CN1218387C - IC package capable of improving signal quality - Google Patents
IC package capable of improving signal quality Download PDFInfo
- Publication number
- CN1218387C CN1218387C CN021017271A CN02101727A CN1218387C CN 1218387 C CN1218387 C CN 1218387C CN 021017271 A CN021017271 A CN 021017271A CN 02101727 A CN02101727 A CN 02101727A CN 1218387 C CN1218387 C CN 1218387C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- substrate
- signal quality
- passive component
- connection gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Combinations Of Printed Boards (AREA)
Abstract
The present invention relates to an IC package element for improving the signal quality. The present invention comprises a PBGA substrate, a wafer, a plurality of outside terminals, a plurality of first connection pads, a passive element carrier, a plurality of second connection pad and a plurality of passive elements, wherein the PBGA substrate has a first surface and a second surface; the wafer is packed on the first surface of the PBGA substrate; the outside terminals are assembled on the first surface of the PBGA substrate; the first connection pads are arranged on the circumference of the first surface of the PBGA substrate and are connected with the corresponding outside terminals; the passive element carrier has a first surface and a second surface; the second surface of the passive element carrier faces the first surface of the PBGA substrate; the second connection pads are arranged on the second surface of the passive element carrier and are engaged with the first connection pads of the first surface of the PBGA substrate; the passive elements are arranged on the first surface of the passive element carrier, and are connected with the second connection pads; each second connection pad is at least connected with one passive element.
Description
Technical field
The present invention is about a kind of electronic encapsulated components (electronic package), particularly passive component (passive component) bearing substrate is assembled in ball grid array (ball grid array about a kind of, BGA) the integrated circuit potted element of substrate is used and is improved signal quality.
Background of invention
BGA Package is the surface mount encapsulation of a kind of integrated circuit (IC) chip (integrated circuit chip, IC chip).Wherein IC chip nationality is engaged by wire bonding (Wire Bonding), upside-down method of hull-section construction (Flip Chip) or winding that (Tape Automatic Bonding, TAB) etc. technology is adhered to the weld pad on intermediary layer (Interposer) surface with it.This intermediary layer is generally minitype circuit board I/O and extends out through the circuit of packaging housing.
In the application of high speed numerical digit, the substrate intraconnections of intraconnections, intermediary layer and BGA in the chip may show electron resonance (electrical resonance) and reflect (refiection) and the reliability of reduction signal integrity and electronic system.The problem that common above-mentioned signal quality reduces can be even more serious along with improving signal frequency.Moreover if reduce power supply supply voltage for power saving, electronics noise filter capacity diminishes, thereby for signal integrity worse influence will be arranged.
Past, at signal path increase electric capacity (caPacitor) or resistance passive components such as (resistor) reduces or eliminates undesired resonance or signal reflex (filtration noise) for example, one of method was for to be arranged at printed circuit board (PCB) (printed circuit board with passive component usually; PCB) on, yet the method is eliminated the effect deficiency of noise.Other method is that passive component is embedded in the BGA substrate, yet the method will make packaging technology complicated, and because the space of BGA substrate is quite limited, can't hold the passive component of sufficient amount.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of IC potted element that improves signal quality, use the passive component that can hold sufficient amount.
In addition, another object of the present invention is to provide a kind of IC potted element that improves signal quality, use and passive component and ground plane and bus plane can be furthered, eliminate the effect of noise to promote passive component.
According to above-mentioned purpose, the objective of the invention is to be directed to above-mentioned known techniques and propose the improvement, the invention provides a kind of IC potted element that improves signal quality, comprising: one first substrate, above-mentioned first substrate have a first surface and a second surface; One Chip Packaging is on the above-mentioned first surface of above-mentioned first substrate; A plurality of outside terminals are assemblied on the above-mentioned second surface of above-mentioned first substrate; A plurality of first connection gaskets are positioned at the periphery of the above-mentioned first surface of above-mentioned first substrate, are connected with corresponding outside terminal; One second substrate has a first surface and a second surface, and the above-mentioned second surface of above-mentioned second substrate is in the face of the above-mentioned first surface of above-mentioned first substrate; A plurality of second connection gaskets are positioned at the above-mentioned second surface of above-mentioned second substrate, and engage with above-mentioned first connection gasket of the above-mentioned first surface of above-mentioned first substrate; And a plurality of passive components are disposed at the above-mentioned first surface of above-mentioned second substrate, and above-mentioned passive component is connected with above-mentioned second connection gasket, and each second connection gasket connects a passive component at least.
One of feature of the present invention is, is used as the microscope carrier of passive component by the second external substrate, is assembled in the plastic cement BGA substrate of being used as first substrate.
Moreover among the above-mentioned IC potted element that improves signal quality, above-mentioned second substrate is annular hollow or quadra.
Moreover, the above-mentioned IC potted element that improves signal quality, wherein passive component is an electric capacity.
Moreover among the above-mentioned IC potted element that improves signal quality, passive component is in the above-mentioned first surface of above-mentioned second substrate by conducting resinl or solder bonds.
And, among the above-mentioned IC potted element that improves signal quality, the bus plane and/or the ground plane electrically conducting of one of first connection gasket and above-mentioned first substrate.
Moreover in the above-mentioned IC potted element that improves signal quality, first connection gasket utilizes conducting resinl or scolder to engage with second connection gasket.
According to the present invention,, can make interior bus plane and the ground planes of the close plastic cement ball-type grid array substrate of passive component such as electric capacity compared to passive component being arranged on the large-sized print circuit board.On the other hand,, adopt shaped as frame second substrate of the embodiment of the invention, can hold more a plurality of passive components, use and improve signal quality compared to passive component being embedded in the encapsulating material substrate; In addition, according to the present invention, can connect electric capacity in parallel, and promote the ability that passive component is eliminated noise; Moreover, according to the present invention, do not need passive component is embedded in the base plate for packaging, can simplify the technology of encapsulation.
Description of drawings
Fig. 1 is the schematic perspective view of the embodiment of the invention second substrate (passive component microscope carrier);
Fig. 2 is inlaid with the schematic perspective view of first substrate (plastic cement ball grid array base plate) of chip for the embodiment of the invention;
Fig. 3 is the combination schematic front view of the embodiment of the invention first substrate and second substrate;
Fig. 4 is first substrate of the embodiment of the invention and the internal cross section figure of second substrate;
Fig. 5 is first substrate of another embodiment of the present invention and the internal cross section figure of second substrate.
Symbol description
10 first substrates (PBGA substrate); The first surface of 10a first substrate;
The second surface of 10b first substrate; 12 outside terminals (metal soldered ball);
14,141,142 first connection gaskets; 16 integrated circuit (IC) chip;
20 second substrates (passive component microscope carrier); The first surface of 20a second substrate;
The second surface of 20b second substrate; 22 passive components (electric capacity);
28,281,282 second connection gaskets.
Embodiment
First embodiment
Below utilize the front view of two substrates combination of stereogram, Fig. 3 of the second substrate stereogram shown in Figure 1, first substrate shown in Figure 2 and substrate two substrates internal cross section figure shown in Figure 4, with the explanation embodiment of the invention.
Fig. 1 shows the square frame shape microscope carrier (supporting frame) of being used as second substrate 20, utilize conducting resinl (Conductive Adhesive) or surface installation technique (SMT) scolder that decoupling capacitance passive components (passive component) such as (decoupling capacitor) is fixed in the upper surface of second substrate 20, the lower surface of second substrate 20 is then reserved the connection gasket (Fig. 1 does not show) with the connection gasket relative position of base plate for packaging.Fig. 2 shows plastic cement ball-type grid array substrate (the plastic ball grid array that is used as first substrate (base plate for packaging) 10; PBGA), its inside comprises signals layer (singnal layer), ground plane (ground layer) and the bus plane (Powerlayer) of follow-up explanation, symbol 12 expressions are used for being used as the metal soldered ball (metal ball) of outside terminal (external terminal), symbol 14 then is the connection gasket that expression is positioned at first substrate, 10 upper surfaces, is used for being electrically connected with the connection gasket of second substrate 20.Symbol 16 expressions are embedded in the integrated circuit (IC) chip of first substrate 10.
Then, please refer to Fig. 3, expression is with the schematic diagram of first substrate, 10 second substrates, 20 combination structure dresses, when two substrates 10,20 combinations, with respect to passive component being arranged on the large-sized print circuit board (PCB), the embodiment of the invention can make passive component such as electric capacity near bus plane and ground plane within the plastic cement ball-type grid array substrate.On the other hand,, adopt shaped as frame second substrate of the embodiment of the invention, can hold more a plurality of passive components, use the ability of improving signal quality that promotes with respect to passive component being embedded in the encapsulating material substrate.
Then, please refer to Fig. 4, symbol 10,20 is represented first substrate of plastic cement ball-type grid array and second substrate of microscope carrier respectively, and first substrate 10 is multi-ply construction, and wherein symbol S represents signals layer, G represents ground plane, and P represents bus plane, and metal contact hole 18 connects bus plane P and the connection gasket 141 that is positioned at first surface 10a, in addition, the connection gasket 142 that metal contact hole 19 connects ground plane G and is positioned at first surface 10a, and can be connected in external circuit by metal soldered ball 12.
The upper surface 20a of second substrate 20 is provided with connection gasket 26, with junction capacitance (passive component) in second substrate 20, electrically conduct respectively in the connection gasket 281,282 that is arranged on lower surface 20b by metal contact hole 32,34 again, so that utilize bonding materials such as conducting resinl, scolder to engage with the connection gasket 141,142 of first substrate 10.
Second embodiment
Below utilize first substrate shown in Figure 5 and the internal cross section figure of second substrate, with the explanation second embodiment of the invention.
Present embodiment, except the electric capacity 22 and 22 ' with parallel connection was connected in second substrate 20, all the other were all identical with first embodiment.
In sum, one of feature of the present invention is, is used as the microscope carrier of passive component by the second external substrate, is assembled in the plastic cement BGA substrate of being used as first substrate, and therefore, the present invention has the following advantages at least:
1,,, can make interior bus plane and the ground planes of the close plastic cement ball-type grid array substrate of passive component such as electric capacity with respect to passive component being arranged on the large-sized print circuit board according to the present invention.On the other hand,, adopt shaped as frame second substrate of the embodiment of the invention, can hold more a plurality of passive components, use and improve signal quality with respect to passive component being embedded in the encapsulating material substrate.
2, in addition, according to the present invention, can connect electric capacity in parallel, and promote the ability that passive component is eliminated noise.
3 moreover, according to the present invention, do not need passive component is embedded in the base plate for packaging, can simplify the technology of encapsulation.
Though the present invention discloses as above with preferred embodiment; right its is not in order to restriction the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the present invention; change and retouching when doing, so protection scope of the present invention is as the criterion when defining with claim.
Claims (10)
1. IC potted element that can improve signal quality is characterized in that comprising:
One first substrate, above-mentioned first substrate has a first surface and a second surface;
One Chip Packaging is on the above-mentioned first surface of above-mentioned first substrate;
A plurality of outside terminals are assemblied on the above-mentioned second surface of above-mentioned first substrate;
A plurality of first connection gaskets are positioned at the periphery of the above-mentioned first surface of above-mentioned first substrate, are connected with corresponding outside terminal;
One second substrate has a first surface and a second surface, and the above-mentioned second surface of above-mentioned second substrate is in the face of the above-mentioned first surface of above-mentioned first substrate;
A plurality of second connection gaskets are positioned at the above-mentioned second surface of above-mentioned second substrate, and engage with above-mentioned first connection gasket of the above-mentioned first surface of above-mentioned first substrate; And
A plurality of passive components are disposed at the above-mentioned first surface of above-mentioned second substrate, and above-mentioned passive component is connected with above-mentioned second connection gasket, and each second connection gasket connects a passive component at least.
2. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned second substrate is an annular hollow.
3. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned second substrate is a square frame shape.
4. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned passive component is an electric capacity.
5. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned passive component is the above-mentioned first surface that is engaged in above-mentioned second substrate by conducting resinl.
6. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned passive component is by the above-mentioned first surface of solder bonds in above-mentioned second substrate.
7. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that the bus plane electrically conducting of one of above-mentioned first connection gasket and above-mentioned first substrate.
8. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that the ground plane electrically conducting of one of above-mentioned first connection gasket and above-mentioned first substrate.
9. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned first connection gasket and second connection gasket are to utilize conducting resinl to engage.
10. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned first connection gasket and second connection gasket are to utilize scolder to engage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN021017271A CN1218387C (en) | 2002-01-14 | 2002-01-14 | IC package capable of improving signal quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN021017271A CN1218387C (en) | 2002-01-14 | 2002-01-14 | IC package capable of improving signal quality |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1433066A CN1433066A (en) | 2003-07-30 |
| CN1218387C true CN1218387C (en) | 2005-09-07 |
Family
ID=27627364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN021017271A Expired - Fee Related CN1218387C (en) | 2002-01-14 | 2002-01-14 | IC package capable of improving signal quality |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1218387C (en) |
-
2002
- 2002-01-14 CN CN021017271A patent/CN1218387C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1433066A (en) | 2003-07-30 |
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