CN1251256A - 一种制造电气部件的装置的测量方法和装置 - Google Patents
一种制造电气部件的装置的测量方法和装置 Download PDFInfo
- Publication number
- CN1251256A CN1251256A CN98803500A CN98803500A CN1251256A CN 1251256 A CN1251256 A CN 1251256A CN 98803500 A CN98803500 A CN 98803500A CN 98803500 A CN98803500 A CN 98803500A CN 1251256 A CN1251256 A CN 1251256A
- Authority
- CN
- China
- Prior art keywords
- reference marker
- emulation part
- breadboard
- plug
- emulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 20
- 238000005259 measurement Methods 0.000 claims abstract description 10
- 239000003550 marker Substances 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 8
- 230000014509 gene expression Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 7
- 238000012937 correction Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 229910052500 inorganic mineral Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011707 mineral Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract description 4
- 239000002313 adhesive film Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19711476.8 | 1997-03-19 | ||
DE19711476A DE19711476A1 (de) | 1997-03-19 | 1997-03-19 | Verfahren und Vorrichtung zum Vermessen einer Einrichtung zur Herstellung von elektrischen Baugruppen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1251256A true CN1251256A (zh) | 2000-04-19 |
CN1189072C CN1189072C (zh) | 2005-02-09 |
Family
ID=7823915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB988035006A Expired - Fee Related CN1189072C (zh) | 1997-03-19 | 1998-03-19 | 插装印刷电路板的装置的测量方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6683688B1 (zh) |
EP (1) | EP0968637B1 (zh) |
JP (1) | JP2001516503A (zh) |
KR (1) | KR100548672B1 (zh) |
CN (1) | CN1189072C (zh) |
DE (2) | DE19711476A1 (zh) |
WO (1) | WO1998042171A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110268816A (zh) * | 2017-02-14 | 2019-09-20 | 株式会社富士 | 测定装置、测定方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU7370998A (en) * | 1998-05-06 | 1999-11-23 | Genrad, Inc. | Local-coordinate-based component-position verification |
DE19839999C1 (de) * | 1998-09-02 | 2000-05-04 | Siemens Ag | Verfahren und Vorrichtung zum Kalibrieren eines Verfahrwegs und/oder einer Winkellage einer Haltevorrichtung in einer Einrichtung zur Herstellung von elektrischen Baugruppen sowie Kalibriersubstrat |
DE10300518B4 (de) * | 2003-01-09 | 2005-06-23 | Siemens Ag | Vorrichtung zum Bestücken von Substraten mit Bauelementen und Verfahren zum Kalibrieren einer solchen Vorrichtung |
DE102004013222A1 (de) * | 2004-03-17 | 2005-10-13 | Siemens Ag | Kontrolleinrichtung und Verfahren zum Überprüfen von optischen Abtastvorrichtungen für Werkstücke in einer Montageeinrichtung für elektrische Baugruppen |
IL174186A0 (en) * | 2006-03-08 | 2006-08-01 | Expert Dynamics Ltd | Reliability simulation method and system |
DE102006033685B4 (de) * | 2006-07-20 | 2011-12-22 | Asm Assembly Systems Gmbh & Co. Kg | Bestimmung der Orientierung einer Kamera relativ zu einer Referenzebene |
DE102008046739B3 (de) * | 2008-09-11 | 2010-04-22 | Siemens Electronics Assembly Systems Gmbh & Co. Kg | Pipette, Anordnung zum Kalibrieren einer wechselbaren Komponente, Positioniersystem, Bestückautomat sowie Messverfahren |
DE102008062043A1 (de) * | 2008-12-12 | 2010-06-17 | Kuka Roboter Gmbh | Verfahren und System zur Prüfung der Genauigkeit eines Sensors |
DE102010033235A1 (de) | 2010-08-03 | 2012-02-09 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zum Umbauen einer Bestückvorrichtung |
DE102013207598A1 (de) * | 2013-04-25 | 2014-10-30 | Finetech Gmbh & Co.Kg | Platziervorrichtung und Platzierverfahren |
CN107006145B (zh) * | 2014-12-18 | 2019-10-22 | 株式会社富士 | 对基板作业机 |
JP7319264B2 (ja) * | 2018-06-20 | 2023-08-01 | 株式会社Fuji | 制御方法、電子部品装着装置 |
CN114858965B (zh) * | 2022-05-09 | 2024-02-09 | 江南造船(集团)有限责任公司 | 一种靠近燃料舱壁绝缘层的明火施工方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4227667A1 (de) * | 1992-08-21 | 1994-02-24 | Dietrich Dr Ing Reuse | Mittel zur meßtechnischen Erfassung der Bestückgenauigkeit |
DE69531854T2 (de) * | 1994-08-02 | 2004-08-19 | Koninklijke Philips Electronics N.V. | Verfahren zur wiederholten abbildung eines maskenmusters auf einem substrat |
US5537204A (en) * | 1994-11-07 | 1996-07-16 | Micron Electronics, Inc. | Automatic optical pick and place calibration and capability analysis system for assembly of components onto printed circuit boards |
-
1997
- 1997-03-19 DE DE19711476A patent/DE19711476A1/de not_active Withdrawn
-
1998
- 1998-03-19 CN CNB988035006A patent/CN1189072C/zh not_active Expired - Fee Related
- 1998-03-19 US US09/381,420 patent/US6683688B1/en not_active Expired - Lifetime
- 1998-03-19 JP JP54003498A patent/JP2001516503A/ja active Pending
- 1998-03-19 EP EP98925413A patent/EP0968637B1/de not_active Expired - Lifetime
- 1998-03-19 KR KR1019997008459A patent/KR100548672B1/ko not_active IP Right Cessation
- 1998-03-19 DE DE59805612T patent/DE59805612D1/de not_active Expired - Lifetime
- 1998-03-19 WO PCT/DE1998/000816 patent/WO1998042171A2/de active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110268816A (zh) * | 2017-02-14 | 2019-09-20 | 株式会社富士 | 测定装置、测定方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1189072C (zh) | 2005-02-09 |
WO1998042171A2 (de) | 1998-09-24 |
JP2001516503A (ja) | 2001-09-25 |
EP0968637B1 (de) | 2002-09-18 |
KR100548672B1 (ko) | 2006-02-02 |
US6683688B1 (en) | 2004-01-27 |
EP0968637A2 (de) | 2000-01-05 |
KR20000076357A (ko) | 2000-12-26 |
WO1998042171A3 (de) | 1998-12-03 |
DE59805612D1 (de) | 2002-10-24 |
DE19711476A1 (de) | 1998-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1251256A (zh) | 一种制造电气部件的装置的测量方法和装置 | |
JP2824351B2 (ja) | プリント回路基板に形成されたパターンの位置ずれを分析する装置とその方法 | |
JP3500124B2 (ja) | 電気的な構成群の製作装置に設けられた保持装置の移動距離及び/又は角度位置を校正するための方法及び装置並びに校正基板 | |
US7330307B2 (en) | Stage apparatus | |
CN109556515B (zh) | 一种基于机器视觉的系统误差校准方法、系统及设备 | |
KR940007899B1 (ko) | 공작물의 3차원위치계측방법과 공작물의 포착방법 | |
CN101568891A (zh) | 定位工具用x-y定位的校准方法及具有这种定位工具的装置 | |
WO2014116807A1 (en) | Automatic programming of solder paste inspection system | |
CN114184931A (zh) | 探针调整方法、装置、电子设备和存储介质 | |
US5896652A (en) | Method of packaging electronic components | |
CN114235351B (zh) | 一种激光阵列中激光光斑偏移检测方法、系统及相关设备 | |
CN113670193B (zh) | 通过多次使用测试元件确定装配机的精度 | |
CN1527661A (zh) | 为基底装夹元件的装置和这种装置的校准方法 | |
CN212433821U (zh) | 一种相机参数标定设备 | |
CN114571455B (zh) | 一种用于校准运动模组运动的系统和方法、机器人 | |
US5107132A (en) | Apparatus for the verification of corrected surfaces or in the process of correction | |
JP2001124700A (ja) | ラインセンサーカメラを備えた検査機のキャリブレーション方法 | |
US4914829A (en) | Image alignment indicators | |
CN111629510A (zh) | 一种控制面板涨缩的方法 | |
CN116448160B (zh) | 一种基于图像的旋转编码器精度检测方法 | |
WO1998042167A2 (de) | Verfahren und vorrichtung zum vermessen einer einrichtung zur herstellung von elektrischen baugruppen | |
KR920004326B1 (ko) | 실장피씨비기판 자동검사장치의 카메라를 이용한 측정방법 | |
JPH069288Y2 (ja) | 光学式板幅計の較正装置 | |
CN117998834A (zh) | 基于固定标记点的平面坐标热补偿方法及系统、存储介质 | |
JPH0770871B2 (ja) | 電子部品実装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LIMITED PARTN Free format text: FORMER OWNER: SIEMENS AG Effective date: 20090925 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090925 Address after: Munich, Federal Republic of Germany Patentee after: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG Address before: Munich, Federal Republic of Germany Patentee before: Siemens AG |
|
C56 | Change in the name or address of the patentee |
Owner name: ADVANCED ASSEMBLY SYSTEMS GMBH + CO. KG Free format text: FORMER NAME: SIEMENS AG (DE) |
|
CP03 | Change of name, title or address |
Address after: Munich, Germany Patentee after: ASM Assembly Systems GmbH & Co. KG Address before: Munich, Federal Republic of Germany Patentee before: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050209 Termination date: 20160319 |
|
CF01 | Termination of patent right due to non-payment of annual fee |