CN1262158C - 印刷电路板和印刷电路板的修复方法 - Google Patents

印刷电路板和印刷电路板的修复方法 Download PDF

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Publication number
CN1262158C
CN1262158C CNB031107621A CN03110762A CN1262158C CN 1262158 C CN1262158 C CN 1262158C CN B031107621 A CNB031107621 A CN B031107621A CN 03110762 A CN03110762 A CN 03110762A CN 1262158 C CN1262158 C CN 1262158C
Authority
CN
China
Prior art keywords
printed circuit
circuit board
pcb
scolding tin
installation portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031107621A
Other languages
English (en)
Chinese (zh)
Other versions
CN1452449A (zh
Inventor
池田幸仁
永平让二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN1452449A publication Critical patent/CN1452449A/zh
Application granted granted Critical
Publication of CN1262158C publication Critical patent/CN1262158C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
CNB031107621A 2002-04-16 2003-04-15 印刷电路板和印刷电路板的修复方法 Expired - Fee Related CN1262158C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP112900/2002 2002-04-16
JP2002112900 2002-04-16
JP068114/2003 2003-03-13
JP2003068114A JP2004006709A (ja) 2002-04-16 2003-03-13 プリント回路板及びプリント回路板の修復方法

Publications (2)

Publication Number Publication Date
CN1452449A CN1452449A (zh) 2003-10-29
CN1262158C true CN1262158C (zh) 2006-06-28

Family

ID=28677642

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031107621A Expired - Fee Related CN1262158C (zh) 2002-04-16 2003-04-15 印刷电路板和印刷电路板的修复方法

Country Status (4)

Country Link
US (1) US20030192938A1 (enExample)
EP (1) EP1355521A3 (enExample)
JP (1) JP2004006709A (enExample)
CN (1) CN1262158C (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5153361B2 (ja) * 2008-01-29 2013-02-27 京セラ株式会社 太陽電池モジュールの修復方法
CN104684267A (zh) * 2015-03-25 2015-06-03 竞陆电子(昆山)有限公司 内层线路开路缺口补线结构
CN107450012A (zh) * 2017-08-10 2017-12-08 薛雪东 一种电路板维修鉴定系统
CN111331321A (zh) * 2020-03-19 2020-06-26 重庆西南铝机电设备工程有限公司 一种铝合金疲劳试样机械加工工艺
US20240110057A1 (en) * 2023-07-12 2024-04-04 Dmitriy Khrustalev Biodegradable Composite Material for Electronic Devices and Electrical Engineering

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4177916A (en) * 1977-12-08 1979-12-11 Hughes Aircraft Company Soldering method and solder joint
US4454585A (en) * 1981-05-28 1984-06-12 Ele John H Printed wiring board inspection, work logging and information system
JPH04320091A (ja) * 1991-04-18 1992-11-10 Matsushita Electric Ind Co Ltd 電子部品修正方法
US5657075A (en) * 1993-02-05 1997-08-12 Teradyne, Inc. Method and apparatus for locating and facilitating the repair of defects on a printed circuit board
US5821627A (en) * 1993-03-11 1998-10-13 Kabushiki Kaisha Toshiba Electronic circuit device
US5392980A (en) * 1993-12-29 1995-02-28 Dell Usa, L.P. Method and apparatus for reworking ball grid array packages to allow reuse of functional devices
US5539652A (en) * 1995-02-07 1996-07-23 Hewlett-Packard Company Method for manufacturing test simulation in electronic circuit design
JPH1034122A (ja) * 1996-07-25 1998-02-10 Fuji Xerox Co Ltd 商品リサイクルシステムにおける部品選別方法
US7047635B2 (en) * 2000-03-15 2006-05-23 Matsushita Electric Industrial Co., Ltd. Connecting material and connecting method
US6570029B2 (en) * 2000-03-29 2003-05-27 Georgia Tech Research Corp. No-flow reworkable epoxy underfills for flip-chip applications
US6663399B2 (en) * 2001-01-31 2003-12-16 High Connection Density, Inc. Surface mount attachable land grid array connector and method of forming same
US7107661B2 (en) * 2001-12-18 2006-09-19 Denso Corporation Method of recycling printed circuit board

Also Published As

Publication number Publication date
CN1452449A (zh) 2003-10-29
US20030192938A1 (en) 2003-10-16
EP1355521A2 (en) 2003-10-22
JP2004006709A (ja) 2004-01-08
EP1355521A3 (en) 2004-12-15

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060628

Termination date: 20190415

CF01 Termination of patent right due to non-payment of annual fee