CN1213471C - Transfer device for semiconductor device in processor - Google Patents
Transfer device for semiconductor device in processor Download PDFInfo
- Publication number
- CN1213471C CN1213471C CNB021568081A CN02156808A CN1213471C CN 1213471 C CN1213471 C CN 1213471C CN B021568081 A CNB021568081 A CN B021568081A CN 02156808 A CN02156808 A CN 02156808A CN 1213471 C CN1213471 C CN 1213471C
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- CN
- China
- Prior art keywords
- pick
- linear motor
- fixed
- mover
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
- F04C18/02—Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents
- F04C18/0207—Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents both members having co-operating elements in spiral form
- F04C18/0215—Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents both members having co-operating elements in spiral form where only one member is moving
Abstract
Disclosed is an apparatus for transferring semiconductor devices in a semiconductor device enabling to simplify the structure for varying pickers for picking up semiconductor devices as well as accomplish fast and precise variation, of the pickers, and includes rectangular frames installed movably on a handler body, stators of two linear motors installed on inner sides of two of the frames adjacent, respectively, movers of the two linear motors installed to move along the stators, respectively, a reference pickup member fixed to an inner corner between the frames to pick up the semiconductor device, first and second pickup members coupled with the movers of the linear motors to move along the frames, respectively, a first guide member fixed to the first pickup member to be in parallel with the frame, a second guide member fixed to the second pickup member to be vertical the first guide member, and a third pickup member coupled with both of the first and second guide members to move along the second and first guide members by movements of the first and second pickup members.
Description
It is that December 17 calendar year 2001, application number are the priority of the korean application of P2001-80160 that the application requires the applying date, and its content is incorporated into that this is for reference.
Technical field
The present invention relates to a kind of device that in the processor of semiconductor test, picks up, transmits semiconductor device, the semiconductor device conveyer of the spacing of the pick-up of the kit change picks up semiconductor devices that can become corresponding to a dish with the kind of semiconductor device to be tested and size in particularly a kind of semiconducter device testing processor.
Background technology
In general, the semiconductor device of producing in a production line will be through test, to determine certified products or substandard products before delivery.
Processor is a kind of device that is used for semiconductor test.This processor uses semiconductor device conveyer to be sent to another place, semiconductor device to be loaded in the test jack of a testing location and to carry out required test being contained in semiconductor device on the dish automatically, then semiconductor test is categorized into various ranks and unloads semiconductor device on this dish.
Fig. 1 illustrates the layout plan of a general semiconductor test handler.
As shown in Figure 1, there are a loading attachment 2 and a discharge mechanism 3 in the front portion of one processor body 1, be mounted with on the loading attachment 2 and remain the dish of semiconductor test on it, discharge mechanism 3 comprises that a plurality of dishes are used for accepting being divided into certified products and reexamining the semiconductor test of product according to test result.In addition, a soaking plate 7 is equipped with at the rear of loading attachment 2.These soaking plate 7 inside have a heater (not shown) and a cooling device (not shown) that semiconductor device to be tested is heated or are cooled to predetermined temperature to carry out temperature test.
In addition, the many stackers of a rejection (rejectmulti-stacker) 5 are equipped with at discharge mechanism 3 rears, and a plurality of acceptance are classified as the semiconductor device of substandard products by test result dish is housed on it.
Be arranged in processor body 1 aftermost testing location 10 one, the performance of a test jack that is electrically connected with an external test arrangements 11 each semiconductor device of test is housed.Test jack 11 tops have dividing head 12a and 12b to move horizontally, and pick up, be loaded in the test jack 11 and the semiconductor test in the test jack 11 and pick up, be retransmitted on the position of readiness of both sides being sent to semiconductor device on the test jack 11 both sides position of readiness.
First and second loading conveyer 8a and the 8b that move back and forth are housed in the place ahead of testing location 10.The first and second loading conveyer 8a and 8b are sent to the semiconductor device on loading attachment 2 or the soaking plate 7 on the test jack 11 both sides position of readiness of testing location 10.First and second unloading conveyer 9a and the 9b that move back and forth are arranged respectively on the side of the first and second loading conveyer 8a and 8b.First and second unloading conveyer 9a and the 9b are sent to testing location 10 outsides to semiconductor test from testing location 10.
The front end of processor body 1 and testing location 10 fixed mount 13 across processor body 1 is housed respectively foremost.A pair of adjustable shelf 14a and 14b can along fixed mount 13 side-to-side movements be contained on the fixed mount 13.In addition, be equipped with respectively on adjustable shelf 14a and the 14b that loading and unloading pick device 15 and 16 can move back and forth along adjustable shelf 14a and 14b, picks up semiconductor devices.Loading and unloading pick device 15 and 16 comprises that respectively a plurality of pick-up (not shown)s transmit a plurality of semiconductor device simultaneously.
In addition, a processor pair semiconductor device such as QFP, BGA, SOP etc. test.After a kind of semiconducter device testing is intact, test another kind of semiconductor device.At this moment, change the kit that comprises this dish, soaking plate 7, loading conveyer 8a and 8b, unloading conveyer 9a and 9b, test jack 11 etc. according to the kind of institute's semiconductor test.
At this moment, because the spacing of the landing gear that lands for semiconductor device of the kit of changing according to the kind of semiconductor device to be tested and varying in size, so the spacing of loading and unloading pick device 15 and 16 pick-up should become with the different of landing device.
But existing loading and unloading pick device 15 and 16 uses the drive unit that comprises mechanical connecting device, belt, spherical leading screw and servomotor etc. to change its spacing.Therefore, it is too complicated that rotation is changed over straight-line this drive unit, and whole volume increases, thereby power consumption increases.
In addition, when using belt and belt pulley, must the periodic adjustment belt tension.The dust of kicking up when in addition, belt and belt pulley are worked can pollute semiconductor device.
Summary of the invention
Therefore the present invention relates to the semiconductor device conveyer in a kind of semiconductor test processor, it can alleviate the one or more problems that caused by the deficiencies in the prior art and shortcoming greatly.
An object of the present invention is to provide the semiconductor device conveyer in a kind of semiconductor test processor, it can be simplified the structure of the pick-up that is used for changing picks up semiconductor devices and fast, accurately change pick-up.
Other advantages of the present invention, purpose and a feature part are seen following explanation, and a part can obviously be found out by following explanation or in implementation process of the present invention to those skilled in the art.Can know the structure that particularly points out from written explanation and claim and the accompanying drawing and find out purpose of the present invention and other advantages.
Implement and the broad purpose of the present invention that illustrates with other advantages and according to the application's book for achieving the above object, the semiconductor device conveyer in the processor of the present invention comprises: be contained in the rectangle frame on the processor body movably; Be contained in the stator of two linear motors on the two rectangle frame adjacent inner surface respectively; Two linear motors can be along the mover of stator movement; One be fixed between two, on the two linear motor meet inside locks, the benchmark pick-up piece of picks up semiconductor devices; Mover with two linear motors first and second pick-up pieces that are connected, move along the rectangle frame respectively; Be fixed on first pick-up piece, with its on the first parallel guiding piece of rectangle frame of second pick-up piece is housed; Be fixed on second pick-up piece, second guiding piece vertical with first guiding piece; And the 3rd pick-up piece that is connected with first and second guiding pieces, moves along second and first guiding piece with the motion of first and second pick-up pieces, and the control device that moves of when described linear motor starts, controlling the described mover of described linear motor by the displacement that detects described first and second pick-up pieces.
According to a further aspect in the invention, the semiconductor device conveyer in the processor of the present invention comprises: one is contained in the base plate on the processor body movably; One be fixed on described base plate one end, the benchmark pick-up piece of picks up semiconductor devices; The stator and the mover of a linear motor of installing along described base plate; First pick-up piece that is fixed on the described mover of described linear motor, moves horizontally along described base plate; And the control device that moves of when described linear motor starts, controlling the described mover of described linear motor by the displacement that detects described first pick-up piece.
Be noted that to above summary of the present invention and following detailed description be exemplary, claims are seen in further explanation of the present invention.
Description of drawings
As the accompanying drawing that the application's book part is included in the application's book embodiments of the invention are shown for further understanding the present invention, these accompanying drawings are used for explaining the principle of the invention with explanation.In the accompanying drawing:
Fig. 1 illustrates the layout of the common process machine of a semiconductor test;
Fig. 2 is the stereogram of semiconductor device conveyer first embodiment of the present invention;
Fig. 3 is the stereogram of the pick-up drive unit of conveyer shown in Figure 2;
Fig. 4 A and 4B are the plane graph of the working condition of explanation semiconductor device conveyer of the present invention; And
Fig. 5 is the stereogram of semiconductor device conveyer second embodiment of the present invention.
Embodiment
Describe the preferred embodiment of the present invention shown in the accompanying drawing below in detail.Same parts is represented with same label as far as possible in each accompanying drawing.
In the following description, the structure of processor of using semiconductor device conveyer of the present invention is identical with the structure of existing processor, and its details are omitted.
Fig. 2 is the stereogram of semiconductor device conveyer first embodiment of the present invention, and Fig. 3 is the stereogram of the pick-up drive unit of conveyer shown in Figure 2, and Fig. 4 A and 4B are the plane graph of the working condition of explanation semiconductor device conveyer of the present invention.
Two rectangle framves 101 are fixed on adjustable shelf 14a and the 14b (referring to Fig. 1).Two linear motors 102 and 104 stator 102a and 104a and mover 102b and 104b are contained in respectively on two 101 the adjacent inner surface.In addition, mover 102b and 104b are connected with 105a and property motion guidance spare 103 along the line and 105 motions with 105 linear movement piece 103a with the linear movement guiding piece 103 parallel with this respectively below stator 102a and 104a.
One fixed block 110 is fixed between two 101, on the corner of linear motor 102 and 104 stator 102a and 104a meet, the benchmark pick-up 120 of a picks up semiconductor devices is fixed on this fixed block 110.
' L ' type first and second movable blocks 111 and 112 are separately fixed on the mover 102b and 104b of linear motor 102 and 104.In addition, the first and second variable pick- ups 121 and 122 that pick up other semiconductor device are contained in respectively on first and second movable blocks 111 and 112.
In addition, first guiding piece 108 with its on the second variable pick-up 122 is housed linear motor 104 be fixed on abreast on one side of first movable block 111, second guiding piece 109 with its on the first variable pick-up 121 is housed linear motor 102 be fixed on abreast on one side of second movable block 112.The setting height(from bottom) of first guiding piece 108 is lower than second guiding piece 109, and therefore first and second guiding pieces are orthogonal but non-intersect.
The 3rd movable block 113 that is fixed with the 3rd variable pick-up 123 of picks up semiconductor devices on it is connected with 109 with first and second guiding pieces 108 simultaneously.When first movable block 111 moved, the 3rd movable block 113 moved along second guiding piece 109.When second movable block 112 moved, the 3rd movable block 113 moved along first guiding piece 108.
Benchmark pick-up 120 and first to the 3rd variable pick-up 121,122 are identical with 123 shape, comprise respectively being fixed on the cylinder 120a-123a on fixed block 110 and movable block 111,112 and 113 and being contained on the cylinder 120a-123a bottom suction head apparatus 120b-123b that moves up and down, holds semiconductor device with pull of vacuum.
Simultaneously, the Hall element 106 that the predetermined magnetic field sensor in a plurality of intervals is housed on the bottom of frame 101 of the stator 102a of linear motor 102 and 104 and 104a is housed on it.Therefore, Hall element 106 detects the current location of the first and second variable pick- ups 121 and 122 before linear motor 102 and 104 starts.In addition, the bottom of the sensing plate 107 that stretches to a plurality of Hall elements 106 and linear motor 102 and 104 mover 102b and 104b is connected and is subjected to the detection of Hall element 106.
In addition, in order when linear motor 102 and 104 starts, accurately to control the mover 102b of linear motor 102 and 104 and moving of 104b by the displacement that detects the first and second variable pick- ups 121 and 122, linear staff 131 and 133 is fixed on the top of the mover 102b of linear motor 102 and 104 and 104b, on the top of the frame 101 that probe 132 that the numerical value of linear staff 131 and 133 is encoded and 134 dresses are equipped with linear motor 102 and 104 thereon.
In addition, a pair of limit sensors 137 and 138 is housed on the top of frame 101 and prevents that by the last moving range that limits the first and second variable pick- ups 121 and 122 transfiniting of pick-up is mobile.Limit sensors 137 and 138 also is used for the original position verification operation.The following original position verification operation of carrying out: after the semiconductor device conveyer installs on the processor, the first and second variable pick- ups 121 and 122 and the 3rd variable pick-up 123 of interlock with it move to disconnected position from approximated position, then the moving range of pick-up 121,122 and 123 is passed to the control device (not shown).
The following describes the working condition of the semiconductor device conveyer of said structure.
After testing a kind of semiconductor device if test another kind of semiconductor device, the kit that semiconductor device is housed on it should be changed according to the corresponding size and the kind of semiconductor device, and the spacing of the pick-up 120-123 of semiconductor device conveyer should change according to the spacing of replacing kit.
The user is in case the control device (not shown) of the specification input processor of replacing kit, control device just uses the Hall element 106 that is contained on the frame 101 to detect the current location of the first and second variable pick- ups 121 and 122, starts linear motor 102 and 104 then variable pick-up 121,122 and 123 is moved set amount to desired location from current location.
That is, detect the first and second variable pick- ups 121 and 122 after the current location on the frame 101, the control device (not shown) is started linear motor 102 and 104.The first and second variable pick- ups 121 and 122 are subjected to the guiding of linear movement guiding piece 103 and 105 then, move on direction initialization.At this moment, the 3rd variable pick-up 123 and the first and second variable pick- ups 121 and 122 synchronously move along second and first guiding piece 109 and 108.
When the first and second variable pick-ups during along with the mover 102b of linear motor 102 and 104 and 104b mobile and mobile, probe 132 and 134 pairs are contained in passes to the control device (not shown) after linear staff 131 on mover 102b and the 104b and 133 displacement are encoded.Therefore, control device can constantly be monitored the displacement of the first and second variable pick-ups 121 and 122.Therefore, when the first and second variable pick- ups 121 and 122 arrived desired location, the control device (not shown) stopped the operation of linear motor 102 and 104, thereby first to the 3rd variable pick-up 121-123 can accurately move to desired location.
For saving time, preferably start a pair of linear motor 102 and 104 simultaneously.But also can successively start this two linear motor.
Fig. 5 is the stereogram of semiconductor device conveyer second embodiment of the present invention, and in this embodiment, this conveyer comprises a pair of variable pick-up.
As shown in Figure 5, a fixed block 210 is fixed on the end of a base plate 201, and this base plate is fixed on the adjustable shelf of a processor.One benchmark pick-up 220 is contained on this fixed block 210.In addition, a stator 202 and a mover 203 are contained on one side of fixed block 210 on the base plate 201.
In this embodiment, the mover 203 of linear motor is connected with the top of the base plate 201 linear movement guiding piece 205 parallel with the bottom with one and moves horizontally along base plate 201.
One movable block 211 is fixed on the mover 203, and a variable pick-up 221 is fixed on the movable block 211.
In addition, identical with conveyer first embodiment of the present invention, a straight line scale 231 is connected with the top of mover 203 and controls the displacement of variable pick-up 221, and one scan 232 is contained on the top of base plate 201 numerical value of linear staff 231 is encoded.
In addition, a plurality of Hall element (not shown)s are distributed in preset space length on the bottom of base plate 201, and a sensing plate (not shown) that stretches to Hall element is connected with the bottom of mover 203.
The working condition of conveyer of the present invention second embodiment of said structure is simpler than first embodiment of the invention.In addition, conveyer of the present invention second embodiment of said structure is convenient to transmit simultaneously two semiconductor device.
Therefore, as the drive unit of a plurality of pick-ups, just can make that with the linear motor of minimum number some pick-ups link simultaneously to linear motor.
Therefore, the present invention can simplify the structure of conveyer and reduce its volume and weight.
In addition, use linear motor can when pick-up changes the position, prevent to generate dust, reduce noise, be convenient to safeguard, quickly and accurately pick-up be sent to desired location, improve testing efficiency.
Obviously, for a person skilled in the art, under the prerequisite that does not deviate from the spirit and scope of the present invention, can make various changes and variation to the present invention.Therefore, various change of the present invention, the content that changes by appending claims and equivalent thereof contain.
Claims (8)
1. the semiconductor device conveyer in the processor is characterized in that this conveyer comprises:
Be contained in two rectangle framves on the processor body movably;
Be contained in the stator of two linear motors on the described two rectangle frame adjacent inner surface respectively;
Two described linear motors can be along the mover of described stator movement;
One be fixed between described two, on the two described linear motor meet inside locks, the benchmark pick-up piece of picks up semiconductor devices;
Mover with two described linear motors first and second pick-up pieces that are connected, move along described rectangle frame respectively;
Be fixed on described first pick-up piece, with its on the first parallel guiding piece of described rectangle frame of described second pick-up piece is housed;
Be fixed on described second pick-up piece, second guiding piece vertical with described first guiding piece;
The 3rd pick-up piece that is connected with described first and second guiding pieces, moves along described second and first guiding piece with the motion of described first and second pick-up pieces; And
When starting, described linear motor controls the control device that moves of the described mover of described linear motor by the displacement that detects described first and second pick-up pieces.
2. conveyer according to claim 1 is characterized in that, described first and second pick-up pieces respectively comprise:
One is fixed on the movable block on the mover of described corresponding linear motor; And
One be fixed on the described movable block, the pick-up of picks up semiconductor devices.
3. conveyer according to claim 1 is characterized in that, comprises that further one detects the position sensing device of the current location of described first and second pick-up pieces before described linear motor starts.
4. conveyer according to claim 3 is characterized in that, described position sensing device comprises:
On the top or bottom of described each rectangle frame of a plurality of stators that described linear motor is housed thereon with predetermined space dress, detect the transducer of described rotor position; And
Be contained in the sensing plate that stretches, is subjected to described sensor on the top or bottom of described stator, to described transducer.
5. conveyer according to claim 1 is characterized in that, described control device comprises:
One is fixed on the linear staff on the described mover of described each linear motor;
And
The probe of encoding on the one described rectangle frame that described linear motor arranged fixed thereon, to the numerical value of described linear staff.
6. conveyer according to claim 3 is characterized in that, described control device comprises:
One is fixed on the linear staff on the described mover of each described linear motor;
And
The probe of encoding on the one described rectangle frame that described linear motor arranged fixed thereon, to the numerical value of described linear staff.
7. conveyer according to claim 1 is characterized in that described rectangle frame comprises the limit sensors of the rearmost position of limiting described first and second pick-up pieces respectively.
8. the semiconductor device conveyer in the processor is characterized in that this conveyer comprises:
One is contained in the base plate on the processor body movably;
One be fixed on described base plate one end, the benchmark pick-up piece of picks up semiconductor devices;
The stator and the mover of a linear motor of installing along described base plate;
First pick-up piece that is fixed on the described mover of described linear motor, moves horizontally along described base plate; And
When starting, described linear motor controls the control device that moves of the described mover of described linear motor by the displacement that detects described first pick-up piece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2001-0008016A KR100417421B1 (en) | 2001-02-17 | 2001-02-17 | Apparatus for protecting rotation of scroll compressor |
| KRP20010080160 | 2001-12-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1427461A CN1427461A (en) | 2003-07-02 |
| CN1213471C true CN1213471C (en) | 2005-08-03 |
Family
ID=19705877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021568081A Expired - Fee Related CN1213471C (en) | 2001-02-17 | 2002-12-13 | Transfer device for semiconductor device in processor |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100417421B1 (en) |
| CN (1) | CN1213471C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100699226B1 (en) * | 2005-08-05 | 2007-03-23 | 한국델파이주식회사 | Structure for Preventing Rotation in Scroll Compressor |
| KR100741684B1 (en) * | 2006-05-08 | 2007-07-23 | 학교법인 두원학원 | A scroll compressor having rotation prevention mechanism |
| KR100750747B1 (en) * | 2006-07-28 | 2007-08-22 | 주식회사 탑 엔지니어링 | Multi-head driving apparatus for semi-conductor chip resin potting machine |
| US9196521B2 (en) * | 2012-11-05 | 2015-11-24 | Infineon Technologies Ag | Adjustable pick-up head and method for manufacturing a device |
| US9776334B2 (en) | 2013-03-14 | 2017-10-03 | Kla-Tencor Corporation | Apparatus and method for automatic pitch conversion of pick and place heads, pick and place head and pick and place device |
| KR101976239B1 (en) * | 2013-03-14 | 2019-05-07 | 케이엘에이-텐코 코포레이션 | Apparatus and method for automatic pitch conversion of pick and place heads, pick and place head and pick and place device |
| KR20200144813A (en) * | 2019-06-19 | 2020-12-30 | 엘지전자 주식회사 | Scroll compressor |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122701A (en) * | 1982-01-14 | 1983-07-21 | 株式会社東芝 | Method of producing voltage nonlinear resistor |
| JPS58122701U (en) * | 1982-02-15 | 1983-08-20 | サンデン株式会社 | Rotation prevention mechanism for rotating piston type fluid machine |
| JPH08338376A (en) * | 1995-06-12 | 1996-12-24 | Nippondenso Co Ltd | Scroll type compressor |
| JPH09133086A (en) * | 1995-11-10 | 1997-05-20 | Nippon Soken Inc | Scroll type compressor |
| KR100208099B1 (en) * | 1997-07-29 | 1999-07-15 | 윤종용 | Scroll compressor |
| KR19990025678U (en) * | 1997-12-17 | 1999-07-05 | 전주범 | Main frame of scroll compressor |
| JP2001090670A (en) * | 1999-09-24 | 2001-04-03 | Daikin Ind Ltd | Hydraulic device |
-
2001
- 2001-02-17 KR KR10-2001-0008016A patent/KR100417421B1/en not_active IP Right Cessation
-
2002
- 2002-12-13 CN CNB021568081A patent/CN1213471C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1427461A (en) | 2003-07-02 |
| KR20020067729A (en) | 2002-08-24 |
| KR100417421B1 (en) | 2004-02-05 |
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Granted publication date: 20050803 Termination date: 20161213 |