CN1285006A - 自由浮动的护罩和半导体处理系统 - Google Patents
自由浮动的护罩和半导体处理系统 Download PDFInfo
- Publication number
- CN1285006A CN1285006A CN98813641A CN98813641A CN1285006A CN 1285006 A CN1285006 A CN 1285006A CN 98813641 A CN98813641 A CN 98813641A CN 98813641 A CN98813641 A CN 98813641A CN 1285006 A CN1285006 A CN 1285006A
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- China
- Prior art keywords
- main body
- mentioned
- boot main
- protective guard
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45595—Atmospheric CVD gas inlets with no enclosed reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (42)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/008,024 US5849088A (en) | 1998-01-16 | 1998-01-16 | Free floating shield |
US09/008,024 | 1998-01-16 | ||
US09/185,180 US6056824A (en) | 1998-01-16 | 1998-11-03 | Free floating shield and semiconductor processing system |
US09/185,180 | 1998-11-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1285006A true CN1285006A (zh) | 2001-02-21 |
CN1111615C CN1111615C (zh) | 2003-06-18 |
Family
ID=21729422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN98813641A Expired - Fee Related CN1111615C (zh) | 1998-01-16 | 1998-12-04 | 自由浮动的护罩和半导体处理系统 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5849088A (zh) |
EP (1) | EP1055014A4 (zh) |
JP (1) | JP3416114B2 (zh) |
CN (1) | CN1111615C (zh) |
AU (1) | AU1625599A (zh) |
CA (1) | CA2318147A1 (zh) |
TW (1) | TW439122B (zh) |
WO (1) | WO1999036585A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1310301C (zh) * | 2002-02-22 | 2007-04-11 | 东京毅力科创株式会社 | 半导体处理系统中的端口机构 |
CN102812545A (zh) * | 2009-12-10 | 2012-12-05 | 恩特格里公司 | 用于微环境中均匀分布吹扫气体的多孔隔板 |
CN103208414A (zh) * | 2013-03-14 | 2013-07-17 | 上海华力微电子有限公司 | 去除bpsg薄膜中散射状颗粒的方法 |
CN105940142A (zh) * | 2014-03-15 | 2016-09-14 | 威科Ald有限公司 | 通过将清洁气体注射到沉积装置中来清洁沉积装置 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6352592B1 (en) * | 1998-01-16 | 2002-03-05 | Silicon Valley Group, Thermal Systems Llc | Free floating shield and semiconductor processing system |
US6056824A (en) * | 1998-01-16 | 2000-05-02 | Silicon Valley Group Thermal Systems | Free floating shield and semiconductor processing system |
US5849088A (en) * | 1998-01-16 | 1998-12-15 | Watkins-Johnson Company | Free floating shield |
US6143080A (en) * | 1999-02-02 | 2000-11-07 | Silicon Valley Group Thermal Systems Llc | Wafer processing reactor having a gas flow control system and method |
US6179913B1 (en) * | 1999-04-16 | 2001-01-30 | Cbl Technologies, Inc. | Compound gas injection system and methods |
US20010047756A1 (en) * | 1999-05-17 | 2001-12-06 | Bartholomew Lawrence Duane | Gas distribution system |
TW452635B (en) * | 1999-05-21 | 2001-09-01 | Silicon Valley Group Thermal | Gas delivery metering tube and gas delivery metering device using the same |
TW530097B (en) * | 1999-05-21 | 2003-05-01 | Silicon Valley Group Thermal | Protective gas shield apparatus |
WO2002024985A1 (de) * | 2000-09-22 | 2002-03-28 | Aixtron Ag | Gaseinlassorgan für cvd-verfahren und vorrichtung |
TW548724B (en) * | 2001-07-13 | 2003-08-21 | Asml Us Inc | Modular injector and exhaust assembly |
US6841006B2 (en) * | 2001-08-23 | 2005-01-11 | Applied Materials, Inc. | Atmospheric substrate processing apparatus for depositing multiple layers on a substrate |
TWI287587B (en) * | 2001-08-24 | 2007-10-01 | Asml Us Inc | Protective shield and system for gas distribution |
TW578198B (en) * | 2001-08-24 | 2004-03-01 | Asml Us Inc | Atmospheric pressure wafer processing reactor having an internal pressure control system and method |
US20100015731A1 (en) * | 2007-02-20 | 2010-01-21 | Lam Research Corporation | Method of low-k dielectric film repair |
US20100212591A1 (en) * | 2008-05-30 | 2010-08-26 | Alta Devices, Inc. | Reactor lid assembly for vapor deposition |
US9416448B2 (en) * | 2008-08-29 | 2016-08-16 | Tokyo Electron Limited | Film deposition apparatus, substrate processing apparatus, film deposition method, and computer-readable storage medium for film deposition method |
JP5107185B2 (ja) | 2008-09-04 | 2012-12-26 | 東京エレクトロン株式会社 | 成膜装置、基板処理装置、成膜方法及びこの成膜方法を実行させるためのプログラムを記録した記録媒体 |
US9297072B2 (en) | 2008-12-01 | 2016-03-29 | Tokyo Electron Limited | Film deposition apparatus |
JP5553588B2 (ja) * | 2009-12-10 | 2014-07-16 | 東京エレクトロン株式会社 | 成膜装置 |
KR101197403B1 (ko) * | 2010-06-16 | 2012-11-05 | 이영구 | 다중 증착 방식을 적용한 인라인 증착장치 |
JP6262115B2 (ja) | 2014-02-10 | 2018-01-17 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
JP6548586B2 (ja) | 2016-02-03 | 2019-07-24 | 東京エレクトロン株式会社 | 成膜方法 |
JP6733516B2 (ja) | 2016-11-21 | 2020-08-05 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
JP6626158B2 (ja) * | 2018-06-11 | 2019-12-25 | 日東電工株式会社 | 遮へい部材を備えた貼合装置 |
DE102018120580A1 (de) * | 2018-08-23 | 2020-02-27 | Infineon Technologies Ag | Vorrichtung und verfahren zum abscheiden einer schicht bei atmosphärendruck |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4834020A (en) * | 1987-12-04 | 1989-05-30 | Watkins-Johnson Company | Atmospheric pressure chemical vapor deposition apparatus |
US5393563A (en) * | 1991-10-29 | 1995-02-28 | Ellis, Jr.; Frank B. | Formation of tin oxide films on glass substrates |
US5849088A (en) * | 1998-01-16 | 1998-12-15 | Watkins-Johnson Company | Free floating shield |
-
1998
- 1998-01-16 US US09/008,024 patent/US5849088A/en not_active Expired - Lifetime
- 1998-11-26 TW TW087119658A patent/TW439122B/zh not_active IP Right Cessation
- 1998-12-04 EP EP98960728A patent/EP1055014A4/en not_active Withdrawn
- 1998-12-04 AU AU16255/99A patent/AU1625599A/en not_active Abandoned
- 1998-12-04 JP JP2000540285A patent/JP3416114B2/ja not_active Expired - Fee Related
- 1998-12-04 WO PCT/US1998/025740 patent/WO1999036585A1/en active IP Right Grant
- 1998-12-04 CA CA002318147A patent/CA2318147A1/en not_active Abandoned
- 1998-12-04 CN CN98813641A patent/CN1111615C/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1310301C (zh) * | 2002-02-22 | 2007-04-11 | 东京毅力科创株式会社 | 半导体处理系统中的端口机构 |
CN102812545A (zh) * | 2009-12-10 | 2012-12-05 | 恩特格里公司 | 用于微环境中均匀分布吹扫气体的多孔隔板 |
CN102812545B (zh) * | 2009-12-10 | 2016-08-03 | 恩特格里公司 | 用于微环境中均匀分布吹扫气体的多孔隔板 |
US10032660B2 (en) | 2009-12-10 | 2018-07-24 | Entegris, Inc. | Porous barrier for evenly distributed purge gas in a microenvironment |
CN103208414A (zh) * | 2013-03-14 | 2013-07-17 | 上海华力微电子有限公司 | 去除bpsg薄膜中散射状颗粒的方法 |
CN103208414B (zh) * | 2013-03-14 | 2016-06-08 | 上海华力微电子有限公司 | 去除bpsg薄膜中散射状颗粒的方法 |
CN105940142A (zh) * | 2014-03-15 | 2016-09-14 | 威科Ald有限公司 | 通过将清洁气体注射到沉积装置中来清洁沉积装置 |
Also Published As
Publication number | Publication date |
---|---|
US5849088A (en) | 1998-12-15 |
AU1625599A (en) | 1999-08-02 |
EP1055014A4 (en) | 2004-04-14 |
TW439122B (en) | 2001-06-07 |
JP3416114B2 (ja) | 2003-06-16 |
CA2318147A1 (en) | 1999-07-22 |
EP1055014A1 (en) | 2000-11-29 |
JP2002509369A (ja) | 2002-03-26 |
WO1999036585A1 (en) | 1999-07-22 |
CN1111615C (zh) | 2003-06-18 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SILICON VALLEY GROUP, INC. Free format text: FORMER NAME OR ADDRESS: SILICON VALLY GROUP HEAT SYSTEM INC. Owner name: ASML AMERICA CO.,LTD. Free format text: FORMER NAME OR ADDRESS: SILICON VALLEY GROUP, INC. |
|
CP01 | Change in the name or title of a patent holder |
Patentee after: ASML US, Inc. Patentee before: SILICON VALLEY Group Inc. Patentee after: SILICON VALLEY Group Inc. Patentee before: SILICON VALLEY GROUP, THERMAL SYSTEMS LLC |
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C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
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