CN1267273C - 导电复合材料 - Google Patents
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Abstract
一种导电多层复合物,它包括第一层和第二层聚合物膜,两层膜都具柔韧性,都有上下表面,其中第二层膜在不低于其玻璃化转变温度的温度下可加热成形。在第一层膜的上表面施加柔韧的导电层,并通过胶粘剂中间层将第一层膜的下表面粘附到第二层膜的上表面上。所述胶粘剂中间层具有弹性,在复合材料发生弯曲时,足以适应按上述方法粘附在一起的两个膜之间的相对运动。
Description
可作交叉参考的相关申请
本发明要求美国专利申请10/017490(提交于2001年12月14日)和临时专利申请60/311187(提交于2001年8月9日)的优先权,这两份专利在此整体参考引用。
技术领域
本发明涉及用于制造EMI/RFI屏蔽垫等部件的导电材料。
背景技术
用金属合金,如金属磷酸盐和铍铜制造EMI/RFI屏蔽垫是众所周知的方法,铍铜合金更是广为应用。这些合金比较昂贵。不仅如此,据职业安全与健康管理委员会(Occupational Safty and Health Administration)于1999年9月2日出版的《危险信息公报》报道,接触铍据称会导致慢性铍疾病(CBD),这种疾病危害肺功能,并且常常致命。因此很有可能发生的情况是,使用含铍的合金即便不被禁止,也将最终受到严格限制。
将金属箔粘合到聚合物基底上,形成复合物,再由此复合物制造EMI/RFI垫,也是已知的方法。尽管这些复合物比上述金属合金便宜,但经验表明,在形成垫的过程中,或者在随后对垫进行反复挠曲的过程中,金属箔容易发生褶皱、开裂,或者从聚合物基底上脱落。
本发明的目标是提供一种改进的导电复合材料,克服现有复合物的缺陷,与金属合金相比不贵,易于形成垫和其他类似的EMI/RFI屏蔽部件。
发明内容
根据本发明,先形成第一层和第二层聚合物膜,两层膜都具柔韧性,都有上下表面,其中第二层膜在不低于其玻璃转变温度的温度下可加热成形。再在第一层膜的上表面上施加柔韧的导电层,通过胶粘剂中间层将第一层膜的下表面粘附到第二层膜的上表面上。所述胶粘剂中间层具有弹性,在此复合材料发生弯曲时,足以适应按上述方法粘附在一起的两个膜之间的相对运动。在复合材料发生弯曲时,上述第一层和第二层膜之间的相对运动能够保护导电层不发生褶皱、开裂或从第一层膜的上表面上脱落。
除了可加热成形外,所述第二层膜还可以具有回弹性。所述复合物可再含几层膜,并且可以在与施加了第一导电层的表面相背的面上施加第二个弹性导电层。
本发明另一方面还涉及制备成形的导电部件的方法,它包括:
a)用下述方法制备导电多层复合物:
i)提供第一层和第二层聚合物膜,两层膜都具柔韧性,都有上下表面,其中第二层膜在不低于其玻璃转变温度的温度下可加热成形;
ii)在所述第一层膜的上表面施加一柔韧的导电层;
iii)通过胶粘剂中间层将第一层膜的下表面粘附到第二层膜的上表面上,所述胶粘剂中间层具有弹性,在复合材料发生弯曲时,足以适应按上述方法粘附在一起的两个膜之间的相对运动;
b)将所述复合物加热到至少所述第二层膜的玻璃转变温度的温度;
c)对加热的复合物进行成形成为一选定的形状;
d)冷却所得成形的复合物至低于上述升到的温度以下。
现在将结合附图叙述本发明的上述及其他特征和目标。
附图说明
图1是本发明导电多层复合物一个实例的截面图,不言而喻,此图经过了很大的放大,即为了便于说明,对各部件相对尺寸作了夸大。
图2是图1所示复合物的分解图。
图3所示为该复合物经热成形后,形成弯曲构形的情况。
图4是图3中圈出部分的放大图。
图5是其外形与基底形状相一致的复合物的示意图。
图6所示为具有回弹力的复合物连接两个彼此隔开的可移动部件。
图7所示为两面都加有导电层的另一个复合物实例。
图8所示为测定本发明复合物性能的测试过程。
具体实施方式
图1和图2所示本发明导电多层复合物的实例记作10。所述复合物包含第一层和第二层柔韧性聚合物膜12、14。膜12有上下表面12a和12b,膜14有上下表面14a和14b。膜14在不低于其玻璃转变温度的温度下可加热成形。
将柔韧的导电层16施加到膜12的上表面12a上,用一胶粘剂中间层18将膜12的下表面12b粘附到膜14的上表面14a上。
导电层16选自铜、铝、镍、锡、银、金、黑色金属及其合金。所述导电层以箔的形式可以借助胶粘剂(未示出)粘附到膜12的上表面12a上,或者它也可以包含通过已知技术施涂的涂层,所述技术如电镀、非电极沉积、真空沉积、等离子体沉积、溅射沉积等。所有情况下,层16宜较薄,厚度不宜超过0.508毫米(20密耳),而且要牢牢地固定在上膜表面12a上。膜12对导电层16起支撑和稳定作用,因此可以阻止导电层发生褶皱、开裂或从膜表面12a上脱落。
膜12、14的聚合材料可选自聚酯、聚酰胺、聚亚酰胺、聚氨酯、聚乙烯砜、聚丁烯及衍生物,聚碳酸酯、聚苯乙烯(及包含苯乙烯的共聚物)、聚乙烯(线形)、聚乙基乙烯酮、聚丙烯酸酯(包括甲基丙烯酸酯)、刚性PVC(及其共聚物)。膜14的体积弹性模量宜高于膜12。
夹层18的胶粘剂具有压敏性,商品例子有V-402、V-23、V-106、V-95、V-98、V-156和Densil,它们全都可以购自FLEXcon,Inc.,Spencer,Massachusetts,U.S.A。这些胶粘剂在-50-150℃的温度下表现出弹性。
复合物10可以加热到等于或高于膜14的玻璃转变温度的高温下,然后弯曲并形成(例如)图3中10’所示的构形,接着冷却到低于膜14的玻璃转变温度的温度下,以保持形成的构形。由于成形而使复合物发生的弯曲会引起膜12和14的相对位移,这反映在图4所示边缘偏移量“x”上。胶粘剂中间层18的弹性足以适应两层膜之间的相对移动,无论是在开始的成形过程中还是在随后对复合物反复弯曲成形的过程中,其结果是,固定在膜12的上表面12a上的导电层16受到的应力达到最小。
复合物10可以加热形成各种形状。例如,如图5所示,可以使复合物形成手机外壳20那样的基底形状,从而起到为用户屏蔽手机产生的RFI的作用。
如图6所示,当第二层膜14由同时具有热成形性和回弹性的聚合物(例如聚酯)组成时,复合物10’可以用作EMI/RFI屏蔽垫,在部件22和24的间隙中起桥梁作用,其中部件22和24可彼此拉近拉远。垫通过弹性弯曲对部件22和24的相对移动作出响应,此时胶粘剂中间层18的弹性再次适应了第一层和第二层膜12和14之间的相对移动。
在图7所示另一个实施方式中,可在第三层膜28上加第二个导电层26,这第三层膜可通过第二个胶粘剂中间层30粘附到第二层膜14的下表面14b上,第二个胶粘剂中间层30也具有足够弹性,以适应复合物在用于(例如)开关等时发生弯曲引起的第二层和第三层膜之间的相对移动。
实施例1
导电多层复合物的制备方法是:先用热固性胶粘剂(ITW PerformancePolymers,Riviera Beach,Florida销售部提供的Devcon 5minute Epoxy)将0.01778毫米(0.7密耳)铜箔粘附到0.0254毫米(1.0密耳)厚的“第一层”聚酯膜上表面,然后用压敏胶粘剂(FLEXcon V-402)将第一层膜的下表面粘附到0.1016毫米(4.0密耳)厚的“第二层”聚酯膜上表面上。
接着加热所得复合物,形成图3和6所示半圆形截面10’,内径1.905厘米(0.75英寸),具体方法是将复合物围绕紧贴加热到121.1℃(250°F)的圆柱形支撑体上,保持此状态60秒,这样来进行弯曲,然后冷却到室温。
如图8所示,接下来将这样形成的复合物10’支撑在一平面S上,反复弯曲到接近平坦状态,如10’中虚线所示。通过反复施加和撤去向下的力,且间隔1秒钟,进行循环弯曲。循环100次后,铜箔保持光滑,仍牢牢地粘附在下面的膜上,而且没有褶皱或开裂的迹象。
实施例2
在0.0254毫米(1.0密耳)厚的第一层聚酯膜的上表面上真空沉积一层1.5-2.0微米厚的铝,用压敏胶粘剂(FLEXcon V-402)将第一层膜的下表面粘附到0.1016毫米(4.0密耳)厚的“第二层”聚酯膜上表面。然后按照实施例1所述程序,将所得复合物加热成形,并进行测试。100次循环测试之后,铝保持光滑,牢牢地粘附在下面的膜上,而且没有褶皱或开裂的迹象。
比较例1
用热固性胶粘剂将0.01778毫米(0.7密耳)铜箔粘附到0.1016毫米(4.0密耳)厚的聚酯膜上表面。热固性胶粘剂、铜箔和膜与实施例1所采用的相同。然后对所得复合物进行加热成形,并进行循环测试,过程也跟实施例1所述相同。循环测试仅仅5次之后,铜箔即出现严重开裂。
比较例2
用压敏胶粘剂(V-402)代替热固性胶粘剂制备比较例1中的复合物。对所得复合物进行加热成形,并进行循环测试,过程也跟实施例1所述相同。循环测试仅仅2次之后,铜箔即出现裂缝和“剥离”(从下面的膜上脱开),循环测试约20次之后,不断出现的裂缝导致箔开始裂开。
比较例3
在涂敷了硅树脂的聚酯载体膜表面上真空沉积1.5-2.0微米厚的铝。然后将沉积铝从载体膜上转移到0.1016毫米(4.0密耳)聚酯膜表面,并用压敏胶粘剂(FLEXcon V-402)粘好。按照实施例1所述程序,对复合物进行加热成形和测试。循环测试10次之后,观察到金属开裂。
从以上所述可以看出,在金属层16和载体膜14之间嵌入膜12和胶粘剂中间层18,再加上胶粘剂中间层的弹性,有利于稳定和保护金属层免受复合物反复弯曲引起的损伤。
Claims (15)
1.导电多层复合物,它包括:
第一层和第二层聚合物膜,两层膜都具柔韧性,都有上下表面,其中第二层膜在不低于其玻璃转变温度的温度下可加热成形;
在第一层膜的上表面施加柔韧的导电层;
通过胶粘剂中间层将第一层膜的下表面粘附到第二层膜的上表面上,所述复合物在高于所述第二层膜的玻璃转变温度的温度下可加热成形,所述胶粘剂中间层具有弹性,在复合材料发生加热成形和弯曲时,足以适应按上述方法粘附在一起的两个膜之间的相对运动。
2.权利要求1所述的复合物,其特征在于所述第二层膜具有回弹性。
3.权利要求2所述的复合物,其特征在于所述胶粘剂中间层在-50°-150℃的温度呈现弹性。
4.权利要求1或2所述的复合物,其特征在于所述导电层是层金属箔,所述金属箔通过第二种胶粘剂粘附在所述第一层膜的上表面。
5.权利要求1或2所述的复合物,其特征在于所述胶粘剂中间层具有压敏性。
6.权利要求2所述的复合物,其特征在于所述第二层膜的体积弹性模量高于所述第一层膜。
7.权利要求1或2所述的复合物,其特征在于它还包括第三层柔韧性聚合物膜,所述膜通过第二胶粘剂中间层粘附在所述第二层膜的下表面。
8.权利要求2或7所述的复合物,其特征在于它还包括第二柔韧性导电层,所述导电层加在所述复合物的与加有所述第一导电层的表面相背的面上。
9.权利要求1或2所述的复合物,其特征在于导电层选自铜、铝、镍、锡、银、金、黑色金属及其合金。
10.权利要求1或2所述的复合物,其特征在于所述导电层的厚度不超过0.508毫米。
11.权利要求1或2所述的复合物,其特征在于所述第一层和第二层膜的聚合物材料选自聚酯、聚酰胺、聚亚酰胺、聚氨酯、聚乙烯砜、聚丁烯及衍生物,聚碳酸酯、聚苯乙烯及包含苯乙烯的共聚物、线形聚乙烯、聚乙基乙烯酮、聚丙烯酸酯、刚性PVC及其共聚物。
12.权利要求1或2所述的复合物,其特征在于所述导电层与所述第一层膜的上表面通过界面固定。
13.权利要求1或2所述的复合物,其特征在于所述第一层和第二层膜的聚合物材料选自甲基丙烯酸酯。
14.制备成形的导电部件的方法,它包括:
a)用下述方法制备导电多层复合物:
i)提供第一层和第二层聚合物膜,两层膜都具柔韧性,都有上下表面,其中第二层膜在不低于其玻璃转变温度的温度下可加热成形;
ii)在所述第一层膜的上表面施加一柔韧的导电层;
iii)通过胶粘剂中间层将第一层膜的下表面粘附到第二层膜的上表面上,所述胶粘剂中间层具有弹性,在复合材料发生弯曲时,足以适应按上述方法粘附在一起的两个膜之间的相对运动;
b)将所述复合物加热到至少所述第二层膜的玻璃转变温度的温度;
c)对加热的复合物进行成形成为一选定的形状;
d)冷却所得成形的复合物至低于上述升到的温度以下。
15.权利要求13或14所述的方法,其特征在于所述第二层膜具有柔韧性。
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US10/017,490 US6717057B1 (en) | 2001-08-09 | 2001-12-14 | Conductive composite formed of a thermoset material |
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CN104521331B (zh) * | 2012-08-07 | 2017-06-23 | 苹果公司 | 柔性显示器 |
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ATE337907T1 (de) | 2006-09-15 |
US6717057B1 (en) | 2004-04-06 |
CN1538910A (zh) | 2004-10-20 |
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TW548185B (en) | 2003-08-21 |
JP4202913B2 (ja) | 2008-12-24 |
DE60214395D1 (de) | 2006-10-12 |
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