US20110139401A1 - Ionic wind heat sink - Google Patents

Ionic wind heat sink Download PDF

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Publication number
US20110139401A1
US20110139401A1 US12/637,188 US63718809A US2011139401A1 US 20110139401 A1 US20110139401 A1 US 20110139401A1 US 63718809 A US63718809 A US 63718809A US 2011139401 A1 US2011139401 A1 US 2011139401A1
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US
United States
Prior art keywords
heat
electrical wire
ionic wind
heat sink
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/637,188
Inventor
Yu-Po HUANG
Tung-Jung Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN JUE-CHUNG ELECTRONICS Co Ltd
Original Assignee
KUNSHAN JUE-CHUNG ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to US12/637,188 priority Critical patent/US20110139401A1/en
Assigned to KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD. reassignment KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, YU-PO, KUO, TUNG-JUNG
Publication of US20110139401A1 publication Critical patent/US20110139401A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/16—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying an electrostatic field to the body of the heat-exchange medium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink, and in particular to an ionic wind heat sink.
  • the heat-dissipating fins are used to be heat-exchanged with the ambient airflow, so that the heat-dissipating efficiency is insufficient.
  • the fan may unfavorably generate noise and vibrations during its operation. As a result, when the fan is used in a precision electronic system having sensors, the noise and vibrations may affect the accuracy of the precision electronic system and even reduce its life.
  • the present Inventor proposes a novel and reasonable structure based on his expert experiences and delicate researches.
  • the present invention is to simplify the mechanical structure of a heat sink to reduce noise and vibrations and take away the heat generated by a heat-generating source more efficiently.
  • the present invention is to provide an ionic wind heat sink, which includes:
  • thermoelectric structure constituted of a plurality of heat-dissipating pieces
  • a high-voltage generator for generating a positive high-voltage surge and a negative high-voltage surge, the high-voltage generator comprising a positive high-voltage end and a negative high-voltage end;
  • air surrounding the first electrical wire is ionized after the first electrical wire receives the positive high-voltage surge, the ionized air is attracted by the negative high-voltage surge of the second electrical wire, thereby generating an ionic wind flowing toward the heat-dissipating structure.
  • the present invention has advantages features as follows.
  • the high-voltage generator generates an ionic wind flowing toward the heat-dissipating structure by means of the first electrical line and the second electrical line.
  • the ionic wind is an active cooling airflow, so that it eliminates a need for the installation of a fan. Further, the whole mechanical construction can be simplified, the noise and vibration can be reduced, and the consumption of electricity is low. Thus, the heat sink may not suffer damage easily and can be repaired rapidly.
  • the ionic wind heat sink of the present invention is used in a precision electronic system that is sensitive to vibrations, the accuracy and life of the sensors in this precision electronic system will not be affected and the heat generated by a heat-generating source can be taken away efficiently.
  • FIG. 1 is an assembled perspective view of the present invention
  • FIG. 2 is a top view of the present invention
  • FIG. 3 is a view showing the operating mechanism of FIG. 2 ;
  • FIG. 4 is a schematic view showing another embodiment of the present invention.
  • FIG. 5 is a schematic view showing another embodiment of the present invention.
  • the present invention relates to an ionic wind heat sink. Please refer to FIGS. 1 and 2 .
  • the ionic wind heat sink includes a heat-dissipating structure 200 , a high-voltage generator 300 , a first electrical wire 330 , and a second electrical wire 340 .
  • the heat-dissipating structure 200 is constituted of a plurality of heat-dissipating pieces 210 .
  • the high-voltage generator 300 is electrically connected to a power source for generating a positive high-voltage surge and a negative high-voltage surge.
  • the high-voltage generator 300 comprises a positive high-voltage end 310 and a negative high-voltage end 320 .
  • the first electrical wire 330 has a first electrode 360 electrically connected to the positive high-voltage end 320 .
  • the second electrical wire 340 has a second electrode 370 electrically connected to the negative high-voltage end 320 .
  • the first electrical wire 330 and the second electrical wire 340 are arranged horizontally with respect to the heat-dissipating structure 200 .
  • the second electrical wire 340 is located between the first electrical wire 330 and the heat-dissipating structure 200 , and a certain distance is formed between the second electrical wire 340 and the heat-dissipating structure 200 to thereby prevent the short circuiting of electric arc.
  • the ionic wind heat sink further includes a support 350 .
  • the support 350 is an insulator and made of plastic or other suitable materials.
  • the support 350 is provided with a slot 251 in which the first electrode 360 and the second electrode 370 can be inserted.
  • the first electrical wire 330 After the first electrical wire 330 receives a positive high-voltage surge, the first electrical wire 330 generates a strong electric field exceeding the dielectric strength of ambient air. Thus, electrons are accelerated to strongly collide with the crystal structure of air molecules, which makes the air molecules to generate permanent structural displacement and start to be ionized, thereby emitting sound and light. Such a phenomenon is referred to as corona discharge, which is a stable plasma discharge at low temperature.
  • corona discharge which is a stable plasma discharge at low temperature.
  • the region surrounding the first electrical wire 330 in which the air is ionized is called a corona range, while the region outside the corona range in which the air is not ionized is called a unipolar region.
  • the present invention can be used inside an electronic device of a limited space, such as notebook, mobile phone, electric dictionary or the like.
  • the ionic wind heat sink can be mounted on one side of the electronic device or mounted on a circuit board directly. Alternatively, the ionic wind heat sink can be made into a module, and then such a module is fixed to the circuit board.
  • the ionic wind is guided by the heat-dissipating structure 200 to flow leftwards, rightwards and rearwards respectively, thereby dissipating the heat of heat-generating sources (such as battery, light-emitting diodes, CPU or other electronic elements) in multiple directions.
  • heat-generating sources such as battery, light-emitting diodes, CPU or other electronic elements
  • the heat-dissipating structure 200 can be made as a heat-dissipating fin assembly that is attached to a heat-generating source.
  • the heat-dissipating piece 210 can be made by metals or other suitable materials.
  • the heat generated by the heat-generating source is conducted to the heat-dissipating structure 200 .
  • the ionic wind with a lower temperature flows through airflow channels 220 to take away the heat accumulated in the heat-dissipating pieces 210 , thereby cooling the heat-generating source.
  • the ionic wind heat sink In virtue of the ionic wind heat sink, it is unnecessary to mount an additional fan to help the heat dissipation. Thus, the problems resulted from the noise, vibrations and life of the fan can be avoided.
  • the ionic wind heat sink is very suitable for a precision electronic system having sensors. Further, the current for the operation of the ionic wind heat sink is only several mini-amperes, and the electricity consumed per second is as low as several mini-watts. Thus, the present invention consumes less electricity, which is cost-effective especially in such an era short of energy sources.
  • the arrangement of the first electrical wire 330 and the second electrical wire 340 can be embodied by other ways. Please refer to FIG. 4 .
  • the second electrical wire 340 is located between the first electrical wire 330 and the heat-dissipating structure 220 .
  • the first electrical wire 330 and the second electrical wire 340 are located at different levels with respect to the heat-dissipating structure 200 .
  • FIG. 5 please refer to FIG. 5 .
  • the first electrical wire 330 and the second electrical wire 340 are located in the same vertical plane with respect to the heat-dissipating structure 200 .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An ionic wind heat sink includes a heat-dissipating structure and a high-voltage generator. The high-voltage generator is configured to output a positive high-voltage surge and a negative high-voltage surge. The high-voltage generator has a positive high-voltage end and a negative high-voltage end. A first electrical wire is electrically connected to the positive high-voltage end, and a second electrical wire is electrically connected to the negative high-voltage end. The two electrical wires generate an ionic wind flowing toward the heat-dissipating structure. With this arrangement, the whole mechanical construction of the heat sink can be simplified. The noise, vibrations and electricity consumption can be reduced, while the heat of a heat-generating source can be taken away efficiently.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat sink, and in particular to an ionic wind heat sink.
  • 2. Description of Prior Art
  • Electronic elements in various apparatuses often generate heat during their operation, which raises the temperature of the electronic elements. If the heat accumulated in the electronic element is not dissipated timely, the high temperature may cause the electronic element to reduce its operating speed and even suffer damage. In order to dissipate the heat, the conventional way of dissipating heat is to attach a heat conductor on a heat-generating source. Further, the heat conductor is formed with heat-dissipating fins. By using an airflow having a lower temperature to heat-exchange with the heat-dissipating fins, the temperature of the electronic element can be reduced.
  • In the above heat sink, only the heat-dissipating fins are used to be heat-exchanged with the ambient airflow, so that the heat-dissipating efficiency is insufficient. Thus, it is necessary to provide a fan for generating compulsory airflow to blow the heat-dissipating fins to thereby increase the heat-dissipating efficiency. However, the fan may unfavorably generate noise and vibrations during its operation. As a result, when the fan is used in a precision electronic system having sensors, the noise and vibrations may affect the accuracy of the precision electronic system and even reduce its life.
  • In view of the above, the present Inventor proposes a novel and reasonable structure based on his expert experiences and delicate researches.
    • SUMMARY OF THE INVENTION
  • The present invention is to simplify the mechanical structure of a heat sink to reduce noise and vibrations and take away the heat generated by a heat-generating source more efficiently.
  • The present invention is to provide an ionic wind heat sink, which includes:
  • a heat-dissipating structure constituted of a plurality of heat-dissipating pieces; and
  • a high-voltage generator for generating a positive high-voltage surge and a negative high-voltage surge, the high-voltage generator comprising a positive high-voltage end and a negative high-voltage end;
  • a first electrical wire electrically connected to the positive high-voltage end and arranged on one side of the heat-dissipating structure; and
  • a second electrical wire electrically connected to the negative high-voltage end and arranged on one side of the heat-dissipating structure,
  • wherein air surrounding the first electrical wire is ionized after the first electrical wire receives the positive high-voltage surge, the ionized air is attracted by the negative high-voltage surge of the second electrical wire, thereby generating an ionic wind flowing toward the heat-dissipating structure.
  • The present invention has advantages features as follows. The high-voltage generator generates an ionic wind flowing toward the heat-dissipating structure by means of the first electrical line and the second electrical line. The ionic wind is an active cooling airflow, so that it eliminates a need for the installation of a fan. Further, the whole mechanical construction can be simplified, the noise and vibration can be reduced, and the consumption of electricity is low. Thus, the heat sink may not suffer damage easily and can be repaired rapidly. When the ionic wind heat sink of the present invention is used in a precision electronic system that is sensitive to vibrations, the accuracy and life of the sensors in this precision electronic system will not be affected and the heat generated by a heat-generating source can be taken away efficiently.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an assembled perspective view of the present invention;
  • FIG. 2 is a top view of the present invention;
  • FIG. 3 is a view showing the operating mechanism of FIG. 2;
  • FIG. 4 is a schematic view showing another embodiment of the present invention; and
  • FIG. 5 is a schematic view showing another embodiment of the present invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • The characteristics and technical contents of the present invention will be described with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
  • The present invention relates to an ionic wind heat sink. Please refer to FIGS. 1 and 2. The ionic wind heat sink includes a heat-dissipating structure 200, a high-voltage generator 300, a first electrical wire 330, and a second electrical wire 340.
  • The heat-dissipating structure 200 is constituted of a plurality of heat-dissipating pieces 210.
  • The high-voltage generator 300 is electrically connected to a power source for generating a positive high-voltage surge and a negative high-voltage surge. The high-voltage generator 300 comprises a positive high-voltage end 310 and a negative high-voltage end 320. The first electrical wire 330 has a first electrode 360 electrically connected to the positive high-voltage end 320. The second electrical wire 340 has a second electrode 370 electrically connected to the negative high-voltage end 320. The first electrical wire 330 and the second electrical wire 340 are arranged horizontally with respect to the heat-dissipating structure 200. Further, the second electrical wire 340 is located between the first electrical wire 330 and the heat-dissipating structure 200, and a certain distance is formed between the second electrical wire 340 and the heat-dissipating structure 200 to thereby prevent the short circuiting of electric arc.
  • The ionic wind heat sink further includes a support 350. The support 350 is an insulator and made of plastic or other suitable materials. The support 350 is provided with a slot 251 in which the first electrode 360 and the second electrode 370 can be inserted.
  • Please refer to FIG. 3. After the first electrical wire 330 receives a positive high-voltage surge, the first electrical wire 330 generates a strong electric field exceeding the dielectric strength of ambient air. Thus, electrons are accelerated to strongly collide with the crystal structure of air molecules, which makes the air molecules to generate permanent structural displacement and start to be ionized, thereby emitting sound and light. Such a phenomenon is referred to as corona discharge, which is a stable plasma discharge at low temperature. The region surrounding the first electrical wire 330 in which the air is ionized is called a corona range, while the region outside the corona range in which the air is not ionized is called a unipolar region. On the other hand, electrons in air molecules are attracted by a positive electrode to depart from the air molecules, so that the air molecules are ionized to become positive-charged ions. These positive ions are attracted by the negative high-voltage surge of the second electrical wire 340 to move toward the second electrical wire 340. The travelling positive ions pushes neutral air molecules to generate a corona wind flowing toward the heat-dissipating structure 200. Such a corona wind is also referred to as an ionic wind. The ionic wind flows through the heat-dissipating pieces 210 and finally exits the heat-dissipating structure 200.
  • The present invention can be used inside an electronic device of a limited space, such as notebook, mobile phone, electric dictionary or the like. The ionic wind heat sink can be mounted on one side of the electronic device or mounted on a circuit board directly. Alternatively, the ionic wind heat sink can be made into a module, and then such a module is fixed to the circuit board. The ionic wind is guided by the heat-dissipating structure 200 to flow leftwards, rightwards and rearwards respectively, thereby dissipating the heat of heat-generating sources (such as battery, light-emitting diodes, CPU or other electronic elements) in multiple directions.
  • The heat-dissipating structure 200 can be made as a heat-dissipating fin assembly that is attached to a heat-generating source. The heat-dissipating piece 210 can be made by metals or other suitable materials. The heat generated by the heat-generating source is conducted to the heat-dissipating structure 200. The ionic wind with a lower temperature flows through airflow channels 220 to take away the heat accumulated in the heat-dissipating pieces 210, thereby cooling the heat-generating source.
  • In virtue of the ionic wind heat sink, it is unnecessary to mount an additional fan to help the heat dissipation. Thus, the problems resulted from the noise, vibrations and life of the fan can be avoided. Thus, the ionic wind heat sink is very suitable for a precision electronic system having sensors. Further, the current for the operation of the ionic wind heat sink is only several mini-amperes, and the electricity consumed per second is as low as several mini-watts. Thus, the present invention consumes less electricity, which is cost-effective especially in such an era short of energy sources.
  • Alternatively, the arrangement of the first electrical wire 330 and the second electrical wire 340 can be embodied by other ways. Please refer to FIG. 4. The second electrical wire 340 is located between the first electrical wire 330 and the heat-dissipating structure 220. Also, the first electrical wire 330 and the second electrical wire 340 are located at different levels with respect to the heat-dissipating structure 200. Alternatively, please refer to FIG. 5. The first electrical wire 330 and the second electrical wire 340 are located in the same vertical plane with respect to the heat-dissipating structure 200.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (8)

1. An ionic wind heat sink, including:
a heat-dissipating structure constituted of a plurality of heat-dissipating pieces; and
a high-voltage generator for generating a positive high-voltage surge and a negative high-voltage surge, the high-voltage generator comprising a positive high-voltage end and a negative high-voltage end;
a first electrical wire electrically connected to the positive high-voltage end and arranged on one side of the heat-dissipating structure; and
a second electrical wire electrically connected to the negative high-voltage end and arranged on one side of the heat-dissipating structure,
wherein air surrounding the first electrical wire is ionized after the first electrical wire receives the positive high-voltage surge, the ionized air is attracted by the negative high-voltage surge of the second electrical wire, thereby generating an ionic wind flowing toward the heat-dissipating structure.
2. The ionic wind heat sink according to claim 1, wherein the second electrical wire is located between the first electrical wire and the heat-dissipating structure.
3. The ionic wind heat sink according to claim 2, wherein the first electrical wire and the second electrical wire are arranged horizontally with respect to the heat-dissipating structure.
4. The ionic wind heat sink according to claim 2, wherein the first electrical wire and the second electrical wire are staggered at different levels with respect to the heat-dissipating structure.
5. The ionic wind heat sink according to claim 2, wherein the first electrical wire and the second electrical wire are staggered at the same vertical plane with respect to the heat-dissipating structure.
6. The ionic wind heat sink according to claim 1, wherein the first electrical wire has a first electrode electrically connected to the positive high-voltage end, and the second electrical wire has a second electrode electrically connected to the negative high-voltage end.
7. The ionic wind heat sink according to claim 6, further including a support, the support having a slot in which the first electrode and the second electrode are inserted.
8. The ionic wind heat sink according to claim 7, wherein the support is an insulator.
US12/637,188 2009-12-14 2009-12-14 Ionic wind heat sink Abandoned US20110139401A1 (en)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110292560A1 (en) * 2010-05-26 2011-12-01 Nels Jewell-Larsen Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices
US20120182687A1 (en) * 2011-01-14 2012-07-19 Microsoft Corporation Adaptive thermal management for devices
US20130153199A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Performance and noise control for a heat sink air mover
US9843250B2 (en) 2014-09-16 2017-12-12 Huawei Technologies Co., Ltd. Electro hydro dynamic cooling for heat sink
CN108054146A (en) * 2017-12-25 2018-05-18 中国矿业大学 Plane membrane type chip heat radiator based on ion wind
CN109560053A (en) * 2019-01-22 2019-04-02 南京皓赛米电力科技有限公司 A kind of ion wind radiator
CN109860382A (en) * 2019-01-30 2019-06-07 江苏大学 A kind of integrated form ion wind for power-type LED heat dissipation is heat sink
KR102185943B1 (en) * 2019-07-17 2020-12-03 한국과학기술연구원 Heat exchanger using ionic wind
US11510336B2 (en) * 2019-09-10 2022-11-22 Lg Electronics Inc. Electronic device having heat dissipation function

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080030920A1 (en) * 2004-01-08 2008-02-07 Kronos Advanced Technologies, Inc. Method of operating an electrostatic air cleaning device
US20080060794A1 (en) * 2006-09-12 2008-03-13 Neng Tyi Precision Industries Co., Ltd. Heat sink device generating an ionic wind
US20080302510A1 (en) * 2007-06-11 2008-12-11 Chien Ouyang Plasma-driven cooling heat sink
US7545640B2 (en) * 2007-02-16 2009-06-09 Intel Corporation Various methods, apparatuses, and systems that use ionic wind to affect heat transfer
US7839634B2 (en) * 2007-08-22 2010-11-23 Chien Ouyang Micro thrust cooling
US20110174468A1 (en) * 2009-08-11 2011-07-21 Ventiva, Inc. Ozone reducing heat sink having contoured fins
US8063382B2 (en) * 2009-12-18 2011-11-22 Intel Corporation Ozone-free ionic wind

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080030920A1 (en) * 2004-01-08 2008-02-07 Kronos Advanced Technologies, Inc. Method of operating an electrostatic air cleaning device
US20080060794A1 (en) * 2006-09-12 2008-03-13 Neng Tyi Precision Industries Co., Ltd. Heat sink device generating an ionic wind
US7545640B2 (en) * 2007-02-16 2009-06-09 Intel Corporation Various methods, apparatuses, and systems that use ionic wind to affect heat transfer
US20080302510A1 (en) * 2007-06-11 2008-12-11 Chien Ouyang Plasma-driven cooling heat sink
US7839634B2 (en) * 2007-08-22 2010-11-23 Chien Ouyang Micro thrust cooling
US20110174468A1 (en) * 2009-08-11 2011-07-21 Ventiva, Inc. Ozone reducing heat sink having contoured fins
US8063382B2 (en) * 2009-12-18 2011-11-22 Intel Corporation Ozone-free ionic wind

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110292560A1 (en) * 2010-05-26 2011-12-01 Nels Jewell-Larsen Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices
US8824142B2 (en) * 2010-05-26 2014-09-02 Panasonic Precision Devices Co., Ltd. Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices
US20120182687A1 (en) * 2011-01-14 2012-07-19 Microsoft Corporation Adaptive thermal management for devices
US8712598B2 (en) * 2011-01-14 2014-04-29 Microsoft Corporation Adaptive flow for thermal cooling of devices
US20130153199A1 (en) * 2011-12-14 2013-06-20 International Business Machines Corporation Performance and noise control for a heat sink air mover
US9843250B2 (en) 2014-09-16 2017-12-12 Huawei Technologies Co., Ltd. Electro hydro dynamic cooling for heat sink
CN108054146A (en) * 2017-12-25 2018-05-18 中国矿业大学 Plane membrane type chip heat radiator based on ion wind
CN109560053A (en) * 2019-01-22 2019-04-02 南京皓赛米电力科技有限公司 A kind of ion wind radiator
CN109860382A (en) * 2019-01-30 2019-06-07 江苏大学 A kind of integrated form ion wind for power-type LED heat dissipation is heat sink
KR102185943B1 (en) * 2019-07-17 2020-12-03 한국과학기술연구원 Heat exchanger using ionic wind
US11510336B2 (en) * 2019-09-10 2022-11-22 Lg Electronics Inc. Electronic device having heat dissipation function

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Owner name: KUNSHAN JUE-CHUNG ELECTRONICS CO., LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, YU-PO;KUO, TUNG-JUNG;REEL/FRAME:023648/0470

Effective date: 20091201

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION