CN1269692A - 等离子体源 - Google Patents
等离子体源 Download PDFInfo
- Publication number
- CN1269692A CN1269692A CN00104533A CN00104533A CN1269692A CN 1269692 A CN1269692 A CN 1269692A CN 00104533 A CN00104533 A CN 00104533A CN 00104533 A CN00104533 A CN 00104533A CN 1269692 A CN1269692 A CN 1269692A
- Authority
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- China
- Prior art keywords
- plasma
- plasma source
- chamber container
- magnetic
- emission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 230000005291 magnetic effect Effects 0.000 claims description 32
- 238000006386 neutralization reaction Methods 0.000 claims description 7
- 230000008676 import Effects 0.000 claims description 5
- 238000005468 ion implantation Methods 0.000 claims description 2
- 238000010884 ion-beam technique Methods 0.000 abstract description 22
- 238000007600 charging Methods 0.000 abstract description 8
- 239000011810 insulating material Substances 0.000 abstract 1
- 210000002381 plasma Anatomy 0.000 description 114
- 239000007789 gas Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32678—Electron cyclotron resonance
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02502499A JP3608416B2 (ja) | 1999-02-02 | 1999-02-02 | プラズマ源 |
JP25024/1999 | 1999-02-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1269692A true CN1269692A (zh) | 2000-10-11 |
CN1191741C CN1191741C (zh) | 2005-03-02 |
Family
ID=12154356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001045334A Expired - Fee Related CN1191741C (zh) | 1999-02-02 | 2000-02-02 | 等离子体源及使用该等离子体源的离子注入装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6297594B1 (zh) |
JP (1) | JP3608416B2 (zh) |
KR (1) | KR100582787B1 (zh) |
CN (1) | CN1191741C (zh) |
GB (1) | GB2348738B (zh) |
TW (1) | TW463533B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1969365B (zh) * | 2004-05-25 | 2011-02-09 | 松下电器产业株式会社 | 电荷中和装置 |
CN1845292B (zh) * | 2006-04-30 | 2011-07-20 | 哈尔滨工业大学 | 磁场辅助的自辉光等离子体离子注入装置 |
CN102612863A (zh) * | 2009-08-24 | 2012-07-25 | 韩国基础科学研究院 | 产生等离子体的微波天线 |
CN101742809B (zh) * | 2008-11-21 | 2012-10-10 | 日新离子机器株式会社 | 等离子体生成设备 |
CN106816353A (zh) * | 2015-12-02 | 2017-06-09 | 中国科学院深圳先进技术研究院 | 等离子体源单元、等离子体源装置及其应用 |
CN108231514A (zh) * | 2016-12-15 | 2018-06-29 | 台湾积体电路制造股份有限公司 | 离子植入机以及将离子植入半导体衬底中的方法 |
CN109681399A (zh) * | 2018-12-12 | 2019-04-26 | 上海航天控制技术研究所 | 一种小直径高效微波ecr中和器 |
CN111149438A (zh) * | 2017-11-24 | 2020-05-12 | 国立研究开发法人宇宙航空研究开发机构 | 微波等离子体源 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6703628B2 (en) | 2000-07-25 | 2004-03-09 | Axceliss Technologies, Inc | Method and system for ion beam containment in an ion beam guide |
US6414329B1 (en) | 2000-07-25 | 2002-07-02 | Axcelis Technologies, Inc. | Method and system for microwave excitation of plasma in an ion beam guide |
US6545419B2 (en) * | 2001-03-07 | 2003-04-08 | Advanced Technology Materials, Inc. | Double chamber ion implantation system |
JP3758520B2 (ja) * | 2001-04-26 | 2006-03-22 | 日新イオン機器株式会社 | イオンビーム照射装置および関連の方法 |
JP2003173757A (ja) * | 2001-12-04 | 2003-06-20 | Nissin Electric Co Ltd | イオンビーム照射装置 |
KR20030057178A (ko) * | 2001-12-28 | 2003-07-04 | 동부전자 주식회사 | 마이크로웨이브를 이용한 이온중성화 장치 |
US6837937B2 (en) * | 2002-08-27 | 2005-01-04 | Hitachi High-Technologies Corporation | Plasma processing apparatus |
KR100497192B1 (ko) * | 2002-12-05 | 2005-06-28 | 동부아남반도체 주식회사 | 이온주입장비의 플라즈마 플러드 건 |
US6891174B2 (en) * | 2003-07-31 | 2005-05-10 | Axcelis Technologies, Inc. | Method and system for ion beam containment using photoelectrons in an ion beam guide |
US8179050B2 (en) * | 2005-06-23 | 2012-05-15 | The Regents Of The University Of California | Helicon plasma source with permanent magnets |
DE102006037144B4 (de) * | 2006-08-09 | 2010-05-20 | Roth & Rau Ag | ECR-Plasmaquelle |
JP4001185B1 (ja) | 2007-03-06 | 2007-10-31 | 日新イオン機器株式会社 | プラズマ発生装置 |
WO2011025143A2 (ko) * | 2009-08-24 | 2011-03-03 | 한국기초과학지원연구원 | 플라즈마 발생용 마이크로웨이브 안테나 |
KR101307111B1 (ko) * | 2010-08-24 | 2013-09-11 | 닛신 이온기기 가부시기가이샤 | 플라즈마 발생 장치 |
WO2013071110A1 (en) * | 2011-11-09 | 2013-05-16 | E/G Electrograph Inc. | Magnetic field reduction apparatus and magnetic plasma flood system for ion beam processing |
RU2548005C2 (ru) * | 2013-06-27 | 2015-04-10 | Открытое акционерное общество "НИИЭФА им. Д.В. Ефремова" (ОАО "НИИЭФА") | Плазменный источник проникающего излучения |
WO2015114992A1 (ja) * | 2014-01-30 | 2015-08-06 | ノベリオン システムズ株式会社 | プラズマ発生装置 |
RU2578192C2 (ru) * | 2014-10-06 | 2016-03-27 | Геннадий Леонидович Багич | Способ излучения энергии и устройство для его осуществления (плазменный излучатель) |
RU2639140C2 (ru) * | 2016-06-14 | 2017-12-20 | Геннадий Леонидович Багич | Плазмотрон, излучатель и способ изготовления излучателя |
US11037765B2 (en) * | 2018-07-03 | 2021-06-15 | Tokyo Electron Limited | Resonant structure for electron cyclotron resonant (ECR) plasma ionization |
RU2686099C1 (ru) * | 2018-07-30 | 2019-04-24 | Акционерное общество "Концерн воздушно-космической обороны "Алмаз - Антей" | Способ генерации проникающего излучения |
KR102318915B1 (ko) * | 2020-01-17 | 2021-10-28 | 심승술 | Ecr 플라즈마 발생기 및 이를 포함하는 중성입자 생성장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4727293A (en) * | 1984-08-16 | 1988-02-23 | Board Of Trustees Operating Michigan State University | Plasma generating apparatus using magnets and method |
US4788473A (en) * | 1986-06-20 | 1988-11-29 | Fujitsu Limited | Plasma generating device with stepped waveguide transition |
JP2587924B2 (ja) | 1986-10-11 | 1997-03-05 | 日本電信電話株式会社 | 薄膜形成装置 |
JP2631650B2 (ja) * | 1986-12-05 | 1997-07-16 | アネルバ株式会社 | 真空装置 |
US4911814A (en) * | 1988-02-08 | 1990-03-27 | Nippon Telegraph And Telephone Corporation | Thin film forming apparatus and ion source utilizing sputtering with microwave plasma |
US5107170A (en) * | 1988-10-18 | 1992-04-21 | Nissin Electric Co., Ltd. | Ion source having auxillary ion chamber |
JP2881881B2 (ja) * | 1989-12-22 | 1999-04-12 | 日新電機株式会社 | 電子シャワー |
ES2078735T3 (es) * | 1991-05-21 | 1995-12-16 | Materials Research Corp | Modulo de grabado suave mediante util de agrupacion y generador de plasma ecr para el mismo. |
JPH0547338A (ja) | 1991-08-16 | 1993-02-26 | Nissin Electric Co Ltd | イオンビーム中性化装置 |
JPH05234562A (ja) * | 1992-02-21 | 1993-09-10 | Hitachi Ltd | イオンビーム中性化装置 |
JP3054302B2 (ja) | 1992-12-02 | 2000-06-19 | アプライド マテリアルズ インコーポレイテッド | イオン注入中の半導体ウェハにおける帯電を低減するプラズマ放出システム |
TW249313B (zh) * | 1993-03-06 | 1995-06-11 | Tokyo Electron Co | |
US5430355A (en) * | 1993-07-30 | 1995-07-04 | Texas Instruments Incorporated | RF induction plasma source for plasma processing |
US5545257A (en) | 1994-06-13 | 1996-08-13 | Electro-Graph, Inc. | Magnetic filter apparatus and method for generating cold plasma in semicoductor processing |
-
1999
- 1999-02-02 JP JP02502499A patent/JP3608416B2/ja not_active Expired - Lifetime
-
2000
- 2000-02-01 US US09/495,455 patent/US6297594B1/en not_active Expired - Lifetime
- 2000-02-01 TW TW089101713A patent/TW463533B/zh not_active IP Right Cessation
- 2000-02-01 KR KR1020000004798A patent/KR100582787B1/ko not_active IP Right Cessation
- 2000-02-02 GB GB0002297A patent/GB2348738B/en not_active Expired - Fee Related
- 2000-02-02 CN CNB001045334A patent/CN1191741C/zh not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1969365B (zh) * | 2004-05-25 | 2011-02-09 | 松下电器产业株式会社 | 电荷中和装置 |
CN1845292B (zh) * | 2006-04-30 | 2011-07-20 | 哈尔滨工业大学 | 磁场辅助的自辉光等离子体离子注入装置 |
CN101742809B (zh) * | 2008-11-21 | 2012-10-10 | 日新离子机器株式会社 | 等离子体生成设备 |
CN102612863A (zh) * | 2009-08-24 | 2012-07-25 | 韩国基础科学研究院 | 产生等离子体的微波天线 |
CN102612863B (zh) * | 2009-08-24 | 2014-11-19 | 韩国基础科学研究院 | 产生等离子体的微波天线 |
CN106816353A (zh) * | 2015-12-02 | 2017-06-09 | 中国科学院深圳先进技术研究院 | 等离子体源单元、等离子体源装置及其应用 |
CN106816353B (zh) * | 2015-12-02 | 2018-08-31 | 中国科学院深圳先进技术研究院 | 等离子体源单元、等离子体源装置及其应用 |
CN108231514A (zh) * | 2016-12-15 | 2018-06-29 | 台湾积体电路制造股份有限公司 | 离子植入机以及将离子植入半导体衬底中的方法 |
CN108231514B (zh) * | 2016-12-15 | 2021-12-03 | 台湾积体电路制造股份有限公司 | 离子植入机以及将离子植入半导体衬底中的方法 |
CN111149438A (zh) * | 2017-11-24 | 2020-05-12 | 国立研究开发法人宇宙航空研究开发机构 | 微波等离子体源 |
CN111149438B (zh) * | 2017-11-24 | 2022-03-18 | 国立研究开发法人宇宙航空研究开发机构 | 微波等离子体源 |
CN109681399A (zh) * | 2018-12-12 | 2019-04-26 | 上海航天控制技术研究所 | 一种小直径高效微波ecr中和器 |
Also Published As
Publication number | Publication date |
---|---|
US6297594B1 (en) | 2001-10-02 |
JP2000223299A (ja) | 2000-08-11 |
GB0002297D0 (en) | 2000-03-22 |
GB2348738B (en) | 2003-10-15 |
TW463533B (en) | 2001-11-11 |
GB2348738A (en) | 2000-10-11 |
JP3608416B2 (ja) | 2005-01-12 |
KR100582787B1 (ko) | 2006-05-24 |
CN1191741C (zh) | 2005-03-02 |
KR20010014462A (ko) | 2001-02-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NISHIN MOTORS CO LTD Free format text: FORMER OWNER: NISHIN DENKI CO., LTD. Effective date: 20060421 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20060421 Address after: Kyoto Japan Patentee after: Nishin Ion Equipment Co., Ltd. Address before: Kyoto Japan Patentee before: Nissin Electric Co., Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: NISSIN ION EQUIPMENT CO LTD Free format text: FORMER NAME OR ADDRESS: NISHIN MOTORS CO LTD |
|
CP01 | Change in the name or title of a patent holder |
Patentee after: Nissin Ion Equipment Co., Ltd. Patentee before: Nishin Ion Equipment Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050302 Termination date: 20140202 |