CN106694878A

CN106694878A - Group scanning calibration and auxiliary heating method for laser sintering or curing 3D forming machine

Info

Publication number: CN106694878A
Application number: CN201610986029.0A
Authority: CN
Inventors: 不公告发明人
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-11-15
Filing date: 2016-11-09
Publication date: 2017-05-24

Abstract

The invention discloses a group scanning calibration and auxiliary heating method for a laser sintering or curing 3D forming machine, and belongs to the field of optics and mechanics. The method includes the steps that an absolute calibration method or a relative calibration method is used for correcting or recording the processing and installation errors of a lens, processing and installation errors of a laser array assembly, processing and installation errors of a laser device and the like, so that the geometric deviation of a 3D printing object is made minimum; the diameter of each light spot can be changed by changing the distance between the laser device and a powder spreading sintering face, and thus the printing requirements of different resolution ratios can be met; and a radiation heat source is inserted into an SLS laser group scanning array so that the heating problem of a surface powder layer can be solved.

Description

Laser sintered or solidification 3D forming machines group scan is demarcated and additional thermal means

[art]

It is specifically the selectivity for realizing successively to dusty material by group scan mode the invention belongs to electro-mechanical arts Sintering (SLS) or solidification (SLA) method and with the 3D forming machines manufactured by the method.

[technical background]

Quick shaping process is developed so far nearly 30 years, with Stereo Lithography (SLA) (Stereo lithography Apparatus), selective laser sintering (SLS), fusion sediment (FDM), layer separated growth (LOM) and 3D printing (3D-P) For the forming method development for representing reaches its maturity, the industrial applicability of various methods extends constantly, is increasing Enterprise receives and approves.In the last few years, the study hotspot of rapid shaping was mainly moulding material and commercial Application.

Mainly there are DTM companies, EOS Corp., Beijing Long Yuan companies and Central China section in the mechanism for being engaged in SLS researchs in the world at present Skill university.This technology is related to SLS Selective Laser Sinterings, is selectively to be layered sintering solid powder using laser, and The cured layer of sinter molding is layering and generate foundation of its whole technical process of the required part of shape including CAD model And data processing, powdering, sintering and post processing etc.

Whole process unit is made up of feed powder cylinder and powder for molding cylinder, first, the threedimensional model of part is converted into STL formatted files, then carry out layered shaping with delamination software to it, i.e. " discretization " process.It is first right before processing is started Forming room is preheated.Feed powder cylinder piston (powder feeding piston) rises during work, by powder-laying roller by powder in powder for molding cylinder Uniform layer overlay on piston (working piston), computer controls the two-dimensional scan rail of laser beam according to the hierarchical model of prototype Mark, selectively sintering solid dusty material is so that after one layer of aspect powder completion for forming part, working piston declines one Individual thickness, powdering system spreads new powder control laser beam and scans the new layer of sintering again and so moves in circles, and is layering, Zhi Daosan Dimension forming parts is last, by unsintered Powder Recovery to powder cylinder, and takes out profiled member and is burnt for metal powder laser Knot, before sintering, whole workbench is heated to uniform temperature, can reduce the thermal deformation in shaping, and beneficial to layer and layer it Between combination it is last, through post processings such as polishing, drying after, you can complete and meet the prototype or part of demand.If forming material Expect to be metal dust, in addition it is also necessary to control forming room's atmosphere, lead to the protective gas such as people's nitrogen, hydrogen, argon gas, to avoid metal dust Aoxidize at high temperature.

Theoretically, SLS most prominent advantage be the quite varied of moulding material that it is used in theory, The dusty material bonded between atom can be formed after any heating can serve as the moulding material of SLS at present, from material properties Upper classification, can be roughly divided into metal dust, plastic powders and ceramic powders.Specific available material include polystyrene powder, Nylon powder, makrolon powder, Silon, wax powder, metal powder, cover and wrap up in the glass dust of nylon, cover fat sand, propolizing ceramic powder, cover Wax metal powder etc..Because SLS moulding materials are wide in variety, materials save, profiled member performance profile extensively, be adapted to multiple use and SLS is without design and manufactures complicated support system, so the more and more extensive of the application of SLS

SLA techniques are similar with SLS；Its technical process be with liquid photosensitive resin be material full of liquid bath, by computer control Controlling laser beam tracking striped cross-sectional track, and the liquid resin in liquid bath is irradiated to, and make this layer of resin solidification, lift afterwards Platform declines a layer height, and one layer of resin is covered with again in molded aspect, and new one layer of scanning is then carried out again, and the one of new solidification Layer is firmly sticked in preceding layer, so repeats to be finished until the manufacture of whole part, obtains 1 three-dimensional entity model.

But the laser module of most of formers is relatively costly, because complicated high frequency galvanometer system is very much costliness, The convergence cost of dynamic beam is quite high, so the single high power laser short-lived using expensive is used as the serious resistance in energy source The popularization of rapid shaping technique is hindered.

[technical scheme]

The purpose of the present invention is that and overcomes current technology weak point, and the powdering based on selective laser sintering is sintered Principle, on the premise of can guarantee that formed precision and speed this paper presents one kind, using cheap and long-life semiconductor laser Device, so as to greatly reduce the manufacturing expense and use cost of former, and further improves shaping speed.

Laser group scan method is the core of the inventive method:

Array is constituted with multiple independent low-power lasers, the luminous point that it is focused on will constitute laser spot array (20), Form numerous micro scanning regions (22)；Scan line (21) is by synchronous generation.When the moving range (amplitude) of laser spot, respectively etc. When the luminous point spacing in rows and columns direction, and in the case of the scan frequency of the scan frequency much larger than row of row, this is to sweep line by line Retouch state and (be equivalent to the row-field scanning of CRT TVs：Capable scan frequency is higher, and the scan frequency of hardwood is relatively low), photoelectricity can be covered All regions.

Due to group scan mode；If laser array is：MxN, it will so that 2 scan frequencies in direction reduce M and N Times, amplitude also reduces M and N times, and the mechanical difficulty of driving greatly reduces, galvanometer system become it is easy some, or even can Directly to avoid the galvanometer system of complexity using mechanical displacement driving and focus on collecting system, system stabilization is simple, Er Qieyou It is MXN in the quantity of laser, thus the power of single laser is allowed to decline MN times；Semiconductor laser can be chosen Part, cost and life-span further reduce, but it is noted that choose the quality of the uniformity of semiconductor laser device, also one excellent Putting is:The replacing of laser device also becomes easily；The numerical value of M, N can be 2-200 individual or more；Semiconductor devices cost Low, long lifespan stable performance small volume, it is convenient to drive；Thus the machine of the desktop level of low cost miniaturization just becomes a reality.

The machinery of scanning is realized passing through, rotating shaft reciprocating rotation mode (rotation drive-type), linear vibration mode (straight line driving), vibration mirror reflected mode (vibration mirror reflected formula).Either that mode, due to amplitude all very littles, be not in The excessive powder planar environment for deviateing liquid level or powder groove of laser beam focus plane.

Group scan method has 2 kinds：That is multizone dynamic balancing group scan method and single region group scan method：

Multizone dynamic balancing group scan method is that scanning area is divided into polylith isolated area, and each piece all higher in frequency Self-movement on that direction, and the phase of motion is reverse, can offset vibration and inertia, it will obtain good dynamic balancing.

Single region group scan method：It is an entire scan mode for uniform areas, dynamic balancing can be offset by external devices, To reduce vibration.

Other main working process that its 3D is molded whole machine are：First, the threedimensional model of part is converted into STL forms text Part, then carries out layered shaping with delamination software to it, i.e. " discretization " process.Before processing is started, first forming room is entered Row preheating.Computer is the two-dimensional scan track that drive circuit controls laser beam according to the hierarchical model of prototype, is selectively burnt Knot solid powder material is so that after one layer of aspect powder completion for forming part, working piston declines a thickness, powdering system New powder controls laser beam scans the new layer of sintering and so moves in circles again on wide bed, is layering, until 3 d part is molded most Afterwards, by unsintered Powder Recovery to powder cylinder, and profiled member is taken out for laser sintering metallic powder, before sintering, Whole workbench is heated to uniform temperature, can reduce the thermal deformation in shaping, and last beneficial to combination between layers, After through post processings such as polishing, drying, you can complete and meet the prototype or part of demand.

If moulding material is metal dust, in addition it is also necessary to control forming room's atmosphere, lead to the protection gas such as people's nitrogen, hydrogen, argon gas Body, to avoid metal dust from aoxidizing at high temperature.

Laser curing and sintering processing and its close, are only replaced with fluid feed slot by powder hopper, are immersed in hopper In lifting platform successively decline, reserve certain thickness liquid state thin layer, curing molding is come by laser scanning

For summary；Group scan laser selective is sintered or curing:It is configured to laser array substantially, and machinery is swept Retouch drive device, material trough, the lowering or hoisting gear in material trough, electron process part composition；It is divided into laser sintered mode or light is solid Change mode；The operation principle of its laser sintered mode is:The threedimensional model of part is first converted into STL formatted files, Ran Houyong Delamination software carries out layered shaping to it, i.e. " discretization " process.Before processing is started, first forming room is preheated.Meter Calculation machine is the two-dimensional scan track that drive circuit controls laser beam according to the hierarchical model of prototype, selectively sintering solid powder Material is so that after one layer of aspect powder completion for forming part, working piston declines a thickness, and powdering system is spread newly Powder control laser beams scan the new layer of sintering and so move in circles again, are layering, until 3 d part shaping is last, will not The Powder Recovery of sintering takes out profiled member for laser sintering metallic powder, before sintering, whole work in powder cylinder Uniform temperature is heated to as platform, the thermal deformation in shaping can be reduced, and it is last beneficial to combination between layers, through polishing, After the post processing such as drying, you can complete and meet the prototype or part of demand；And laser curing and laser sintered mode and its It is close, powder hopper is only replaced with fluid feed slot, the lifting platform being immersed in hopper successively declines, and reserves certain thickness Liquid state thin layer, curing molding is come by laser scanning；Either laser sintered mode or photocuring mode, in scan mode all Group scan method is followed, the core content of the method is specified as:Laser group scan method is the luminous point structure using multiple separate lasers Into laser spot array (20), numerous micro scanning regions (22) are formed；Scan line (21) is by synchronous generation.When the shifting of laser spot During dynamic scope (amplitude), the respectively equal to luminous point spacing in rows and columns direction, and work as the scan frequency of row much larger than the scanning for arranging frequently In the case of rate, this is that progressive scan state (is equivalent to the row-field scanning of CRT TVs：Capable scan frequency is higher, and the scanning of hardwood is frequently Rate is relatively low), photoelectricity can cover all regions；Due to group scan mode；If laser array is：MxN, it will so that 2 directions Scan frequency reduce M and N times, amplitude also reduces M and N times, and the mechanical difficulty of driving greatly reduces, and galvanometer system becomes Easily some, it might even be possible to directly driven using mechanical displacement avoid complexity galvanometer system and focusing collecting system, be Stabilization of uniting is simple, and because the quantity of laser is MN, the numerical value of M, N can be 2-200 individual or more；It is thus single The power of laser is allowed to decline MN times；Semiconductor laser device can be chosen, cost and life-span further reduce, but will Note the quality of the uniformity of selection semiconductor laser device, still yet another advantage is that:The replacing of laser device also becomes easy ；And group scan method has and is divided into：Multizone dynamic balancing group scan method and single region group scan method；Multizone dynamic balancing group scan method It is that scanning area is divided into polylith isolated area, each piece of all self-movement on frequency that direction higher, and motion Phase reversely, can offset vibration and inertia, it will obtain good dynamic balancing；Single region group scan method：It is a unified area The entire scan mode in domain, dynamic balancing can be offset by external devices, to reduce vibration；；Its essential technique feature：Use multiple MxN laser device of concurrent working carries out mechanical scanning to complete to sinter or solidify work, and its scan amplitude is equal to or bigger The lattice distance of square formation is arranged in laser device；Its scanning area is divided into multizone dynamic balancing group scan and single region group scan； The driving of mechanical scanning can be vibration mirror reflected formula, straight line driving, rotate drive-type.

The position skew of Laser Focusing lattice array is decided by several key elements：The processing of camera lens and alignment error, laser array The accumulation results of the processing of component and alignment error, laser device processing in itself and alignment error etc., even if the finest Processing conditions and machine condition under, be not easy to so that the coordinate offset dispersion numerical value of laser spot array is limited in 30 microns It is interior, it is necessary to which that calibration demarcation is carried out to laser array, only 2 mechanical systems of (20 microns) accuracy error could be met so that Laser Focusing point is located in accurate square dot-matrix array, and the spacing between adjacent point in X, Y-direction is consistent, and error needs control System is within 1-2.

Specific method is divided into：Absolute calibration's (correction) method or relative Calibration method:

So-called absolute calibration's method refers to:

Rely on the relative position adjustment correction and locking of mechanical system such as：The translation locking of each camera lens, laser device it is flat Move locking, the processing of related optical support and alignment error etc.；Above-mentioned 3 kinds of adjustment amounts only implement 1 individual event without implementing simultaneously Or the difficulty implemented 2 projects and both can definitely have been adjusted with simultaneously be the precision being machined grasp and component between it is fine Coordinate, locking after adjusting the controllability of displacement and adjusting etc.

So-called relative Calibration method refers to:

Machining accuracy to component has relaxed；But the stability of assembling has been strengthened；Laser module has been assembled Bi Hou, does not spend the installation site for adjusting any laser module, it is only necessary to measure the physical location of Laser Focusing point, and will be all In the actual coordinate value input electronic operation of Laser Focusing point and the module section of driving；Section sintering is completed in laser group scan During process, the grid deviation numerical value of electronic module computing each Laser Focusing point arranges rational SECO to determine each The switch of individual laser, in order to accommodate the redundancy issue of the scan area of Laser Focusing point, needs the square area of group scan More than and cover the area of the 4 side shapes that 4 neighbouring ideal laser focus point lines are enclosed, i.e., adjacent Laser Focusing point is swept Region all mutuals are retouched to overlap；Absolute coordinate situation of each Laser Focusing point according to section position；Complete independently sintering process, Meet the geometry and position of actual slice

Mode in demarcating the coordinate value of all Laser Focusing points and having 2:The direct calibration-type of optical touch screen and graph paper burn point and read again Modus ponens:Hereinafter explained respectively:

The direct calibration-type of optical touch screen refers to:It is on two adjacent bevel surfaces sides of display in traditional optical touch system Edge places light-sensitive element, for analysis system, determines touch action.When external luminous point is radiated at the sensing, will be in corresponding light Cause light measurement value at sensing element.The outputting measurement value of light sensing is determined for out the coordinate of irradiation luminous point.Generally control Device processed is to scan light sensing array, therefore this technology is sometimes referred to as " scanning IR ".Avoid interference under high light direct projection this Individual problem, the photosensitive threshold value of raising and masking interference light are also necessary.

Graph paper burning point reads formula and refers to again:Calcination is carried out on finer reference paper and goes out small stain, then further according to The coordinate line of graph paper, demarcates the coordinate value for reading each small stain；Need to be put into graph paper in powder groove, burning point During finer reference paper definitely avoid being moved；Whether putting for paper just has no too much influence；Reason is to only need to mark It is fixed it is all between relative position coordinates relation, the direction of motion of powdering groove is inclined with the perpendicularity of the scanning direction of laser group scan From formed precision will be influenceed；Because the scanning shift amount of group scan is more much smaller than the sweep length of vibration mirror scanning mode, thus hang down The influence of the deviation of straight degree is by the situation of far smaller than vibration mirror scanning mode

Because this laser beam is to obtain small spot come short distance using the type of focusing, stability and uniformity are exceeded well over and shaken Scarnning mirror mode, the diameter for changing hot spot is very convenient, it is only necessary to which changing laser both can be with root with the distance of powdering sintered surface Understood according to the characteristics of optical path of geometric optics:Focus on light beam is minimum in focal point spot diameter, and the distance of off-focal is bigger, hot spot The bigger of diameter

In order to meet the printing demand of different resolution, thus can by the vertical direction of group scan laser module ( It is exactly Z-direction) distance, or single vertical direction (namely Z-direction) distance for changing powdering groove, can also obtain same Effect change sintering spot size after, need to carry out carrying out calibration demarcation to laser array again, if in Z-direction Can be by position in the realization of mechanical system without carrying out carry out laser array calibration demarcating again when changing little Group scan laser array component or powdering system is moved to complete

Because laser group scan array is focus type light beam, towards on the direction of powder powdering groove, with the increasing of distance Plus, the effective area of beam bundles is smaller, and the installation to heater element provides locus, the powder for directly heating powdering groove Layer surface；Heating source thus can be added such as with the passage of non-light beam:Face source heating source with holes, hole is for through laser beam 's；The wire heat source component of wire can also be installed, laser beam bundle passes through the space position of its wire；Or use spot light Array, is installed on 4 adjacent central areas of laser array；

In order that the bisque surface of powdering groove is heated uniformly, can be by all points of light source of above-mentioned heating surface battle array with ring-type Point group is independently controlled, and is the characteristics of ring-type point group:Center is 1 independent region, is outwards expanded by the region, then divide Temperature into the separate control area of 1-1000 each heating region is controlled to the temperature uniformity that causes, and error is only Only within 1 degree or 10 degree, this is a test parameters, and the surrounding's heat supply condition with powder cylinder is relevant, regardless of；Above-mentioned When being fixed on heating source Close All before laser group scan array, the surface temperature field distribution one of the powder cylinder of 4 walls or 5 wall heat supplies Surely center is close to into shape；The extra ring-type position to low-temperature region uses heating power higher, and colder ring Shape position uses relatively low heating power, can cause that Temperature Field Control is installed on laser array in rational uniformity heating sources Component is interspersed in the space area of laser group close to powder cylinder or the one side of fluid cylinder, does not block laser beam；And carry out ring-type point group, The heat energy independent control of each annular section

[brief description of the drawings]

(1) laser element

(2) laser beam

(3) laser stent

(4) backswing axis

(5) alternating translational direction

(6) linear electric motors displacement post

(7) linear electric motors

(8) linear electric motors

(9) linear electric motors fixed support

(10) torsion motor rotation axis

(11) torsion motor

(12) torsion motor fixed rack

(13) powder cylinder housing

(14) powder for molding cylinder

(15) feed powder cylinder

(16) powder-laying roller

(20) laser spots in movement are scanned

(21) scan line

(22) micro scanning region

(23) laser spots

(24) horizontal shift reciprocately value A

(25) shift reciprocately value B is indulged

(29) amplitude width

(30) light point area unit

(31) light point area unit

(32) light point area unit

(33) direction of displacement

(34) direction of displacement

(35) direction of displacement

(36) displacement such as forward direction changing of the relative positions value

(37) displacement changing of the relative positions value is reversely waited

(40) LED lens

(41) laser chip

(42) laser beam is focused on

(43) laser chip contact conductor

(44) radiant heating source support

(45) radiant heating source

(46) radiant heating source array removes figure

(47) laser and heat source configurations body

(48) laser beam foucing

[case study on implementation]

Below in conjunction with accompanying drawing, with regard to preferred embodiment, the invention will be further described：

Fig. 1 laser group scan method schematic diagrams.

Fig. 2 group scans laser selective successively sinters 3D shaping machine main body organigrams.

Fig. 3 multizone dynamic balancing group scan method schematic diagrames.

Fig. 4 is in group scan component part and the radiant heating source schematic diagram installed

As shown in Figure 1：

Laser group scan displacement method：The laser spots (23) projected using multiple separate lasers line up array (in figure It is the array of 8x10), the horizontal spacing of array is A, and the longitudinal pitch of array is B；Lateral amplitude of vibration is approximately equal to horizontal reciprocal during scanning Shift value A (24), pitch amplitude is approximately equal to vertical shift reciprocately value B (25)；Actual amplitude should be that spacing subtracts spot diameter；Structure Into laser spots (20) of the scanning in mobile, numerous (80) micro scanning regions (22) are formed；The scan line (21) of each scanning area will Synchronous generation.

When the moving range (amplitude), the respectively equal to luminous point spacing in rows and columns direction of laser spot, and sweeping when row Retouch in the case of scan frequency of the frequency much larger than row, this is progressive scan state, and photoelectricity can cover all regions.

As shown in Figure 2：

Group scan laser selective successively sinters the core process device of 3D shaping machine main bodies construction by feed powder cylinder (15) constituted with powder for molding cylinder (14), (the powder feeding piston) of feed powder cylinder (15) bottom rises during work, then by powder-laying roller (16) by powder on powder for molding cylinder (14) surface uniform layer overlay (it is upper once complete sintering after, powder for molding cylinder is lived Plug (working piston) can in advance fall before 1 layer of height, be ensuing powdering slot milling).

The group scan of laser beam is：Passed through by the linear electric motors (7) being fixed on linear electric motors fixed support (9) and (8) Linear electric motors displacement post (6) is stretched to cause laser stent (3) along level (X) direction shift reciprocately；So and laser Laser element (1) array that support (3) is fixed together also will therewith along level (X) direction shift reciprocately；Other torsion The torsion motor rotation axis (10) of the torsion motor (11) that motor fixed rack (12) is rigidly fixed together are and linear electric motors Fixed support (9) is rigidly connected, as rotation and the laser stent (3) of torsion motor rotation axis (10) are fixed together Laser element (1) array also will therewith around Y-axis：Backswing axis (4) is rotated；So laser element (1) array will join simultaneously With 2 kinds of compound motions, the focus point of each laser beam (2) will completion group scan action.(5) it is linear electric motors fixed support (9) alternating translational direction, (13) are 2 powder cylinder housings.

Other main working process of its whole machine are：First, the threedimensional model of part is converted into STL formatted files, so Layered shaping is carried out to it with delamination software afterwards, i.e. " discretization " process.Before processing is started, first forming room is carried out pre- Heat.Computer is the two-dimensional scan track that drive circuit controls laser beam according to the hierarchical model of prototype, is selectively sintered solid Body dusty material is so that after one layer of aspect powder completion for forming part, working piston declines a thickness, powdering system paving Upper new powder controls laser beam scans the new layer of sintering and so moves in circles again, is layering, until 3 d part shaping is last, By in unsintered Powder Recovery to powder cylinder, and profiled member is taken out for laser sintering metallic powder, it is before sintering, whole Individual workbench is heated to uniform temperature, can reduce the thermal deformation in shaping, and, warp last beneficial to combination between layers After the post processings such as polishing, drying, you can complete and meet the prototype or part of demand.

As shown in Figure 3：

Scanning array is divided into 3 regions, is respectively：Light point area unit (30), not light point area unit (31), luminous point Territory element (32)；Arrange assembly quality so that the quality of light point area unit (31) is approximately equal to light point area unit (30) With light point area unit (32) sum.

When displacement changing of the relative positions value (36) such as the forward direction for causing light point area unit (31) are approximately equal to light point area unit (30) When waiting displacement changing of the relative positions value (37) with light point area unit (32) reverse, and position phase (direction of motion) it is opposite when, translation inertia phase Mutually offset, dynamic balancing is best.(29) it is amplitude width.

As shown in Figure 3：

The laser of laser chip (41) can be pooled focusing laser beam (42) by LED lens (40)；(43) it is laser core Plate electrode lead, (48) are laser beam foucings；Radiant heating source (45) is fixed on radiant heating source support (44), forms laser And heat source configurations body (47), (46) are partial radiation heating source array removal figures；Array as lasing light emitter, is arranged in laser The vacant area of source point battle array.

Claims

1. laser sintered or solidification 3D forming machines group scan scaling method；This is laser sintered or laser curing forming machine basic It is configured to:Lowering or hoisting gear, electron process part group in laser array, mechanical scan drive, material trough, material trough Into；The operation principle of its laser sintered mode is:The threedimensional model of part is first converted into STL formatted files, then with layering Software it is carried out layered shaping formed section file, first forming room was preheated before processing starts, computer with drive Dynamic circuit collaboration, the hierarchical model according to prototype controls the switch of the output of the laser beam in scanning, selectively sintering solid Dusty material with complete manufacture part an aspect, complete an aspect after, working piston declines a thickness, powdering system again New bisque on wide bed, the part that laser beam is scanned and selects sintering new again cuts layer, moves in circles, and is layering, until three-dimensional Forming parts；And the operation principle of laser curing mode is close with laser sintered mode, only powder hopper is replaced with Fluid feed slot, and be immersed in the lifting platform in hopper and successively decline, certain thickness liquid state thin layer is reserved, solidified by laser scanning Shaping；Either laser sintered mode or photocuring mode, all follow group scan method, the core content of the method in scan mode It is specified as:Laser group scan method is to constitute laser spot array (20) using the luminous point of multiple separate lasers, is formed numerous Micro scanning region (22)；Scan line (21) is by synchronous generation.When the moving range of laser spot, respectively equal to rows and columns direction During luminous point spacing, and in the case of the scan frequency of the scan frequency much larger than row of row, this is progressive scan state, and luminous point is swept Retouching path can cover all regions；In the case of being MxN for laser array, it will so that 2 scan frequencies in direction reduce M And N times, amplitude also reduces M and N times, and the power of single laser is allowed to decline MN times；Compatibility is directly filled using mechanical displacement Put to drive；The position skew of Laser Focusing lattice array depends on following key element：Camera lens, laser array structure part and laser device The processing of itself and the accumulation results of alignment error, correction or the specific method demarcated are divided into：Absolute calibration's method or relative Calibration Method:The diameter for changing laser facula is to spread the vertical of new bisque by changing group scan laser array component and powdering system Distance in distance, i.e. Z-direction；Its feature is that:The calibration of laser array is demarcated use absolute calibration's method or Relative Calibration method；What the demarcation control to laser spot size diameter was taken is to change group scan laser array component to be spread with powdering system The vertically opposite distance of new bisque, i.e. distance in Z-direction, in the realization of mechanical system are swashed by displacement group scan Optical arrays component or powdering system are completed.

2. absolute calibration's method as claimed in claim 1 refers to:Rely on the relative position adjustment and locking of mechanical system such as：Each mirror The translation locking of head, the translation locking of laser device, the processing of related optical support and alignment error etc.；Above-mentioned 3 kinds of adjustment amounts Without implementing simultaneously, only 1 individual event of implementation or the difficulty that 2 projects of implementation both can definitely have been adjusted with simultaneously are to be machined Precision grasp and component between fine fit, adjust displacement controllability and adjustment after locking etc..

3. relative Calibration method as claimed in claim 1 refers to:Machining accuracy to component has relaxed；But assembling is steady It is qualitative to have been strengthened；After laser module assembling is finished, the installation site for adjusting any laser module is not spent, it is only necessary to measure The physical location of Laser Focusing point, and the actual coordinate value of all Laser Focusing points is input into the module portion of electronic operation and driving In point；When laser group scan completes section sintering process, the grid deviation number of electronic module computing each Laser Focusing point Value, arranges rational SECO to determine the switch of each laser, in order to accommodate Laser Focusing point scan area it is superfluous Remaining problem, needs that the square area of group scan is exceeded and covered the 4 side shapes that 4 neighbouring ideal laser focus point lines are enclosed Area, i.e., scanning area all mutuals of adjacent Laser Focusing point overlap；Each Laser Focusing point is according to section position Absolute coordinate situation；Complete independently sintering process, meets geometry and the position of actual slice.

4. laser sintered or solidification 3D forming machines additional thermal means:Laser sintered or laser curing forming machine the essential structure It is identical with described in claim 1, add heating source such as in the passage of the non-light beam of laser array component:Face source heating with holes Source, hole is for through laser beam；The wire heat source component of wire can also be installed, laser beam bundle passes through the space of its wire Position；Or pointolite array is used, it is installed on 4 adjacent central areas of laser array；For uniform heating powdering , with ring-type minute group can be independently controlled light source all points of above-mentioned heating surface battle array by the surface bisque of groove, and ring-type divides group's Feature is:Center is 1 independent region, is outwards expanded by the region, is separated into the heating of the independent control of 1-1000 Region；Its feature is that:Heating source is installed on laser array component close to powder cylinder or the one side of fluid cylinder, is interspersed in laser group's Space area, does not block laser beam；And carry out ring-type point group, the heat energy independent control of each annular section.