CN1198494C - Manufacture of thin core board for multiple-layer circuit board - Google Patents
Manufacture of thin core board for multiple-layer circuit board Download PDFInfo
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- CN1198494C CN1198494C CN 01136591 CN01136591A CN1198494C CN 1198494 C CN1198494 C CN 1198494C CN 01136591 CN01136591 CN 01136591 CN 01136591 A CN01136591 A CN 01136591A CN 1198494 C CN1198494 C CN 1198494C
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- layer
- circuit board
- blind hole
- insulating barrier
- conductive layer
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Abstract
The present invention relates to a method for manufacturing a core substrate of a build-up circuit board. The present invention has the following ideal implementation steps that an insulating layer covered with an electrically conductive film is used to form an opening in a preset position of the insulating layer, namely the position where a subsequent blind via is formed; a conducting layer is deposited and covered on the blind via opening to form a structure of electrically conducting the blind via; after the electrically conductive film and the conducting layer are patterned, the thin core substrate is manufactured. Then a plurality of build-up structures are completed on at least one surface of the core substrate, and the build-up circuit board can be manufactured.
Description
Technical field
The present invention relates to a kind of processing procedure of layer increased circuit board, particularly a kind of method for making that is used to make the thin core board of layer increased circuit board, the formation of this core board utilizes its surface to be covered with the insulating barrier of electrically conductive layer, and makes the blind hole that electrically conducts at insulating barrier, so that the connection between conductive layer to be provided.
Background technology
The electronic product small light has become main flow, as mobile phone, laptop computer, portable videocorder or personal digital assistant (personal digital assistants) etc.Therefore the making of these electronic products needs to use than littler, thinner in the past circuit board and electronic building brick.Along with the trend of this downsizing, the semiconductor subassembly of various difference in functionalitys is embedded in then more highdensity demand on the circuit board.Therefore, corresponding multilayer circuit board with above-mentioned thinner and high wiring density is in electronic product, and the processing procedure of circuit board then will face higher challenge with designing.
Make industry at circuit board, low cost, high-reliability and high wiring density are the targets of being pursued always.For reaching this target, a kind of layer technology (build-up) that increase so develop.The so-called layer technology that increase is meant mutual storehouse multilayer dielectric layer and conductive layer on a core board surface basically, makes electrically conducting hole (via holes) so that the electric connection between each conductive layer to be provided again in insulating barrier.Yet the number of layer increased circuit board can be complied with the required storehouse of actual industry situation above 10 or 20 layers more than.So far, the technology of layer increased circuit board has produced many multilayer circuit boards that are mounted with various electronic building brick and has been applied to various commercial product.
Usually, making layer increased circuit board need utilize a single, double panel or multi-layer sheet as core substrate (core substrate) or abbreviation core board.Fig. 1 and Fig. 2 then increase the schematic diagram of layer multi-layer circuit board for tradition.See also Fig. 1, one increases layer multi-layer circuit board 100 comprises a core substrate 101 and two layer reinforced structures 102.This core substrate 101 comprises the circuit layer 103 of some patternings, and the insulating barrier 104 that is positioned at 103 of wantonly two circuit layers.105 electrically interior connections of one conductive through hole as 103 of circuit layers.And this layer reinforced structure 102 also comprises the multilayer of circuit layer 106 and insulating barrier 107, yet, the circuit layer 106 of layer reinforced structure 102 and insulating barrier 107 than the circuit layer 103 of core substrate 101 and insulating barrier 104 to approach usually many.106 of the circuit layers of this layer reinforced structure 102 then electrically connect with conductive through hole 108 (vias).With Fig. 1, core substrate 101 is a multilayer circuit board (that is six layers), and layer reinforced structure 102 is then two-layer for respectively having up and down.
Figure 2 shows that another tradition increases the schematic diagram of layer multi-layer circuit board, wherein one increases layer multi-layer circuit board 200 and comprises a circuit board 201 as core substrate and two layer reinforced structures 202.This circuit board 201 comprises two patterned circuit layer 203 and insulating barrier 204 therebetween.205 electric connections of one conductive through hole as 203 of circuit layers.And this layer reinforced structure 202 also comprises circuit layer 206 and insulating barrier 207, yet, the circuit layer 206 of layer reinforced structure 202 and insulating barrier 207 than the circuit layer 203 of circuit board 201 and insulating barrier 204 to approach usually many.206 of the circuit layers of this layer reinforced structure 202 then electrically connect with through hole 208 (vias).And with Fig. 2, circuit board 201 is a multilayer circuit board (that is two-layer), and layer reinforced structure 202 following two sides on circuit board 201 then respectively has two to increase layer, so then forms a 6-layer circuit board structure.
Design processing procedure in multilayer circuit board for reaching more reliable via, Fig. 3 shows three kinds of via processing procedures that industry is common.Fig. 3 A is depicted as one and is commonly called as plating via (platedthrough hole, schematic diagram PTH).Wherein the opening of through hole extends and to pass through insulating barrier 301 and to be overlying on its surperficial circuit layer 302 and 303, and the conductive layer that is made of plated metal 304 then is formed at the sidewall of this via.After plating is finished, recharge a conduction or non-conductive filling material 305 and fill up residual clearance, to guarantee the reliability of via.
Fig. 3 B is depicted as another kind of through-hole form, promptly so-called blind hole (blind via), and wherein the opening of blind hole extends to insulating barrier 306 inside, but does not penetrate circuit layer 307.After electrodeposited coating 308 depositions, fill a conduction or non-conductive material 309 in recess, think that successive process provides suitable flatness.
Fig. 3 C is depicted as the third through-hole form, and wherein insulating barrier 310 is passed through in the extension of the opening of blind hole, but does not also penetrate circuit layer 311.After through hole is inserted conduction material 313, form circuit layer 312 again.
Above-mentioned three kinds of conventional arts all need be inserted and fill material in the space of through hole.Yet be lower than 0.05mm when following at through-hole diameter, its processing procedure will become and be difficult to carry out.When therefore general industry was produced in a large amount of manufacturings, above-mentioned three kinds of processing procedures must be implemented when 0.75mm is above in through-hole diameter, make the feasibility of manufacturing many easily.So under the situation, core substrate just can limit because of the process technique of through hole, and can't reach the requirement of higher wiring density.
Therefore, problem to be solved by this invention provides the core substrate of higher wiring density, and form a thinner and higher wiring density increase the layer multi-layer circuit board.
Summary of the invention
Purpose of the present invention is for providing a kind of method for making that is used to make the thin core board of layer increased circuit board, and the method for making that increases the layer multi-layer circuit board that can utilize the thin and high wiring density of this core board manufacturing.
The method for making that is used to make the thin core board of layer increased circuit board provided by the invention, may further comprise the steps: an organic insulator a) is provided, and this insulating barrier has first and second relative surface; B) on first and second surface of described insulating barrier, be formed with an electrically conductive layer (conductive sheet) respectively; C) remove in this electrically conductive layer material on the some precalculated positions of this electrically conductive layer and this insulating barrier material on the identical precalculated position at this insulating barrier, to form blind hole (blind via) opening; D) deposition one conductive layer covers respectively this blind hole; E) carry out patterning and define circuit layer.
The processing procedure of layer increased circuit board provided by the invention (build-up circuit layer) may further comprise the steps: an organic insulator a) is provided, and the upper and lower surface of this insulating barrier is formed with an electrically conductive layer (conductive sheet) respectively; B) remove in this electrically conductive layer material on the some precalculated positions of this electrically conductive layer and this insulating barrier material on the identical precalculated position at this insulating barrier, to form blind hole (bland via) opening; C) deposition one conductive layer covers respectively this blind hole; D) carry out patterning and define circuit layer, to form a core substrate; E) at least one layer reinforced structure (build-up structure) is formed on the one side at least of this core substrate, to form a layer increased circuit board.
Below in conjunction with description of drawings purpose of the present invention, feature and effect.
Description of drawings
Fig. 1 is the schematic diagram that increases the layer multi-layer board structure of circuit in the conventional art.
Fig. 2 is the schematic diagram that increases the layer multi-layer board structure of circuit in another conventional art.
Fig. 3 A is the schematic diagram of conventional art electroplating ventilating hole structure.
Fig. 3 B institute conventional art recess is filled with the blind hole structure schematic diagram of filling material.
Fig. 3 C institute conventional art is filled with the blind hole structure schematic diagram of conduction material material fully.
Fig. 4 A is the schematic diagram with the core board structure of the blind hole of recess.
Fig. 4 B is the schematic diagram of the core board structure of another form blind hole of filling up entirely.
Fig. 5 A to Fig. 5 F is the schematic diagram that the embodiment of the invention is made thin core board processing procedure.
Fig. 6 A is that the embodiment of the invention utilizes a thin core layer to form the schematic diagram of layer increased circuit board.
Fig. 6 B is that another embodiment of the present invention utilizes a thin core layer to form the schematic diagram of layer increased circuit board.
The drawing reference numeral explanation: 1,10,13,104,107,301,306,310,403, the 503-insulating barrier; 2, the 11-electrically conductive layer; The 3-opening; 4-blind hole opening; 5,6,7,8,307,405, the 505-conductive layer; 14,103,106,203,206,302,303,307,312,313,401,402,501, the 502-circuit layer; 9,102, the 202-layer reinforced structure; 101,400, the 500-core substrate; 100,200,600,700-increases the layer multi-layer circuit board; 105,205-via (through hole); 108,208-guide hole (via); 201, the 202-circuit board; The 304-plated metal; 305,309-fills material; 313-conducts electricity material; The 404-blind hole.
Embodiment
For purpose, feature and the effect that makes the present invention, can further understand and approval, described in detail below in conjunction with accompanying drawing.Certainly, the present invention can implement in a variety of forms, and the following stated only is preferred embodiment of the present invention, but not limits the scope of the invention, so long as be attached to the embodiment under the spirit of the present invention, all belongs to scope of the present invention.
The present invention proposes a kind of method for making that is used to make the thin core board of layer increased circuit board, utilize this core board can produce the multilayer circuit board of thin and the high wiring density of tool.Diagram of the present invention only is simple declaration, be not to describe according to actual size, that is unreacted goes out in the Mulitilayer circuit board actual size of each level and characteristic.
The described thin core board of the present invention's embodiment is the circuit board of a tool two conductive layers, and this circuit board has the design of the blind hole of electrically conducting.Be depicted as a typical core substrate 400 as Fig. 4 A, it is the two-tier circuit plate with the blind hole design, wherein there are two circuit layers 401,402 to be located at the both sides up and down of insulating barrier 403 respectively, and are coated with of the electric connection of the blind hole 404 of conductive layer 405 as two circuit layers 401,402.Yet the recess of through hole is not filled up fully by conductive layer 405 materials.Then be the core substrate 500 of another form shown in Fig. 4 B, it also is the two-tier circuit plate with blind hole design, wherein has two circuit layers 501,502 to be located at the both sides up and down of insulating barrier 503 respectively, and 504 of the openings of blind hole are filled up fully by conductive layer 505 materials.
Figure 5 shows that the processing procedure schematic diagram of aforesaid core substrate 400 or 500.See also Fig. 5 A, an organic insulator 1 is provided earlier, its bond has two electrically conductive layers 2 up and down, and the preferred thickness of this insulating barrier 1 is between 0.01～0.2mm, and better person is between 0.01～0.06mm.Described organic insulator 1 has base material matter etc. to be constituted by organic material, fibre strengthening (fiber-reinforced) organic material or particle strengthening (particle-reinforced), as the composite material of epoxy resin (epoxy resin), poly-ethanamide (polyimide), two butadiene dilute acid vinegar imines/three nitrogen traps (bismaleimide triazine-based) resin, hydrocyanic ester (cyanate ester), polybenzocyclobutane or its glass fibre (glassfiber) etc.Certainly, organic insulator 1 also can be formed by stacking by the multilayer unlike material.And described electrically conductive layer 2 can be metal material, as gold, silver, copper, aluminium etc., or electroconductive polymer (conductive polymer) etc.; This conductive film 2 is preferably copper material, and preferred thickness then is between 0.008～0.015mm.Electrically conductive layer 2 also can carry out chemistry or physical etch makes it attenuation according to required, because of thin conductive layer can be in general etched circuit formation technology, and the fine and close circuit pattern of easier formation (finner circuit pattern).
Then shown in Fig. 5 B, remove partially conductive thin layer 2, on electrically conductive layer 2, form opening 3 with laser explosion worn (laser ablation) or etching technique; The preferable diameter of this opening 3 is between 0.005～1.0mm, is more preferred between 0.02～0.04mm.
Technology such as then can the laser explosion worn, chemical etching or (plasma) etching of electricity slurry form blind hole opening 4 in this insulating barrier 1, shown in Fig. 5 C.Yet under this situation, it is noted that, if the material of insulating barrier 1 is a light video picture resin (photoimageableresin), then can't the little shadow technology of mat tradition form blind hole opening 4, this is because ultraviolet light (UV) can be stopped (blocked) by electrically conductive layer 2.After forming blind hole opening 4, to carrying out the surface of the electrically conductive layer 2 in the cleaning, particularly blind hole in the blind hole, be subject to residue and pollute again, then also can carry out physics or chemical roughen, to promote tackness (adhesion property) in the blind hole and the outer surface of blind hole.
Deposition is just like conductive layer 5 among Fig. 5 D and Fig. 5 E or the conductive layer 6 among Fig. 5 F, cover in electrically conductive layer 2 and/or the blind hole opening 4, it can be electroplated modes such as (electroplating), electroless plating (electroless plating), physical vapor deposition (PVD) or chemical vapor deposition (CVD) and form.Wherein copper plating (copper plating) should be the preferable selection under the invention process cost is considered.In addition, in blind hole opening 4,5 of the conductive layers of Fig. 5 D and Fig. 5 E have only filling part blind hole opening 4 and still have the depression (recess) of not filling up with respect to conductive layer 6 complete filling of Fig. 5 F.Certainly, when aperture during less than 0.05mm, with electro-coppering via openings being filled up fully and will be easier to realize, also is more helpful to making storehouse through hole (stacked vias).Form circuit layer 7 among Fig. 5 D and Fig. 5 E (be electrically conductive layer 2 with conductive layer 5 combine) in worn with the laser explosion (being commonly called as the direct patterning method of laser), chemistry or electric paste etching technology, or the circuit layer among Fig. 5 F 8 (be electrically conductive layer 2 with conductive layer 6 combine), the preferred thickness of circuit layer 7,8 can be between 0.008～0.015mm.So, here being made in of core substrate 400,500 (being shown in respectively among Fig. 4 A, Fig. 4 B) finishes.
Certainly, the conductive layer 5 of Fig. 5 D and Fig. 5 E is because of having only filling part blind hole opening 4, and still has the sunk structure that does not fill up, wherein sunk structure can design on the difference one side of insulating barrier 1, as the structural representation of Fig. 5 D, or on same one side, shown in the structural representation of Fig. 5 E.
As shown in Figure 6A, wherein layer reinforced structure 9 includes insulating barrier 10 and electrically conductive layer 11, and it also is formed on the core substrate 400 and increases layer multi-layer circuit board 600 to form one, and wherein, this increases the blind hole recess place of layer multi-layer circuit board 600 and is filled with insulation material 10.
Same method, in Fig. 6 B, described layer reinforced structure 12 includes insulating barrier 13 and circuit layer 14, and it also is formed on the core substrate 500 and increases layer multi-layer circuit board 700 to form another.Yet it is noted that so-called storehouse through hole 15 (stackedvias) can provide higher wiring density in circuit board 700.In addition, described increase layer multi-layer circuit board 600,700 can be used as for core layer to form more multi-layered lamination.And, described layer a technology implementation example and the non-limiting scope of the present invention of increasing, those skilled in the art knows that all the application of any layer increased circuit board processing procedure all belongs to scope of the present invention.
In sum, the invention provides a kind of method for making that is used to make the thin core board of layer increased circuit board, the good reliability between layer multi-layer circuit board and circuit board of increasing of thin and high wiring density can be provided.
The above only is the preferred embodiment of board structure of circuit of the present invention and processing procedure; be not in order to limit practical range of the present invention; any those skilled in the art is in the modification of making without prejudice to spirit of the present invention; all should belong to scope of the present invention, so protection scope of the present invention ought be a foundation with claims.
Claims (10)
1, a kind of method for making that is used to make the thin core board of layer increased circuit board may further comprise the steps:
(a) provide an organic insulator, this insulating barrier has first and second relative surface;
(b) on first and second surface of described insulating barrier, be formed with an electrically conductive layer respectively;
(c) remove electrically conductive layer material on these some precalculated positions of two electrically conductive layers on first and second surface respectively, and the insulating barrier material on the identical precalculated position of this insulating barrier, to form the blind hole opening;
(d) deposition one conductive layer covers respectively this blind hole;
(e) carry out patterning and define circuit layer.
2, the method for making that is used to make the thin core board of layer increased circuit board as claimed in claim 1, wherein the thickness of this insulating barrier ties up between 0.001mm～0.1mm.
3, the method for making that is used to make the thin core board of layer increased circuit board as claimed in claim 1, wherein the diameter of this blind hole opening ties up between 0.005mm～0.15mm.
4, the method for making that is used to make the thin core board of layer increased circuit board as claimed in claim 1, the blind hole of wherein said step (d) is partly filled up by conductive layer.
5, the method for making that is used to make the thin core board of layer increased circuit board as claimed in claim 1, the blind hole of wherein said step (d) is filled up fully by conductive layer.
6, a kind of method for making of layer increased circuit board may further comprise the steps:
(a) provide an organic insulator, the upper and lower surface of this insulating barrier is formed with an electrically conductive layer respectively;
(b) remove electrically conductive layer material on these some precalculated positions of two electrically conductive layers on first and second surface respectively, and at this insulating barrier to the insulating barrier material on the precalculated position, to form the blind hole opening;
(c) deposition one conductive layer covers respectively this blind hole;
(d) carry out patterning and define circuit layer, to form a core substrate;
(e) at least one layer reinforced structure is formed on the one side at least of this core substrate, to form a layer increased circuit board.
7, the method for making of layer increased circuit board as claimed in claim 6, wherein the thickness of this insulating barrier ties up between 0.001mm～0.1mm.
8, the method for making of layer increased circuit board as claimed in claim 6, wherein the diameter of this blind hole opening is between 0.005mm～0.15mm.
9, the method for making of layer increased circuit board as claimed in claim 6, the blind hole of wherein said step (c) can partly be filled up by conductive layer.
10, the method for making of layer increased circuit board as claimed in claim 6, the blind hole of wherein said step (c) is filled up fully by conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01136591 CN1198494C (en) | 2001-10-19 | 2001-10-19 | Manufacture of thin core board for multiple-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01136591 CN1198494C (en) | 2001-10-19 | 2001-10-19 | Manufacture of thin core board for multiple-layer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1348330A CN1348330A (en) | 2002-05-08 |
| CN1198494C true CN1198494C (en) | 2005-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01136591 Expired - Fee Related CN1198494C (en) | 2001-10-19 | 2001-10-19 | Manufacture of thin core board for multiple-layer circuit board |
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| Country | Link |
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| CN (1) | CN1198494C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101511151B (en) * | 2009-03-02 | 2011-03-23 | 汕头超声印制板公司 | Method for processing blind hole of PCB |
| CN101790289B (en) * | 2009-06-10 | 2011-05-18 | 华为技术有限公司 | PCB with interconnected blind holes and processing method thereof |
| CN102026471B (en) * | 2009-09-18 | 2013-05-08 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| TWI496258B (en) * | 2010-10-26 | 2015-08-11 | Unimicron Technology Corp | Fabrication method of package substrate |
| CN102958288B (en) * | 2011-08-21 | 2015-04-29 | 深南电路有限公司 | Printed circuit board drilling method |
| CN103857208A (en) * | 2012-12-06 | 2014-06-11 | 深南电路有限公司 | Machining method for circuit board drilling |
-
2001
- 2001-10-19 CN CN 01136591 patent/CN1198494C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1348330A (en) | 2002-05-08 |
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Granted publication date: 20050420 Termination date: 20161019 |