JPWO2024224467A1 - - Google Patents
Info
- Publication number
- JPWO2024224467A1 JPWO2024224467A1 JP2025516340A JP2025516340A JPWO2024224467A1 JP WO2024224467 A1 JPWO2024224467 A1 JP WO2024224467A1 JP 2025516340 A JP2025516340 A JP 2025516340A JP 2025516340 A JP2025516340 A JP 2025516340A JP WO2024224467 A1 JPWO2024224467 A1 JP WO2024224467A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
- G05B23/0267—Fault communication, e.g. human machine interface [HMI]
- G05B23/027—Alarm generation, e.g. communication protocol; Forms of alarm
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformations in the plane of the image
- G06T3/40—Scaling of whole images or parts thereof, e.g. expanding or contracting
- G06T3/4053—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution
- G06T3/4076—Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution using the original low-resolution images to iteratively correct the high-resolution images
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/60—Image enhancement or restoration using machine learning, e.g. neural networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/11—Region-based segmentation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Software Systems (AREA)
- Artificial Intelligence (AREA)
- Mathematical Physics (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- Data Mining & Analysis (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- Quality & Reliability (AREA)
- Image Analysis (AREA)
- Image Processing (AREA)
- Facsimile Image Signal Circuits (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/016216 WO2024224467A1 (ja) | 2023-04-25 | 2023-04-25 | 学習モデル適合領域検知装置、学習モデル適合領域検知方法、並びに学習モデル運用方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024224467A1 true JPWO2024224467A1 (https=) | 2024-10-31 |
Family
ID=93256054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025516340A Pending JPWO2024224467A1 (https=) | 2023-04-25 | 2023-04-25 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024224467A1 (https=) |
| KR (1) | KR20250140559A (https=) |
| CN (1) | CN120752649A (https=) |
| WO (1) | WO2024224467A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021095256A1 (https=) | 2019-11-15 | 2021-05-20 | ||
| WO2022070236A1 (ja) * | 2020-09-29 | 2022-04-07 | 株式会社日立ハイテク | 画質改善システム及び画質改善方法 |
| JP7724114B2 (ja) * | 2021-09-06 | 2025-08-15 | 川崎重工業株式会社 | 学習済モデルの構築方法 |
-
2023
- 2023-04-25 JP JP2025516340A patent/JPWO2024224467A1/ja active Pending
- 2023-04-25 WO PCT/JP2023/016216 patent/WO2024224467A1/ja not_active Ceased
- 2023-04-25 CN CN202380094427.XA patent/CN120752649A/zh active Pending
- 2023-04-25 KR KR1020257027850A patent/KR20250140559A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250140559A (ko) | 2025-09-25 |
| WO2024224467A1 (ja) | 2024-10-31 |
| CN120752649A (zh) | 2025-10-03 |
| TW202443446A (zh) | 2024-11-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250718 |