CN102508583A - Preparation method for metal lead of capacitance type touch screen - Google Patents
Preparation method for metal lead of capacitance type touch screen Download PDFInfo
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- CN102508583A CN102508583A CN2011102969853A CN201110296985A CN102508583A CN 102508583 A CN102508583 A CN 102508583A CN 2011102969853 A CN2011102969853 A CN 2011102969853A CN 201110296985 A CN201110296985 A CN 201110296985A CN 102508583 A CN102508583 A CN 102508583A
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Abstract
Disclosed is a preparation method for a metal lead of a capacitance type touch screen. The preparation method is characterized in that firstly, resin protecting adhesive is in screen printing and thermal curing to form protecting films, ITO (indium tin oxide) patterns are arranged on two surfaces of a glass substrate, ITO outgoing lines are disposed on the periphery of the glass substrate, the ITO patterns on the glass substrate are covered by the protecting films, and the ITO outgoing lines are exposed; and secondly, copper and nickel metal films are sequentially covered on surfaces of the exposed ITO outgoing lines on the periphery of the glass substrate by the aid of a chemical plating method, and accordingly the metal lead of the touch screen is formed. The metal lead manufactured by the aid of the preparation method is excellent in conductivity, and the preparation method is simple in manufacture process and low in cost as compared with other methods.
Description
Technical field
The present invention relates to a kind of capacitive touch screen technology of preparing, the preparation method of metal lead wire on especially a kind of touch-screen, specifically a kind of method of making metal lead wire on the condenser type touch screen substrate through electroless copper and chemical nickel plating.
Background technology
In order to reduce the capacitive touch screen resistance of extension line part on every side, during touch-screen is made extension line around the glass is made into metal wire and obtains good electrical properties.The metal lead wire method for making of patent report has the serigraphy conductive metal slurry to make behind metal wire [CN101996007A] the sputter deposited metal film photoetching and metal wire [CN102096534A] is made in etching, and electroless gold-plating method is made metal lead wire [CN10184625A].These methods all exist complex manufacturing technology, problem that cost of manufacture is high.
Summary of the invention
The objective of the invention is to existing touch-screen metal lead wire complicated process of preparation, the problem that cost is high, it is low to invent a kind of cost, the preparation method of capacitive touch screen metal lead wire simple for process.
Technical scheme of the present invention is:
A kind of preparation method of capacitive touch screen metal lead wire; It is characterized in that at first forming diaphragm with the two-sided ITO of having figure, have the ITO figure on the glass substrate of ITO extension line to cover in all around, and the ITO extension line is exposed through serigraphy resin protection glue and heat curing; Secondly, through the ITO extension line surface of exposing of chemical plating method around glass substrate covering copper and nickel metal film successively, finally form the touch-screen metal lead wire.
Described electroless copper and chemical nickel plating comprise degreasing, alligatoring, colloid palladium activation, dispergation, electroless copper, ionic palladium activation, chemical nickel plating and oven dry:
(1) degreasing: have in the neutral degreaser that the glass substrate of protecting glue is immersed in 40-50 ℃ 3-5 minute, take out the back with the deionized water rinsing glass that flows;
(2) alligatoring: glass substrate is put into pH value acid solution 3-5 minute for 1-3, with deionized water glass substrate is rinsed well;
(3) colloid palladium activation: glass substrate immersed in the room temperature alkali palladium colloid 3-5 minute, after the activation in ionized water the glass cleaning substrate;
(4) dispergation: glass substrate immerses 10-60s in the sodium hydroxide solution, takes out glass substrate then and rinses well with deionized water;
(5) electroless copper: glass substrate immerses temperature in the chemical bronze plating liquid that 35-50 ℃ of pH value is 11-12.5 1-3 minute; The copper film that on the ITO extension line around the glass substrate, forms the 1-5 micron thick covers, and takes out glass substrate and rinses well with deionized water;
(6) ionic palladium activation: glass substrate was put in the ionic palladium activating solution 1-2 minute, with deionized water glass substrate was rinsed well;
(7) chemical nickel plating: glass substrate is put into 80-95 ℃ of pH value chemical nickel-plating solution 2-5 minute for 4-6, on the copper film of ITO lead-in wire around the glass, forms the nickel metal layer of 3-6 micron, with deionized water glass substrate is rinsed well;
(8) remove glass substrate graphics field ITO and go up the diaphragm that covers, glass substrate is put into 150 ℃ of baking ovens, be incubated 30 minutes.
Beneficial effect of the present invention:
The present invention adopts the method for electroless copper and chemical nickel plating to form copper nickel metal lead wire in the glass edge, and it has the advantage that manufacture craft is simplified, cost of manufacture is low.
Embodiment
Below in conjunction with embodiment the present invention is further described.
A kind of preparation method of capacitive touch screen metal lead wire; At first on glass substrate, make two-sided ITO figure; And around glass substrate, form the ITO extension line, and cover in the ITO figure on the glass substrate through serigraphy resin protection glue, have good adhesion between this protection glue and ITO figure and the glass substrate after the oven dry; Chemistry, physical change do not take place in the chemical plating fluid of strong acid and strong base, can not come off.
Then, glass substrate is put into neutral degreaser soaked 3～5 minutes, degreaser concentration is 25g/L, and temperature is 40～50 ℃, removes the grease that glass substrate processing and fabricating transmittance process forms.Use mobile deionized water rinsing 2 minutes after the degreasing, the degreaser complete flushing is clean.The pH value is 1～3 under the glass substrate immersion room temperature; The best is in 2 the acid solution 3～5 minutes; ITO extension line on the glass substrate is carried out alligatoring, and this coarsening solution is made up of oxalic acid, hydrochloric acid, nitric acid, hydrofluorite, sodium chloride etc., with deionized water glass substrate is rinsed well after the alligatoring.Glass substrate immerses in the colloidal pd activation solution of room temperature and to let the palladium micelle be adsorbed on the ITO surface in 3～5 minutes, with deionized water rinsing 2 minutes, contains sodium chloride, palladium bichloride, stannous chloride in this colloid palladium after the activation, and weight ratio is respectively 11%, 0.02%, 0.86%.10-60 the best second is 15s in the sodium hydroxide solution that glass substrate immerses under the room temperature, concentration is 25g/L, deionized water rinsing 1 minute, and purpose is that the palladium ion in the micelle is come out.Glass substrate is put into 35～50 ℃, and the best is that 45 ℃, pH are 11-12.5, and the best is in 12 the chemical bronze plating liquid 1-3 minute, obtains thickness and be 2 microns copper film (also can with THICKNESS CONTROL in the 1-5 micron), takes out and rinses well with deionized water.Copper sulphate 16g/L, EDTA-2Na 25g/L, copper plating additive 7mL/L, formaldehyde 15mL/L, NaOH 14g/L in this chemical bronze plating liquid.The substrate that plates copper film is put into the ionic palladium activating solution and was rinsed well with deionized water in 1-2 minute, contains palladium bichloride 0.1g/L, hydrochloric acid 0.2g/L in this ionic palladium.With glass substrate put into 85 ℃ of (also can be 80-95 ℃) pH values be 4.5 (also can be 4-6) nickel plating solution 2-5 minute obtaining the nickel film that thickness is 3 microns (also can between the 3-6 micron) on the copper film, under ionized water, rinse well.Chemical composition has nickelous sulfate 25g/L, lactic acid 25mL/L, sodium acetate 15g/L, inferior sodium phosphate 30g/L, chemical nickel adjuvant 5mL/L in the chemical nickel-plating liquid.Form copper and mickel plain conductor touch screen base plate through chemical plating method, remove the diaphragm of ITO graphics field on the substrate, put into that insulation made the adhesion between metal film and the substrate further firm in 30 minutes in 150 ℃ of drying boxes.
The present invention does not relate to all identical with the prior art prior art that maybe can adopt of part and realizes.
Claims (2)
1. the preparation method of a capacitive touch screen metal lead wire; It is characterized in that at first forming diaphragm with the two-sided ITO of having figure, have the ITO figure on the glass substrate of ITO extension line to cover in all around, and the ITO extension line is exposed through serigraphy resin protection glue and heat curing; Secondly, the ITO extension line surface of around glass substrate, exposing through chemical plating method is covering copper and nickel metal film successively, forms the touch-screen metal lead wire.
2. method according to claim 1 is characterized in that described electroless copper and chemical nickel plating comprise degreasing, alligatoring, colloid palladium activation, dispergation, electroless copper, ionic palladium activation, chemical nickel plating and oven dry:
Degreasing: have in the neutral degreaser that the glass substrate of protecting glue is immersed in 40-50 ℃ 3-5 minute, take out the back with the deionized water rinsing glass that flows;
Alligatoring: glass substrate is put into pH value acid solution 3-5 minute for 1-3, with deionized water glass substrate is rinsed well;
The colloid palladium activation: glass substrate immersed in the room temperature alkali palladium colloid 3-5 minute, after the activation in ionized water the glass cleaning substrate;
Dispergation: glass substrate immerses 10-60s in the sodium hydroxide solution, takes out glass substrate then and rinses well with deionized water;
Electroless copper: glass substrate immerses temperature, and to be 35-50 ℃ of pH value be in the chemical bronze plating liquid of 11-12.5 1-3 minute, and the copper film that on the ITO extension line around the glass substrate, forms the 1-5 micron thick covers, and the taking-up glass substrate is rinsed well with deionized water;
The ionic palladium activation: glass substrate was put in the ionic palladium activating solution 1-2 minute, with deionized water glass substrate was rinsed well;
Chemical nickel plating: glass substrate is put into 80-95 ℃ of pH value chemical nickel-plating solution 2-5 minute for 4-6, on the copper film of ITO lead-in wire around the glass, forms the nickel metal layer of 3-6 micron, with deionized water glass substrate is rinsed well;
Oven dry: remove glass substrate graphics field ITO and go up the resin protection film that covers, glass substrate is put into 150 ℃ of baking ovens, be incubated 30 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110296985.3A CN102508583B (en) | 2011-09-30 | 2011-09-30 | Preparation method for metal lead of capacitance type touch screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110296985.3A CN102508583B (en) | 2011-09-30 | 2011-09-30 | Preparation method for metal lead of capacitance type touch screen |
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| CN102508583A true CN102508583A (en) | 2012-06-20 |
| CN102508583B CN102508583B (en) | 2014-05-21 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102765267A (en) * | 2012-07-31 | 2012-11-07 | 意力(广州)电子科技有限公司 | Roll-to-roll printing process of capacitance product |
| CN102799326A (en) * | 2012-07-03 | 2012-11-28 | 深圳市长江力伟股份有限公司 | Capacitive screen function sheet with double-faced electrode routing and machining method thereof |
| CN102929450A (en) * | 2012-11-21 | 2013-02-13 | 南京华显高科有限公司 | Preparation method for peelable glue protection graph of capacitive touch screen |
| CN117878196A (en) * | 2024-03-12 | 2024-04-12 | 深圳市松柏科工股份有限公司 | Manufacturing process of photovoltaic solar N-type oxide semiconductor ITO electroless copper plating |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85108685A (en) * | 1985-04-23 | 1986-10-22 | 施林工业产权保护股份公司 | The method and apparatus of coating metal on goods |
| CN1245223A (en) * | 1998-08-14 | 2000-02-23 | 金艺企业股份有限公司 | Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
| CN1420416A (en) * | 2001-11-17 | 2003-05-28 | 余章军 | Process for mfg. light-transmission character electroplated key |
| CN1646728A (en) * | 2002-04-23 | 2005-07-27 | 新加坡科技研究局 | Method for electroless deposition of a metal layer on selected portions of a substrate |
| CN101220491A (en) * | 2007-10-08 | 2008-07-16 | 四川长虹电器股份有限公司 | Partially plating method for plastic parts |
-
2011
- 2011-09-30 CN CN201110296985.3A patent/CN102508583B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85108685A (en) * | 1985-04-23 | 1986-10-22 | 施林工业产权保护股份公司 | The method and apparatus of coating metal on goods |
| CN1245223A (en) * | 1998-08-14 | 2000-02-23 | 金艺企业股份有限公司 | Process for electroplating on single surface of plastics without electrolysis and its resultant structure |
| CN1420416A (en) * | 2001-11-17 | 2003-05-28 | 余章军 | Process for mfg. light-transmission character electroplated key |
| CN1646728A (en) * | 2002-04-23 | 2005-07-27 | 新加坡科技研究局 | Method for electroless deposition of a metal layer on selected portions of a substrate |
| CN101220491A (en) * | 2007-10-08 | 2008-07-16 | 四川长虹电器股份有限公司 | Partially plating method for plastic parts |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102799326A (en) * | 2012-07-03 | 2012-11-28 | 深圳市长江力伟股份有限公司 | Capacitive screen function sheet with double-faced electrode routing and machining method thereof |
| WO2014005387A1 (en) * | 2012-07-03 | 2014-01-09 | 深圳市长江力伟股份有限公司 | Capacitive-screen sensor having electrode wiring on two sides thereof and processing method for said sensor |
| CN102765267A (en) * | 2012-07-31 | 2012-11-07 | 意力(广州)电子科技有限公司 | Roll-to-roll printing process of capacitance product |
| CN102765267B (en) * | 2012-07-31 | 2015-02-25 | 意力(广州)电子科技有限公司 | Roll-to-roll printing process of capacitance product |
| CN102929450A (en) * | 2012-11-21 | 2013-02-13 | 南京华显高科有限公司 | Preparation method for peelable glue protection graph of capacitive touch screen |
| CN117878196A (en) * | 2024-03-12 | 2024-04-12 | 深圳市松柏科工股份有限公司 | Manufacturing process of photovoltaic solar N-type oxide semiconductor ITO electroless copper plating |
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| CN102508583B (en) | 2014-05-21 |
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Owner name: NANJING XIONGMAO ELECTRONICS CO., LTD. Free format text: FORMER OWNER: NANJING HUAXIAN HIGH-TECH CO., LTD. Effective date: 20130802 |
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Effective date of registration: 20130802 Address after: 210002 Zhongshan East Road, Jiangsu, China, No. 301, No. Applicant after: Nanjing Xiongmao Electronics Co., Ltd. Address before: 210061 commercial building, room 413, hi tech Development Zone, Jiangsu, Nanjing Applicant before: Nanjing Huaxian High-Tech Co., Ltd. |
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