CN121359596A - 柔性印刷布线板的制造方法及柔性印刷布线板 - Google Patents

柔性印刷布线板的制造方法及柔性印刷布线板

Info

Publication number
CN121359596A
CN121359596A CN202480041476.1A CN202480041476A CN121359596A CN 121359596 A CN121359596 A CN 121359596A CN 202480041476 A CN202480041476 A CN 202480041476A CN 121359596 A CN121359596 A CN 121359596A
Authority
CN
China
Prior art keywords
plating
layer
plating layer
metal foil
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480041476.1A
Other languages
English (en)
Chinese (zh)
Inventor
小川亚希子
冈田淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Printed Circuit Co ltd
Original Assignee
Fujikura Printed Circuit Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Printed Circuit Co ltd filed Critical Fujikura Printed Circuit Co ltd
Publication of CN121359596A publication Critical patent/CN121359596A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/115Via connections; Lands around holes or via connections
    • H05K1/116Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN202480041476.1A 2023-07-03 2024-06-13 柔性印刷布线板的制造方法及柔性印刷布线板 Pending CN121359596A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-109563 2023-07-03
JP2023109563 2023-07-03
PCT/JP2024/021580 WO2025009357A1 (ja) 2023-07-03 2024-06-13 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板

Publications (1)

Publication Number Publication Date
CN121359596A true CN121359596A (zh) 2026-01-16

Family

ID=94171710

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480041476.1A Pending CN121359596A (zh) 2023-07-03 2024-06-13 柔性印刷布线板的制造方法及柔性印刷布线板

Country Status (4)

Country Link
JP (1) JPWO2025009357A1 (https=)
KR (1) KR20260014642A (https=)
CN (1) CN121359596A (https=)
WO (1) WO2025009357A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254793A (ja) * 1987-04-11 1988-10-21 ソニー株式会社 プリント配線基板の製造方法
JPH04100294A (ja) * 1990-08-20 1992-04-02 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JP3095857B2 (ja) * 1992-02-24 2000-10-10 イビデン株式会社 電子部品搭載用基板
JP5000446B2 (ja) 2007-10-01 2012-08-15 日本メクトロン株式会社 プリント配線板の製造方法
JP7714848B2 (ja) 2022-01-27 2025-07-30 大王製紙株式会社 吸収性物品

Also Published As

Publication number Publication date
WO2025009357A1 (ja) 2025-01-09
KR20260014642A (ko) 2026-01-30
JPWO2025009357A1 (https=) 2025-01-09

Similar Documents

Publication Publication Date Title
JP2005183952A (ja) 導電孔を有したプリント回路ボードの製造方法及びボード
US7381587B2 (en) Method of making circuitized substrate
JP2001053188A (ja) 多層配線基板の製造方法
US20030201242A1 (en) Method for manufacturing wiring circuit boards with bumps and method for forming bumps
KR101089986B1 (ko) 캐리어기판, 그의 제조방법, 이를 이용한 인쇄회로기판 및 그의 제조방법
KR20060106766A (ko) 전해 도금을 이용한 회로 기판의 제조 방법
KR20000071696A (ko) 다층 배선판 및 그 제조 방법
CN101422091B (zh) 具有电缆部分的多层电路板及其制造方法
JPH05327211A (ja) 多層フレキシブルプリント基板およびその製法
CN121359596A (zh) 柔性印刷布线板的制造方法及柔性印刷布线板
JP2002324962A (ja) インダクタ内蔵のプリント配線板及びその製造方法
CN118044344A (zh) 印刷布线板的制造方法
JP2000323841A (ja) 多層回路基板とその製造方法
KR20060066971A (ko) 양면 연성회로기판 제조방법
CN115250583B (zh) 电路板及其制造方法
JP2005108941A (ja) 多層配線板及びその製造方法
JP2001068807A (ja) 配線基板及び配線基板の製造方法
KR100658437B1 (ko) 범프기판를 이용한 인쇄회로기판 및 제조방법
CN118402322A (zh) 柔性印刷线路板的制造方法及柔性印刷线路板
JP7336845B2 (ja) 印刷配線板の製造方法
JP2003332720A (ja) 多層プリント配線板とその製造方法
CN121358289A (zh) 封装基板及其制备方法
JP2024011386A (ja) 配線基板
JP2025142534A (ja) 配線基板
JP2025008669A (ja) 配線回路基板および配線回路基板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination