CN102765267B - Roll-to-roll printing process of capacitance product - Google Patents

Roll-to-roll printing process of capacitance product Download PDF

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Publication number
CN102765267B
CN102765267B CN201210271582.8A CN201210271582A CN102765267B CN 102765267 B CN102765267 B CN 102765267B CN 201210271582 A CN201210271582 A CN 201210271582A CN 102765267 B CN102765267 B CN 102765267B
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roll
substrate
conductive surface
printing process
layer
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CN102765267A (en
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宋洪逍
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EELY Guangzhou Electronic Technology Co Ltd
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EELY Guangzhou Electronic Technology Co Ltd
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Abstract

本发明公开了一种卷对卷电容产品印刷工艺,包括以下步骤:提供基材,所述基材包括导电面和非导电面,所述基材成卷状。提供液态油墨,利用印刷机将所述油墨印刷在所述基材的非导电面的表面形成保护层。然后将所述基材的导电面卷对卷的压合一层干膜。上述卷对卷电容产品印刷工艺,直接在卷状基材的非导电面上贴合保护胶,然后再在基材的导电面卷对卷的压合一层干膜。对基材的成卷进行作业,提高生产效率,同时也避免在生产过程中人为擦伤,刮花等等。The invention discloses a roll-to-roll capacitance product printing process, comprising the following steps: providing a base material, the base material includes a conductive surface and a non-conductive surface, and the base material is in a roll shape. Liquid ink is provided, and a printing machine is used to print the ink on the surface of the non-conductive surface of the substrate to form a protective layer. The conductive side of the substrate is then laminated roll-to-roll with a layer of dry film. In the roll-to-roll capacitance product printing process described above, a protective adhesive is directly pasted on the non-conductive surface of the roll substrate, and then a layer of dry film is laminated roll-to-roll on the conductive surface of the substrate. Work on the roll of the substrate to improve production efficiency, and at the same time avoid artificial abrasions, scratches, etc. during the production process.

Description

卷对卷电容产品印刷工艺Roll-to-roll capacitor product printing process

技术领域 technical field

本发明涉及电子领域,特别是涉及一种卷对卷电容产品印刷工艺。The invention relates to the field of electronics, in particular to a roll-to-roll capacitance product printing process.

背景技术 Background technique

目前行业内进行电容产品的在进行投料作业时,一般的工艺流程是先将购买来的基材进行裁切成不同尺寸的片料,然后对片料进行印刷非导电保护胶、缩水、贴干膜、曝光、显影、蚀刻、印刷银胶等一系列的加工流程。但是由于片料形式的投料,生产效率较低。同时在生产过程中转运、环境、机器等影响还会造成片料的擦伤、刮花等不良产生。At present, when feeding capacitor products in the industry, the general process is to first cut the purchased substrate into sheets of different sizes, and then print non-conductive protective glue on the sheets, shrink them, and paste them dry. A series of processing processes such as film, exposure, development, etching, printing silver glue, etc. However, due to the feeding in the form of flakes, the production efficiency is low. At the same time, the effects of transshipment, environment, and machines during the production process will also cause scratches and scratches on the sheet material.

发明内容 Contents of the invention

基于此,有必要提供一种可以提高生产效率、减少人为影响造成不良的卷对卷电容产品印刷工艺。Based on this, it is necessary to provide a roll-to-roll capacitor product printing process that can improve production efficiency and reduce adverse effects caused by human influence.

一种卷对卷电容产品印刷工艺,包括以下步骤:提供基材,所述基材包括导电面和非导电面,所述基材成卷状。提供液态油墨,利用印刷机将所述油墨印刷在所述基材的非导电面的表面形成保护层。然后将所述基材的导电面卷对卷的压合一层干膜。A roll-to-roll capacitance product printing process includes the following steps: providing a base material, the base material includes a conductive surface and a non-conductive surface, and the base material is in a roll shape. Liquid ink is provided, and a printing machine is used to print the ink on the surface of the non-conductive surface of the substrate to form a protective layer. The conductive side of the substrate is then laminated roll-to-roll with a layer of dry film.

在其中一个实施例中,所述基材分为产品区和非产品区,所述保护层的尺寸大于所述基材的非导电面的产品区的尺寸。In one embodiment, the substrate is divided into a product area and a non-product area, and the size of the protective layer is larger than that of the product area on the non-conductive surface of the substrate.

在其中一个实施例中,在所述基材的非导电面印刷油墨形成保护层之后,还进行烘烤的步骤。In one embodiment, after the protective layer is formed by printing ink on the non-conductive surface of the substrate, a baking step is also performed.

在其中一个实施例中,所述烘烤为红外线烘烤。In one embodiment, the baking is infrared baking.

在其中一个实施例中,所述烘烤的温度为100℃。In one embodiment, the baking temperature is 100°C.

在其中一个实施例中,在压合干膜之后,进行自动裁切成片料的步骤。In one of the embodiments, after laminating the dry film, the step of automatically cutting into sheets is performed.

上述卷对卷电容产品印刷工艺,直接在卷状基材的非导电面上贴合保护胶,然后再在基材的导电面卷对卷的压合一层干膜。对基材的成卷进行作业,提高生产效率,同时也避免在生产过程中人为擦伤,刮花等等。In the roll-to-roll capacitance product printing process described above, a protective adhesive is directly pasted on the non-conductive surface of the roll substrate, and then a layer of dry film is laminated roll-to-roll on the conductive surface of the substrate. Work on the roll of the substrate to improve production efficiency, and at the same time avoid artificial abrasions, scratches, etc. during the production process.

所述保护胶的尺寸大于所述基材的非导电面的尺寸。充分保护产品区域内不被刮花。。The size of the protective glue is larger than the size of the non-conductive surface of the substrate. Fully protect the product area from being scratched. .

在所述基材的非导电面形成保护层之后,还进行烘烤的步骤。通过烘烤使油墨由液态转化为固态。所述烘烤为红外线烘烤。优选的,所述烘烤的温度为100±5℃。在此烘烤温度下,能使保护层充分干燥,同时对导电面贴合的干膜烘烤不造成影响。After the protective layer is formed on the non-conductive surface of the substrate, a baking step is also performed. The ink is converted from liquid to solid by baking. The baking is infrared baking. Preferably, the baking temperature is 100±5°C. At this baking temperature, the protective layer can be fully dried, and at the same time, it will not affect the baking of the dry film bonded to the conductive surface.

具体实施方式 Detailed ways

以下结合实施例对做进一步的说明。Below in conjunction with embodiment to do further description.

一种卷对卷电容产品印刷工艺,包括以下步骤:提供基材,所述基材包括导电面和非导电面,所述基材成卷状。提供液态油墨,利用印刷机将所述油墨印刷在所述基材的非导电面的表面形成保护层。然后将所述基材的导电面卷对卷的压合一层干膜。在本实施例中,基材由PET、以及在PET上镀上一层ITO(氧化铟锡)组成,PET作为非导电层,其表面的镀层为导电层。A roll-to-roll capacitance product printing process includes the following steps: providing a base material, the base material includes a conductive surface and a non-conductive surface, and the base material is in a roll shape. Liquid ink is provided, and a printing machine is used to print the ink on the surface of the non-conductive surface of the substrate to form a protective layer. The conductive side of the substrate is then laminated roll-to-roll with a layer of dry film. In this embodiment, the base material is composed of PET and a layer of ITO (indium tin oxide) is plated on the PET, and the PET is used as a non-conductive layer, and the plated layer on its surface is a conductive layer.

所述基材分为产品区和非产品区,所述保护层的尺寸大于所述基材的非导电面的产品区的尺寸。The substrate is divided into a product area and a non-product area, and the size of the protective layer is larger than that of the product area of the non-conductive surface of the substrate.

在所述基材的非导电面印刷油墨形成保护层之后,还进行烘烤的步骤。After the non-conductive surface of the substrate is printed with ink to form a protective layer, a baking step is also performed.

所述烘烤为红外线烘烤。The baking is infrared baking.

所述烘烤的温度为100±5℃。The baking temperature is 100±5°C.

在压合干膜之后,进行自动裁切成片料的步骤。After pressing the dry film, the step of automatic cutting into sheets is carried out.

上述卷对卷电容产品印刷工艺,直接在卷状基材的非导电面上贴合保护层,然后再在基材的导电面卷对卷的压合一层干膜。对基材的成卷进行作业,提高生产效率,同时也避免在生产过程中人为擦伤,刮花等等。In the roll-to-roll capacitance product printing process described above, a protective layer is directly laminated on the non-conductive surface of the roll-shaped substrate, and then a layer of dry film is rolled-to-roll laminated on the conductive surface of the substrate. Work on the roll of the substrate to improve production efficiency, and at the same time avoid artificial abrasions, scratches, etc. during the production process.

所述保护层的尺寸大于所述基材的非导电面的尺寸。充分保护产品区域内不被刮花。The size of the protective layer is larger than the size of the non-conductive side of the substrate. Fully protect the product area from being scratched.

在所述基材的非导电面贴合所述保护层之后,还进行烘烤的步骤。通过烘烤使油墨由液态转化为固态。所述烘烤为红外线烘烤。优选的,所述烘烤的温度为100±5℃。在此烘烤温度下,能使保护层充分干燥,同时对导电面贴合的干膜烘烤不造成影响。After the protective layer is pasted on the non-conductive surface of the substrate, a step of baking is also performed. The ink is converted from liquid to solid by baking. The baking is infrared baking. Preferably, the baking temperature is 100±5°C. At this baking temperature, the protective layer can be fully dried, and at the same time, it will not affect the baking of the dry film bonded to the conductive surface.

以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims (1)

1.一种卷对卷电容产品印刷工艺,其特征在于,包括以下步骤:1. A roll-to-roll capacitance product printing process is characterized in that, comprising the following steps: 提供基材,所述基材包括导电面和非导电面,所述基材成卷状;providing a substrate, the substrate includes a conductive surface and a non-conductive surface, and the substrate is rolled; 提供液态油墨;Provide liquid ink; 利用印刷机将所述油墨印刷在所述基材的非导电面的表面形成保护层,所述基材分为产品区和非产品区,所述保护层的尺寸大于所述基材的非导电面的产品区的尺寸;Utilize a printing machine to print the ink on the surface of the non-conductive surface of the substrate to form a protective layer, the substrate is divided into a product area and a non-product area, and the size of the protective layer is larger than the non-conductive surface of the substrate. Dimensions of the product area of the face; 进行红外线烘烤,所述烘烤温度为100±5℃;Infrared baking is carried out, and the baking temperature is 100±5°C; 然后将所述基材的导电面卷对卷的压合一层干膜;Then the conductive surface of the base material is laminated with a layer of dry film roll-to-roll; 将压合干膜之后的所述基材自动裁切成片料。The substrate after laminating the dry film is automatically cut into sheets.
CN201210271582.8A 2012-07-31 2012-07-31 Roll-to-roll printing process of capacitance product Expired - Fee Related CN102765267B (en)

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CN103313518B (en) * 2013-06-25 2016-04-06 惠州中京电子科技股份有限公司 A kind of manufacture method of FPC one side Ultrathin substrate circuit
CN103831342A (en) * 2014-03-05 2014-06-04 艾柯豪博(苏州)电子有限公司 Roll-to-roll insulating varnish printing process of stamping parts
CN106313859A (en) * 2016-08-12 2017-01-11 深圳市骏达光电股份有限公司 ITO coiled material integrated processing technology

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CN102508583A (en) * 2011-09-30 2012-06-20 南京华显高科有限公司 Preparation method for metal lead of capacitance type touch screen

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US5567328A (en) * 1995-06-08 1996-10-22 The Whitaker Corporation Medical circuit forming process
CN101340778A (en) * 2007-07-06 2009-01-07 富葵精密组件(深圳)有限公司 Manufacturing method of hollow printed circuit board
CN101122105A (en) * 2007-08-07 2008-02-13 河南金芒果印刷有限公司 Gravure technique for making white cardboard having same surface effect as gold cardboard
CN201563300U (en) * 2009-12-10 2010-08-25 昆山市线路板厂 Continuous dry film laminating system for flexible circuit board
CN102508583A (en) * 2011-09-30 2012-06-20 南京华显高科有限公司 Preparation method for metal lead of capacitance type touch screen

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