CN120435766A - 中介板 - Google Patents
中介板Info
- Publication number
- CN120435766A CN120435766A CN202480007354.0A CN202480007354A CN120435766A CN 120435766 A CN120435766 A CN 120435766A CN 202480007354 A CN202480007354 A CN 202480007354A CN 120435766 A CN120435766 A CN 120435766A
- Authority
- CN
- China
- Prior art keywords
- electrode
- dielectric
- dielectric layer
- capacitor
- interposer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-016287 | 2023-02-06 | ||
| JP2023016287 | 2023-02-06 | ||
| PCT/JP2024/002675 WO2024166733A1 (ja) | 2023-02-06 | 2024-01-29 | インタポーザ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120435766A true CN120435766A (zh) | 2025-08-05 |
Family
ID=92262441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202480007354.0A Pending CN120435766A (zh) | 2023-02-06 | 2024-01-29 | 中介板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024166733A1 (https=) |
| CN (1) | CN120435766A (https=) |
| WO (1) | WO2024166733A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051501A (ja) * | 2001-05-30 | 2003-02-21 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| JP5003502B2 (ja) * | 2008-01-16 | 2012-08-15 | 日本電気株式会社 | キャパシタ、キャパシタ内蔵配線基板、及びその製造方法 |
| JP2020191377A (ja) * | 2019-05-22 | 2020-11-26 | 株式会社アドヴィックス | 回路基板 |
-
2024
- 2024-01-29 WO PCT/JP2024/002675 patent/WO2024166733A1/ja not_active Ceased
- 2024-01-29 CN CN202480007354.0A patent/CN120435766A/zh active Pending
- 2024-01-29 JP JP2024576252A patent/JPWO2024166733A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024166733A1 (ja) | 2024-08-15 |
| JPWO2024166733A1 (https=) | 2024-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10032646B2 (en) | Robust multi-layer wiring elements and assemblies with embedded microelectronic elements | |
| US7713788B2 (en) | Method of manufacturing semiconductor package using redistribution substrate | |
| JP5161732B2 (ja) | 半導体装置の製造方法 | |
| US6396153B2 (en) | Circuit chip package and fabrication method | |
| US20170256496A1 (en) | Chip package and method for forming the same | |
| US12218098B2 (en) | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | |
| KR20030094029A (ko) | 반도체 장치 및 그 제조 방법 | |
| US11557542B2 (en) | Electronic circuit device and method of manufacturing electronic circuit device | |
| US7839650B2 (en) | Circuit board structure having embedded capacitor and fabrication method thereof | |
| TW201947710A (zh) | 封裝載板結構及其製造方法 | |
| US20230163074A1 (en) | Chip packaging structure and manufacturing method thereof | |
| WO2007037106A1 (ja) | 三次元積層構造を持つ集積回路装置の製造方法 | |
| US9171804B2 (en) | Method for fabricating an electronic component | |
| US7078311B2 (en) | Substrate-embedded capacitor, production method thereof, and circuit board | |
| CN120435766A (zh) | 中介板 | |
| US20250105130A1 (en) | Electronic Device and Manufacturing Method Thereof | |
| US10897823B2 (en) | Circuit board, package structure and method of manufacturing the same | |
| CN101120622B (zh) | 用于将配线膜互连的部件及其制造方法 | |
| CN113615324B (zh) | 承载件布置和用于制备承载件布置的方法 | |
| US7244647B2 (en) | Embedded capacitor structure in circuit board and method for fabricating the same | |
| EP4503124A1 (en) | Hybrid substrates and manufacturing methods thereof | |
| US20250379175A1 (en) | Semiconductor device and manufacturing method thereof | |
| KR20250147857A (ko) | 유리 기판, 유리 기판을 포함하는 반도체 패키지 및 그 제조 방법 | |
| KR20250136347A (ko) | 배선 기판군 및 그 제조 방법 그리고 배선 기판 및 그 제조 방법 | |
| WO2025032826A1 (ja) | 半導体装置の製造方法及び半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |