CN1213598A - Method and appts. for realizing fast shaping by using semiconductor laser device array - Google Patents
Method and appts. for realizing fast shaping by using semiconductor laser device array Download PDFInfo
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- CN1213598A CN1213598A CN 98117997 CN98117997A CN1213598A CN 1213598 A CN1213598 A CN 1213598A CN 98117997 CN98117997 CN 98117997 CN 98117997 A CN98117997 A CN 98117997A CN 1213598 A CN1213598 A CN 1213598A
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- semiconductor laser
- array
- laser array
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- axis collimation
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- Powder Metallurgy (AREA)
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Abstract
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Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 98117997 CN1062799C (en) | 1998-09-15 | 1998-09-15 | Method and appts. for realizing fast shaping by using semiconductor laser device array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 98117997 CN1062799C (en) | 1998-09-15 | 1998-09-15 | Method and appts. for realizing fast shaping by using semiconductor laser device array |
Publications (2)
Publication Number | Publication Date |
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CN1213598A true CN1213598A (en) | 1999-04-14 |
CN1062799C CN1062799C (en) | 2001-03-07 |
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Application Number | Title | Priority Date | Filing Date |
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CN 98117997 Expired - Fee Related CN1062799C (en) | 1998-09-15 | 1998-09-15 | Method and appts. for realizing fast shaping by using semiconductor laser device array |
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CN (1) | CN1062799C (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105562688A (en) * | 2014-10-31 | 2016-05-11 | 西门子公司 | Manufacture of a component through selective laser melting |
CN105710369A (en) * | 2016-03-03 | 2016-06-29 | 西安铂力特激光成形技术有限公司 | Device for manufacturing three-dimensional body layer by layer, control method and scanning method |
CN105880593A (en) * | 2016-06-17 | 2016-08-24 | 哈尔滨福沃德多维智能装备有限公司 | Multi-laser line beam printing type scanning fast forming device and method for manufacturing parts |
CN106111985A (en) * | 2015-05-07 | 2016-11-16 | 吴小平 | Group scan laser selective sintering or curing and 3D forming machine thereof |
CN106694878A (en) * | 2015-11-15 | 2017-05-24 | 罗天珍 | Group scanning calibration and auxiliary heating method for laser sintering or curing 3D forming machine |
CN110842198A (en) * | 2019-11-19 | 2020-02-28 | 中国工程物理研究院机械制造工艺研究所 | Selective metal melting forming method based on laser spot patterning output |
EP3554795A4 (en) * | 2016-12-15 | 2020-07-29 | General Electric Company | Additive manufacturing systems and methods |
-
1998
- 1998-09-15 CN CN 98117997 patent/CN1062799C/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105562688A (en) * | 2014-10-31 | 2016-05-11 | 西门子公司 | Manufacture of a component through selective laser melting |
CN105562688B (en) * | 2014-10-31 | 2020-03-17 | 西门子公司 | Production of components by selective laser melting |
US10603748B2 (en) | 2014-10-31 | 2020-03-31 | Siemens Aktiengesellschaft | Production of a component by selective laser melting |
CN106111985A (en) * | 2015-05-07 | 2016-11-16 | 吴小平 | Group scan laser selective sintering or curing and 3D forming machine thereof |
CN106694878A (en) * | 2015-11-15 | 2017-05-24 | 罗天珍 | Group scanning calibration and auxiliary heating method for laser sintering or curing 3D forming machine |
CN105710369A (en) * | 2016-03-03 | 2016-06-29 | 西安铂力特激光成形技术有限公司 | Device for manufacturing three-dimensional body layer by layer, control method and scanning method |
CN105880593A (en) * | 2016-06-17 | 2016-08-24 | 哈尔滨福沃德多维智能装备有限公司 | Multi-laser line beam printing type scanning fast forming device and method for manufacturing parts |
EP3554795A4 (en) * | 2016-12-15 | 2020-07-29 | General Electric Company | Additive manufacturing systems and methods |
CN110842198A (en) * | 2019-11-19 | 2020-02-28 | 中国工程物理研究院机械制造工艺研究所 | Selective metal melting forming method based on laser spot patterning output |
Also Published As
Publication number | Publication date |
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CN1062799C (en) | 2001-03-07 |
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Legal Events
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CI01 | Correction of invention patent gazette |
Correction item: Termination of patent right Correct: delete False: Termination of patent right Number: 46 Page: 429 Volume: 19 |
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ERR | Gazette correction |
Free format text: CORRECT: CESSATION OF PATENT RIGHT; FROM: CESSATION OF PATENT RIGHT TO: DELETION |
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ASS | Succession or assignment of patent right |
Owner name: BEIFANG HENGLI SCIENCE & TECHNOLOGY DEVELOPMENT C Free format text: FORMER OWNER: HUABEI POLYTECHNICAL COLLEGE Effective date: 20041231 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20041231 Address after: 100081, room 3, building 17, 1004 South Avenue, Haidian District, Beijing, Zhongguancun Patentee after: Beifang Hengli Science and Technology Development Co., Ltd., Beijing Address before: 030051 Lan town, Taiyuan City, Shanxi Province Patentee before: Huabei Polytechnic College |
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C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20010307 |