CN1245223A - Process for electroplating on single surface of plastics without electrolysis and its resultant structure - Google Patents
Process for electroplating on single surface of plastics without electrolysis and its resultant structure Download PDFInfo
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- CN1245223A CN1245223A CN 98117180 CN98117180A CN1245223A CN 1245223 A CN1245223 A CN 1245223A CN 98117180 CN98117180 CN 98117180 CN 98117180 A CN98117180 A CN 98117180A CN 1245223 A CN1245223 A CN 1245223A
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- plastics
- electroless plating
- copper
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- single face
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Abstract
A process for electroplating on single surface of plastics without electrolysis includes such steps as defatting or dilating while wetting the raw plastics, coarsing, adding catalytic promoter, activating (including drying, non-conductive spray paint and drying), accelerating, electroplating copper without electrolysis, activating, electroplating nickel without electrolysis, passivating, dewatering, drying, inspecting and packaging. With the said process, an enamelized layer can be formed on raw plastics to easily electroplate on single surface. It can be used for high-sensitivity electronic devices.
Description
The present invention relates to a kind of single surface of plastics electroless plating method and made structure thereof.It does not have the shortcoming of traditional single face electrolytic process and traditional two-sided electrochemical plating, but has this both advantage concurrently, and can reach the purpose of single surface of plastics plating easily.
Tradition has the method for anti electromagnetic wave interferential every the ripple layer for forming on the insulativity material that does not have electroconductibility at plastic cement, pottery or glass etc., often adopts two kinds of two-sided non-electrolytic plating method and traditional single face non-electrolytic plating methods etc.
The two-sided non-electrolytic plating method of tradition, its flow process is divided into 13 steps: the degreasing of material or swelling are handled (Pre-Etching), alligatoring (Etching), are added catalytic promoter, the 4th step was accelerationizations (Acceleration), and electroless plating copper (Electroless Copper), activation, electroless nickel plating (ElectrolessNickel), passivation (Sealed), dehydration, drying (Drying), the inspection in the 6th to 13 step and pack (Packing) for activation (Activation), the 5th step.Referring to Fig. 1, by shown in it, respectively plate layer of copper 1 two-sided all formation on the material " adjacent surface " of ripple layer, on " inferior adjacent surface ", then respectively plate one deck nickel 2, and " outermost " in these material 5 outsides is to form lacquerization layer 3 (Paint).
In addition, tradition single face non-electrolytic plating method, it is made flow process and also comprises 13 steps: (it is made of Metal Power (metal powder)+Resin (resin) spray catalyst lacquer, this metal powder is Ag, Fe, Ni), the 6th to the 13 step in dry, hydrophilic treatment and the above-mentioned two-sided non-electrolytic plating method.Referring to Fig. 2,, locate to form catalyst enamelled coating 4 in the formation of a certain single face place every the material 5 times " adjacent surfaces " of ripple layer and plate layer of copper 1 and one deck nickel 2 more in regular turn, and on " adjacent surface " of this material 5, optionally can increase one deck lacquerization layer 3 by shown in it.
But above-mentioned two-sided non-electrolytic plating method only can be used for two-sided plating, can't be used for single face and electroplate, and because it is two-sided plating, then in the environmental issue that will cause copper, nickel electrolytic coating to separate with material aspect the recovery in the future, and the puzzlement of depainting is arranged, but have the advantage of low cost.And above-mentioned traditional single face non-electrolytic plating method, because it must use the catalyst lacquer, so the copper 1 and the nickel that are plated on this catalyst enamelled coating 4 will form uneven surface for 2 layers, if utilize the made material 5 of this kind single face non-electrolytic plating method, when itself and electronic component institute in abutting connection with the time, then often cause protruding grain on this uneven surface with after electronic component contacts, the conductive material on the electronic component is ground off and break down.Therefore, be it can't be used on the highly sensitive electronic product, thereby its working conditions is restricted; Moreover why it can constitute single face is electroplated, be because of its again die sinking produce and this material 5 identical moulds reach the effect of isolation so that fasten another face that need not electroplate of material 5.Yet this mould must " fully " reach airtight effect fully with material 5 identical sides, and accurate again mould, owing to need put into and convenient to remove, so how much can produce finedraw, make the catalyst lacquer overflow appearance unavoidably, thereby cause afterwards the treatment people cost huge, and condemnation factor is high, influence delivery timeliness, and increased the manufacturing cost of this mould greatly, therefore this kind single face electrochemical plating cost is increased substantially relatively, it does not meet actual needs, but but the advantage of single face plating is arranged.
Primary and foremost purpose of the present invention provides a kind of single surface of plastics electroless plating method and made structure thereof, it mainly is by not needing galvanized this face to implement lacquerization on the plastic cement material and forming and electroplate complete insulating lacquerization layer, and drying treatment, be to reach anyway to electroplate the excellent effect that all can not be plated to this face, and owing to do not use the catalyst lacquer, then make copper, nickel two electrolytic coatings are to be even surface, definitely can be used on the highly sensitive electronic product, furthermore, because method of the present invention do not have every shortcoming of the traditional two-sided and single face electrochemical plating in the above-mentioned background technology, and have every advantage of traditional two-sided and single face electrochemical plating concurrently.
Characteristic on the present invention's above-mentioned purpose and structure thereof and the function will be illustrated with following preferred embodiment.
Fig. 1 is the structural representation that traditional two-sided non-electrolytic plating method was plated to;
The structural representation that Fig. 2 is plated to for traditional single face non-electrolytic plating method;
The structural representation that Fig. 3 is plated to for single face non-electrolytic plating method of the present invention.
The figure number explanation:
1 ... copper
2 ... nickel
3 ... the lacquerization layer
4 ... the catalyst enamelled coating
5 ... material
Preferred embodiment: the invention provides a kind of single surface of plastics electroless plating method and made structure thereof, its treatment scheme comprises: 1. the degreasing of material or swelling processing, 2. alligatoring, 3. add that catalytic promoter, 4. activation, 4a. drying, 4b. non-conductively spray paint, the 4c. drying, 5. accelerationizations, 6. electroless plating copper, 7. activate, 8. 16 steps such as electroless plating nickel, 9. passivation, 10. dehydration, 11. dryings, 12. inspections and 13. packings.Referring to Fig. 3, shown in this figure, when it proceeded to the activation flow process, drying of being carried out and non-conductive spraying paint and drying step were the lacquer layer 3 that can form on material 5 through the lacquerization processing.The purpose of this lacquerization layer 3 be except that can increasing the aesthetic property, and because of it be non-conductive, then is not subjected to galvanized the influence fully and reaches single face electroplating processes mode extremely easily; At this moment, carry out the 5.th to the 13.th step again, but then can below this material 5, plate 2 layers in anti electromagnetic wave interferential copper 1 and nickel.On the other hand, then increase aesthetic property and reach the purpose of single face plating because of lacquer layer 3 through the lacquerization processing.In addition, its copper 1 and nickel 2 electrolytic coatings are even surface, and these different uneven surfaces that can form with traditional type single face non-electrolytic plating method not only can be used for high sensitive electronic product thereby make it the present invention, and its cost are lower; Because traditional single face non-electrolytic plating method has the environmental protection of being unfavorable for and can't the galvanized shortcoming of single face, the present invention is different with it, is the effect with environmental protection, but and single face plating.Above-mentioned material 5 can be ABS or is ABS+PC or PC+FIBER (glass fibre), if its ABS then need carry out degreasing in the 1.th step; And if its ABS+PC or PC+FIBER then need carry out swelling and handle in the 1.th step.The present invention is compared as follows with the two-sided and single face electrochemical plating of tradition:
| The present invention | The tradition single face | Tradition is two-sided | |
| The catalyst lacquer | Needn't | Necessary and be subject to foreign country | Needn't |
| The comparison of catalyst lacquer mould and outward appearance die cost | Easily, cheap | Be difficult for, expensive | Easily, cheap |
| The material common die face uses the greasy dirt of slight off-shape agent | Do not influence | Influence adhering to of catalyst lacquer | Do not influence |
| Remedying of material surface | Can accomplish | Can't accomplish | Can accomplish |
| Finished product condition of molding and operation | Easily | Difficulty | Easily |
| Outward appearance | Spray outward appearance lacquer better appearance | The material ratio sprays paint not attractive in appearance slightly, if spray then increases cost | Spray outward appearance lacquer better appearance |
| Depainting | Do not have | Do not have | Because of being sprayed directly on on the copper nickel, so may |
| Texture | Not essential | Necessary | Not essential |
| Environmental protection is considered | After removing de-plating, lacquer+material is ejection formation again | After removing de-plating, can be left material+metal powder+resin | After removing de-plating, can be left material+lacquer+copper+nickel (removing not fall) |
| Coating surface | Level and smooth little bright assembling that do not influence | Coarse, tarnish is so its trickle metal easily comes off | Level and smooth little bright assembling that do not influence |
| Fraction defective | Low | High | Low |
| Again handle again (Rework) | Can | Not all right | Can |
| The electrolytic copper time | Short | Long | Short |
| Copper groove size (same thickness of coating) | Little | Very big | Little |
| Copper groove liquid waste disposal | Easily | Volume is big, is difficult for | Easily |
| The conduction value | Well | Poor slightly | Well |
| Adherence | Machinery combines well with chemical bond | Because the influence of metal powder is so symbol property is relatively poor | Machinery combines well with chemical bond |
| Cost is considered | Low | High | In |
As seen from the above table, the present invention is tool tradition single face and the two-sided shortcoming of tradition not, but has this both advantage concurrently, and then the present invention is the single face electroless plating method for the best.
In sum, single surface of plastics electroless plating method provided by the present invention and made structure thereof, it is the shortcoming of the two-sided non-electrolytic plating method of tool tradition and traditional single face non-electrolytic plating method not, but has both advantages concurrently, and can reach the purpose of single surface of plastics plating easily.
The above only is the preferable possible embodiments of one of the present invention, the above-mentioned method of all the present invention of utilization, shape, structure and the variation carried out all belongs within the scope of the present invention.
Claims (2)
1 one kinds of single surface of plastics electroless plating methods and made structure thereof, its treatment scheme comprises: 1. the degreasing of material or swelling processing, 2. alligatoring, 3. add catalytic promoter, 4. activation, 5. accelerationizations, 6. electroless plating copper .7. activation, 8. electroless plating nickel, 9. passivation, 10. dehydration, 11. dryings, 12. inspections and 13. are packed, it is characterized in that:
Further add dry, non-conductive spraying paint and dry three steps between 4. activation in above-mentioned flow process and 5. accelerationization, two steps;
Thereby but the one side that is formed in material plates anti electromagnetic wave interferential copper layer and nickel dam, and another side then increases its aesthetic property for the lacquer layer through the lacquerization processing and reaches the purpose of single face plating.
2. single surface of plastics electroless plating method according to claim 1 and made structure thereof, wherein said material can be ABS or ABS+PC or PC+FIBER.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98117180 CN1245223A (en) | 1998-08-14 | 1998-08-14 | Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 98117180 CN1245223A (en) | 1998-08-14 | 1998-08-14 | Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
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| Publication Number | Publication Date |
|---|---|
| CN1245223A true CN1245223A (en) | 2000-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 98117180 Pending CN1245223A (en) | 1998-08-14 | 1998-08-14 | Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102508583A (en) * | 2011-09-30 | 2012-06-20 | 南京华显高科有限公司 | Preparation method for metal lead of capacitance type touch screen |
-
1998
- 1998-08-14 CN CN 98117180 patent/CN1245223A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102508583A (en) * | 2011-09-30 | 2012-06-20 | 南京华显高科有限公司 | Preparation method for metal lead of capacitance type touch screen |
| CN102508583B (en) * | 2011-09-30 | 2014-05-21 | 南京熊猫电子股份有限公司 | Preparation method for metal lead of capacitance type touch screen |
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