CN120603895A - 导热性树脂组合物和导热性部件 - Google Patents

导热性树脂组合物和导热性部件

Info

Publication number
CN120603895A
CN120603895A CN202480009825.1A CN202480009825A CN120603895A CN 120603895 A CN120603895 A CN 120603895A CN 202480009825 A CN202480009825 A CN 202480009825A CN 120603895 A CN120603895 A CN 120603895A
Authority
CN
China
Prior art keywords
thermally conductive
resin composition
less
conductive resin
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480009825.1A
Other languages
English (en)
Chinese (zh)
Inventor
小林祐辅
古川淳士
岩本达矢
吉冈哲朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN120603895A publication Critical patent/CN120603895A/zh
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/223Di-epoxy compounds together with monoepoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/65Means for temperature control structurally associated with the cells
    • H01M10/653Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/33Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00Presence of epoxy resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202480009825.1A 2023-01-31 2024-01-31 导热性树脂组合物和导热性部件 Pending CN120603895A (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2023-013584 2023-01-31
JP2023013583 2023-01-31
JP2023013584 2023-01-31
JP2023-013583 2023-01-31
JP2023035923 2023-03-08
JP2023-035923 2023-03-08
JP2023059573 2023-03-31
JP2023-059573 2023-03-31
JP2023059531 2023-03-31
JP2023-059531 2023-03-31
PCT/JP2024/003187 WO2024162420A1 (ja) 2023-01-31 2024-01-31 熱伝導性樹脂組成物、及び熱伝導性部材

Publications (1)

Publication Number Publication Date
CN120603895A true CN120603895A (zh) 2025-09-05

Family

ID=92146650

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202480009825.1A Pending CN120603895A (zh) 2023-01-31 2024-01-31 导热性树脂组合物和导热性部件
CN202480010003.5A Pending CN120548341A (zh) 2023-01-31 2024-01-31 导热性树脂组合物和导热性构件
CN202480010084.9A Pending CN120641489A (zh) 2023-01-31 2024-01-31 固化性组合物及导热部件

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202480010003.5A Pending CN120548341A (zh) 2023-01-31 2024-01-31 导热性树脂组合物和导热性构件
CN202480010084.9A Pending CN120641489A (zh) 2023-01-31 2024-01-31 固化性组合物及导热部件

Country Status (4)

Country Link
EP (3) EP4660241A1 (https=)
JP (3) JPWO2024162423A1 (https=)
CN (3) CN120603895A (https=)
WO (3) WO2024162423A1 (https=)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR530E (fr) 1902-05-01 1903-02-03 Clement Adolphe Dispositif pour le controle d'allumage et la mise en marche automatique des moteurs à explosion
JP2001261722A (ja) * 2000-03-22 2001-09-26 Jsr Corp 熱伝導性シート用硬化性組成物、半硬化熱伝導性シートおよびその製造方法
JP4752109B2 (ja) * 2000-12-12 2011-08-17 日立化成工業株式会社 樹脂ペースト組成物及びこれを用いた半導体装置
JP2011195673A (ja) * 2010-03-18 2011-10-06 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート、樹脂シートの製造方法及び積層構造体
JP6134089B2 (ja) * 2011-02-22 2017-05-24 積水化学工業株式会社 絶縁材料及び積層構造体
JP5913884B2 (ja) * 2011-09-27 2016-04-27 積水化学工業株式会社 絶縁材料及び積層構造体
JP2015021118A (ja) * 2013-07-23 2015-02-02 スリーエム イノベイティブ プロパティズ カンパニー 2液型ポッティング組成物
JP6405867B2 (ja) * 2013-12-16 2018-10-17 日立化成株式会社 樹脂ペースト組成物及び半導体装置
KR102029853B1 (ko) * 2016-10-31 2019-10-08 스미또모 베이크라이트 가부시키가이샤 열전도성 페이스트 및 전자 장치
WO2019155327A2 (en) 2018-02-12 2019-08-15 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
WO2020077333A1 (en) * 2018-10-12 2020-04-16 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
KR102391491B1 (ko) * 2019-11-20 2022-04-27 주식회사 엘지화학 경화성 조성물
JP2022116587A (ja) 2021-01-29 2022-08-10 デクセリアルズ株式会社 熱伝導性組成物及びこれを用いた電子機器

Also Published As

Publication number Publication date
WO2024162423A1 (ja) 2024-08-08
CN120641489A (zh) 2025-09-12
CN120548341A (zh) 2025-08-26
EP4660243A1 (en) 2025-12-10
EP4660242A1 (en) 2025-12-10
WO2024162414A1 (ja) 2024-08-08
JPWO2024162414A1 (https=) 2024-08-08
JPWO2024162420A1 (https=) 2024-08-08
EP4660241A1 (en) 2025-12-10
JPWO2024162423A1 (https=) 2024-08-08
WO2024162420A1 (ja) 2024-08-08

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