 614a that is used for back sound.
Here, diaphragm member 604 comprises and is used for the polar ring 604a that is electrically connected with shell 602 and the diaphragm 604b by oscillation of sound pressure.Backboard 610 comprises and is used for and will be formed with the organic film welding metallic plate thereon of electret.Whole substrate 612 has a kind of like this structure, thereby adopt the PCB technology with hollow cylindrical insulator 612a as PCB, in the both sides of this hollow cylindrical insulator 612a and inner circumferential surface, form the conductive layer 612b of external diameter then less than the metallic plate of its peripheral external diameter.Similarly, whole substrate 612 according to the present invention second substrate that is configured to carry out first substrate of conventional insulation function and carries out conduction function can be formed by a whole substrate.
[operation of the 4th to the 6th embodiment]
To carry out the operation of the condenser microphone of the 4th to the 6th embodiment below.
Figure 18 is the sectional view of the assembly of the 4th to the 6th embodiment of the present invention.Adopt those Reference numerals of the 4th embodiment to represent the Reference numeral of these parts typically.
With reference to Figure 18, the unidirectional condenser microphone 400～600 of the 4th to the 6th embodiment has the shell 102 of a square box shape respectively, wherein is furnished with the PCB414 of diaphragm member 404, pad 406, shading ring 408, backboard 410, acoustic resistor 411, whole substrate 412 and the side's of forming plate shape successively.Afterwards, curl by the end that makes shell 402 and assemble this condenser microphone.
On the exposed surface of PCB414, be formed with and stretch out terminal, and these stretch out terminal and more stretch out than curved surface, thereby this condenser microphone 400～600 can be installed on the main PCB (for example cellular PCB) in the SMD method.These terminals 416 can be for being used for terminal and earth terminal and the terminal required according to additional function that Vdd connects.
In addition, the square part of the 4th to the 6th embodiment can have the circular edge that forms that is in contact with one another according to the manufacturing of these parts and the convenience of assembling.Be installed in that IC among the PCB comprises junction field effect transistor (JFET), amplifier, analog to digital (A/D) transducer or as the ASIC of the IC that is used to customize this amplifier and analog to digital (A/D) transducer.
To carry out the operation of the condenser microphone of the 4th to the 6th embodiment below.
Will stretching out on the splicing ear that terminal 416 is connected to main PCB according to condenser microphone of the present invention.Stretch out terminal to these and apply Vdd and GND energy.Therefore, in condenser microphone 400～600 according to the present invention, diaphragm 404b is electrically connected with PCB414 by shell 402 and polar ring 404a, and the conductive layer 412b that backboard 410 passes through acoustic resistor 611 and whole substrate 412 is electrically connected with PCB414.
In this case, flow into the inside of microphone and pass to diaphragm 404b from the front sound of outside sound source sound hole 402a by shell.Back sound is by the sound hole 414a of PCB414 and weakened by acoustic resistor 411 subsequently or change over and have different phase places.Sound by acoustic resistor 411 is transmitted through the sound hole 410a of backboard 410 to diaphragm 404b.At this moment, owing to back sound is weakened by acoustic resistor 411, so diaphragm 404b only responds the front sound generating.
Therefore, the diaphragm 404b acoustic pressure effect vibration down of sound in front.As a result, the gap between diaphragm 404b and the backboard 410 can change.The electrostatic capacitance that is produced by diaphragm 404b and backboard 410 will change, and therefore can realize the variation of the signal of telecommunication (voltage) according to sound wave.This signal is transmitted to the IC that is installed among the PCB414 along top electrical connection path, thereby is exaggerated and exports to external circuit by stretching out terminal 416 subsequently.
Simultaneously, in the above-described embodiment, notice because the bottom central part branch of shell is to be used for adopting vacuum chuck from the position that band-reel accurately picks up microphone when processing SMD, so this shell does not form sound hole.
Industrial applicibility
As mentioned above, according to condenser microphone provider tropism of the present invention.In addition, because during finished surface erecting device (SMD), can confirm the direction of parts, so can easily regulate two or more splicing ears of parts mutually.Therefore, depart from this surface that is connected that can prevent the splicing ear of the splicing ear of main PCB and condenser microphone, and reduced the connection fault that connection or direction (polarity) variation owing to splicing ear cause.
Though describe the present invention above with reference to the preferred embodiments of the invention, but it can be understood by the person skilled in the art that not breaking away under the situation of scope of the present invention defined in the claims and notion and can make various changes or variation.
Claims (10)
1. parallelepiped type directional capacitance microphone, this condenser microphone comprises:
Form the shell of square box shape, this shell has the sealing bottom surface that open surfaces and being formed with is used to collect the sound hole of sound;
Form the diaphragm member of annular, this diaphragm member is inserted in the described shell;
Form the shim liner of annular;
Cylindrical dead ring, it has open top and bottom;
Backboard, it forms plate-like and has the sound hole that passes therethrough;
Annular conductive rings is used to make described backboard to be electrically connected with PCB; And
The PCB of the side's of forming plate shape, described PCB have the lip-deep electronic unit that is installed in this PCB and are formed on its another lip-deep terminal that stretches out, and this PCB part place in the central is formed with the sound hole that is used for back sound,
Thus, described diaphragm member, pad, dead ring, backboard, conducting ring and PCB sequentially are arranged in the described shell, and curl by the end that makes described shell then and assemble out integratedly this condenser microphone,
Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts is installed towards described conducting ring.
2. parallelepiped type directional capacitance microphone, this condenser microphone comprises:
Form the shell of square box shape, this shell has the sealing bottom surface that open surfaces and being formed with is used to collect the sound hole of sound;
Diaphragm member, it has square outer surface that is inserted in the described shell and the circular film that is formed on its inboard;
Pad, it has square outer surface and circular inner circumferential surface;
The square box shaped dead ring, it has open top and bottom;
Backboard, it forms square and has the sound hole that passes therethrough;
Conducting ring, it has and is used to square outer surface and circular inner circumferential surface that described backboard is electrically connected with PCB; And
The PCB of the side's of forming plate shape, described PCB have the lip-deep electronic unit that is installed in this PCB and are formed on its another lip-deep terminal that stretches out, and this PCB part place in the central is formed with the sound hole that is used for back sound,
Thus, described diaphragm member, pad, dead ring, backboard, conducting ring and PCB sequentially are arranged in the described shell, and curl by the end that makes described shell then and assemble out integratedly this condenser microphone,
Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts is installed towards described conducting ring.
3. parallelepiped type directional capacitance microphone, this condenser microphone comprises:
Form the shell of square box shape, this shell has the sealing bottom surface that open surfaces and being formed with is used to collect the sound hole of sound;
Diaphragm member, it has square outer surface that is inserted in the described shell and the square diaphragm that is formed on its inboard;
Pad, it has square outer surface and square inner circumferential surface;
The square box shaped dead ring, it has open top and bottom;
Backboard, it forms square and has the sound hole that passes therethrough;
Conducting ring, it has and is used to square outer surface and square inner circumferential surface that described backboard is electrically connected with PCB; And
The PCB of the side's of forming plate shape, described PCB have the lip-deep electronic unit that is installed in this PCB and are formed on its another lip-deep terminal that stretches out, and this PCB part place in the central is formed with the sound hole that is used for back sound,
Thus, described diaphragm member, pad, dead ring, backboard, conducting ring and PCB sequentially are arranged in the described shell, and curl by the end that makes described shell then and assemble out integratedly this condenser microphone,
Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts is installed towards described conducting ring.
4. according to each described condenser microphone in the claim 1 to 3, it is characterized in that, also comprise an acoustic resistor, be used to weaken or postpone at the back of described backboard rear side sound, described acoustic resistor is configured in the sound hole of described PCB.
5. parallelepiped type directional capacitance microphone, this condenser microphone comprises:
Form the shell of square box shape, this shell has the sealing bottom surface that open surfaces and being formed with is used to collect the sound hole of front sound;
Form the diaphragm member of annular, this diaphragm member is inserted in the described shell;
Form the shim liner of annular;
Form the shading ring of annular, be used to isolate backboard;
Backboard, it forms plate-like and has the sound hole that passes therethrough;
Whole substrate, it has cylindrical insulator and the conductive layer that has open top and bottom, and this conductive layer provides between backboard and PCB and is electrically connected and is formed in the inner surface of described insulator; And
The PCB of the side's of forming plate shape, described PCB have the lip-deep electronic unit that is installed in this PCB and are formed on its another lip-deep terminal that stretches out, and this PCB part place in the central is formed with the sound hole that is used for back sound,
Thus, described diaphragm member, pad, shading ring, backboard, whole substrate and PCB sequentially are arranged in the described shell, and curl by the end that makes described shell then and assemble out integratedly this condenser microphone,
Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts is installed towards described whole substrate.
6. parallelepiped type directional capacitance microphone, this condenser microphone comprises:
Form the shell of square box shape, this shell has the sealing bottom surface that open surfaces and being formed with is used to collect the sound hole of sound;
Diaphragm member, it has square outer surface that is inserted in the described shell and the square diaphragm that is formed on its inboard;
Pad, it has square outer surface and square inner circumferential surface;
Form the shading ring of square ring-type, be used to isolate backboard;
Backboard, its side's of forming plate shape and have the sound hole that passes therethrough;
Whole substrate, it has square box shaped insulator and the conductive layer that has open top and bottom, and this conductive layer provides between backboard and PCB and is electrically connected and is formed in the inner surface of described insulator; And
The PCB of the side's of forming plate shape, described PCB have the lip-deep electronic unit that is installed in this PCB and are formed on its another lip-deep terminal that stretches out, and this PCB part place in the central is formed with the sound hole that is used for back sound,
Thus, described diaphragm member, pad, shading ring, backboard, whole substrate and PCB sequentially are arranged in the described shell, and curl by the end that makes described shell then and assemble out integratedly this condenser microphone,
Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts is installed towards described whole substrate.
7. parallelepiped type directional capacitance microphone, this condenser microphone comprises:
Form the shell of square box shape, this shell has the sealing bottom surface that open surfaces and being formed with is used to collect the sound hole of sound;
Diaphragm member, it has square outer surface that is inserted in the described shell and the circular film that is formed on its inboard;
Pad, it has square outer surface and circular inner circumferential surface;
Shading ring, it has square outer surface and the circular inner circumferential surface that is used to isolate backboard;
Backboard, it forms plate-like and has the sound hole that passes therethrough;
Whole substrate, it has insulator and the conductive layer that has open top and bottom, square outer surface and cylindrical inner circumferential surface, and this conductive layer provides between described backboard and PCB and is electrically connected and is formed in the inner surface of described insulator; And
The PCB of the side's of forming plate shape, described PCB have the lip-deep electronic unit that is installed in this PCB and are formed on its another lip-deep terminal that stretches out, and this PCB is formed with the sound hole that is used for back sound in the part in the central,
Thus, described diaphragm member, pad, shading ring, backboard, whole substrate and PCB sequentially are arranged in the described shell, and curl by the end that makes described shell then and assemble out integratedly this condenser microphone,
Open surfaces at described shell is provided with described PCB, and makes described PCB the one side of parts is installed towards described whole substrate.
8. according to each described condenser microphone in the claim 5 to 7, it is characterized in that described microphone also comprises acoustic resistor, be used to weaken or postpone that described acoustic resistor is configured in the sound hole of described PCB at the back of described backboard rear side sound.
9. according to each described condenser microphone in the claim 5 to 7, it is characterized in that described whole substrate comprises through hole or via hole, its inside that is formed on described insulator is used to connect the end face of described insulator and the conductive plated pattern on the bottom surface.
10. as each described condenser microphone in claim 1 to 3 and the claim 5 to 7, it is characterized in that, described shell does not form sound hole in the central portion office of its bottom surface, and this middle body is to be used for the position of picking up this microphone when the finished surface erecting device from band-reel.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040012310A KR100544281B1 (en) | 2004-02-24 | 2004-02-24 | A parallelepiped type directional condenser microphone |
| KR10-2004-0012310 | 2004-02-24 | ||
| KR1020040012310 | 2004-02-24 | ||
| PCT/KR2004/002529 WO2005081582A1 (en) | 2004-02-24 | 2004-10-01 | A parallelepiped type directional condenser microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1961610A CN1961610A (en) | 2007-05-09 |
| CN1961610B true CN1961610B (en) | 2011-05-11 |
Family
ID=34880276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004800012997A Expired - Fee Related CN1961610B (en) | 2004-02-24 | 2004-10-01 | Parallelepiped type directional capacitance microphone |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100544281B1 (en) |
| CN (1) | CN1961610B (en) |
| BR (1) | BRPI0500580A (en) |
| WO (1) | WO2005081582A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305331A (en) * | 1999-12-13 | 2001-07-25 | 元一通讯株式会社 | Condenser microphone |
| KR20020024122A (en) * | 2002-01-26 | 2002-03-29 | 이석순 | Capacitor microphone |
| CN1354615A (en) * | 2000-11-21 | 2002-06-19 | 松下电器产业株式会社 | Electret condenser microphone |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58207800A (en) * | 1982-05-28 | 1983-12-03 | Toshiba Corp | Transducer |
| JP3479464B2 (en) * | 1999-02-08 | 2003-12-15 | ホシデン株式会社 | Unidirectional electret condenser microphone |
| JP3471775B2 (en) * | 2001-08-27 | 2003-12-02 | ヤマハメタニクス株式会社 | Microphone holder |
| JP3748810B2 (en) * | 2001-11-29 | 2006-02-22 | シチズン電子株式会社 | Microphone |
| JP4003870B2 (en) * | 2002-05-28 | 2007-11-07 | シチズン電子株式会社 | Electret condenser microphone |
| KR200332944Y1 (en) * | 2003-07-29 | 2003-11-14 | 주식회사 비에스이 | SMD possible electret condenser microphone |
| KR200330089Y1 (en) * | 2003-07-29 | 2003-10-11 | 주식회사 비에스이 | Integrated base and electret condenser microphone using the same |
| KR100544283B1 (en) * | 2004-01-20 | 2006-01-24 | 주식회사 비에스이 | A parallelepiped type condenser microphone for SMD |
-
2004
- 2004-02-24 KR KR1020040012310A patent/KR100544281B1/en not_active IP Right Cessation
- 2004-10-01 WO PCT/KR2004/002529 patent/WO2005081582A1/en active Application Filing
- 2004-10-01 CN CN2004800012997A patent/CN1961610B/en not_active Expired - Fee Related
-
2005
- 2005-02-21 BR BR0500580-9A patent/BRPI0500580A/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305331A (en) * | 1999-12-13 | 2001-07-25 | 元一通讯株式会社 | Condenser microphone |
| CN1354615A (en) * | 2000-11-21 | 2002-06-19 | 松下电器产业株式会社 | Electret condenser microphone |
| KR20020024122A (en) * | 2002-01-26 | 2002-03-29 | 이석순 | Capacitor microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005081582A1 (en) | 2005-09-01 |
| KR100544281B1 (en) | 2006-01-23 |
| BRPI0500580A (en) | 2005-10-18 |
| CN1961610A (en) | 2007-05-09 |
| KR20050087093A (en) | 2005-08-31 |
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