CN1286175C - 大功率发光二极管发光装置 - Google Patents

大功率发光二极管发光装置 Download PDF

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CN1286175C
CN1286175C CNB011353929A CN01135392A CN1286175C CN 1286175 C CN1286175 C CN 1286175C CN B011353929 A CNB011353929 A CN B011353929A CN 01135392 A CN01135392 A CN 01135392A CN 1286175 C CN1286175 C CN 1286175C
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emitting diode
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CN1341966A (zh
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葛世潮
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Zhejiang Manelux Lighting Co Ltd
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HANGZHOU FUYANG NOVEL ELECTRONICS CO Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

一种大功率发光二极管发光装置，包括有至少二个发光二极管芯片，它们被安装在至少一个反射体上，反射体被安装在一个基板和一个散热器上；一个透光容器，安装在反射体上方，透光容器内壁可有光转换材料，可将发光二极管芯片发出的光转变成所需色的光；至少一个驱动电路和一个电连接器，电连接器与外电源相连，其输出与发光二极管芯片相连，它可用于制造大功率、高效率发光二极管灯泡或平板式光源和显示器。

Description

大功率发光二极管发光装置
【技术领域】
本发明涉及一种大功率发光二极管照明和显示装置，用于照明和信息显示。
【背景技术】
现有的发光二极管如图1所示，均以1或2个芯片1安装在一个反射碗2内，芯片经连接线4和阳极引线3相连，并通过发光二极管芯片的引出线6外连，再用透光环氧树脂5密封为一基本单元，此种结构芯片散热难，芯片安装密度低，工作电流一般限于20mA以下，难于制成大功率的发光二极管器件。发光二极管是一种对温度很敏感的器件，输入功率增大时，芯片温度上升将导致发光效率明显下降。对于大功率发光二极管，如何改进散热，特别是在大电流和高芯片安装密度的情况下，散热更是一个关键问题。
【发明内容】
本发明的目的是要克服现有技术存在的不足，提供一种易散热的大功率发光二极管发光器件。
本发明采用的技术方案是：大功率发光二极管发光装置，它包括有安装在反射体上的发光二极管，所述的发光二极管芯片至少有二个，并安装在至少一个反射体上，反射体被安装在散热器上，反射体与散热器之间设置有导热胶，导热胶层内具有由玻璃珠构成的绝缘支柱。
所述的发光二极管芯片至少有二个，也可安装在至少一个反射体上，反射体被安装在散热基板上，散热基板安装在散热器上，基板与散热器之间设置有导热胶。
所述的安装有发光二极管芯片的发射体由导热金属制成，该发射体被安装在由导热绝缘材料制成的散热基板上，反射体、基板和散热器之间设置有导热胶。
所述的反射体上开有一反射碗，其深度大于反射碗口径的半径。
所述的发光二极管芯片和反射体上覆盖有光转换材料。
大功率发光二极管灯泡，发光二极管芯片前方有泡壳，该泡壳固定在散热器上，一个绝缘外壳用于连接散热器和下部灯头，灯头与外壳内有驱动器，其输入端经引线与灯头相连，其输出端经引线与发光二极管芯片相连。
所述的泡壳的内壁上有光转换材料，光转换材料上设有保护层。
所述的泡壳为一开口泡壳并设有反射层，基板和散热器上设有至少一个通孔。
大功率发光二极管显示单元，发光二极管芯片前方设有泡壳，该泡壳固定在散热器上，散热器安装在显示系统的基板上。
本发明具有易散热、效率高的优点，便于制成大功率的发光二极管灯和显示器。
【附图说明】
图1为现有的发光二极管的结构示意图。图2为本发明的大功率发光二极管发光装置的一个实施例的结构示意图。
图3为本发明的大功率发光二极管发光装置的又一个实施例的结构示意图。
图4为图3的等效电路图。
图5为图3的A-A剖面结构示意图。
图6为本发明的大功率发光二极管发光装置的又一个实施例的结构示意图。
图7为本发明的大功率发光二极管灯泡的一个实施例的结构示意图。
图8为本发明的大功率发光二极管灯泡的又一个实施例的结构示意图。
【具体实施方式】
下面结合附图对本发明作详细的介绍：
图2为本发明的大功率发光二极管发光装置的一个实施例结构示意图101。发光二极管芯片1固定在反射体7上，例如金属反射碗内，反射碗固定在基板8上。基板8与散热器9紧密接触，其间有导热胶10，用于导热。散热器9可为一平板或有多个槽的有利于散热的形状的板。芯片上有透光密封胶11，如环氧树脂。基板8由陶瓷、玻璃或电路板等高导热率材料制成。散热器由热导率高的材料如铝、银、铜或合金制成。为防止绝缘基板8因膨胀系数与散热器9不同而断裂，导热胶10可为软性胶。芯片1的排列可按需要串联、并联或串并联。绝缘基板8和散热器9可以是平面或曲面的。为避免透光密封胶11因热膨胀而断裂，所述透光密封胶11可分为若干小块。
图2所述结构，芯片1与散热器9之间热阻很小，可使芯片产生的热量很快散掉；同时芯片的安装密度很高，从而可制成大功率、高效率的发光二极管装置。
为确保发光二极管芯片中有个别损坏时器件仍能正常工作，可先将若干芯片并联后串联，如图3所示。图中的1a、1b、1c……和1A、1B、1C……为芯片，另图中所示有连接线4a、4b，导电反射基板12。所述芯片可安装在平面或曲面的反射体上。
图4为图3的等效电路图，其中1a、1b、1c……并联，1A、1B、1C……并联，若干阻并联的芯片串联。
图5为图3的A-A剖面示意图102，其中导电反射基板12和散热板9之间有薄绝缘导热层13，如云母、人造云母等。另有导热胶层10，芯片上有透光密封胶11。芯片和反射基板12上有光转换材料15，可将由芯片发出的光转变成所需色的光。
图5中导热胶层10内有绝缘支柱，如小玻璃珠，如图6中24所示。此时反射体可直接安装在散热器上，而不用绝缘导热层13。
为得到效率更高的出射光25，反射体上的反射碗12a可较深，其深度大于反射碗口径的半径，如图6所示。反射碗12a可设计成抛物面的形状。
图7为本发明的大功率发光二极管灯泡的一个实施例的结构示意图。其中的发光二极管发光装置可用图2、图5或图6的结构。散热器9被设计成与灯泡相似秉有利于散热的形状，如叶片、通孔等。芯片阵列1a、1b……上有一透光泡壳14，用玻璃或塑料制成，固定在散热器9上，其内壁上有光转换材料15，光转换材料15上有保护层16。图中有灯头17，绝缘外壳18有塑料或陶瓷制成，用于连接散热器与灯头。驱动电路19，其输入端经引线20与灯头17相连，其输出端经引线21与发光二极管芯片相连，当歪电源经灯头接通时，驱动其的输出即可点亮发光二极管芯片，使灯泡发光。
泡壳14内壁也可不用光转换材料，泡壳为透明或乳白色。
芯片可为同色或不同色发光体，以得到所需的光色。
图7所示的整灯的形状，可设计成其他几何形状，如球形，蘑菇形等。泡壳14也可以是开口的，其内壁上有反射层22，如图8所示。散热器9和基板12上有一通孔23，以使空气流通，增强散热效果。
图7与图8的装置也可用于制造显示单元，这时灯头17和外壳18不用，直接吧散热器9安装在显示系统基板上，散热器9也可以是显示系统基板本身。
本发明要求保护的范围不限于本文中介绍的各实施例，只要了解本发明内容，可以根据说明书做各种形式的变换和交换。

Claims (3)

1、大功率发光二极管发光装置，它包括有安装在反射体上的发光二极管，其特征在于所述的发光二极管芯片至少有二个，并安装在至少一个反射体上，反射体被安装在散热器上，反射体与散热器之间设置有导热胶，导热胶层内具有由玻璃珠构成的绝缘支柱。
2、如权利要求1所述的大功率发光二极管发光装置，其特征在于所述的反射体上开有一反射碗，其深度大于反射碗口径的半径。
3、如权利要求1所述的大功率发光二极管发光装置，其特征在于所述的发光二极管芯片和反射体上覆盖有光转换材料。
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