CN1302356C - Cooling apparatus - Google Patents
Cooling apparatus Download PDFInfo
- Publication number
- CN1302356C CN1302356C CNB2003101027376A CN200310102737A CN1302356C CN 1302356 C CN1302356 C CN 1302356C CN B2003101027376 A CNB2003101027376 A CN B2003101027376A CN 200310102737 A CN200310102737 A CN 200310102737A CN 1302356 C CN1302356 C CN 1302356C
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- casing
- electronic apparatus
- cooling device
- electronic component
- tail end
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- 238000001816 cooling Methods 0.000 title claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 239000002184 metal Substances 0.000 claims abstract description 71
- 230000005855 radiation Effects 0.000 claims abstract description 8
- 235000012149 noodles Nutrition 0.000 claims description 36
- 238000013461 design Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- QFTYEBTUFIFTHD-UHFFFAOYSA-N 1-[6,7-dimethoxy-1-[1-(6-methoxynaphthalen-2-yl)ethyl]-3,4-dihydro-1H-isoquinolin-2-yl]-2-piperidin-1-ylethanone Chemical compound C1=CC2=CC(OC)=CC=C2C=C1C(C)C(C1=CC(OC)=C(OC)C=C1CC1)N1C(=O)CN1CCCCC1 QFTYEBTUFIFTHD-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a cooling device which is used for an electronic device casing; the present invention is used for carrying out heat radiating operation for a system in the electronic device casing rather than the present invention is used for carrying out the heat radiating operation for a certain element. The electronic device casing is provided with a tail end part, wherein at least an electronic part is arranged near the tail end part. The cooling device comprises a cooling chip and a metal frame, wherein the cooling chip is provided with a cooling face and a hot face; the hot face is attached to the electronic device casing; the metal frame is arranged in the electronic device casing and is coupled with the cooling face of the cooling chip so as to conduct the cold current generated by the cooling face; the cold current forms convection current with the heat generated by the electronic part which is arranged in the electronic device casing; therefore, the heat generated by the electronic part is carried to the tail end part of the electronic device casing by the cold current; the metal frame can be matched with a fan to carry out the heat radiation for all electronic parts in the electronic device casing.
Description
Technical field
The present invention relates to a kind of cooling device, and particularly relevant for the cooling device that is used in computer system.
Background technology
(in the speed of CPU more and more fast today, required relatively power is also more and more big for Central Processor Unit, the CPU) power that all has its heat to produce for each central processing unit.Can predict in the near future, the power of CPU is about to break through 100 watts (Watt).Under so high power, computer system can be unstable because of the heat that CPU produced.
Please refer to Fig. 1, it shows the cooling device structural map of existing computer CPU.Be used in the existing cooling device 10 of computer CPU 16, comprise a refrigerating chip (Thermoelectric Cooler, TEC) 11.The huyashi-chuuka (cold chinese-style noodles) of this refrigerating chip 11 is coupled to and for example is the huyashi-chuuka (cold chinese-style noodles) heat radiator 12 of Heat Conduction Material or compound, and its hot side then is coupled to hot side heat radiator 14.Wherein, huyashi-chuuka (cold chinese-style noodles) heat radiator 12 is by the CPU 16 that for example is connected to the desire cooling for the Heat Conduction Material 18 of silicon sheet.17 in fan is mounted on the fixed mount 19, apart from hot side heat radiator 14 one section space is arranged.Fan 17 is drained computer system by the hot-air around the hot side heat radiator 14.
As known from the above, existing cooling device is that the temperature around the CPU is reduced, but also only terminates in this, and is also little to the contribution of whole computer system.
Summary of the invention
In view of this, purpose of the present invention just provides a kind of cooling device.This cooling device is used in casing of electronic apparatus, can be opposite to the system in the casing of electronic apparatus, the action of dispelling the heat, rather than only dispel the heat at a certain element.
As known from the above, the purpose of this invention is to provide a kind of cooling device, comprise refrigerating chip and metal framework.This cooling device is used in casing of electronic apparatus, and this casing of electronic apparatus has tail end, and wherein has electronic component to be configured near the tail end.In cooling device provided by the present invention, its refrigerating chip has hot side and huyashi-chuuka (cold chinese-style noodles) two ends.Wherein, hot side is attached at casing of electronic apparatus, and huyashi-chuuka (cold chinese-style noodles) then is coupled to metal framework.This metal framework is that device is in casing of electronic apparatus, and has metal mesh structure, be used for the low temperature on this huyashi-chuuka (cold chinese-style noodles) is conducted on the whole metal framework, so that the air-flow of coming in from this casing of electronic apparatus outside becomes cold airflow through behind this metal framework, wherein cold airflow produces convection current with the heat that electronic component produced that is disposed at casing of electronic apparatus, makes cold airflow the torrid zone that electronic component produced be arrived the tail end of casing of electronic apparatus.
In first embodiment of the invention, casing of electronic apparatus also comprises one deck thermofin, is configured in the surface of the casing of electronic apparatus that hot side attached of refrigerating chip.At the hot side of refrigerating chip, be connected to the tail end of casing of electronic apparatus via heat pipe or hardware.When cold airflow arrives the tail end of casing of electronic apparatus with the torrid zone that electronic component produced, can simultaneously the hot type that hot side produced be fallen.For making the respond well of heat extraction, therefore, cooling device also comprises fan, and it is configured between metal framework and the electronic component, is used for forcing cold airflow to flow toward tail end.And the flow of fan can influence the design of the wire netting mesh size of metal framework.
Provide a kind of cooling device in another viewpoint of the present invention, comprise refrigerating chip, first fan and metal framework.This cooling device is used in casing of electronic apparatus, and this casing of electronic apparatus has tail end, and wherein has electronic component to be configured near the tail end.In cooling device provided by the invention, first fan is coupled to electronic component, is used for electronic component is dispelled the heat.Refrigerating chip in the cooling device has hot side and huyashi-chuuka (cold chinese-style noodles) two ends.Wherein, hot side is attached at casing of electronic apparatus, and huyashi-chuuka (cold chinese-style noodles) then is coupled to metal framework.This metal framework be device in casing of electronic apparatus, and have metal mesh structure, be used for the low temperature on this huyashi-chuuka (cold chinese-style noodles) is conducted on the whole metal framework, so that the air-flow of coming in from this casing of electronic apparatus outside becomes cold airflow through behind this metal framework.This cold airflow produces convection current with the heat that electronic component produced that is disposed at casing of electronic apparatus, and the air-flow that first fan produces forces to make cold airflow to flow toward tail end, uses the tail end that makes cold airflow the torrid zone that electronic component produced be arrived casing of electronic apparatus.
In second embodiment of the invention, casing of electronic apparatus also comprises one deck thermofin, is configured in the surface of the casing of electronic apparatus that hot side attached of refrigerating chip.At the hot side of refrigerating chip, be connected to the tail end of casing of electronic apparatus via heat pipe or hardware.When cold airflow arrives the tail end of casing of electronic apparatus with the torrid zone that electronic component produced, can simultaneously the hot type that hot side produced be fallen.For making the respond well of heat extraction, therefore, cooling device also comprises second fan, and it is configured between metal framework and the electronic component, is used for forcing cold airflow to flow toward tail end.And the flow of second fan can influence the design of the wire netting mesh size of metal framework.
Provide a kind of cooling device in another viewpoint of the present invention, comprise refrigerating chip and metal framework.This cooling device is used in casing of electronic apparatus, and this casing of electronic apparatus has air intake opening and gas outlet, and wherein has electronic component to be configured near the gas outlet.In cooling device provided by the present invention, its refrigerating chip has hot side and huyashi-chuuka (cold chinese-style noodles) two ends.Wherein, hot side is attached at casing of electronic apparatus, and huyashi-chuuka (cold chinese-style noodles) then is coupled to metal framework.This metal framework is that device is in casing of electronic apparatus, and has metal mesh structure, be used for the low temperature on this huyashi-chuuka (cold chinese-style noodles) is conducted on the whole metal framework, so that the air-flow of coming in from this casing of electronic apparatus outside becomes cold airflow through behind this metal framework, this cold airflow flows to electronic component again, so that the heat that electronic component produces, flow to the outside of casing of electronic apparatus via the gas outlet.
In third embodiment of the invention, casing of electronic apparatus also comprises one deck thermofin, is configured in the surface of the casing of electronic apparatus that hot side attached of refrigerating chip.At the hot side of refrigerating chip, be connected to the gas outlet of casing of electronic apparatus via heat pipe or hardware.When cold airflow arrives the gas outlet of casing of electronic apparatus with the torrid zone that electronic component produced, can simultaneously the hot type that hot side produced be fallen.For making the respond well of heat extraction, therefore, cooling device also comprises fan, and it is configured between metal framework and the electronic component, is used for forcing cold airflow to flow toward the gas outlet.And the flow of fan can influence the design of the wire netting mesh size of metal framework.
As known from the above, the present invention uses metal framework to be coupled to the huyashi-chuuka (cold chinese-style noodles) of refrigerating chip, make the area of refrigerating chip huyashi-chuuka (cold chinese-style noodles) significantly extend by metal framework, so the present invention can reach the purpose of heat radiation to total system, can allow system stability operate, and can only not be confined on the single electronic component.
For above and other objects of the present invention, feature and advantage can be become apparent, three embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 shows the cooling device structural map of existing computer CPU;
Fig. 2 shows the refrigerating chip structural representation that can be used in embodiments of the invention;
Fig. 3 shows cooling device and the casing of electronic apparatus side view according to first embodiment of the invention;
Fig. 4 shows the casing of electronic apparatus vertical view according to first embodiment of the invention;
Fig. 5 shows cooling device and the casing of electronic apparatus side view according to second embodiment of the invention;
Fig. 6 shows cooling device and the casing of electronic apparatus side view according to third embodiment of the invention.
Description of reference numerals
10 cooling devices, 11 refrigerating chips
12 huyashi-chuuka (cold chinese-style noodles) heat radiator, 14 hot side heat radiator
16 central processing units, 18 Heat Conduction Materials
17,35,41 fans, 19 fixed mounts
20,50,60 casing of electronic apparatus, 21 thermofins
23,51,61 CPU, 25,53,63 mainboards
27,57,66 thermal currents, 29,58,68 cold airflows
30,40 cooling devices, 31 refrigerating chips
31a huyashi-chuuka (cold chinese-style noodles) 31b hot side
32 insulators, 33 metal frameworks
34 conductors, 36 N-type semiconductors
37 heat-transfer devices, 38 P-type semiconductors
43 direct supplys, 59 air-flows
65 outer gas streams
Embodiment
In order to make those skilled in the art can more understand spiritual place of the present invention, special before the explanation various embodiments of the present invention, simply introduce earlier refrigerating chip (Thermoelectric Cooler, principle TEC).Please refer to Fig. 2, its demonstration can be used in the refrigerating chip structural representation of embodiments of the invention.Refrigerating chip 31 is spaced by the semiconductor grain of many for example N-type semiconductors 36 and P-type semiconductor 38 and forms, and the material of these semiconductor grains is generally bismuth telluride.With the metallic conductor 34 complete circuit that is formed by connecting, the material of this conductor 34 for example is copper, aluminium or other metallic conductor between these semiconductor grains.At last by two potsherd insulators 32 for example, with the folder circuit that whole semiconductor grain and metallic conductor 34 are formed, this insulator 32 must insulation and heat conduction good.
Please continue with reference to Fig. 2, direct supply 43 provides the electronics required energy that flows.After refrigerating chip 31 logical upward direct supplys 43, electronics is set out by the negative terminal of direct supply 43.At first absorb heat, and electronics has arrived N-type semiconductor 36 heat has been emitted through P-type semiconductor 38 and at this.So, a pair of NP semiconductor of every process while just there is heat other by being sent to, causes the temperature difference, and forms huyashi-chuuka (cold chinese-style noodles) 31a and hot side 31b.Huyashi-chuuka (cold chinese-style noodles) 31a and hot side 31b are made of two insulators 32 respectively, and wherein huyashi-chuuka (cold chinese-style noodles) 31a will connect thermal source, and the thing of desire cooling just for example is CPU.And hot side 31b will connect the device of heat radiation, is fan for example, is used for heat is discharged.
Please refer to Fig. 3, it shows cooling device and casing of electronic apparatus side view according to first embodiment of the invention.Cooling device 30 comprise refrigerating chip (Thermoelectric Cooler, TEC) 31 and metal framework 33, it is used in casing of electronic apparatus 20.Casing of electronic apparatus 20 for example also comprises central processing unit (Central Processor Unit, CPU) 23 and the electronic component of mainboard (MainBoard) 25 except cooling device 30.Casing of electronic apparatus 20 has tail end, and these electronic components just are configured near the tail end.Refrigerating chip 31 has hot side 31b and huyashi-chuuka (cold chinese-style noodles) 31a two ends, and wherein, huyashi-chuuka (cold chinese-style noodles) 31a then is coupled to metal framework 33.Metal framework 33 be device in casing of electronic apparatus 20, be used for conducting the cold airflow 29 that huyashi-chuuka (cold chinese-style noodles) 31a produces.In more detail, cold airflow 29 can produce convection current with the heat that mainboard 25 is produced with the CPU 23 that is disposed at casing of electronic apparatus 20, make cold airflow 29 that CPU 23 is arrived the tail end of casing of electronic apparatus 20 with the torrid zone that mainboard 25 is produced, thereby reach the purpose of heat radiation.
Please continue with reference to Fig. 3, the hot side 31b of refrigerating chip 31 is attached at casing of electronic apparatus 20, and the surface of the casing of electronic apparatus 20 that attaches at hot side 31b, configuration one deck thermofin 21.Please be simultaneously with reference to Fig. 4, it shows the casing of electronic apparatus vertical view according to first embodiment of the invention.On the hot side 31b of refrigerating chip 31, via the tail end that for example is connected to casing of electronic apparatus 20 for hardware or the heat-transfer device of metal tube 37.The surface of all the other casing of electronic apparatus 20 then disposes thermofin 21, arrives other parts to prevent the thermal diffusion on the hot side 31b, causes radiating effect clear.In above-mentioned mode, cold airflow 29 can arrive the torrid zone that electronic component produced the tail end of casing of electronic apparatus 20.In addition, the heat that can simultaneously hot side 31b be produced can be transmitted to tail end via the heat-transfer device on the casing 20 37.
Please continue with reference to Fig. 3, metal framework 33 has metal mesh structure.Because metal framework 33 is coupled to the huyashi-chuuka (cold chinese-style noodles) of refrigerating chip 31, the low temperature on the huyashi-chuuka (cold chinese-style noodles) can be conducted on the whole metal framework 33.Therefore the air-flow 27 of coming in from casing 20 outsides becomes cold airflow 29 through behind the metal mesh structures of metal framework 33, again the thermosetting convection current that is produced with CPU 23 and mainboard 25 and with the tail end of the torrid zone toward casing of electronic apparatus 20.For the more effectively convection current of heat that cold airflow 29 and CPU 23 and mainboard 25 are produced, so cooling device 30 also comprises fan 35.Fan 35 is configured between metal framework 33 and the CPU23.The heat generation convection current that fan 35 can more force cold airflow 29 and CPU 23 and mainboard 25 to be produced, and force cold airflow 29 to flow toward tail end.In design, the size of the wire netting mesh of metal framework can design according to the flow of fan 35.
Please refer to Fig. 5, it shows cooling device and casing of electronic apparatus side view according to second embodiment of the invention.In the present embodiment, cooling device 40 has also comprised fan 41 except refrigerating chip 31, fan 35 and metal framework 33.Fan 41 is coupled to and for example is the electronic component of CPU 51 and mainboard 53, is used for to CPU 51 and mainboard 53 heat radiations.In more detail, by first embodiment of the invention as can be known, metal framework 33 is cold airflow 58 because be coupled to the huyashi-chuuka (cold chinese-style noodles) 31a of refrigerating chip 31 so can become after thermal current 57 is by metal framework 33.The air-flow 59 that fan 41 produces forces to make cold airflow 58 to flow toward tail ends, uses to make the torrid zone that cold airflow 58 produced CPU 51 and the mainboard 53 heat radiations tail end to casing of electronic apparatus 50.Remaining part and its link position of device and function are all identical with first embodiment of the invention in cooling device 40 and the casing of electronic apparatus 50, do not add to give unnecessary details at this.
Please refer to Fig. 6, it shows cooling device and casing of electronic apparatus side view according to third embodiment of the invention.In the 3rd embodiment, casing of electronic apparatus 60 has air intake opening and gas outlet, and for example is configured near the gas outlet for the electronic component of CPU 61 and mainboard 62.In more detail, after outer gas stream 65 entered the inside of casing of electronic apparatus 60 by air intake opening, fan 35 can forced draft flow to the gas outlet.By first embodiment of the invention as can be known, because metal framework 33 is coupled to the huyashi-chuuka (cold chinese-style noodles) 31a of refrigerating chip 31, after crossing metal framework 33, air communication can become cold airflow 68.Produce convection current with CPU 61 with the heat that mainboard 62 is produced again, CPU 61 is led out with the thermal current 66 that mainboard 62 is produced by the gas outlet.Remaining part is all identical with first embodiment of the invention with function with its link position of device in the present embodiment, does not add to give unnecessary details at this.
As known from the above, the present invention is coupled to the huyashi-chuuka (cold chinese-style noodles) of refrigerating chip with the metal framework in the cooling device, and the function of extending refrigerating chip is to whole electronic system, and no longer just is confined on some electronic components, therefore can allow the more stable running of total system.
Though the present invention discloses as above in conjunction with three embodiment; so it is not to be used for limiting the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is with being as the criterion that appended claims was defined.
Claims (18)
1. a cooling device is used in a casing of electronic apparatus, and this casing of electronic apparatus has a tail end, and wherein at least one electronic component is configured near this tail end, and this cooling device comprises:
One refrigerating chip has a huyashi-chuuka (cold chinese-style noodles) and a hot side, and this hot side is attached at this casing of electronic apparatus;
One metal framework, be configured in this casing of electronic apparatus, and be coupled to this huyashi-chuuka (cold chinese-style noodles) of this refrigerating chip, thereby the low temperature on this huyashi-chuuka (cold chinese-style noodles) is conducted on the whole metal framework, so that the air-flow of coming in from this casing of electronic apparatus outside becomes cold airflow through behind this metal framework, wherein this cold airflow produces convection current with the heat that this electronic component produced that is disposed at this casing of electronic apparatus, makes this cold airflow the torrid zone that this electronic component produced be arrived this tail end of this casing of electronic apparatus.
2. cooling device as claimed in claim 1 also comprises a fan, is configured between this metal framework and this electronic component, flows toward this tail end to force this cold airflow.
3. cooling device as claimed in claim 1, wherein this hot side is connected to this tail end of this casing of electronic apparatus via a heat pipe or a hardware.
4. cooling device as claimed in claim 1 also comprises a thermofin, is configured in the surface of this casing of electronic apparatus that this hot side attached of this refrigerating chip.
5. cooling device as claimed in claim 1, wherein this metal framework has a metal mesh structure.
6. cooling device as claimed in claim 2, wherein this metal framework has a metal mesh structure, and the mesh size of this metal mesh structure designs according to the flow of this fan.
7. a cooling device is used in a casing of electronic apparatus, and this casing of electronic apparatus has a tail end, and wherein at least one electronic component is configured near this tail end, and this cooling device comprises:
One refrigerating chip has a huyashi-chuuka (cold chinese-style noodles) and a hot side, and this hot side is attached at this casing of electronic apparatus;
One metal framework, be configured in this casing of electronic apparatus, and be coupled to this huyashi-chuuka (cold chinese-style noodles) of this refrigerating chip, thereby the low temperature on this huyashi-chuuka (cold chinese-style noodles) is conducted on the whole metal framework, so that the air-flow of coming in from this casing of electronic apparatus outside becomes cold airflow through behind this metal framework;
One first fan is coupled to this electronic component, with to the heat radiation of this electronic component,
Wherein this cold airflow produces convection current with the heat that this electronic component produced that is disposed at this casing of electronic apparatus, and the air-flow that this first fan produces forces to make this cold airflow to flow toward this tail end, uses this tail end that makes this cold airflow the torrid zone that this electronic component produced be arrived this casing of electronic apparatus.
8. cooling device as claimed in claim 7 also comprises one second fan, is configured between this metal framework and this electronic component, flows toward this tail end to force this cold airflow.
9. cooling device as claimed in claim 7, wherein this hot side is connected to this tail end of this casing of electronic apparatus via a heat pipe or a hardware.
10. cooling device as claimed in claim 7 also comprises a thermofin, is configured in the surface of this casing of electronic apparatus that this hot side attached of this refrigerating chip.
11. cooling device as claimed in claim 7, wherein this metal framework has a metal mesh structure.
12. cooling device as claimed in claim 8, wherein this metal framework has a metal mesh structure, and the mesh size of this metal mesh structure designs according to the flow of this second fan.
13. a cooling device is used in a casing of electronic apparatus, this casing of electronic apparatus has an air intake opening and a gas outlet, and wherein at least one electronic component is configured near this gas outlet, and this cooling device comprises:
One refrigerating chip has a huyashi-chuuka (cold chinese-style noodles) and a hot side, and this hot side is attached on this casing of electronic apparatus; And
One metal truss, be configured in this casing of electronic apparatus, and be coupled to this huyashi-chuuka (cold chinese-style noodles) of this refrigerating chip, thereby the low temperature on this huyashi-chuuka (cold chinese-style noodles) is conducted on the whole metal truss, so that the air-flow of coming in from this casing of electronic apparatus outside becomes cold airflow through behind this metal truss, this cold airflow flows to this electronic component again, so that the heat that this electronic component produces, flows to the outside of this casing of electronic apparatus via this gas outlet.
14. cooling device as claimed in claim 13 also comprises a fan, is configured between this metal truss and this electronic component, flows toward this gas outlet to force this cold airflow.
15. cooling device as claimed in claim 13, wherein this hot side is connected near this gas outlet of this casing of electronic apparatus via a heat pipe or a hardware.
16. cooling device as claimed in claim 13 also comprises a thermofin, is configured in the surface of this casing of electronic apparatus that this hot side attached of this refrigerating chip.
17. cooling device as claimed in claim 14, wherein the mesh size of this metal truss designs according to the flow of this fan.
18. cooling device as claimed in claim 14, wherein this electronic component also comprises a radiator fan, is used for this electronic component heat radiation, and further forces this cold airflow to flow toward this gas outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101027376A CN1302356C (en) | 2003-10-22 | 2003-10-22 | Cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101027376A CN1302356C (en) | 2003-10-22 | 2003-10-22 | Cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1609751A CN1609751A (en) | 2005-04-27 |
| CN1302356C true CN1302356C (en) | 2007-02-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101027376A Expired - Fee Related CN1302356C (en) | 2003-10-22 | 2003-10-22 | Cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1302356C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066300B (en) * | 2013-03-20 | 2016-12-28 | 英业达科技有限公司 | Electronic installation |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2416711Y (en) * | 2000-03-14 | 2001-01-24 | 林浩正 | Temperature-lowering device |
| CN1293458A (en) * | 1999-10-13 | 2001-05-02 | 曹知光 | Efficient electronic refrigerating chip |
| WO2001069694A1 (en) * | 2000-03-12 | 2001-09-20 | Active Cool Ltd. | Cooling system for an enclosure for heat sensitive components and method |
| WO2001090866A2 (en) * | 2000-05-22 | 2001-11-29 | Active Cool Ltd. | Active cooling system for cpu and semiconductors |
| US20020149910A1 (en) * | 2001-04-13 | 2002-10-17 | Lee Tsung Lung | Cooling system for computer |
-
2003
- 2003-10-22 CN CNB2003101027376A patent/CN1302356C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1293458A (en) * | 1999-10-13 | 2001-05-02 | 曹知光 | Efficient electronic refrigerating chip |
| WO2001069694A1 (en) * | 2000-03-12 | 2001-09-20 | Active Cool Ltd. | Cooling system for an enclosure for heat sensitive components and method |
| CN2416711Y (en) * | 2000-03-14 | 2001-01-24 | 林浩正 | Temperature-lowering device |
| WO2001090866A2 (en) * | 2000-05-22 | 2001-11-29 | Active Cool Ltd. | Active cooling system for cpu and semiconductors |
| US20020149910A1 (en) * | 2001-04-13 | 2002-10-17 | Lee Tsung Lung | Cooling system for computer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1609751A (en) | 2005-04-27 |
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