CN1258825C - 功率型半导体固体照明光源及其封装制备方法 - Google Patents
功率型半导体固体照明光源及其封装制备方法 Download PDFInfo
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- CN1258825C CN1258825C CNB2003101121700A CN200310112170A CN1258825C CN 1258825 C CN1258825 C CN 1258825C CN B2003101121700 A CNB2003101121700 A CN B2003101121700A CN 200310112170 A CN200310112170 A CN 200310112170A CN 1258825 C CN1258825 C CN 1258825C
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 239000007787 solid Substances 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000000654 additive Substances 0.000 claims abstract description 8
- 230000000996 additive effect Effects 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 230000004907 flux Effects 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010453 quartz Substances 0.000 abstract description 2
- 238000004020 luminiscence type Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 9
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003708 ampul Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101121700A CN1258825C (zh) | 2003-11-18 | 2003-11-18 | 功率型半导体固体照明光源及其封装制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101121700A CN1258825C (zh) | 2003-11-18 | 2003-11-18 | 功率型半导体固体照明光源及其封装制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1545146A CN1545146A (zh) | 2004-11-10 |
CN1258825C true CN1258825C (zh) | 2006-06-07 |
Family
ID=34336421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101121700A Expired - Fee Related CN1258825C (zh) | 2003-11-18 | 2003-11-18 | 功率型半导体固体照明光源及其封装制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN1258825C (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005019375A1 (de) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | LED-Array |
CN101079460B (zh) * | 2006-05-23 | 2010-05-12 | 台达电子工业股份有限公司 | 发光装置 |
CN101079461B (zh) * | 2006-05-23 | 2010-05-12 | 台达电子工业股份有限公司 | 发光装置 |
CN101197402B (zh) * | 2006-12-08 | 2010-09-29 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管 |
CN101436638B (zh) * | 2008-12-16 | 2010-06-02 | 王海军 | 大功率led封装结构 |
CN101621106B (zh) * | 2009-07-30 | 2012-05-16 | 中国计量学院 | 具有增透效应薄膜的发光二极管及其制备方法 |
CN105874265B (zh) * | 2013-12-17 | 2019-06-18 | 亮锐控股有限公司 | 低和高光束led灯 |
CN108321149B (zh) * | 2017-01-18 | 2022-08-26 | 惠州科锐半导体照明有限公司 | 发光二极管封装件与发光二极管显示器 |
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2003
- 2003-11-18 CN CNB2003101121700A patent/CN1258825C/zh not_active Expired - Fee Related
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Publication number | Publication date |
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CN1545146A (zh) | 2004-11-10 |
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Owner name: SHENZHEN CITY ZHONGDIAN MIAOHAO SOLID LIGHTING CO Free format text: FORMER OWNER: MIAOHAN HIGH AND NEW TECH DEVELOPMENT CO., LTD., SHENZHEN CITY Effective date: 20080111 |
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Owner name: CHANGZHI HONGYUAN TECHNOLOGY SOLID STATE DISPLAY C Free format text: FORMER OWNER: SHENZHEN ZHONGDIAN MIAOHAO SOLID LIGHT SOURCE CO., LTD. Effective date: 20120214 |
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