CN120418937A - 传送装置及传送方法 - Google Patents

传送装置及传送方法

Info

Publication number
CN120418937A
CN120418937A CN202280102819.1A CN202280102819A CN120418937A CN 120418937 A CN120418937 A CN 120418937A CN 202280102819 A CN202280102819 A CN 202280102819A CN 120418937 A CN120418937 A CN 120418937A
Authority
CN
China
Prior art keywords
substrate
optical system
laser light
transfer
starting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280102819.1A
Other languages
English (en)
Chinese (zh)
Inventor
大谷义和
山冈裕
宇佐美健人
仓田昌实
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Publication of CN120418937A publication Critical patent/CN120418937A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202280102819.1A 2022-12-27 2022-12-27 传送装置及传送方法 Pending CN120418937A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/048404 WO2024142328A1 (ja) 2022-12-27 2022-12-27 移送装置及び移送方法

Publications (1)

Publication Number Publication Date
CN120418937A true CN120418937A (zh) 2025-08-01

Family

ID=91716821

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280102819.1A Pending CN120418937A (zh) 2022-12-27 2022-12-27 传送装置及传送方法

Country Status (5)

Country Link
JP (1) JPWO2024142328A1 (enrdf_load_stackoverflow)
KR (1) KR20250128973A (enrdf_load_stackoverflow)
CN (1) CN120418937A (enrdf_load_stackoverflow)
TW (1) TW202427663A (enrdf_load_stackoverflow)
WO (1) WO2024142328A1 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744770B2 (en) * 2004-06-23 2010-06-29 Sony Corporation Device transfer method
JP2018060993A (ja) * 2016-09-29 2018-04-12 東レエンジニアリング株式会社 転写方法、実装方法、転写装置、及び実装装置
CN115335974A (zh) * 2020-03-23 2022-11-11 东丽工程株式会社 安装方法、安装装置以及转印装置

Also Published As

Publication number Publication date
TW202427663A (zh) 2024-07-01
JPWO2024142328A1 (enrdf_load_stackoverflow) 2024-07-04
WO2024142328A1 (ja) 2024-07-04
KR20250128973A (ko) 2025-08-28

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