CN213092260U - Radiator and electronic equipment - Google Patents
Radiator and electronic equipment Download PDFInfo
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- CN213092260U CN213092260U CN202021586348.0U CN202021586348U CN213092260U CN 213092260 U CN213092260 U CN 213092260U CN 202021586348 U CN202021586348 U CN 202021586348U CN 213092260 U CN213092260 U CN 213092260U
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000036039 immunity Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a radiator and electronic equipment. Wherein, this radiator includes: a multi-stage heat conducting structure, which is connected to a target heating component in a contact manner, and is used for absorbing heat generated by the target heating component and guiding out the heat generated by the target heating component; and the heat dissipation equipment is connected with the multistage heat conduction structure and is used for carrying out heat dissipation treatment on the heat led out by the multistage heat conduction structure. The utility model provides a radiator among the prior art adopt radiator fan to realize the heat dissipation, be unfavorable for the technical problem of the normal stable work of mainboard and storage hard disk.
Description
Technical Field
The utility model relates to a heat dissipation equipment field particularly, relates to a radiator and electronic equipment.
Background
With the advent of the big data era, data security becomes more and more important, a home-made processor is the basis for ensuring data security, a gateway device of a server for storing data is an important device for ensuring data security, and the application and gateway device of the home-made processor are rapidly developed. Fig. 1 is a schematic view of an application scenario of a heat dissipation fan according to the prior art, as shown in fig. 1, a conventional Intel processor and a server gateway product in the related art perform heat dissipation processing in an active heat dissipation manner, in which a chassis fan is used to suck cold air into the interior of a chassis through heat dissipation holes on a sidewall of the chassis in an arrow direction, and form convection with hot air generated by a motherboard CPU and a south bridge inside the chassis, and the hot air is exhausted outside the chassis in an outward blowing manner by the fan, thereby achieving the purpose of heat dissipation of the chassis.
However, the fans used in the active heat dissipation in the related art are basically classified into two categories, i.e., ball type and magnetic suspension type, the life of the two categories of heat dissipation fans is rapidly reduced under the working state of 7 × 24 hours, the average service life is no more than 2 years at most, the heat dissipation fans suck a large amount of dust and fine particles in the air while sucking cold air into the equipment, and the long-time suction can cause the equipment to be full of a large amount of dust and foreign matters, thereby causing invisible threat to the normal and stable work of the motherboard, because the active heat dissipation fans all realize the heat dissipation function by the rotation of the fan blades, the heat dissipation equipment can generate noise and easily generate high-frequency vibration under the condition that a plurality of fans rotate simultaneously, the vibration is a direct killer of a hard disk for storing data, and the shock resistance of the large-capacity hard disk in the current market is very poor, the data storage device is very easy to damage under the condition of being in high-frequency vibration for a long time, the data of the server is easily damaged and lost, and the requirement of the server on the data safety cannot be met.
In view of the above problems, no effective solution has been proposed.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a radiator and electronic equipment to at least, the radiator of solving among the prior art adopts radiator fan to realize the heat dissipation, is unfavorable for the technical problem of the normal stable work of mainboard and storage hard disk.
According to an aspect of the embodiments of the present invention, there is provided a heat sink, including: a multi-stage heat conducting structure, which is connected to a target heating component in a contact manner, and is used for absorbing heat generated by the target heating component and guiding out the heat generated by the target heating component; and the heat dissipation equipment is connected with the multistage heat conduction structure and is used for carrying out heat dissipation treatment on the heat led out by the multistage heat conduction structure.
Optionally, the multistage heat conduction structure includes: a first heat conducting device in contact with the target heat generating component for conducting the heat away; the second heat conduction equipment is connected with the first heat conduction equipment and is used for transferring the heat conducted out by the first heat conduction equipment; and the third heat-conducting equipment is connected with the second heat-conducting equipment and is used for exporting the heat transmitted by the second heat-conducting equipment.
Optionally, the multi-stage heat conducting structure is disposed inside a chassis, the heat dissipating device is disposed outside the chassis, and the target heat generating component is further disposed in the chassis, wherein the target heat generating component is a processor.
Optionally, the heat dissipation device is further configured to dissipate the heat from the chassis.
Optionally, the first heat conducting device is a heat conducting rubber pad.
Optionally, the second heat conducting device is a heat dissipation aluminum block.
Optionally, the heat dissipation device is an aluminum fin.
Optionally, the third heat conducting device is a heat conducting copper pipe.
Optionally, the operating time of the heat sink is at least 16 hours, and the temperature value of the operating environment of the heat sink is at least 55 ℃.
According to an aspect of the embodiments of the present invention, there is provided an electronic apparatus, including: a target heat generating component; the heat sink of any one of the above claims, in contact with the target heat-generating component, is configured to dissipate heat generated by the target heat-generating component.
In the embodiment of the present invention, a fanless heat dissipation manner is adopted, and the heat dissipation manner is connected to a target heat-generating component in a contact manner through a multi-stage heat conduction structure, so as to absorb heat generated by the target heat-generating component and guide out the heat generated by the target heat-generating component; the heat dissipation device is connected with the multistage heat conduction structure and used for conducting heat dissipation processing on the heat conducted by the multistage heat conduction structure, and the purpose of ensuring normal stable work of the mainboard and the storage hard disk is achieved, so that the technical effects of avoiding damage and loss of running data and storage data are achieved, and the technical problem that the heat dissipation of the radiator in the prior art is achieved by adopting a heat dissipation fan, and the normal stable work of the mainboard and the storage hard disk is not facilitated is solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:
fig. 1 is a schematic view of an application scenario of a heat dissipation fan according to the prior art;
fig. 2 is a schematic structural diagram of an alternative heat sink according to an embodiment of the present invention;
fig. 3 is a schematic view of an application scenario of an alternative heat sink according to an embodiment of the present invention;
wherein the figures include the following reference numerals:
the multi-stage heat conducting structure comprises a multi-stage heat conducting structure 10, a target heating component 12, a heat radiating device 14, a heat conducting rubber pad D, a heat radiating aluminum block C, an aluminum fin A, a heat conducting copper pipe B and a four-core mainboard E of a processor.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Example 1
According to the embodiment of the present invention, an embodiment of a heat sink is provided, fig. 2 is a schematic structural diagram of a heat sink according to the embodiment of the present invention, as shown in fig. 2, this heat sink 100 includes:
a multi-stage heat conducting structure 10, which is in contact connection with a target heat-generating component 12, and is configured to absorb heat generated by the target heat-generating component and to conduct away the heat generated by the target heat-generating component; and a heat dissipation device 14 connected to the multi-stage heat conduction structure 10, for dissipating the heat conducted by the multi-stage heat conduction structure.
In an alternative embodiment, the multistage heat conducting structure includes:
a first heat conducting device in contact with the target heat generating component for conducting the heat away;
the second heat conduction equipment is connected with the first heat conduction equipment and is used for transferring the heat conducted out by the first heat conduction equipment;
and the third heat-conducting equipment is connected with the second heat-conducting equipment and is used for exporting the heat transmitted by the second heat-conducting equipment.
As an alternative embodiment, the multi-stage heat conducting structure is disposed inside a chassis, the heat dissipating device is disposed outside the chassis, and the target heat generating component is further disposed in the chassis, wherein the target heat generating component is a processor.
In the above optional embodiment, the heat dissipation device is further configured to dissipate the heat from the chassis.
As an alternative embodiment, as shown in fig. 3, the first heat conducting device is a heat conducting rubber pad D, the second heat conducting device is a heat dissipating aluminum block C, the heat dissipating device is an aluminum fin a, and the third heat conducting device is a heat conducting copper tube B. Taking the target heat generating component as an example of a processor, the thermal pad D shown in fig. 3 is connected to the quad-core motherboard E of the processor in a contact manner.
In an alternative embodiment, the radiator operates for at least 16 hours, and the temperature of the operating environment of the radiator is at least 55 ℃.
The embodiment of the utility model provides a radiator can be but not limited to be based on FT1500 treater no fan heat conduction module, and the heat conductivility is high, low-power consumption, noiselessness are taken into account simultaneously to the heat dissipation material of the radiator that provides in the embodiment of the application, characteristics such as throughput are strong, and the heat that produces the part that generates heat to the target through the radiator carries out the heat dissipation and handles, can be so that the long-time stable operating condition that is in of the part that generates heat of this target.
Taking the target heating component as an example of the processor, the processor is directly connected with the radiator in a contact manner through the heat-conducting rubber pad and the heat-conducting aluminum block with high heat conductivity coefficient, so that heat emitted by the processor can be rapidly absorbed and led out by the heat-radiating aluminum block through the heat-conducting rubber pad, and then the heat is led out to large-area aluminum fins (arranged outside the case) through the heat-conducting copper pipe, so that the heat can be led out of the case of the processor, and the heat radiating effect is realized.
In addition, the heat-conducting rubber pad has certain elasticity, so that the processor core mainboard is prevented from being damaged due to the fact that the processor is directly contacted with an aluminum radiator.
The heat dissipation device in the embodiment of the application adopts the design of large-area aluminum heat dissipation fins, and the unit heat dissipation area can be increased by utilizing the characteristic of good heat dissipation of aluminum metal and the design of the aluminum fins, so that the heat dissipation area and the heat dissipation efficiency of the unit area are improved.
In the embodiment of the application, the radiator which is noiseless, fanless and vibration-free is provided, the service life of the fan is not required to be considered, the heat radiation performance is good, the airtightness of the whole machine can be better improved, the machine can work stably for a long time without interruption, and the heat radiation cost is saved and is beneficial to maintenance.
Because the fan-free aluminum fin radiator is adopted for contact type heat dissipation, the whole machine using the heat dissipation mode does not need heat dissipation holes, the installation method is simple, the firmness is strong, the airtightness of the whole machine is greatly improved, and the fan-free aluminum fin radiator can be applied to special severe industrial environments for a long time.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:
the heat generated by the processor is transferred to the heat dissipation aluminum block through the heat conduction rubber pad with high heat conductivity coefficient, then the heat is transferred to the aluminum profile fins through the copper guide pipe, and then the heat is led out to the outside of the case through the aluminum fins; the external heat dissipation upper cover adopts a fin type design, so that the heat dissipation area on the unit volume is increased, and the heat dissipation effect is more obvious; the purpose of no noise pollution is achieved due to the fact that the fan of the case does not rotate, high-frequency resonance of the case is eliminated, data loss caused by vibration of the fan of the hard disk is eliminated, and the inside of the case is airtight and dust-free, so that the whole machine does not suffer from the influence of the external severe environment, the service life of a product can be prolonged under the condition that the performance of the product is not reduced, and the operation cost is reduced.
The radiator provided by the embodiment of the application meets the standard through the following tests: 1) and (3) high-temperature testing: the continuous work at high temperature (55 ℃) for 16 hours is met; 2) and (3) electrostatic testing: electromagnetic compatibility test and measurement technology electrostatic discharge immunity test conforming to GBT 17626.2-2006 3) fast transient test: the method conforms to GBT 17626.4-1998 electromagnetic compatibility test and measurement technology electric fast transient pulse group immunity test; 4) and (3) surge testing: and the surge (impact) immunity test conforms to the GBT 17626.5-2008 electromagnetic compatibility test and measurement technology.
In the embodiment of the present invention, a fanless heat dissipation manner is adopted, and the heat dissipation manner is connected to a target heat-generating component in a contact manner through a multi-stage heat conduction structure, so as to absorb heat generated by the target heat-generating component and guide out the heat generated by the target heat-generating component; the heat dissipation device is connected with the multistage heat conduction structure and used for conducting heat dissipation processing on the heat conducted by the multistage heat conduction structure, and the purpose of ensuring normal stable work of the mainboard and the storage hard disk is achieved, so that the technical effects of avoiding damage and loss of running data and storage data are achieved, and the technical problem that the heat dissipation of the radiator in the prior art is achieved by adopting a heat dissipation fan, and the normal stable work of the mainboard and the storage hard disk is not facilitated is solved.
According to the utility model discloses the embodiment still provides an electronic equipment's embodiment, include: a target heat generating component; the heat sink of any one of the above claims, in contact with the target heat-generating component, is configured to dissipate heat generated by the target heat-generating component.
In addition, it should be noted that, for alternative or preferred embodiments of the present embodiment, reference may be made to the related description in the foregoing heat sink embodiment, and details are not described herein again.
The above embodiment numbers of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A heat sink, comprising:
the multistage heat conduction structure is connected with the target heating component in a contact manner and is used for absorbing heat generated by the target heating component and guiding out the heat generated by the target heating component;
and the heat dissipation equipment is connected with the multistage heat conduction structure and is used for carrying out heat dissipation treatment on the heat led out by the multistage heat conduction structure.
2. The heat sink of claim 1, wherein the multilevel heat conducting structure comprises:
a first heat conducting device in contact connection with the target heat generating component for conducting the heat away;
the second heat conducting equipment is connected with the first heat conducting equipment and is used for transferring the heat conducted out by the first heat conducting equipment;
and the third heat-conducting equipment is connected with the second heat-conducting equipment and is used for exporting the heat transmitted by the second heat-conducting equipment.
3. The heatsink of claim 1, wherein the multilevel heat-conducting structure is disposed inside a chassis, a heatsink device is disposed outside the chassis, and the target heat-generating component is further disposed in the chassis, wherein the target heat-generating component is a processor.
4. The heat sink of claim 3, wherein said heat sink apparatus is further configured to dissipate said heat from said enclosure.
5. The heat sink of claim 2, wherein the first thermally conductive apparatus is a thermally conductive rubber mat.
6. The heat sink of claim 2, wherein the second thermally conductive apparatus is a heat dissipating aluminum block.
7. The heat sink of claim 2, wherein said third thermally conductive apparatus is a thermally conductive copper tube.
8. The heat sink of claim 1, wherein the heat sink is an aluminum fin.
9. The heat sink of claim 1, wherein the heat sink has an operating time of at least 16 hours and the temperature of the operating environment of the heat sink is at least 55 ℃.
10. An electronic device, comprising:
a target heat generating component;
the heat sink of any one of claims 1-9, in contact with the target heat-generating component, for dissipating heat generated by the target heat-generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021586348.0U CN213092260U (en) | 2020-08-03 | 2020-08-03 | Radiator and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021586348.0U CN213092260U (en) | 2020-08-03 | 2020-08-03 | Radiator and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213092260U true CN213092260U (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021586348.0U Active CN213092260U (en) | 2020-08-03 | 2020-08-03 | Radiator and electronic equipment |
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| CN (1) | CN213092260U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119126945A (en) * | 2024-09-03 | 2024-12-13 | 凡尔智能科技集团有限公司 | A high-efficiency CPU radiator for coal mining equipment |
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2020
- 2020-08-03 CN CN202021586348.0U patent/CN213092260U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119126945A (en) * | 2024-09-03 | 2024-12-13 | 凡尔智能科技集团有限公司 | A high-efficiency CPU radiator for coal mining equipment |
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