CN1283549A - Composite laminated plate and its mfg process - Google Patents
Composite laminated plate and its mfg process Download PDFInfo
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- CN1283549A CN1283549A CN00122800A CN00122800A CN1283549A CN 1283549 A CN1283549 A CN 1283549A CN 00122800 A CN00122800 A CN 00122800A CN 00122800 A CN00122800 A CN 00122800A CN 1283549 A CN1283549 A CN 1283549A
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- lamella
- laminated plate
- composite laminated
- glass
- ceramic particle
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
- B32B17/10045—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets with at least one intermediate layer consisting of a glass sheet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
- B32B2038/0048—Annealing, relaxing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
- C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
- C03C2217/475—Inorganic materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
A composite laminate includes at least one first sheet layer comprising glass, and at least one second sheet layer comprising ceramic particles, in contact with the first sheet layer. The second sheet layer constitutes at least one main surface of the composite laminate, the ceramic particles in the second sheet layer are unsintered, and the glass contained in the first sheet layer is melted and partially penetrated into the second sheet layer so that the ceramic particles are bonded to each other. The main surface of the composite laminate has a satisfactory roughness for forming an external conductive film having a fine pattern, and the composite laminate is useful as a multilayered circuit board.
Description
The present invention relates to composite laminated plate and manufacture method thereof.The composite laminated plate that the present invention is specifically related to comprise glass and ceramic material and is applicable to multilayer circuit board, but also relate to its manufacture method.
Along with reducing of chip component size and weight, the size of the circuit board of mounting core piece element and weight also need correspondingly to reduce.For example, the multilayer circuit board of glass ceramics just can meet this requirement effectively, because the glass ceramics multilayer circuit board is convenient to the thickness and the weight of carrying out highdensity wiring and reducing base material itself.
The glass ceramics multilayer circuit board forms usually as follows.Provide and contain the two many layer green sheet of glass powder and ceramic powders.Inner conductor for example internal electrode is formed on each concrete green sheet by for example printing process.These green sheet are piled up, suppress, heat-treat then.At last, form for example external electrode of outside conducting film.
In order on the outer surface of glass ceramics multilayer circuit board, to carry out high-density wiring, must on substrate surface, form meticulous line pattern.Therefore must improve the surface flatness of base material.
This improvement of surface flatness not only need be used the ceramic powders of fine gtinding in the green sheet that constitutes outer surface, also need use the glass powder of fine gtinding in other green sheet.Yet the glass powder of preparation fine gtinding is compared comparatively difficulty, and can be increased processing cost with the grinding of ceramic powders.The result is, the glass ceramics multilayer circuit board that is used for carrying out high-density wiring is just very expensive.
Therefore, an object of the present invention is to provide the method that comparatively cheap being convenient to of price carried out the glass ceramics multilayer circuit board of high-density wiring and made this kind glass ceramics multilayer circuit board.
According to an aspect of the present invention, composite laminated plate comprise one deck at least contain first lamella of glass and at least one deck contain second lamella of ceramic particle, it contacts with first lamella.Wherein second lamella constitutes at least one first type surface of composite laminated plate, and the ceramic particle in second lamella is unsintered, makes the glass melting that is contained in first lamella, partly infiltrates second lamella, makes ceramic particle bonded to one another.
In composite laminated plate of the present invention, first lamella preferably also contains ceramic packing.
When composite laminated plate of the present invention when the multilayer circuit board, the first type surface that is provided by second lamella can be used as a surface of the outer conducting film that constitutes multilayer circuit board part circuit in the above.
The inner conductor that constitutes multilayer circuit board part circuit can be provided in the inside of composite laminated plate.
According to a further aspect in the invention, the manufacture method of composite laminated plate comprises the steps: the first step, prepare composite laminated plate green compact, it comprises that one deck at least contains first lamella of glass, at least one deck contains second lamella of ceramic particle, second lamella contacts with first lamella, and second lamella constitutes at least one first type surface of composite laminated plate; Second step, at a certain temperature the composite laminated plate green compact are heat-treated, this temperature should not cause the sintering of ceramic particle but will make glass melting, purpose is that the fusing by glass in first lamella bonds first lamella, and the segment glass that makes fusing infiltrates in second lamella, makes ceramic particle bonded to one another.
In the first step of the manufacture method of composite laminated plate, preferably the glass in first lamella is use powder, and the granularity of the ceramic particle that second lamella is interior is then less than the granularity of glass powder.
In the first step, first lamella preferably also contains ceramic packing.
In the first step, first lamella can be made separately earlier, then second lamella is formed on first lamella.Another kind of way is that first lamella and second lamella can be made separately earlier separately, then first lamella and second lamella is piled up, and forms the green compact of composite laminated plate.
When this method when making the method for multilayer circuit board, the outer conducting film that constitutes multilayer circuit board part circuit can be formed at least one first type surface that is formed by second lamella.
The inner conductor that constitutes multilayer circuit board part circuit can be formed on the inside of composite laminated plate green compact.
According to the present invention, the surface roughness of second lamella depends on the granularity that is included in ceramic particle in second lamella basically.Therefore,, in second lamella, use tiny ceramic particle also can improve the surface flatness of this lamella, promptly improve the surface flatness of composite laminated plate first type surface even when the green sheet of first lamella contains the bigger glass powder of granularity.Therefore, just can need not glass powder is further ground, just can make composite laminated plate of the present invention by less cost.In addition, when first lamella also contains ceramic packing except glass, can further improve the mechanical strength of composite laminated plate.
According to the present invention, the surface roughness of second lamella depends on the granularity that is included in ceramic particle in second lamella basically.Therefore, even when the green sheet of first lamella contains the bigger glass powder of granularity, in second lamella, use tiny ceramic particle also can improve the surface flatness of this lamella, promptly improve the surface flatness of composite laminated plate first type surface.Therefore, just can need not glass powder is further ground, just can make composite laminated plate of the present invention by less cost.When this composite laminated plate is used as circuit board, just can on its first type surface, form outer conducting film with fine pattern no problemly, on circuit board, form highdensity circuit.In addition, when first lamella also contains ceramic packing except glass, can further improve the mechanical strength of composite laminated plate.
Figure 1A is the constructed profile of the composite laminated plate green compact of one embodiment of the present invention; Figure 1B is the schematic cross sectional view of composite laminated plate after heat treatment of Figure 1A.
Fig. 2 A is the constructed profile of the composite laminated plate green compact of another embodiment of the present invention; Fig. 2 B is the schematic cross sectional view of composite laminated plate after heat treatment of Fig. 2 A.
Fig. 3 is the schematic cross sectional view that is applied to the composite laminated plate of multilayer circuit board.
Figure 1A is the constructed profile of the laminated plate green compact of one embodiment of the present invention; Figure 1B is the schematic cross sectional view of the composite laminated plate 2 that forms after 1 heat treatment of laminated plate green compact.
Sintering laminated plate 1 does not comprise first lamella 4 and two second lamellas 6 that contain ceramic particle 5 that contain glass powder 3.Two second lamellas 6 all contact with first lamella 4.Because two second lamellas 6 are clamped first lamella 4 in this embodiment, so two first type surfaces of laminated plate green compact 1 are provided by these two second lamellas 6.
The preferred glass material of glass powder 3 is anorthite glass ceramicses in first lamella.The example of another kind of glass material comprises borosilicate glass and cordierite glass ceramics.The granularity of glass powder 3 needn't be little as the granularity of ceramic particle 5, and can be bigger than the granularity of ceramic particle 5.
First lamella 4 can preferably be made separately earlier, for example makes the green sheet that contains glass powder 3.Its manufacturing is glass powder 3, decentralized medium and adhesive to be mixed form slurry, removes the bubble in the slurry, forms sheet with the scraping blade coating coating slurry then.Adhesive and decentralized medium are shown in the carrier among Figure 1A and the 1B 7.
The example of useful decentralized medium is water, toluene, alcohol and composition thereof.The example of adhesive is butyral resin, acrylic resin, polyurethane resin, vinyl acetate resin and polyvinyl alcohol.If desired, slurry can contain plasticizer, dispersant and defoamer.Green sheet can form by extruding, roll-in or compacting.
After first lamella 4 was made separately as mentioned above, second lamella 6 just can be formed on this sheet.In this case, preparation earlier contains the slurry of ceramic particle 5, dispersant and adhesive, will immerse in the slurry as the sheet of first lamella 4.This immersion processes can be made effectively and comprise the laminated plate green compact 1 that are provided at 4 two lip-deep second lamellas 6 of first lamella.Regulate content and the Immersion time of ceramic particle 5 in slurry, just can control the thickness of second lamella 6.
In the slurry of second lamella 6, in Figure 1A and 1B, be shown as the adhesive and the dispersant of carrier 8, can be identical with adhesive and the dispersant in first lamella, 4 slurries, also can be different.
Replace immersion process, second lamella 6 can also form by the slurry that spraying, roller coat or printing contain ceramic particle 5.In addition, also can then these two second lamellas 6 be stacked in the two sides of first lamella 4, make laminated plate green compact 1 like this as two second lamellas 6 of first lamella, 4 independent manufacturings.
Preferably, the glass powder 3 in 5 pairs first lamellas of ceramic particle 4 in second lamella 6 shows good wettability.For ceramic particle 5, preferred ceramic material is an aluminium oxide.The example of the ceramic material that other are useful comprises MgO, ZrO
2, SiO
2And TiO
2
Before the heat treatment, laminated plate green compact 1 should be suppressed on stacked direction.In heat treatment step, the temperature of employing should not cause ceramic particle 5 sintering but make glass powder 3 fusings.In heat treatment step, the carrier 8 in the carrier 7 in first lamella 4 and second lamella 6 is removed, and the glass powder 3 in first lamella 4 is fused into glass melt, is bonded into first lamella 4, shown in Figure 1B.In addition, a part of glass melt 9 infiltrates in second lamella 6 by capillary force, enters the gap between the ceramic particle 5, and ceramic particle 5 is bonded to each other.
The surface roughness of two first type surfaces of formed composite laminated plate 2 depends on the granularity of the ceramic particle 5 in second lamella 6.Therefore, even when the granularity of glass powder 3 is big, use undersized ceramic particle 5, also can reduce the surface roughness of composite laminated plate 2.
The size of the ceramic particle 5 in second lamella 6 is more little, and the ceramic particle 5 in second lamella 6 is just intensive more.In this case, cause that the capillary force of glass melt 9 generation VISCOUS FLOW is just big more, glass melt 9 will be more intensive.
In addition, glass melt 9 can arrive the outer surface of second lamella 6, and its surface tension can make this smooth outer surface.Therefore, glass melt 9 also helps to improve the smoothness of two first type surfaces of composite laminated plate 2.
Fig. 2 A and 2B have shown another embodiment of the invention, and be corresponding with Figure 1A and 1B.In Fig. 2 A and 2B, with component identical shown in Figure 1A and the 1B with identical numeral, it illustrates in this omission.
In the embodiment shown in Fig. 2 A and the 2B, the first lamella 4a of the laminated plate green compact 1a shown in Fig. 2 A not only contains glass powder 3, and contains ceramic packing 10.Therefore, the first lamella 4a of the composite laminated plate 2a shown in Fig. 2 B also contains ceramic packing 10 except glass melt 9 is arranged.
Aspect granularity and material, ceramic packing 10 can be identical with the ceramic particle 5 in being contained in second lamella 6, also can be different.
Other structures and manufacture method shown in Fig. 2 A and the 2B in second embodiment are identical with the embodiment shown in Figure 1A and the 1B basically.
Because the first lamella 4a contains ceramic packing 10, so formed composite laminated plate 2a has bigger mechanical strength.
In the composite laminated plate 2a shown in the composite laminated plate shown in Figure 1A and the 1B 2 and Fig. 2 A and the 2B, make second lamella 6 of smooth surface on composite laminate beyond the region of objective existence limit by using tiny ceramic particle 5.As composite laminated plate 2 or 2a during as circuit board, the outer conducting film with fine pattern just can be formed on its first type surface no problemly, the high-density line of formation circuit board.
Composite laminated plate 2 or 2a can comprise inner conductor, for example inner conductive film and also at the perforation contact of inside.
Fig. 3 is the schematic cross sectional view with composite laminated plate 11 of above-mentioned outer conducting film and inner conductor.This composite laminated plate 11 comprises corresponding to first lamella 12 of first lamella 4 or 4a in the above-mentioned embodiment with corresponding to second lamella 13 of second lamella 6 in the above-mentioned embodiment.This two second lamellas 13 constitute composite laminated plates 11 two outer surfaces, be first type surface.
Composite laminated plate 11 has the outer conducting film 14,15,16,17 and 18 that is formed on these two first type surfaces, with the inner conductor that is formed in the laminate, for example internal conductive film 19,20,21,22,23 and 24 and the perforation contact 25,26,27,28,29 and 30.Internal conductive film 19 and 20 is formed on the interface position between first lamella 12 and top second lamella 13.Shown in the geometric configuration of internal conductive film 21-24 and perforation contact 27-30, first lamella 12 is by laminating formation with many green compact, and these each green sheet all contain the part of the predetermined pattern of promising formation internal conductive film 19-24 and perforation contact 25-30.
In addition, each second lamella 13 can be made by many green sheet are laminated.In this case, internal conductive film can easily be formed at the inside of second lamella 13.
As shown in table 1, prepared the composite plate of embodiment of the invention 1-4 and Comparative Examples 1-5, be used for the evaluation table surface roughness.
The glass powder that is contained in first lamella is the anorthite glass ceramics, and granularity is about 6.50 microns in embodiment 1-4, and granularity is about 3.63 to 7.47 microns in Comparative Examples 1-4.First lamella in the Comparative Examples 5 does not contain glass powder.
In all composite plates, first lamella all contains the Powdered aluminium oxide that granularity is about 0.35 micron, as ceramic packing.
Glass powder and ceramic packing mix with 60: 40 part by weight.In embodiment 1-4 and Comparative Examples 1-4, water joins in the mixture as adhesive as dispersant, butyral resin, and water and butyral resin then join in Comparative Examples 5 in the ceramic packing, forms slurry.Remove the bubble in the slurry, form green sheet with the scraping blade method, making dry thickness is 500 microns.
The Powdered aluminium oxide that granularity is about the 0.35-0.60 micron is as ceramic powders, and preparation forms the aqueous slurry of embodiment 1-4 second lamella, and its solids content is 10% (volume).
To immerse as the green sheet of first lamella in the slurry, dry then, on two surface, form thickness and be about 10 microns ceramic layer, as second lamella.
Use-rigid press, each lamination green compact or green sheet of compacting under the pressure of double centner/centimetres 2 is then for embodiment 1-4 and Comparative Examples 1-4, in air in 850 ℃ of following heat treatments 2 hours, for Comparative Examples 5, be 1500 ℃ of following heat treatments, make a plate.The surface roughness Ra of each plate is as shown in table 1.Table 1
Table 1 shows that every surface roughness Ra with plate of second lamella all is positioned at O.17-0.48 micrometer range.Surface roughness Ra depends on the granularity of ceramic powders in second lamella, and when promptly the granularity of ceramic powders reduced, surface flatness increased.
With compare except 0.8 micron the surface roughness Ra that does not form second lamella, Comparative Examples 3 that other preparation condition is identical, the surface roughness Ra among the embodiment 1-4 obviously descends.
Relatively Comparative Examples 1-4 as seen, when the granularity of glass powder reduces, surface roughness just descends.Yet shown in Comparative Examples 1, the granularity of glass powder must be decreased to about 3.63 microns, just can obtain to be comparable to the surface roughness of embodiment 1-4.So little granularity is actually unpractical, because it is very high to prepare the production cost of thin glass powder.
When not forming second lamella on first lamella that only contains ceramic packing, shown in Comparative Examples 5, surface roughness Ra is 0.20 micron, and so little surface roughness is satisfactory.Yet in this case, heat treatment temperature must be increased to 1500 ℃.Therefore, can just be restricted as the metal of internal conductive film 19-24 and perforation contact 25-30.So little surface roughness can be by for example the ceramic powders granularity in second lamella being decreased to 0.35 micron and easily obtain, shown in embodiment 1.
The present invention can comprise the various variations to the above-mentioned embodiment of reference accompanying drawing and table 1 illustrated embodiment.
The number of first and second lamellas and stacked order thereof can change according to designing requirement, as long as each second lamella all contacts with each first lamella, and second lamella will constitute at least one first type surface of composite laminated plate.
First lamella can have thickness arbitrarily.Second lamella also can have thickness arbitrarily, as long as the glass melt in first lamella can partly infiltrate in second lamella, thereby makes the ceramic powder particle in second lamella can be bonded to one another.
The green sheet of first lamella can contain glass fibre, glass whisker, glass flake or glass platelet, is used for replacing glass powder.
The present invention also can be applicable to have on the outer surface the composite laminated plate in the hole of opening.These holes are formed in the composite laminated plate green compact, and when the composite laminated plate of making was used as multilayer circuit board, these holes were used for fixing electronic component.
Claims (11)
1. composite laminated plate, it comprises:
At least one deck contains first lamella of glass, second lamella that contains ceramic particle and contact with first lamella with one deck at least; Wherein second lamella constitutes at least one first type surface of composite laminated plate, and the ceramic particle in second lamella is unsintered, makes the glass melting in first lamella, and partly infiltrates second lamella, makes ceramic particle bonded to one another.
2. composite laminated plate as claimed in claim 1 is characterized in that described first lamella also contains ceramic packing.
3. composite laminated plate as claimed in claim 1 or 2, it also has the outer conducting film that is formed on the first type surface that second lamella provided.
4. as each described composite laminated plate among the claim 1-3, it also contains and is provided at its inner inner conductor.
5. the manufacture method of composite laminated plate comprises the steps:
The first step prepares composite laminated plate green compact, it comprise one deck at least contain first lamella of glass and at least one deck contain second lamella of ceramic particle, this second lamella contacts with first lamella, second lamella constitutes at least one first type surface of composite laminated plate;
Second step, the composite laminated plate green compact are heat-treated not causing the ceramic particle sintering but make under the temperature of glass melting, purpose is that the fusing by glass in first lamella bonds first lamella, and a part of glass melt is infiltrated in second lamella, makes ceramic particle bonded to one another.
6. the manufacture method of composite laminated plate as claimed in claim 5 is characterized in that in the described first step, and the glass in first lamella is pulverous, and the granularity of the ceramic particle in second lamella is less than glass powder.
7. as the manufacture method of claim 5 or 6 described composite laminated plates, it is characterized in that in the described first step, first lamella also contains ceramic packing.
8. as the manufacture method of each described composite laminated plate among the claim 5-7, it is characterized in that in the described first step that make first lamella earlier separately, second lamella is formed on first lamella then.
9. as the manufacture method of each described composite laminated plate among the claim 5-7, it is characterized in that in the described first step, make first lamella and second lamella respectively earlier, first lamella and second lamella are piled up, form the composite laminated plate green compact.
10. as the manufacture method of each described composite laminated plate among the claim 5-9, it is characterized in that also being included in the step that forms outer conducting film on the first type surface that described at least one second lamella constituted.
11., it is characterized in that the described first step is included in the interior inner conductor that forms of green compact of composite laminated plate as the manufacture method of each described composite laminated plate among the claim 5-10.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP225131/1999 | 1999-08-09 | ||
| JP11225131A JP2001047423A (en) | 1999-08-09 | 1999-08-09 | Composite laminate and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1283549A true CN1283549A (en) | 2001-02-14 |
| CN1179845C CN1179845C (en) | 2004-12-15 |
Family
ID=16824456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001228005A Expired - Lifetime CN1179845C (en) | 1999-08-09 | 2000-08-09 | Composite laminated plate and its mfg process |
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| Country | Link |
|---|---|
| JP (1) | JP2001047423A (en) |
| KR (1) | KR100348385B1 (en) |
| CN (1) | CN1179845C (en) |
| DE (1) | DE10038429C2 (en) |
| GB (1) | GB2354484B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101371317B (en) * | 2006-01-20 | 2011-04-20 | Lg伊诺特有限公司 | Connecting structure and adhesion method of PCB using anisotropic conductive film, and method for evaluating connecting condition using the same |
| CN103296344A (en) * | 2012-03-01 | 2013-09-11 | 深圳光启创新技术有限公司 | Media of dielectric filter and connection method of media |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4426805B2 (en) * | 2002-11-11 | 2010-03-03 | 日本特殊陶業株式会社 | Wiring board and manufacturing method thereof |
| DE10309689B4 (en) * | 2003-02-27 | 2005-04-07 | Bundesanstalt für Materialforschung und -Prüfung (BAM) | Ceramic plate with monolithic layer structure and method for its production |
| ITMI20040049A1 (en) * | 2004-01-16 | 2004-04-16 | Mdf Italia S R L | MULTI-LAYER PANEL |
| JP5074792B2 (en) * | 2007-03-14 | 2012-11-14 | 日本特殊陶業株式会社 | Wiring board and manufacturing method thereof |
| CN103243885B (en) * | 2013-04-26 | 2015-07-29 | 中国科学院上海技术物理研究所 | Low emissivity window still wall film system of a kind of low cost Color tunable and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2451692A1 (en) * | 1974-10-31 | 1976-05-06 | Helmut Hoedt | Facing plate for buildings - with layer of finely divided mineral components and org binders applied to cover plate |
| JPH08181443A (en) * | 1994-12-21 | 1996-07-12 | Murata Mfg Co Ltd | Ceramic multilayer board and manufacture thereof |
| JP3601679B2 (en) * | 1999-07-27 | 2004-12-15 | 株式会社村田製作所 | Method for producing composite laminate |
-
1999
- 1999-08-09 JP JP11225131A patent/JP2001047423A/en active Pending
-
2000
- 2000-07-21 GB GB0018021A patent/GB2354484B/en not_active Expired - Lifetime
- 2000-08-04 KR KR1020000045217A patent/KR100348385B1/en active IP Right Grant
- 2000-08-07 DE DE10038429A patent/DE10038429C2/en not_active Expired - Lifetime
- 2000-08-09 CN CNB001228005A patent/CN1179845C/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101371317B (en) * | 2006-01-20 | 2011-04-20 | Lg伊诺特有限公司 | Connecting structure and adhesion method of PCB using anisotropic conductive film, and method for evaluating connecting condition using the same |
| CN103296344A (en) * | 2012-03-01 | 2013-09-11 | 深圳光启创新技术有限公司 | Media of dielectric filter and connection method of media |
| CN103296344B (en) * | 2012-03-01 | 2017-11-10 | 深圳光启高等理工研究院 | A kind of medium of dielectric filter and attaching method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0018021D0 (en) | 2000-09-13 |
| GB2354484B (en) | 2002-06-19 |
| GB2354484A (en) | 2001-03-28 |
| KR100348385B1 (en) | 2002-08-10 |
| JP2001047423A (en) | 2001-02-20 |
| DE10038429A1 (en) | 2001-04-05 |
| DE10038429C2 (en) | 2002-09-12 |
| KR20010021219A (en) | 2001-03-15 |
| CN1179845C (en) | 2004-12-15 |
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