CN1233212C - 元件箱的标识装置 - Google Patents
元件箱的标识装置 Download PDFInfo
- Publication number
- CN1233212C CN1233212C CNB028122704A CN02812270A CN1233212C CN 1233212 C CN1233212 C CN 1233212C CN B028122704 A CNB028122704 A CN B028122704A CN 02812270 A CN02812270 A CN 02812270A CN 1233212 C CN1233212 C CN 1233212C
- Authority
- CN
- China
- Prior art keywords
- data medium
- data
- plug
- mounting
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53478—Means to assemble or disassemble with magazine supply
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
- General Factory Administration (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10119232.0 | 2001-04-19 | ||
DE10119232A DE10119232C1 (de) | 2001-04-19 | 2001-04-19 | Einrichtung zum Kennzeichnen von mit einer Mehrzahl zu bestückender elektrischer Bauelemente versehenen Bauelemententrägern und Verfahren zur Verwendung der Einrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1518853A CN1518853A (zh) | 2004-08-04 |
CN1233212C true CN1233212C (zh) | 2005-12-21 |
Family
ID=7681996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028122704A Expired - Fee Related CN1233212C (zh) | 2001-04-19 | 2002-04-03 | 元件箱的标识装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6901311B2 (zh) |
EP (1) | EP1380197B1 (zh) |
CN (1) | CN1233212C (zh) |
DE (2) | DE10119232C1 (zh) |
WO (1) | WO2002087302A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7273166B2 (en) * | 2002-11-11 | 2007-09-25 | Fuji Machine Mfg. Co., Ltd. | Component information applying method and apparatus |
DE10356676B4 (de) * | 2003-12-04 | 2012-07-19 | Giesecke & Devrient Gmbh | Elektronisches Gerät mit einem Sicherheitsmodul |
US9182480B2 (en) * | 2005-01-28 | 2015-11-10 | Hewlett-Packard Development Company, L.P. | Information technology (IT) equipment positioning system |
DE102005006400A1 (de) * | 2005-02-11 | 2006-08-24 | Siemens Ag | Verfahren zum Zuführen von Bauelementen und Bestückautomat |
DE102005062024B4 (de) * | 2005-12-22 | 2022-12-08 | Innovative Sensor Technology Ist Ag | Vorrichtung zur Ausgabe eines Sensorelements und Verfahren zur Herstellung eines Messgeräts |
DE102007017123B3 (de) * | 2007-04-11 | 2008-08-21 | Siemens Ag | Positionsbestimmung von mit elektronischen Bauelementen befüllten Gebinden in Gebinde-Aufnahmevorrichtung |
DE102007017120A1 (de) | 2007-04-11 | 2008-10-23 | Siemens Ag | Zuordnung zwischen Gebinde-Aufnahmefach und Bauelement-Zuführvorrichtung mittels Führungselement |
DE102007046346A1 (de) * | 2007-09-27 | 2009-04-23 | Siemens Ag | Instandhaltung einer auswechselbaren Komponente einer Bestückvorrichtung |
JP5875229B2 (ja) * | 2011-01-31 | 2016-03-02 | 富士機械製造株式会社 | 対デバイス固定体、その対デバイス固定体が取り付けられたデバイスである部品保持ヘッド,部品フィーダ、およびその対デバイス固定体を用いて構成された製造作業機 |
US9446908B2 (en) * | 2012-02-05 | 2016-09-20 | Matthews Resources, Inc. | Conveying systems and methods of associating data with an item transported by a conveying system |
EP3047716A2 (en) * | 2013-09-18 | 2016-07-27 | Mycronic AB | Method, system and device for providing information to an smt system operator |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH550783A (de) * | 1971-11-24 | 1974-06-28 | Ciba Geigy Ag | Verfahren zur herstellung von neuen glycidylurethanverbindungen und ihre verwendung. |
US4787143A (en) * | 1985-12-04 | 1988-11-29 | Tdk Corporation | Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor |
JPH0776364A (ja) * | 1993-09-07 | 1995-03-20 | Matsushita Electric Ind Co Ltd | 部品供給テープ |
GB9405961D0 (en) * | 1994-03-25 | 1994-05-11 | Road Technology Uk Ltd | Method & means for the identification of electronic assemblies |
DE19651566B4 (de) * | 1996-12-11 | 2006-09-07 | Assa Abloy Identification Technology Group Ab | Chip-Modul sowie Verfahren zu dessen Herstellung und eine Chip-Karte |
DE19804594A1 (de) * | 1998-02-05 | 1999-08-19 | Siemens Ag | Transportvorrichtung |
DE19814159C2 (de) * | 1998-03-30 | 2000-04-13 | Siemens Ag | Stellantrieb für ein pneumatisches Ventil eines Bestückkopfes für elektrische Bauelemente |
US6718629B1 (en) * | 1999-04-30 | 2004-04-13 | Siemens Aktiengesellschaft | Method and apparatus for mounting components onto a substrate of an electrical assembly |
DE19940584A1 (de) * | 1999-08-26 | 2001-03-22 | Siemens Ag | Verfahren und System zum Bestücken von in einer Bestückungseinheit angeordneten Schaltungsträgern |
US6779726B1 (en) * | 1999-11-03 | 2004-08-24 | Solectron Corporation | Method and apparatus for controlling a production operation using printed information on a component tape |
US6332536B2 (en) * | 1999-11-03 | 2001-12-25 | Solectron Corporation | Component tape including a printed component count |
DE29919674U1 (de) * | 1999-11-09 | 2000-05-18 | Asys Automatisierungssysteme GmbH, 89160 Dornstadt | Steuerungssystem |
US6415977B1 (en) * | 2000-08-30 | 2002-07-09 | Micron Technology, Inc. | Method and apparatus for marking and identifying a defective die site |
US6778878B1 (en) * | 2000-11-27 | 2004-08-17 | Accu-Assembly Incorporated | Monitoring electronic component holders |
-
2001
- 2001-04-19 DE DE10119232A patent/DE10119232C1/de not_active Expired - Fee Related
-
2002
- 2002-04-03 CN CNB028122704A patent/CN1233212C/zh not_active Expired - Fee Related
- 2002-04-03 DE DE50209719T patent/DE50209719D1/de not_active Expired - Lifetime
- 2002-04-03 EP EP02724126A patent/EP1380197B1/de not_active Expired - Lifetime
- 2002-04-03 US US10/475,178 patent/US6901311B2/en not_active Expired - Fee Related
- 2002-04-03 WO PCT/DE2002/001210 patent/WO2002087302A1/de active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US20040148762A1 (en) | 2004-08-05 |
DE50209719D1 (de) | 2007-04-26 |
EP1380197A1 (de) | 2004-01-14 |
DE10119232C1 (de) | 2002-12-05 |
WO2002087302A1 (de) | 2002-10-31 |
CN1518853A (zh) | 2004-08-04 |
EP1380197B1 (de) | 2007-03-14 |
US6901311B2 (en) | 2005-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LIMITED PARTN Free format text: FORMER OWNER: SIEMENS AG Effective date: 20090925 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090925 Address after: Munich, Germany Patentee after: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG Address before: Munich, Germany Patentee before: Siemens AG |
|
C56 | Change in the name or address of the patentee |
Owner name: ADVANCED ASSEMBLY SYSTEMS GMBH + CO. KG Free format text: FORMER NAME: SIEMENS AG (DE) |
|
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: ASM Assembly Systems GmbH & Co. KG Address before: Munich, Germany Patentee before: SIEMENS ELECTRONICS ASSEMBLY SYSTEMS GmbH & Co.KG |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051221 Termination date: 20160403 |
|
CF01 | Termination of patent right due to non-payment of annual fee |