JP2005277071A - Method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method by which an electronic component can be manufactured which is free from delamination and has high dimensional accuracy. <P>SOLUTION: The method of manufacturing the electronic component includes a step of forming a first green ceramic sheet layer 2 containing inorganic powder, a first binder, and a fused component; a step of forming a green ceramic sheet 4 by forming a second green ceramic sheet layer 3 containing the inorganic powder, and a second binder on the first green ceramic sheet layer 2; and a step of forming a conductor layer 5 on the green ceramic sheet 4. The method also includes a step of manufacturing a green ceramic sheet laminate 6 by laminating a plurality of green ceramic sheets on which conductor layers 5 are formed upon another and heating the laminated body, and a step of baking the green ceramic sheet laminate 6. The amount of the organic component composed of the first binder and fused component is adjusted to 10-50 pts.mass to 100 pts.mass of the inorganic powder. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic component such as a multilayer capacitor or a multilayer ceramic wiring board.

  In recent years, with the miniaturization of electronic devices, there has been a demand for miniaturization and high performance in electronic components such as multilayer capacitors and multilayer ceramic wiring boards. For example, multilayer capacitors are required to have multilayered thin dielectric layers and conductor layers for miniaturization and high capacity. In addition, in multilayer ceramic wiring boards, thinner insulation layers and wiring conductor layers are formed in multiple layers in order to reduce the size and increase the density of wiring conductors, and the wiring conductor layers must have finer wiring widths and intervals. ing.

  Such electronic parts are made by adding an organic binder, plasticizer, solvent, etc. to ceramic powder to form a slurry, forming a ceramic green sheet (hereinafter also referred to as green sheet) with a doctor blade, etc., and then a conductor containing metal powder. A conductive layer is formed on a green sheet by printing a paste, and then a green sheet on which a plurality of conductive layers are formed is laminated and pressed to obtain a laminated body. Obtained by firing.

  As one improvement request for electronic components, when a large number of green sheets with conductor layers formed thereon are stacked, the difference in thickness between the areas where the conductor layers are formed overlaps with the areas where the areas do not overlap. For this reason, when the laminated green sheets are pressed in the thickness direction, a sufficient pressing force is applied to the portion where the regions where the conductor layers are formed overlap, but it is difficult to sufficiently apply the pressing force to the other portions. Therefore, it tends to be insufficient crimping. As a result, when such a laminate is fired, there is a problem in that delamination (delamination) occurs at a portion where the pressure bonding is insufficient.

  If this delamination is present inside the electronic component, there is a problem that the electric characteristics cannot be secured because the capacitance value is likely to change or the dielectric breakdown is likely to occur.

  In order to solve this problem, Patent Document 1 proposes to use a laminate having a highly fluid portion having high fluidity when pressurized. When the laminated body is pressed in the thickness direction, the high fluidity part existing in the area where the internal electrodes are laminated moves to the remaining part and the thickness of the remaining part increases to increase the pressure. Is uniformly added to the whole, so that delamination hardly occurs.

  In addition, when another green sheet is laminated on the conductor layer formed on the green sheet, the green sheet hardly follows the cross-sectional shape of the conductor layer, so that a void is generated around the conductor layer. There is a problem that delamination is likely to occur. In particular, when the wiring interval of the conductor layer is fine, voids are easily generated between the wirings of the conductor layer.

In order to solve this problem, Patent Document 2 proposes that after a conductor layer is formed on a green sheet, a ceramic paste is printed in a region around the portion where the conductor layer is formed. If such a method is used, the step between the conductor layer and the green sheet can be eliminated by printing the ceramic paste in a region around the portion where the conductor layer is formed. For this reason, it is possible to suppress the generation of voids around the conductor layer and between the wirings of the wiring conductor layer, and to suppress the occurrence of delamination caused by the voids. In addition, there is no difference in thickness even when a plurality of green sheets on which a conductor layer is formed are laminated, so that pressure can be applied without unevenness and crimping can be suppressed, and the occurrence of insufficient crimping can be suppressed. Generation of lamination can be suppressed.
Japanese Patent No. 3344100 Japanese Patent Laid-Open No. 5-217448

  However, in the conventional method using a laminate having a high fluidity portion, in order to perform pressure bonding so that delamination does not occur by moving the high fluidity portion, for example, a high pressure of 180 MPa is applied in the thickness direction. Need to add. When such a high pressure is applied to the green sheet on which the conductor layer is formed, the shape of the green sheet or the pattern of the conductor layer is deformed. As a result, since the desired dimensional accuracy of the board cannot be obtained, it is difficult to mount components on the board, and the conductor layer pattern shape as designed cannot be obtained. However, there is a problem that electrical characteristics such as impedance matching cannot be obtained. Furthermore, the problem of the gap generated between the wirings when the wiring interval of the wiring conductor layer is fine remains unsolved.

  In addition, in the method of printing the ceramic paste on the area around the portion where the conductor layer is formed, not only is the process of printing the ceramic paste further on the green sheet on which the conductor layer is formed, but also the wiring conductor When the wiring interval of the layers is fine, it is difficult to print the ceramic paste between the wirings. For this reason, the ceramic paste is also printed on the wiring conductor layer, and the through-conductor for connecting the wiring conductor layers stacked and arranged vertically by the ceramic paste printed on the wiring conductor layer is provided. There was a problem that it was not connected to the wiring conductor layer.

  Further, when an electronic component having a cavity is manufactured, a green sheet laminated body is formed by laminating a green sheet having a through hole serving as a cavity and a green sheet not having a through hole serving as a bottom of the cavity. There was a problem that the bottom of the cavity was warped. This is because pressure is applied only to the periphery of the cavity due to pressurization for crimping, and the lean sheet around the cavity extends due to pressurization, while no pressure is applied to the bottom of the cavity, so the green sheet at the bottom of the cavity It is because it is pushed from. This is more likely to occur when the electronic component is smaller and the cavity bottom is thinner. If the cavity bottom warps, it becomes difficult to mount an electronic element such as a crystal resonator or an IC chip. Even if it can be mounted, the mounted components are tilted. Therefore, when an optical semiconductor element such as a CCD or C-MOS is mounted, there is a problem that the light receiving accuracy deteriorates.

  The present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to provide a method for manufacturing an electronic component that has no delamination and has high dimensional accuracy.

  The method of manufacturing an electronic component according to the present invention includes a step of forming a first ceramic green sheet layer containing an inorganic powder, a first binder, and a molten component, and an inorganic powder and a first layer on the first ceramic green sheet layer. Forming a second ceramic green sheet layer containing two binders to form a ceramic green sheet; forming a conductor layer on the second ceramic green sheet layer of the ceramic green sheet; and A step of producing a ceramic green sheet laminate by laminating and heating a plurality of the ceramic green sheets on which a conductor layer is formed, and a step of firing the ceramic green sheet laminate, Organic component of the first ceramic green sheet layer comprising one binder and the molten component The amount is characterized in that 10 to 50 parts by weight with respect to the inorganic powder 100 parts by weight contained in the first ceramic green sheet layer.

  In the electronic component manufacturing method of the present invention, preferably, the melting component has a melting point of 35 to 100 ° C.

  According to the method for manufacturing an electronic component of the present invention, since the first ceramic green sheet layer contains a melting component that melts when heated, the first ceramic green sheet layer is heated when the ceramic green sheets on which the conductor layer is formed are laminated and heated. Since the first ceramic green sheet layer is softened, the first ceramic green sheet layer is formed of the second ceramic green sheet layer of the ceramic green sheet located thereunder and, for example, the pattern of the conductor layer formed thereon. Deforms following the shape. As a result, the ceramic green sheets adhere to each other without generating voids around the conductor layers and between the wirings of the conductor layers, and the electronic components obtained by firing the ceramic green sheet laminate are free from delamination. .

  In addition, since the first ceramic green sheet layer contains a melting component that melts when heated, the first ceramic green sheet layer is softened and has adhesiveness only by heating. There is no need to crimp ceramic green sheets. And since the second ceramic green sheet layer does not contain a melting component that melts during heating, the second ceramic green sheet layer does not deform during heating, so that the laminated ceramic green sheets do not shift. Further, the softened first ceramic green sheet layer is not deformed to such an extent that it is pressed to assist in deforming following the shapes of the second ceramic green sheet layer and the conductor layer. Therefore, the shape of the ceramic green sheet and the conductor layer formed thereon is not deformed, and the obtained ceramic green sheet laminate and the electronic component obtained by firing it have high dimensional accuracy.

  The amount of the organic component of the first ceramic green sheet layer composed of the first binder and the molten component is 10 to 50 parts by mass with respect to 100 parts by mass of the inorganic powder contained in the first ceramic green sheet layer. For this reason, the amount of the organic component combined with the inorganic component becomes an appropriate amount, and the first ceramic green sheet layer is uniformly softened by heating when the ceramic green sheet laminate is produced, and the inorganic component is aggregated. Thus, a portion having low adhesiveness is not generated. As a result, the ceramic green sheets adhere to each other without any voids around the conductor layer and between the wiring of the conductor layers, and the electronic components obtained by firing the ceramic green sheet laminate are free from delamination It becomes.

  In addition, when the melting point of the melting component that is melted during heating is 35 ° C. to 100 ° C., the first ceramic green sheet layer does not soften and deform at room temperature. It becomes easy, and organic components such as a binder and a plasticizer in the ceramic green sheet are not decomposed during heating, so that delamination is not generated by the decomposition gas, which is preferable.

  As described above, according to the manufacturing method of the present invention, it is possible to obtain a ceramic green sheet laminate in which no gap is generated between the ceramic green sheets and the deformation of the ceramic green sheet or the conductor layer is suppressed. The electronic component produced by the manufacturing method of the invention has no delamination and becomes an electronic component having high dimensional accuracy.

  The method for manufacturing an electronic component of the present invention will be described in detail below. FIG. 1 is a sectional view for each process showing an example of an embodiment of an electronic component manufacturing method according to the present invention, wherein 1 is a support, 2 is a first ceramic green sheet layer, and 3 is a second ceramic green sheet. Layers 4, 4 are ceramic green sheets, 5 is a conductor layer, and 6 is a ceramic green sheet laminate.

  First, as shown in FIG. 1A, a first ceramic green sheet layer 2 is formed on a support 1, and then, as shown in FIG. The ceramic green sheet layer 3 is formed to form the ceramic green sheet 4.

  The first ceramic green sheet layer 2 and the second ceramic green sheet layer 3 in the present invention are formed using a mixture of an inorganic powder, an organic binder (also simply referred to as a binder), a solvent, and the like. The first ceramic green sheet layer further contains a molten component. The first binder contained in the first ceramic green sheet layer 2 and the second binder contained in the second ceramic green sheet layer 3 may be the same organic binder or different organic binders. In both the first ceramic green sheet layer 2 and the second ceramic green sheet layer 3, a plasticizer may be further added to adjust the hardness and strength of the ceramic green sheet 4.

Examples of the inorganic powder include Al ₂ O ₃ , AlN, glass ceramic powder (a mixture of glass powder and filler powder) and the like for a ceramic wiring board, and BaTiO ₃ and PbTiO ₃ for a multilayer capacitor. Composite perovskite-based ceramic powders, and the like, are selected as appropriate in accordance with characteristics required for electronic components.

Examples of the glass component of the glass ceramic powder include SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO system (however, , M represents Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same or different, and Ca, Sr , Mg, Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (where M ¹ and M ² are the same as above), SiO ₂ — B ₂ O ₃ —M ³ ₂ O system (where M ³ represents Li, Na or K, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ³ ₂ O system (where M ³ is The same), Pb glass, Bi glass and the like.

Further, as the filler powder of the glass ceramic powder, for example, a composite oxide of Al ₂ O ₃ , SiO ₂ , ZrO ₂ and an alkaline earth metal oxide, a composite oxide of TiO ₂ and an alkaline earth metal oxide, A ceramic powder such as a composite oxide (for example, spinel, mullite, cordierite) containing at least one selected from Al ₂ O ₃ and SiO ₂ can be used.

  As the organic binder contained in the ceramic green sheet 4, those conventionally used for ceramic green sheets can be used. For example, acrylic (acrylic acid, methacrylic acid or ester homopolymer or copolymer A polymer, specifically an acrylic ester copolymer, a methacrylic ester copolymer, an acrylic ester-methacrylic ester copolymer, etc.), polyvinyl butyral, polyvinyl alcohol, acrylic-styrene, polypropylene carbonate, Examples include cellulose-based homopolymers or copolymers. In view of decomposition and volatility in the firing step, an acrylic binder is more preferable.

  The molten component contained in the first ceramic green sheet layer 2 is in a molten state upon heating when the ceramic green sheet laminate 6 is produced, and includes hydrocarbon, fatty acid, ester, aliphatic alcohol, polyvalent Alcohol etc. are mentioned. These molten components have a positive polarity for hydrocarbons and a negative polarity for fatty acids, esters, fatty alcohols and polyhydric alcohols. In view of decomposition and volatility in the firing step, aliphatic alcohols and polyhydric alcohols that do not contain a double bond are more preferable.

  Here, the amount of the organic component of the first ceramic green sheet layer 2 composed of the first binder and the molten component is 10 to 50 with respect to 100 parts by mass of the inorganic powder contained in the first ceramic green sheet layer 2. Part by mass. If the amount of the organic component is less than 10 parts by mass, the absolute amount of the organic component having a role of dispersing in the first ceramic green sheet layer 2 due to the combination with the inorganic component is insufficient. The first ceramic green sheet layer 2 is not softened as a whole at the time of heating in the manufacturing process, and adhesiveness cannot be obtained, or the first ceramic green sheet layer 2 is not uniformly softened and has a portion having no adhesiveness. Thus, delamination occurs in the electronic component obtained by firing. If the organic component is more than 50 parts by mass, the organic component combined with the inorganic component is excessive, and a portion where the organic component that cannot be dispersed in the first ceramic green sheet layer 2 is aggregated is generated. This part has an organic component and has adhesiveness, but the inorganic component does not exist. Therefore, delamination caused by voids and voids occurs in the electronic component obtained by removing the organic component during firing. It will be.

  Here, the organic component indicates a first binder and a molten component. When forming the ceramic green sheet layer, a slurry to which a solvent, a plasticizer, a dispersant, and the like are added as an organic component is used, but the slurry is dried to form a ceramic green sheet layer. Does not contain any solvent that evaporates, and the amount of plasticizer, dispersant, etc. is small and diffuses into the ceramic green sheet 4, so that the organic component is the first binder and the molten component.

  Among the above-mentioned melting components, those having a melting point of 35 to 100 ° C. are preferable. This is because when the melting point in this range is used, the first ceramic green sheet layer 2 is not softened and deformed at room temperature. This is because organic components such as a binder and a plasticizer in the ceramic green sheet 4 are not decomposed during heating in the production process, and therefore delamination is not generated by the decomposition gas. Specific examples of the melting component having a melting point of 35 to 100 ° C. include hexadecanol, polyethylene glycol, polyglycerol, stearylamide, oleylamide, ethylene glycol monostearate, paraffin, stearic acid, and silicone. Among these, those having good decomposition and volatility in the baking step and having a hydroxyl group are hexadecanol, polyethylene glycol, and polyglycerol.

  The first ceramic green sheet layer 2 is a slurry obtained by adding a solvent (organic solvent, water, etc.) to the inorganic powder, organic binder, and molten component, and a predetermined amount of plasticizer and dispersant as required. It is obtained by molding on a support 1 such as a PET film by a doctor blade method, a lip coater method, a die coater method or the like. The thickness of the first ceramic green sheet layer 2 is formed so as to be thicker than the thickness of the conductor layer 5 in order to fill the step between the conductor layer 5 and the ceramic green sheet 4.

  The second ceramic green sheet layer 3 is formed using a slurry that does not contain a molten component with respect to the slurry used for the first ceramic green sheet layer 2.

  The method of forming the second ceramic green sheet layer 3 on the first ceramic green sheet layer 2 is as follows. (1) The second ceramic green sheet layer 3 formed in the same manner as the first ceramic green sheet layer 2 is (2) A slurry of the second ceramic green sheet 3 is applied on the first ceramic green sheet layer 2 formed on the support 1. And (3) a method in which the slurry of the second ceramic green sheet layer 3 is applied on the slurry of the first ceramic green sheet layer 2 applied on the support 1.

  When the second ceramic green sheet layer 3 is laminated on the first ceramic green sheet layer 2, a gap is generated between the first ceramic green sheet layer 2 and the second ceramic green sheet layer 3. Therefore, in order to improve the adhesion between the first ceramic green sheet layer 2 and the second ceramic green sheet layer 3, the method (2) or (3) is preferable. Furthermore, the method (3) is more preferable because the first ceramic green sheet layer 2 and the second ceramic green sheet layer 3 are formed almost simultaneously, which simplifies the process. In the method (3), an extrusion method such as a die coater method or a lip coater method may be used. These are non-contact coating methods, and a slurry having a relatively low viscosity and a small amount of solvent is used. Since it can be used, the ceramic green sheet 4 may be formed without mixing the slurry of the first ceramic green sheet layer 2 and the slurry of the second ceramic green sheet layer 3.

  Next, a conductor layer 5 is formed on the ceramic green sheet 4 as shown in FIG. As a method for forming the conductor layer 5 on the ceramic green sheet 4, for example, a conductor paste obtained by pasting a conductor material powder is printed by a screen printing method or a gravure printing method, or a predetermined pattern shape is formed by a plating method or a vapor deposition method. Formed directly on the ceramic green sheet 4 to form a metal film, or a conductor thick film formed into a predetermined pattern shape by printing, a metal foil processed into a predetermined pattern shape, a plating method or a vapor deposition method There is a method of transferring a metal film having a predetermined pattern shape onto the ceramic green sheet 4. Examples of the conductive material include one or more of W, Mo, Mn, Au, Ag, Cu, Pd (palladium), Pt (platinum), etc., and in the case of two or more, mixing, alloy, layer Any form such as another coating may be used.

  The conductor layer 5 is preferably formed on the second ceramic green sheet layer 3 of the ceramic green sheet 4. This is because since the second ceramic green sheet layer 3 does not contain a melting component that melts when heated, the second ceramic green sheet layer 3 is not deformed when heated, so that the conductor layer 5 is formed thereon. This is to prevent the conductor layer 5 from being deformed.

  In addition, before forming the conductor layer 5, you may form through conductors, such as a via-hole conductor and a through-hole conductor, for connecting the conductor layers 5 between the upper and lower ceramic layers as needed. The through conductor is formed by a means such as embedding a conductor paste obtained by pasting a conductor material powder into a through hole formed in the ceramic green sheet 4 by punching, laser processing, or the like by printing or press filling.

  In the case of manufacturing an electronic component having a cavity, a cavity-shaped through hole is formed in a part of the ceramic green sheet 4 by punching with a mold or the like before the step of manufacturing the next laminate. The through hole may be formed before or after the conductor layer 5 is formed, depending on whether or not the conductor layer 5 is formed on the inner wall surface of the cavity.

  Next, as shown in FIG. 1D, the ceramic green sheets 4 that are aligned and stacked are melted at a temperature at which the molten component becomes molten and the first ceramic green sheet layer 2 is softened and deformed, that is, melted. The ceramic green sheet laminated body 6 is produced by heating at a temperature about the melting point of the components. At this time, the laminated ceramic green sheets 4 are not displaced, and the softened first ceramic green sheet layer 2 is replaced with the second ceramic green sheet layer 3 and the conductor layer 5 formed thereon. If pressurizing is performed to assist in deforming following the pattern shape, more accurate and reliable pressing can be performed.

  In the step of producing the ceramic green sheet laminate 6, the first ceramic green sheet layer 2 contains a melting component that melts when heated, and thus the ceramic green sheet 4 on which the conductor layer 5 is formed is laminated and heated. At this time, the first ceramic green sheet layer 2 is softened, so that the first ceramic green sheet layer 2 is the second ceramic green sheet layer 3 of the ceramic green sheet 4 located thereunder and the conductor formed thereon. Deformation follows the shape of the layer 5. As a result, the ceramic green sheets 4 are brought into close contact with each other without generating voids around the conductor layer 5 and between the wirings of the conductor layer 5, and the electronic component obtained by firing the ceramic green sheet laminate 6 generates delamination. There will be no.

  In addition, since the first ceramic green sheet layer 2 contains a melting component that melts when heated, the first ceramic green sheet layer 2 is softened and has adhesiveness only by heating. There is no need to press the ceramic green sheet 4 by pressure. For example, since the second ceramic green sheet layer 3 on which the conductor layer 5 is formed does not contain a melting component that melts when heated, the second ceramic green sheet layer 3 is laminated without being deformed when heated. The softened first ceramic green sheet layer 2 is made to follow the pattern shape of the second ceramic green sheet layer 3 and the conductor layer 5 formed thereon so that the ceramic green sheet 4 is not displaced. It does not deform as long as it is pressed to assist in deformation. Therefore, the shape of the ceramic green sheet 4 and the conductor layer 5 formed thereon is not deformed, and the ceramic green sheet laminate 6 obtained without distortion to the ceramic green sheet 4 due to pressurization is obtained. The electronic component obtained by firing has high dimensional accuracy.

  For example, when the first ceramic green sheet layer 2 that does not contain a melting component that melts when heated is used, the dimensional accuracy of the ceramic green sheet laminate 6 and the electronic component was about ± 0.5%. When the first ceramic green sheet layer 2 containing the molten component was used, the dimensional accuracy of the ceramic green sheet laminate 6 and the electronic component was about ± 0.3%, and it was proved by experiment that .

  Further, when an electronic component having a cavity is manufactured, it is not necessary to press the ceramic green sheet 4 with a large pressure, so that the cavity bottom portion due to the difference in elongation of the green sheet 4 due to the pressurization between the cavity peripheral portion and the cavity bottom portion. The occurrence of warpage can be suppressed, and an electronic component that can accurately and reliably mount an electronic element on the bottom of the cavity can be obtained.

  As the ceramic green sheet positioned at the bottom of FIG. 1 (d), a ceramic green sheet 4 'composed only of the second ceramic green sheet layer 3 may be used. In the case of an electronic component in which the conductor layer 5 is not exposed on the surface, such as a multilayer capacitor, the ceramic green sheet 4 in which the conductor layer 5 is not formed on the ceramic green sheet 4 positioned at the top of FIG. In the case of an electronic component in which the conductor layer 5 is exposed on both surfaces, such as a multilayer ceramic wiring board, the one in which the conductor layer 5 is formed on both surfaces of the lowermost ceramic green sheet 4 ′ may be used. .

  Finally, the ceramic green sheet laminate 6 is fired to produce the electronic component of the present invention. The firing step consists of removing organic components and sintering inorganic powder. Removal of the organic component is performed by heating the ceramic green sheet laminate 6 in a temperature range of 100 to 800 ° C. to decompose and volatilize the organic component. The sintering temperature depends on the ceramic composition and is in the range of about 800-1600 ° C. The firing atmosphere varies depending on the inorganic powder and the conductor material, and is performed in the air, in a reducing atmosphere, in a non-oxidizing atmosphere or the like, and may contain water vapor or the like in order to effectively remove organic components.

  The electronic component obtained after firing has a good connection means on the surface of the conductor layer 5 exposed on the surface, for preventing corrosion of the conductor layer 5, or for an external substrate such as solder or metal wire or an electronic component. For connection, Ni or Au may be plated.

When a low-temperature sintered material such as glass ceramic is used as the ceramic material, if the constrained green sheet is further laminated on the upper and lower surfaces of the ceramic green sheet laminate 6 and fired, and the restraint sheet is removed after firing, A ceramic substrate with high dimensional accuracy can be obtained. The constrained green sheet is a green sheet mainly composed of a hardly sinterable inorganic material such as Al ₂ O ₃ and does not shrink during firing. In the ceramic green sheet laminate 6 in which the constraining green sheets are laminated, the constraining green sheet that does not contract is suppressed from contracting in the stacking plane direction (xy direction: plane direction) and contracts only in the stacking direction (z direction). Dimensional variation accompanying firing shrinkage is suppressed. If the constraining green sheet at this time also has a first ceramic green sheet layer 2 and a second ceramic green sheet layer 3 similar to the ceramic green sheet laminate 6 of the present invention, the constraining green sheet is laminated. A large pressing force is not required for the pressure bonding, and the obtained electronic component may have a higher dimensional accuracy.

  In addition to the hardly sinterable inorganic component, the constrained green sheet may contain a glass component having a softening point not higher than the firing temperature, for example, the same glass as the glass in the ceramic green sheet 4. When the glass is softened and bonded to the ceramic green sheet 4 during firing, the bonding between the ceramic green sheet 4 and the constraining green sheet becomes strong, and a more reliable restraining force can be obtained. When the amount of the glass is 0.5 to 15 parts by mass with respect to 100 parts by mass of the inorganic component combined with the hardly sinterable inorganic component and the glass component, the binding force is improved and the firing shrinkage of the constrained green sheet Is suppressed to 0.5% or less.

  After firing, the constraining sheet is removed. Examples of the removal method include polishing, water jet, chemical blasting, sand blasting, wet blasting (a method of spraying abrasive grains and water by air pressure) and the like.

  The electronic component manufactured by the method as described above does not have delamination inside and has high dimensional accuracy, and thus has excellent electrical characteristics and high airtightness required as an electronic component.

  Examples of the present invention will be described below.

  First, for the first ceramic green sheet layer, 90% by mass of alumina having an average particle diameter of 1 μm, silica, magnesia and calcia as sintering aids, and transition metal oxide (chromium trioxide) as coloring pigments are used. Table 1 shows 100 parts by mass of ceramic powder prepared at a ratio of 10% by mass, isobutyl methacrylate resin as an organic binder, and hexadecanol as a melting component having a melting point of 48 ° C. as a melting component. The first slurry was prepared by mixing at a ratio and mixing for 40 hours with a ball mill using toluene and ethyl acetate as a solvent.

  Also, for the second ceramic green sheet layer, 10 parts by mass of solid methyl methacrylate resin as an organic binder and dibutyl phthalate as a plasticizer with respect to 100 parts by mass of the ceramic powder similar to the first slurry. 1 part by mass was added, and toluene and ethyl acetate were used as a solvent and mixed by a ball mill for 40 hours to prepare a second slurry.

  Next, using a die coater sheet molding machine, the first slurry is applied with a width of 250 mm at a molding speed of 2 m / min, and the second slurry is applied thereon and dried. A ceramic green sheet having a thickness of 1 ceramic green sheet layer of 50 μm and a thickness of the second ceramic green sheet layer of 50 μm was produced.

  On the second ceramic green sheet layer of this ceramic green sheet, a conductor layer having a predetermined pattern shape is formed with a thickness of 10 to 20 μm by a screen printing method using a conductor paste mainly composed of tungsten powder to form a conductor layer. Four ceramic green sheets were stacked and heat-pressed at a pressure of 0.5 MPa and a temperature of 80 ° C. in the thickness direction to produce a ceramic green sheet laminate.

  The obtained ceramic green sheet laminate was heated in a nitrogen atmosphere containing water vapor at a temperature of about 1000 ° C. for 1 hour to remove organic components, and then in a reducing atmosphere at a temperature of about 1600 ° C. for 1 hour. A ceramic sintered body for evaluation was produced by firing.

This ceramic sintered body was observed for cross section (cross section) to investigate the occurrence of delamination between the ceramic layers and the conductor layers. The evaluation results of delamination are shown in Table 1.

  In the column of delamination in Table 1, “◯” indicates that delamination was not observed inside the ceramic sintered body and was excellent. Further, “x” indicates that delamination was observed inside the ceramic sintered body.

  From Table 1, the sample No. in which the amount of organic component contained in the first ceramic green sheet is less than 10 parts by mass with respect to 100 parts by mass of the inorganic component. In No. 1, delamination occurred entirely within the sintered body.

  In addition, Sample No. in which the amount of the organic component contained in the first ceramic green sheet is more than 50 parts by mass with respect to 100 parts by mass of the inorganic component. 9 and 10 were also partially delaminated inside the sintered body. There was no specific trend in the place of delamination.

  On the other hand, Sample No. in which the amount of the molten component contained in the ceramic green sheet is 50 to 100 parts by mass with respect to 100 parts by mass of the first binder. Nos. 2 to 8 were excellent with no delamination.

(A)-(d) is sectional drawing for every process which shows an example of embodiment of the manufacturing method of the electronic component of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support body 2 ... 1st ceramic green sheet layer 3 ... 2nd ceramic green sheet layer 4 ... Ceramic green sheet 5 ... Conductive layer 6 ... Ceramic green sheet laminated body

Claims (2)

Forming a first ceramic green sheet layer including an inorganic powder, a first binder, and a molten component; and a second ceramic including an inorganic powder and a second binder on the first ceramic green sheet layer. A step of forming a green sheet layer to form a ceramic green sheet; a step of forming a conductor layer on the second ceramic green sheet layer of the ceramic green sheet; and the ceramic green sheet having the conductor layer formed thereon A step of producing a ceramic green sheet laminate by laminating a plurality of layers and heating, and a step of firing the ceramic green sheet laminate, comprising the first binder and the molten component. The amount of the organic component of the first ceramic green sheet layer is the amount of the first ceramic green sheet. Method of manufacturing an electronic component, which is a 10 to 50 parts by weight relative to the inorganic powder 100 parts by weight contained in Nshito layer. The method for manufacturing an electronic component according to claim 1, wherein the melting component has a melting point of 35 to 100 ° C.

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