CN102765267B - Roll-to-roll printing process of capacitance product - Google Patents
Roll-to-roll printing process of capacitance product Download PDFInfo
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- CN102765267B CN102765267B CN201210271582.8A CN201210271582A CN102765267B CN 102765267 B CN102765267 B CN 102765267B CN 201210271582 A CN201210271582 A CN 201210271582A CN 102765267 B CN102765267 B CN 102765267B
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Abstract
The invention discloses a roll-to-roll printing process of a roll-to-roll capacitance product, which comprises the following steps: a substrate is provided, wherein the substrate comprises a conductive surface and a non-conductive surface and the substrate is rolled; liquid printing ink is provided; a printer prints the printing ink on the surface of the non-conductive surface of the substrate to form a protective layer; and then, a layer of dry film is pressed on the conductive surface of the substrate in roll to roll. In the roll-to-roll printing process of the capacitance product, protective glue is directly glued on the non-conductive surface of the rolled substrate; and the layer of dry film is pressed on the conductive surface of the substrate in roll to roll. The rolling operation of the substrate is carried out so that the production efficiency is improved; and the man-made scratch and the like can be also avoided in the production process at the same time.
Description
Technical field
The present invention relates to electronic applications, particularly relate to a kind of volume to volume capacitor packages typography.
Background technology
Carry out in current industry capacitor packages when carrying out feeding intake operation; general technological process is the sheet stock first carrying out the base material that purchase comes to cut into different size, then prints a series of work flows such as non-conductive protecting glue, shrink, subsides dry film, exposure, development, etching, printing elargol to sheet stock.But due to feeding intake of pellet form, production efficiency is lower.Transhipment, environment, machine etc. affect bad generations such as also can causing the scratch of sheet stock, scratch in process of production simultaneously.
Summary of the invention
Based on this, be necessary to provide a kind of and can enhance productivity, reduce man's activity and cause bad volume to volume capacitor packages typography.
A kind of volume to volume capacitor packages typography, comprise the following steps: provide base material, described base material comprises conducting surface and nonconductive surface, and described base material becomes web-like.Liquid ink is provided, utilizes printing machine that described ink printing is formed protective layer on the surface of the nonconductive surface of described base material.Then by pressing one deck dry film of the conducting surface volume to volume of described base material.
Wherein in an embodiment, described base material is divided into product zone and non-product district, and the size of described protective layer is greater than the size of the product zone of the nonconductive surface of described base material.
Wherein in an embodiment, after the nonconductive surface printing-ink of described base material forms protective layer, also carry out the step of toasting.
Wherein in an embodiment, described baking is infrared ray baking.
Wherein in an embodiment, the temperature of described baking is 100 DEG C.
Wherein in an embodiment, after pressing dry film, carry out the step that automatic cutting is cut into sheet stock.
Above-mentioned volume to volume capacitor packages typography, protecting glue of directly fitting on the nonconductive surface of web-like base material, and then pressing one deck dry film of conducting surface volume to volume at base material.Operation is carried out to the rolling of base material, enhances productivity, also avoid artificially abrading in process of production simultaneously, scratch etc.
The size of described protecting glue is greater than the size of the nonconductive surface of described base material.Do not scratched in the product area that adequately protects.。
After the nonconductive surface of described base material forms protective layer, also carry out the step of toasting.Ink is made to be solid-state by liquid conversion by baking.Described baking is infrared ray baking.Preferably, the temperature of described baking is 100 ± 5 DEG C.Under this baking temperature, protective layer can be made fully dry, the dry film baking of conducting surface laminating not impacted simultaneously.
Detailed description of the invention
Below in conjunction with embodiment to being described further.
A kind of volume to volume capacitor packages typography, comprise the following steps: provide base material, described base material comprises conducting surface and nonconductive surface, and described base material becomes web-like.Liquid ink is provided, utilizes printing machine that described ink printing is formed protective layer on the surface of the nonconductive surface of described base material.Then by pressing one deck dry film of the conducting surface volume to volume of described base material.In the present embodiment, base material is by PET and on PET, plate one deck ITO(tin indium oxide) form, PET is as non-conductive layer, and the coating on its surface is conductive layer.
Described base material is divided into product zone and non-product district, and the size of described protective layer is greater than the size of the product zone of the nonconductive surface of described base material.
After the nonconductive surface printing-ink of described base material forms protective layer, also carry out the step of toasting.
Described baking is infrared ray baking.
The temperature of described baking is 100 ± 5 DEG C.
After pressing dry film, carry out the step that automatic cutting is cut into sheet stock.
Above-mentioned volume to volume capacitor packages typography, protective layer of directly fitting on the nonconductive surface of web-like base material, and then pressing one deck dry film of conducting surface volume to volume at base material.Operation is carried out to the rolling of base material, enhances productivity, also avoid artificially abrading in process of production simultaneously, scratch etc.
The size of described protective layer is greater than the size of the nonconductive surface of described base material.Do not scratched in the product area that adequately protects.
After the nonconductive surface of described base material fits described protective layer, also carry out the step of toasting.Ink is made to be solid-state by liquid conversion by baking.Described baking is infrared ray baking.Preferably, the temperature of described baking is 100 ± 5 DEG C.Under this baking temperature, protective layer can be made fully dry, the dry film baking of conducting surface laminating not impacted simultaneously.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (1)
1. a volume to volume capacitor packages typography, is characterized in that, comprises the following steps:
There is provided base material, described base material comprises conducting surface and nonconductive surface, and described base material becomes web-like;
Liquid ink is provided;
Utilize printing machine that described ink printing is formed protective layer on the surface of the nonconductive surface of described base material, described base material is divided into product zone and non-product district, and the size of described protective layer is greater than the size of the product zone of the nonconductive surface of described base material;
Carry out infrared ray baking, described baking temperature is 100 ± 5 DEG C;
Then by pressing one deck dry film of the conducting surface volume to volume of described base material;
Described base material automatic cutting after pressing dry film is cut into sheet stock.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210271582.8A CN102765267B (en) | 2012-07-31 | 2012-07-31 | Roll-to-roll printing process of capacitance product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210271582.8A CN102765267B (en) | 2012-07-31 | 2012-07-31 | Roll-to-roll printing process of capacitance product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102765267A CN102765267A (en) | 2012-11-07 |
| CN102765267B true CN102765267B (en) | 2015-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201210271582.8A Active CN102765267B (en) | 2012-07-31 | 2012-07-31 | Roll-to-roll printing process of capacitance product |
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| CN (1) | CN102765267B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313518B (en) * | 2013-06-25 | 2016-04-06 | 惠州中京电子科技股份有限公司 | A kind of manufacture method of FPC one side Ultrathin substrate circuit |
| CN103831342A (en) * | 2014-03-05 | 2014-06-04 | 艾柯豪博（苏州）电子有限公司 | Roll-to-roll insulating varnish printing process of stamping parts |
| CN106313859A (en) * | 2016-08-12 | 2017-01-11 | 深圳市骏达光电股份有限公司 | ITO coiled material integrated processing technology |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5567328A (en) * | 1995-06-08 | 1996-10-22 | The Whitaker Corporation | Medical circuit forming process |
| CN101122105A (en) * | 2007-08-07 | 2008-02-13 | 河南金芒果印刷有限公司 | Gravure technique for making white cardboard having same surface effect as gold cardboard |
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN201563300U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Continuous dry film laminating system for flexible circuit board |
| CN102508583A (en) * | 2011-09-30 | 2012-06-20 | 南京华显高科有限公司 | Preparation method for metal lead of capacitance type touch screen |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60175050A (en) * | 1984-02-21 | 1985-09-09 | Nec Corp | Forming method of metallic film pattern |
| JP4429689B2 (en) * | 2003-11-04 | 2010-03-10 | 住友ゴム工業株式会社 | Offset printing method |
| JP2008246938A (en) * | 2007-03-30 | 2008-10-16 | Toppan Printing Co Ltd | Fine pattern printing method |
-
2012
- 2012-07-31 CN CN201210271582.8A patent/CN102765267B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5567328A (en) * | 1995-06-08 | 1996-10-22 | The Whitaker Corporation | Medical circuit forming process |
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollowed-out PCB |
| CN101122105A (en) * | 2007-08-07 | 2008-02-13 | 河南金芒果印刷有限公司 | Gravure technique for making white cardboard having same surface effect as gold cardboard |
| CN201563300U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Continuous dry film laminating system for flexible circuit board |
| CN102508583A (en) * | 2011-09-30 | 2012-06-20 | 南京华显高科有限公司 | Preparation method for metal lead of capacitance type touch screen |
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| Publication number | Publication date |
|---|---|
| CN102765267A (en) | 2012-11-07 |
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