JP2010272559A - Collector box for photovoltaic power generation system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a collector box for a photovoltaic power generation system, provided with a heat dissipation means having good effect to cost. <P>SOLUTION: The collector box for the photovoltaic power generation system includes a fitting plate for internal equipment that has an equipment fitting surface where the internal equipment is fitted and a heat conduction surface for bringing an upper end of the equipment fitting surface into contact with a back plate of the collector box, wherein a heat dissipation member having higher heat conductivity than the fitting plate for the internal equipment is arranged on the equipment fitting surface, all reverse current blocking diodes in the internal equipment are fitted on the heat dissipation member, and other internal equipment is fitted directly on the fitting plate of the internal equipment. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a current collection box for a photovoltaic power generation system including a plurality of solar cells.

  A DC current collector for a photovoltaic power generation system is provided with a disconnect device, a backflow prevention diode, a current collector for each string of solar cells, that is, for each module group in which solar cells are connected in series so as to obtain a necessary DC voltage. It is equipped with a switch and a surge absorber. Among the internal devices, heat generated from the backflow prevention diode, in particular, can be a factor that impairs the life of the peripheral members.

  In order to avoid this problem and improve the heat dissipation effect in the DC current collector for the photovoltaic power generation system, a technique in which the mounting base of the internal device is configured from a heat sink is generally employed (for example, a patent) Reference 1).

  However, there is a problem in that it is not preferable from the viewpoint of cost effectiveness to construct the mounting base itself of the internal device to which the internal device other than the backflow prevention diode that generates heat is mounted, from a high cost heat sink.

JP 2000-261177 A

The object of the present invention is to solve the above-mentioned problems and to provide a collection box for a photovoltaic power generation system provided with a cost-effective heat dissipation means.

  A current collection box for a photovoltaic power generation system according to the present invention, which has been made to solve the above-mentioned problems, includes a device mounting surface to which an internal device is attached, and a heat conduction in which the upper end of the device mounting surface is brought into contact with the back plate of the current collection box A mounting plate for an internal device having a surface, and a heat dissipating member having a higher thermal conductivity than the mounting plate for the internal device is disposed on the mounting surface of the internal device. It is characterized in that it is mounted on the heat dissipating member and other internal devices are directly mounted on the mounting plate of the internal device.

  According to a second aspect of the present invention, in the current collection box for the solar power generation system according to the first aspect, the surface formed by bending the end of the device mounting surface into a crank shape is a heat conducting surface. It is what.

  The present invention includes a mounting plate for an internal device having a device mounting surface for mounting an internal device and a heat conducting surface for contacting the upper end of the device mounting surface with a back plate of a current collecting box, and the internal mounting plate is provided on the device mounting surface. A collector box for a photovoltaic power generation system, which is disposed on a heat radiating member having a higher thermal conductivity than the mounting plate of the device, and the heat radiating member and other internal devices are directly mounted on the mounting plate of the internal device. It has a configuration. With this configuration, the heat stored in the upper part of the mounting plate of the internal device can be dissipated on the heat conducting surface. In addition, the amount of heat-dissipating members, which are expensive, can be minimized to the minimum amount necessary to arrange all the backflow prevention diodes that generate heat. Cost-effectiveness can be greatly improved compared to the conventional case.

  According to the invention described in claim 2, the device mounting surface has a configuration in which a surface formed by bending an end portion of the device mounting surface in a crank shape is a heat conducting surface. Since the heat conducting surface is the uppermost end of the mounting plate, the heat stored in the upper part of the mounting plate of the internal device can be radiated more effectively on the heat conducting surface.

It is internal structure explanatory drawing of the current collection box for photovoltaic power generation systems which concerns on this invention. It is a front view of FIG. It is explanatory drawing regarding the structure of the mounting plate of an internal apparatus. It is explanatory drawing regarding the structure of the mounting plate of an internal apparatus. It is explanatory drawing regarding the structure of the mounting plate of an internal apparatus.

  Preferred embodiments of the present invention are shown below.

  FIG. 1 is an explanatory diagram of the internal structure of a current collection box for a photovoltaic power generation system according to the present invention, and FIG. 2 is a front view of FIG.

  Inside the current collection box of the present invention, an internal device mounting plate 3 is disposed inside the current collection box 1. The mounting plate 3 for the internal device includes a device mounting surface 32 for mounting the internal device, and a heat conductive surface 31 for contacting the mounting plate for the internal device with the back plate 11 in the current collection box 1. A surface formed by bending the end of 32 in a crank shape is the heat conducting surface 31. With this structure, the heat generated from the internal device is stored in the upper part of the mounting plate 3 of the internal device, so that the heat conductive surface is located on the uppermost end of the mounting plate from the heat conductive surface 31 on the back plate 11 of the current collecting box 1. It is possible to dissipate heat.

  On the device mounting surface 32 of the mounting plate 3 of the internal device, there are a backflow prevention diode 21, a current collecting switch 22, an input switch 23, a P pole (+) copper bar 24, an N pole (−) copper bar 25, and the like. The internal apparatus 2 is attached and each is connected and formed with the electric wire which is not shown in figure. Among these, the backflow prevention diode 21 is arranged on the heat dissipation member 4 as a group of backflow prevention diodes.

  The backflow prevention diode 21 has a function of setting a current to flow only in one direction from the solar cell to the power conditioner (residential distribution board), and is most likely to generate heat in the internal device 2. Since the backflow prevention diode 21 is provided for each string of solar cells, normally, a plurality of backflow prevention diodes 21 are present inside one current collection box. In the present invention, the plurality of backflow prevention diodes 21 are collected in one place, and the heat dissipation member 4 is disposed below the plurality of backflow prevention diodes 21, thereby improving the heat dissipation efficiency.

  The heat dissipating member 4 may be a plate material or a block material such as a heat sink. In this embodiment, an aluminum plate is used, but a metal plate having a high thermal conductivity such as a copper plate can also be used. In the present embodiment, the heat radiating member 4 made of the aluminum plate is fixed to the device mounting surface 32 with screws or the like.

  In FIGS. 3-5, explanatory drawing regarding the structure of the mounting plate 3 of an internal apparatus is shown.

  As shown in FIGS. 3 to 5, the mounting plate 3 of the internal device is composed of a device mounting surface 32 for mounting the internal device, and a heat conduction surface 31 that contacts the mounting plate 3 of the internal device in the current collection box. Since the heat conduction surface 31 is the uppermost end of the mounting plate, the surface formed by bending the end portion of the device mounting surface 32 into a crank shape is the heat conduction surface 31. The heat stored in the upper part of 3 can be dissipated at the heat conducting surface.

  The device mounting surface 32 may be formed by bending in a direction opposite to the heat conducting surface 31 via a bent side 33 formed at the end of the heat conducting surface 31 (FIG. 3). Alternatively, it may be formed by bending in the same direction as the heat conduction surface 31 (FIG. 4). In addition, both ends of the device mounting surface 32 are respectively connected to the heat conduction surface 31 via the bent sides 33. Can also be supported (FIG. 4).

DESCRIPTION OF SYMBOLS 1 Current collection box 11 Back plate 2 Internal equipment 21 Backflow prevention diode 22 Current collection switch 23 Input switch 24 P pole (+) copper bar 25 N pole (-) copper bar 3 Mounting plate 31 of internal equipment Heat conduction surface 32 Equipment mounting surface 33 Bent side 4 Heat dissipation member

Claims (2)

A device mounting surface for mounting the internal device, and a mounting plate for the internal device having a heat conduction surface that makes the upper end of the device mounting surface contact the back plate of the current collection box,
A heat dissipating member having a higher thermal conductivity than the mounting plate of the internal device is disposed on the device mounting surface,
Among the internal devices, all the backflow prevention diodes are mounted on the heat dissipation member,
A current collection box for a photovoltaic power generation system, wherein other internal devices are directly mounted on a mounting plate of the internal device. The current collection box for a photovoltaic power generation system according to claim 1, wherein a surface formed by bending an end portion of the device mounting surface into a crank shape is a heat conducting surface.

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