CN1433066A - IC package capable of improving signal quality - Google Patents
IC package capable of improving signal quality Download PDFInfo
- Publication number
- CN1433066A CN1433066A CN02101727A CN02101727A CN1433066A CN 1433066 A CN1433066 A CN 1433066A CN 02101727 A CN02101727 A CN 02101727A CN 02101727 A CN02101727 A CN 02101727A CN 1433066 A CN1433066 A CN 1433066A
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- China
- Prior art keywords
- mentioned
- substrate
- signal quality
- connection gasket
- passive device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The IC package capable of improving signal quality includes one PBGA substrate with the first surface and the second surface; one chip packed on the first surface of the PBGA substrate; outer terminals on the first surface of the PBGA substrate; the first connecting pads around the first surface of the PBGA substrate and connected to corresponding outer terminals; one passive element carrier with the first surface and the second surface opposite to the first surface of the PBGA substrate; the second connecting pads on the second surface of the passive element carrier and connected to the first connecting pads; and passive elements on the first surface of the passive element carrier and connected to the second connecting pads, with each of the second connecting pads being connected to at least one passive element.
Description
Technical field
The present invention system is about a kind of electronic encapsulated components (electronic package), particularly passive device (passive component) bearing substrate is assembled in ball grid array (ball gridarray about a kind of, BGA) the integrated circuit potted element of substrate is used and is improved signal quality.
Background of invention
BGA Package is the surface mounted encapsulation of a kind of integrated circuit wafer (integrated circuit chip, IC chip).Wherein IC wafer nationality is engaged by bonding wire (Wire Bonding), chip bonding (Flip Chip) or winding that (Tape Automatic Bonding, technology such as TAB) is with its adhesive weld pad to intermediary layer (Interposer) surface.This intermediary layer is generally minitype circuit board I/O and extends out through the circuit of packaging housing.
In the application of high speed numerical digit, the substrate intraconnections of intraconnections, intermediary layer and BGA in the wafer may show electron resonance (electrical resonance) and reflect (refiection) and the reliability of reduction signal integrality and electronic system.The problem that common above-mentioned signal quality reduces can be even more serious with work raising signal frequency.Moreover if reduce power supply supply voltage for power saving, electronics noise filter capacity diminishes, thereby for the signal integrality worse influence will be arranged.
Past for example increases electric capacity (caPacitor) usually in the signal path or resistance passive devices such as (resistor) reduces or eliminates undesired resonance or signal reflection (filtration noise), and one of method is for to be arranged at printed circuit board (PCB) (printed circuit board with passive device; PCB) on, yet the method is eliminated the effect deficiency of noise.Other method is that passive device is embedded in the BGA substrate, yet the method will make encapsulation procedure complicated, and because the space of BGA substrate is quite limited, can't hold the passive device of sufficient amount.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of IC potted element that improves signal quality, use the passive device that can hold sufficient amount.
In addition, another object of the present invention is to provide a kind of IC potted element that improves signal quality, use and passive device and ground plane and bus plane can be furthered, eliminate the effect of noise to promote passive device.
According to above-mentioned purpose, purpose of the present invention is to be directed to above-mentioned known techniques and to propose improvement, the invention provides a kind of IC potted element that improves signal quality, and comprising: one first substrate, above-mentioned first substrate have a first surface and a second surface; One wafer package is on the above-mentioned first surface of above-mentioned first substrate; The plural number outside terminal is assemblied on the above-mentioned second surface of above-mentioned first substrate; Plural number first connection gasket is positioned at the periphery of the above-mentioned first surface of above-mentioned first substrate, is connected with corresponding outside terminal; One second substrate has a first surface and a second surface, and the above-mentioned second surface of above-mentioned second substrate is the above-mentioned first surface in the face of above-mentioned first substrate; Plural number second connection gasket is positioned at the above-mentioned second surface of above-mentioned second substrate, and engages with above-mentioned first connection gasket of the above-mentioned first surface of above-mentioned first substrate; And plural passive device is disposed at the above-mentioned first surface of above-mentioned second substrate, and above-mentioned passive device is connected with above-mentioned second connection gasket, and each second connection gasket connects a passive device at least.
One of characteristic of the present invention is, is used as the microscope carrier of passive device by the second external substrate, is assembled in the plastic cement BGA substrate of being used as first substrate.
Moreover among the above-mentioned IC potted element that improves signal quality, above-mentioned second substrate is annular hollow or quadra.
Moreover, the above-mentioned IC potted element that improves signal quality, wherein passive device is an electric capacity.
Moreover, among the above-mentioned IC potted element that improves signal quality, passive device system by conducting resinl or solder bonds in the above-mentioned first surface of above-mentioned second substrate.
And, among the above-mentioned IC potted element that improves signal quality, first connection gasket one with the bus plane and/or the ground plane electrically conducting of above-mentioned first substrate.
Moreover in the above-mentioned IC potted element that improves signal quality, first connection gasket utilizes conducting resinl or scolder to engage with second connection gasket system.
According to the present invention,, can make interior bus plane and the ground planes of the close plastic cement ball-type grid array substrate of passive device such as electric capacity compared to passive device being arranged on the large-sized print circuit board.On the other hand,, adopt shaped as frame second substrate of the embodiment of the invention, can hold more a plurality of passive devices, use and improve signal quality compared to passive device being embedded in the encapsulating material substrate; In addition, according to the present invention, can connect electric capacity in parallel, and promote the ability that passive device is eliminated noise; Moreover, according to the present invention, do not need passive device is embedded in the base plate for packaging, can simplify the processing procedure of encapsulation.
Description of drawings
Fig. 1 is the schematic perspective view of the embodiment of the invention second substrate (passive device microscope carrier);
Fig. 2 is inlaid with the schematic perspective view of first substrate (plastic cement ball grid array base plate) of wafer for the embodiment of the invention;
Fig. 3 is the combination schematic front view of the embodiment of the invention first substrate and second substrate;
Fig. 4 is first substrate of the embodiment of the invention and the internal cross section figure of second substrate;
Fig. 5 is first substrate of another embodiment of the present invention and the internal cross section figure of second substrate.
Symbol description
10 first substrates (PBGA substrate); The first surface of 10a first substrate;
The second surface of 10b first substrate; 12 outside terminals (metal soldered ball);
14,141,142 first connection gaskets; 16 integrated circuit (IC) wafer;
20 second substrates (passive device microscope carrier); The first surface of 20a second substrate;
The second surface of 20b second substrate; 22 passive devices (electric capacity);
28,281,282 second connection gaskets.
Embodiment
First embodiment
Below utilize the front view of two substrates combination of stereogram, Fig. 3 of the second substrate stereogram shown in Figure 1, first substrate shown in Figure 2 and substrate two substrates internal cross section figure shown in Figure 4, with the explanation embodiment of the invention.
Fig. 1 shows the square frame shape microscope carrier (supporting frame) of being used as second substrate 20, utilize conducting resinl (Conductive Adhesive) or surface mounted (SMT) scolder that decoupling capacitance passive devices (passive component) such as (decoupling capacitor) is fixed in the upper surface of second substrate 20, the lower surface of second substrate 20 is then reserved the connection gasket (Fig. 1 does not show) with the connection gasket relative position of base plate for packaging.Fig. 2 shows plastic cement ball-type grid array substrate (the plastic ball grid array that is used as first substrate (base plate for packaging) 10; PBGA), its inside comprises signal layer (singnal layer), ground plane (ground layer) and the bus plane (Powerlayer) of follow-up explanation, symbol 12 expressions are used for being used as the metal soldered ball (metal ball) of outside terminal (external terminal), symbol 14 then is the connection gasket that expression is positioned at first substrate, 10 upper surfaces, is used for being electrically connected with the connection gasket of second substrate 20.Symbol 16 expressions are embedded in the integrated circuit (IC) wafer of first substrate 10.
Now, please refer to Fig. 3, expression is with the schematic diagram of first substrate, 10 second substrates, 20 combination structure dresses, when two substrates 10,20 combinations, compared to passive device being arranged on the large-sized print circuit board (PCB), the embodiment of the invention can make passive device such as electric capacity near bus plane and ground plane within the plastic cement ball-type grid array substrate.On the other hand,, adopt shaped as frame second substrate of the embodiment of the invention, can hold more a plurality of passive devices, use the ability of improving signal quality that promotes compared to passive device being embedded in the encapsulating material substrate.
Then, please refer to Fig. 4, symbol 10,20 is represented first substrate of plastic cement ball-type grid array and second substrate of microscope carrier respectively, and first substrate 10 is multi-ply construction, and wherein symbol S represents the signal layer, G represents ground plane, and P represents bus plane, and metal contact hole 18 connects bus plane P and the connection gasket 141 that is positioned at first surface 10a, in addition, the connection gasket 142 that metal contact hole 19 connects ground plane G and is positioned at first surface 10a, and can be connected in external circuit by metal soldered ball 12.
The upper surface 20a of second substrate 20 is provided with connection gasket 26, with junction capacitance (passive device) in second substrate 20, electrically conduct respectively in the connection gasket 281,282 that is arranged on lower surface 20b by metal contact hole 32,34 again, so that utilize bonding materials such as conducting resinl, scolder to engage with the connection gasket 141,142 of first substrate 10.
Second embodiment
Below utilize first substrate shown in Figure 5 and the internal cross section figure of second substrate, with the explanation second embodiment of the invention.
Present embodiment, except the electric capacity 22 and 22 ' with parallel connection was connected in second substrate 20, all the other were all identical with first embodiment.
In sum, one of characteristic of the present invention is, is used as the microscope carrier of passive device by the second external substrate, is assembled in the plastic cement BGA substrate of being used as first substrate, and therefore, the present invention has the following advantages at least:
1,,, can make interior bus plane and the ground planes of the close plastic cement ball-type grid array substrate of passive device such as electric capacity compared to passive device being arranged on the large-sized print circuit board according to the present invention.On the other hand,, adopt shaped as frame second substrate of the embodiment of the invention, can hold more a plurality of passive devices, use and improve signal quality compared to passive device being embedded in the encapsulating material substrate.
2, in addition, according to the present invention, can connect electric capacity in parallel, and promote the ability that passive device is eliminated noise.
3 moreover, according to the present invention, do not need passive device is embedded in the base plate for packaging, can simplify the processing procedure of encapsulation.
Though the present invention discloses as above with preferred embodiment; right its is not in order to restriction the present invention, anyly has the knack of this skill person, without departing from the spirit and scope of the present invention; change and retouching when doing, so protection scope of the present invention is as the criterion when defining with claim.
Claims (10)
1. IC potted element that can improve signal quality is characterized in that comprising:
One first substrate, above-mentioned first substrate has a first surface and a second surface;
One wafer package is on the above-mentioned first surface of above-mentioned first substrate;
The plural number outside terminal is assemblied on the above-mentioned second surface of above-mentioned first substrate;
Plural number first connection gasket is positioned at the periphery of the above-mentioned first surface of above-mentioned first substrate, is connected with corresponding outside terminal;
One second substrate has a first surface and a second surface, and the above-mentioned second surface of above-mentioned second substrate is the above-mentioned first surface in the face of above-mentioned first substrate;
Plural number second connection gasket is positioned at the above-mentioned second surface of above-mentioned second substrate, and engages with above-mentioned first connection gasket of the above-mentioned first surface of above-mentioned first substrate; And
The plural number passive device is disposed at the above-mentioned first surface of above-mentioned second substrate, and above-mentioned passive device is connected with above-mentioned second connection gasket, and each second connection gasket connects a passive device at least.
2. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned second substrate is an annular hollow.
3. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned second substrate is a square frame shape.
4. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned passive device is an electric capacity.
5. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned passive device is the above-mentioned first surface that is engaged in above-mentioned second substrate by conducting resinl.
6. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned passive device is by the above-mentioned first surface of solder bonds in above-mentioned second substrate
7. the IC potted element that improves signal quality as claimed in claim 1, it is characterized in that above-mentioned first connection gasket one with the bus plane electrically conducting of above-mentioned first substrate.
8. the IC potted element that improves signal quality as claimed in claim 1, it is characterized in that above-mentioned first connection gasket one with the ground plane electrically conducting of above-mentioned first substrate.
9. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned first connection gasket utilizes conducting resinl to engage with second connection gasket system.
10. the IC potted element that improves signal quality as claimed in claim 1 is characterized in that above-mentioned first connection gasket utilizes scolder to engage with second connection gasket system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN021017271A CN1218387C (en) | 2002-01-14 | 2002-01-14 | IC package capable of improving signal quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN021017271A CN1218387C (en) | 2002-01-14 | 2002-01-14 | IC package capable of improving signal quality |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1433066A true CN1433066A (en) | 2003-07-30 |
| CN1218387C CN1218387C (en) | 2005-09-07 |
Family
ID=27627364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN021017271A Expired - Fee Related CN1218387C (en) | 2002-01-14 | 2002-01-14 | IC package capable of improving signal quality |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1218387C (en) |
-
2002
- 2002-01-14 CN CN021017271A patent/CN1218387C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1218387C (en) | 2005-09-07 |
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