JPWO2025009357A1 - - Google Patents

Info

Publication number
JPWO2025009357A1
JPWO2025009357A1 JP2025531462A JP2025531462A JPWO2025009357A1 JP WO2025009357 A1 JPWO2025009357 A1 JP WO2025009357A1 JP 2025531462 A JP2025531462 A JP 2025531462A JP 2025531462 A JP2025531462 A JP 2025531462A JP WO2025009357 A1 JPWO2025009357 A1 JP WO2025009357A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025531462A
Other languages
Japanese (ja)
Other versions
JPWO2025009357A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025009357A1 publication Critical patent/JPWO2025009357A1/ja
Publication of JPWO2025009357A5 publication Critical patent/JPWO2025009357A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2025531462A 2023-07-03 2024-06-13 Pending JPWO2025009357A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023109563 2023-07-03
PCT/JP2024/021580 WO2025009357A1 (ja) 2023-07-03 2024-06-13 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2025009357A1 true JPWO2025009357A1 (https=) 2025-01-09
JPWO2025009357A5 JPWO2025009357A5 (https=) 2026-03-23

Family

ID=94171710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025531462A Pending JPWO2025009357A1 (https=) 2023-07-03 2024-06-13

Country Status (4)

Country Link
JP (1) JPWO2025009357A1 (https=)
KR (1) KR20260014642A (https=)
CN (1) CN121359596A (https=)
WO (1) WO2025009357A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254793A (ja) * 1987-04-11 1988-10-21 ソニー株式会社 プリント配線基板の製造方法
JPH04100294A (ja) * 1990-08-20 1992-04-02 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JP3095857B2 (ja) * 1992-02-24 2000-10-10 イビデン株式会社 電子部品搭載用基板
JP5000446B2 (ja) 2007-10-01 2012-08-15 日本メクトロン株式会社 プリント配線板の製造方法
JP7714848B2 (ja) 2022-01-27 2025-07-30 大王製紙株式会社 吸収性物品

Also Published As

Publication number Publication date
WO2025009357A1 (ja) 2025-01-09
KR20260014642A (ko) 2026-01-30
CN121359596A (zh) 2026-01-16

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Legal Events

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