CN1215743C - 强化玻璃电路板的制造方法 - Google Patents

强化玻璃电路板的制造方法 Download PDF

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CN1215743C
CN1215743C CNB021203105A CN02120310A CN1215743C CN 1215743 C CN1215743 C CN 1215743C CN B021203105 A CNB021203105 A CN B021203105A CN 02120310 A CN02120310 A CN 02120310A CN 1215743 C CN1215743 C CN 1215743C
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glass
circuit board
silver slurry
tempered glass
strengthened glass
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CN1383355A (zh
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李武雄
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Shangzhun Balance Co Ltd
Shang Chuen Weighting Machine Co Ltd
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Priority to US10/194,218 priority patent/US20040009291A1/en
Priority to EP02255170A priority patent/EP1384701A1/en
Priority to CA002394932A priority patent/CA2394932A1/en
Priority to JP2002246480A priority patent/JP2004087773A/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/02—Annealing glass products in a discontinuous way
    • C03B25/025—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B32/00—Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/25—Metals
    • C03C2217/251—Al, Cu, Mg or noble metals
    • C03C2217/254—Noble metals
    • C03C2217/256—Ag
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/25—Metals
    • C03C2217/27—Mixtures of metals, alloys
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/10—Deposition methods
    • C03C2218/11—Deposition methods from solutions or suspensions
    • C03C2218/119—Deposition methods from solutions or suspensions by printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Treatment Of Glass (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

一种强化玻璃电路板的制造方法，其步骤是先于一玻璃表面用印刷网板均匀涂抹一层银浆，待银浆干涸后，再将玻璃由30℃逐步加温至450-550℃，玻璃表面与银浆经高温热熔而完全相互熔合，再持续加温至750±2℃，令玻璃达强化作用后，再逐步降温至室温，即呈现一强化玻璃电路板。可直接于强化玻璃表面进行焊接电路作用，取代并适用于任一需具导电的强化玻璃。具有成本低廉，不受气候影响，增加使用寿命，绝缘效果良好，符合环保及经济效益的功效。

Description

强化玻璃电路板的制造方法
技术领域
本发明是有关于一种强化玻璃电路板的制造方法，其是利用强化玻璃制作前，先将银浆用印刷网板涂抹于玻璃表面，再一起加温经热熔产生相互熔合成一强化玻璃电路板，并经由电镀防止银浆产生氧化，可直接于玻璃表面进行焊接，进而取代及适用于任一需具有导电作用的强化玻璃，且不受气候影响及使用寿命长和绝缘效果良好，达到环保效益及经济效益。
背景技术
目前，一般欲使玻璃具有导电作用时，大多是以软式线路板粘贴于玻璃的表面，或将导电线路洗入PC板较粗的毛细孔中而成。其主要缺陷在于：
由于软式线路板是以粘着剂粘贴于玻璃表面，一旦经日晒雨淋后，则易产生剥离及脱落现象，而致使导电效果不佳，进而需不定期更新，不仅使用寿命短，更易增加环保负担，且其亦需以人工的方式将软式线路板粘贴于玻级表面，而需耗费较高的成本，故不符经济效益。
一般市面上贩售的PC板成份均为纤维材质，故易造成环保问题，且软式线路板及PC板的表面因形成凸条状或凸粒状，而易遭刮伤，进而致使绝缘效果不佳。
发明内容
本发明的主要目的是提供一种强化玻璃电路板的制造方法，其是利用玻璃于制作前，先将银浆用印刷网板涂抹于玻璃表面，再一起加温经热熔产生相互熔合成一强化玻璃电路板，进而取代软式线路板及PC板，达到环保效益的目的。
本发明的第二目的是提供一种强化玻璃电路板的制造方法，该强化玻璃电路板不仅不受气候影响产生任何变化，且可直接于玻璃表面进行焊接，达到增加使用上的便利性的目的。
本发明的第三目的是提供一种强化玻璃电路板的制造方法，该强化玻璃电路板是适用于任一需具有导电的强化玻璃，故适用范围广，且无需粘贴软式线路板，达到降低成本和提升市场竞争力的目的。
本发明的第四目的是提供一种强化玻璃电路板，其银浆直接与玻璃表面相互熔合，不会遭到刮伤，达到较佳的绝缘效果的目的。
本发明的第五目的是提供一种强化玻璃电路板，该强化玻璃电路板经由电镀防止银浆氧化生锈，达到避免老化及延长使用寿命的目的。
本发明的第六目的是提供一种强化玻璃电路板应用，除可直接于强化玻璃表面进行焊接电路，形成强化玻璃电路板，取代软式线路板及PC板外，进而可以取代并适用于任一需具有导电的强化玻璃。
本发明的目的是这样实现的：一种强化玻璃电路板的制造方法，其特征是：它包括如下步骤：
(一)先取一玻璃，并于玻璃表面用印刷网板涂抹一层银浆，并待银浆干涸；
(二)银浆干涸后，再将玻璃输送入烧结隧道炉内由30℃逐步加温；
(三)待温度到450-550℃时，玻璃表面经高温热熔并同时与银浆完全相互熔合；
(四)再持续加温至750±2℃，令玻璃直接强化；
(五)玻璃达强化作用后，再逐步降温至室温30℃下，并经电镀防止氧化，即呈现一可抗氧防锈的强化玻璃电路板，直接于强化玻璃表面进行焊接电路，形成强化玻璃电路板。
该银浆的成份以重量份数计是：银粉68-72份、凝固剂78-82份、玻璃粉1-3份、树脂3-5份及有机溶剂14-19份。该银浆的粘度为400±50p。该银浆的干燥条件需于150℃保持十分钟。
本发明还提供一种强化玻璃电路板，其特征是：它是在玻璃的表面熔接有银浆层、电镀有抗氧防锈层和焊接有电路的结构。
该银浆层的成份以重量份数计是：银粉68-72份、凝固剂78-82份、玻璃粉1-3份、树脂3-5份及有机溶剂14-19份。
本发明又提供一种强化玻璃电路板的应用，其特征是：它适用于取代PC板及软式线路板。它还适用于任一需具有导电的强化玻璃。
下面结合较佳实施例配合附图详细说明。
附图说明
图1是本发明的制作流程示意图。
具体实施方式
参阅图1所示，本发明的制作方法包括如下步骤：
A、先取一玻璃，并于玻璃表面用印刷网板涂抹一层银浆，该银浆的成分和组成以重量分数计为银粉68-72份、凝固剂78-82份、玻璃粉1-3份、树脂3-5份及有机溶剂14-19份，其粘度为400±50p(泊)，并置于150℃，保持十分钟，待银浆干涸，由于其中的凝固剂、树脂及有机溶剂为本领域的技术人员所熟知的通用的原料，故不详述；
B、银浆干涸后，再将玻璃输送入烧结隧道炉内由30℃逐步加温；
C、待温度到450-550℃时，玻璃表面经高温热熔，并同时与银浆完全相互熔合；
D、再持续加温至750±2℃时，令玻璃直接强化；
E、玻璃达强化作用后，再逐步降温置于室温30℃下，并经电镀防止氧化，即呈现一可抗氧防锈的强化玻璃，可直接于强化玻璃表面进行焊接电路，形成强化玻璃电路板，可取代PC板及软式线路板。
本发明的方法制造的强化玻璃电路板是在玻璃的表面熔接有银浆层和电镀有抗氧防锈层。除可直接于强化玻璃表面进行焊接电路，形成强化玻璃电路板外，进而可以取代并适用于任一需具有导电的强化玻璃，例如：体脂肪体重秤的踏板感应区或装设于汽车后挡窗时，则可通过导电作用，达到除雾的功效。
综上所述，当知本发明具有产业上实用性与创造性，且本发明未见于任何刊物，亦具有新颖性。
以上所述，仅为本发明的较佳实施例而己，凡依本发明所作的均等变化与修饰，皆应属于本发明的保护范围之内。

Claims (3)

1、一种强化玻璃电路板的制造方法，其特征是：它包括如下步骤：
(一)先取一玻璃，并于玻璃表面用印刷网板涂抹一层银浆，并待银浆干涸；
(二)银浆干涸后，再将玻璃输送入烧结隧道炉内由30℃逐步加温；
(三)待温度到450-550℃时，玻璃表面经高温热熔与银浆完全相互熔合；
(四)再持续加温至750±2℃，令玻璃直接强化；
(五)玻璃达强化作用后，再逐步降温至室温30℃下，并经电镀防止氧化，即呈现一抗氧防锈的强化导电玻璃，直接于强化导电玻璃表面进行焊接电路，形成强化玻璃电路板；
其中，所述银浆的成份以重量份数计是：银粉68-72份、凝固剂78-82份、玻璃粉1-3份、树脂3-5份及有机溶剂14-19份。
2、根据权利要求1所述的强化玻璃电路板的制造方法，其特征是：该银浆的粘度为400±50p。
3、根据权利要求1所述的强化玻璃电路板的制造方法，其特征是：该银浆的干涸条件需于150℃保持10分钟。
CNB021203105A 2002-05-10 2002-05-22 强化玻璃电路板的制造方法 Expired - Fee Related CN1215743C (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW091109812A TW538662B (en) 2002-05-10 2002-05-10 Method of producing reinforced glass circuit boards
CNB021203105A CN1215743C (zh) 2002-05-10 2002-05-22 强化玻璃电路板的制造方法
US10/194,218 US20040009291A1 (en) 2002-05-10 2002-07-15 Manufacturing method for tempered glass circuit board
EP02255170A EP1384701A1 (en) 2002-05-10 2002-07-24 Manufacturing method for tempered glass circuit board
CA002394932A CA2394932A1 (en) 2002-05-10 2002-07-24 Manufacturing method for tempered glass circuit board
JP2002246480A JP2004087773A (ja) 2002-05-10 2002-08-27 焼入れ強化ガラス回路基板の製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
TW091109812A TW538662B (en) 2002-05-10 2002-05-10 Method of producing reinforced glass circuit boards
CNB021203105A CN1215743C (zh) 2002-05-10 2002-05-22 强化玻璃电路板的制造方法
US10/194,218 US20040009291A1 (en) 2002-05-10 2002-07-15 Manufacturing method for tempered glass circuit board
EP02255170A EP1384701A1 (en) 2002-05-10 2002-07-24 Manufacturing method for tempered glass circuit board
CA002394932A CA2394932A1 (en) 2002-05-10 2002-07-24 Manufacturing method for tempered glass circuit board
JP2002246480A JP2004087773A (ja) 2002-05-10 2002-08-27 焼入れ強化ガラス回路基板の製造方法

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CN1215743C true CN1215743C (zh) 2005-08-17

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CN101442174B (zh) * 2008-12-02 2010-10-06 浙江大学 在ito导电玻璃的电极上焊接电外引线的方法
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FR96614E (fr) * 1968-09-27 1973-07-20 Saint Gobain Vitrage chauffant pour véhicule, procédé et appareillage pour sa fabrication.
US3723080A (en) * 1971-02-12 1973-03-27 Corning Glass Works Ion-exchange strengthened electrically-heated glass
US4294867A (en) * 1980-08-15 1981-10-13 Ford Motor Company Method for developing a pattern on a ceramic substrate
JPS62275041A (ja) * 1986-05-22 1987-11-30 Hard Glass Kogyo Kk 装飾強化ガラスの製造方法

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CA2394932A1 (en) 2004-01-24
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