CN120752649A - 学习模型适合区域检测装置、学习模型适合区域检测方法以及学习模型运用方法 - Google Patents

学习模型适合区域检测装置、学习模型适合区域检测方法以及学习模型运用方法

Info

Publication number
CN120752649A
CN120752649A CN202380094427.XA CN202380094427A CN120752649A CN 120752649 A CN120752649 A CN 120752649A CN 202380094427 A CN202380094427 A CN 202380094427A CN 120752649 A CN120752649 A CN 120752649A
Authority
CN
China
Prior art keywords
model
image
region
information
learning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380094427.XA
Other languages
English (en)
Chinese (zh)
Inventor
鹈沼宗利
小松壮太
石川昌义
丰田康隆
奥田知之
元吉隆广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Publication of CN120752649A publication Critical patent/CN120752649A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0267—Fault communication, e.g. human machine interface [HMI]
    • G05B23/027—Alarm generation, e.g. communication protocol; Forms of alarm
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00—Geometric image transformations in the plane of the image
    • G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
    • G06T3/4053—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution
    • G06T3/4076—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution using the original low-resolution images to iteratively correct the high-resolution images
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/60—Image enhancement or restoration using machine learning, e.g. neural networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/11—Region-based segmentation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Quality & Reliability (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Facsimile Image Signal Circuits (AREA)
  • Manufacturing & Machinery (AREA)
CN202380094427.XA 2023-04-25 2023-04-25 学习模型适合区域检测装置、学习模型适合区域检测方法以及学习模型运用方法 Pending CN120752649A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/016216 WO2024224467A1 (ja) 2023-04-25 2023-04-25 学習モデル適合領域検知装置、学習モデル適合領域検知方法、並びに学習モデル運用方法

Publications (1)

Publication Number Publication Date
CN120752649A true CN120752649A (zh) 2025-10-03

Family

ID=93256054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380094427.XA Pending CN120752649A (zh) 2023-04-25 2023-04-25 学习模型适合区域检测装置、学习模型适合区域检测方法以及学习模型运用方法

Country Status (4)

Country Link
JP (1) JPWO2024224467A1 (https=)
KR (1) KR20250140559A (https=)
CN (1) CN120752649A (https=)
WO (1) WO2024224467A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021095256A1 (https=) 2019-11-15 2021-05-20
WO2022070236A1 (ja) * 2020-09-29 2022-04-07 株式会社日立ハイテク 画質改善システム及び画質改善方法
JP7724114B2 (ja) * 2021-09-06 2025-08-15 川崎重工業株式会社 学習済モデルの構築方法

Also Published As

Publication number Publication date
KR20250140559A (ko) 2025-09-25
WO2024224467A1 (ja) 2024-10-31
TW202443446A (zh) 2024-11-01
JPWO2024224467A1 (https=) 2024-10-31

Similar Documents

Publication Publication Date Title
US20040040003A1 (en) Use of overlay diagnostics for enhanced automatic process control
JP3953355B2 (ja) 画像処理アライメント方法及び半導体装置の製造方法
KR20190059639A (ko) 콘크리트 표면 균열 측정 장치 및 방법
JP4677231B2 (ja) 向上された自動プロセス制御のためのオーバレイ診断の利用
JP6018803B2 (ja) 計測方法、画像処理装置、及び荷電粒子線装置
US8687921B2 (en) Image processing apparatus, image processing method, and image processing program
CN120752649A (zh) 学习模型适合区域检测装置、学习模型适合区域检测方法以及学习模型运用方法
CN115628685B (zh) 关键尺寸的测量方法、设备及关键尺寸的分级定位方法
JP4240066B2 (ja) エッチングプロセス監視方法及びエッチングプロセス制御方法
CN114612412B (zh) 三维点云数据的处理方法及其用途、电子设备、存储介质
JP5868462B2 (ja) パターン形状評価装置
JP2003214820A (ja) 線幅検査方法とその装置
CN117579814B (zh) 基于对焦检测的镜头快速检测方法
CN107863303A (zh) 缺陷检测方法
TWI913721B (zh) 學習模型適合領域測知裝置、學習模型適合領域測知方法、以及學習模型運用方法
JP5596812B2 (ja) パターン生成装置およびパターン形状評価装置
CN111473944A (zh) 观测流场中存在复杂壁面的piv数据修正方法、装置
JP4843415B2 (ja) パターン評価方法およびプログラム
JP3864491B2 (ja) 視差算出装置、距離算出装置およびこれらの方法
CN114049342A (zh) 一种去噪模型生成方法、系统、设备及介质
KR101802083B1 (ko) 플라즈마 방전 특성 모니터링 방법 및 그 장치
CN118982539B (zh) 一种数控机床铸件缺陷视觉检测方法及系统
CN115453827B (zh) 机台overlay监测方法、存储介质及系统
JP2000114150A (ja) リソグラフィ工程におけるアライメント方法およびオーバレイ測定方法、露光装置およびオーバレイ測定装置
Zhang et al. An effective method for low-contrast high-noise lithography SEM image contour extraction

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination