JPWO2024224467A1 - - Google Patents

Info

Publication number
JPWO2024224467A1
JPWO2024224467A1 JP2025516340A JP2025516340A JPWO2024224467A1 JP WO2024224467 A1 JPWO2024224467 A1 JP WO2024224467A1 JP 2025516340 A JP2025516340 A JP 2025516340A JP 2025516340 A JP2025516340 A JP 2025516340A JP WO2024224467 A1 JPWO2024224467 A1 JP WO2024224467A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025516340A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024224467A1 publication Critical patent/JPWO2024224467A1/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00Testing or monitoring of control systems or parts thereof
    • G05B23/02Electric testing or monitoring
    • G05B23/0205Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0267Fault communication, e.g. human machine interface [HMI]
    • G05B23/027Alarm generation, e.g. communication protocol; Forms of alarm
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00Machine learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00Geometric image transformations in the plane of the image
    • G06T3/40Scaling of whole images or parts thereof, e.g. expanding or contracting
    • G06T3/4053Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution
    • G06T3/4076Scaling of whole images or parts thereof, e.g. expanding or contracting based on super-resolution, i.e. the output image resolution being higher than the sensor resolution using the original low-resolution images to iteratively correct the high-resolution images
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00Image enhancement or restoration
    • G06T5/60Image enhancement or restoration using machine learning, e.g. neural networks
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • G06T7/11Region-based segmentation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20081Training; Learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Mathematical Physics (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Quality & Reliability (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Facsimile Image Signal Circuits (AREA)
  • Manufacturing & Machinery (AREA)
JP2025516340A 2023-04-25 2023-04-25 Pending JPWO2024224467A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/016216 WO2024224467A1 (ja) 2023-04-25 2023-04-25 学習モデル適合領域検知装置、学習モデル適合領域検知方法、並びに学習モデル運用方法

Publications (1)

Publication Number Publication Date
JPWO2024224467A1 true JPWO2024224467A1 (https=) 2024-10-31

Family

ID=93256054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025516340A Pending JPWO2024224467A1 (https=) 2023-04-25 2023-04-25

Country Status (4)

Country Link
JP (1) JPWO2024224467A1 (https=)
KR (1) KR20250140559A (https=)
CN (1) CN120752649A (https=)
WO (1) WO2024224467A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021095256A1 (https=) 2019-11-15 2021-05-20
WO2022070236A1 (ja) * 2020-09-29 2022-04-07 株式会社日立ハイテク 画質改善システム及び画質改善方法
JP7724114B2 (ja) * 2021-09-06 2025-08-15 川崎重工業株式会社 学習済モデルの構築方法

Also Published As

Publication number Publication date
KR20250140559A (ko) 2025-09-25
WO2024224467A1 (ja) 2024-10-31
CN120752649A (zh) 2025-10-03
TW202443446A (zh) 2024-11-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250718