CN1434675A - Method for making stacking type multilayer board with inner embeded film shape resistor element - Google Patents
Method for making stacking type multilayer board with inner embeded film shape resistor element Download PDFInfo
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- CN1434675A CN1434675A CN 02102489 CN02102489A CN1434675A CN 1434675 A CN1434675 A CN 1434675A CN 02102489 CN02102489 CN 02102489 CN 02102489 A CN02102489 A CN 02102489A CN 1434675 A CN1434675 A CN 1434675A
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Abstract
This invention relates to a process method for laminated multilayer circuit board embedded with film resistor elements including firstly providing an organic insulation baseplate with a laminated conductive layer, removing part of the conductive layer to form an open zone, then depositing an insulation layer and a resistor layer in it orderly again depositing a conductive layer covering the resistor layer to be protected when it forms guide holes and through holes later, then again forming electrode and circuit diagram of the resistor layer by microimage etching technology. An laminated multilayer circuit board with embedded film resistor elements is processed by repeating the said method.
Description
Technical field
The present invention relates to a kind of method for making stacking type multilayer board that is embedded with film resistance, particularly relate to a kind of manufacture method of passive device in multilayer circuit board that the excellent electrical accuracy of tool is provided, it also has superior in reliability.
Background technology
Along with the continuous development of integrated circuit industry, it has inlayed the trend of density, high associativity and the high speed of service toward height.Under such technical field, semiconductor element or passive device high density are embedded in technology on the multilayer circuit board also with regard to particular importance.Yet for further can dwindle the space requirement of circuit board, the multilayer circuit board that edge is embedded with passive device, passive device such as resistor, capacitor and inductor and voltage-controlled quartz (controlled) oscillator (voltage controlledoscillators) etc. so develop.
Multiple passive device combination is made in a multilayer circuit board has several different modes.This shows,, be embedded in a multilayer circuit board as membranaceous resistor combination edge and also have multiple mode a membranaceous passive device.For instance, the thick-film resistor modulator material intersperses among thick-film resistor modulator material in the resin and ruthenium-oxide (RuO as silver powder or carbon granule
2) being dispersed in thick-film resistor modulator material in the binding agent (binder) with glass powder, this kind thick-film resistor can utilize silk screen process mode (screenprinting) coating to be solidified to form usually again.And with the film resistor modulator material, as the film resistor modulator material of nickel chromium triangle (Ni-Cr), nickel phosphorus (Ni-P), nickel tin (Ni-Sn), chromium aluminium (Cr-Al) and titanium nitride (TaN) alloy etc., this thin film resistor then can utilize sputter (sputtering), (electroplating) or the electroless plating modes such as (electroless plating) of electroplating forms.And select to use thick-film resistor or use thin film resistor, then be to decide with the cost of manufacture of making multilayer circuit board and the electrical accuracy of made passive device.
Though many is that many institutes are all known in order to the thick film of making passive device or the method for thin-film material, but key wherein is how to inlay to bury this type of thick film or film passive device in circuit board, with multilayer circuit board, its key aspect refers to promptly that also membranaceous passive device manufacture method must can be combined in the manufacture method of multilayer circuit board.Yet most of technology in this field, as United States Patent (USP) U.S.patent No.3,857,683,5,243,320 and 5,683,928 etc., mostly be in the multilayer circuit board fabrication method before forming a new lamination, form thick film or film passive device with silk screen process and/or photoresistance etching modes such as (photoresist-etching) earlier at surface of insulating layer.But these modes have the shortcoming that can't overcome, and are not the coarse uneven causes of surface of insulating layer owing to the passive device bottom, and are difficult to reach feasible high electrically accuracy; Otherwise be exactly because insulating barrier is too level and smooth, and the adherence between the patterned circuit layer of causing weakening, and can't reach preferable reliability circuitry plate.
Therefore, one of problem to be solved by this invention, promptly be that embedded manufacture method and one stacked (laminate) multilayer circuit board fabrication method with a kind of membranaceous passive device makes up, the multilayer circuit board of made not only has the high reliability characteristic, and the high electrically accuracy of its embedded membranaceous passive device tool.
Summary of the invention
Main purpose of the present invention is to provide a kind of multilayer circuit board fabrication method that is embedded with resistive element, especially can provide the passive device of the excellent electrically accuracy of tool to inlay the manufacture method that is embedded in the multilayer circuit board, and have superior in reliability.
Another object of the present invention is to provide a kind of multilayer circuit board fabrication method that is embedded with film resistance, it can be manufactured in the method for manufacturing circuit board of being made up of multi-layered sheet easily.
A further object of the present invention is to provide a kind of high electrically multilayer circuit board fabrication method of accuracy film resistance that is embedded with, and the film resistance edge is embedded in the multilayer circuit board, and still possesses the character of high reliability.
A further object of the present invention is to provide a kind of multilayer circuit board fabrication method that is embedded with film resistance, and it forms a film resistance earlier on the relatively flat surface of an insulating barrier, and covers with a conductive layer; Then form via and through hole.And form the electrode and the circuit pattern of this resistor simultaneously.Therefore, not only the size of resistive film can reasonably form, and the strong adherence between patterned conductive layer and insulating barrier still is being held.More particularly, because conductive layer covers the relation of each resistive film, in the process that forms via or through hole, all can not hurt resistive film, and make resistive film keep electrically good.
Above-mentioned purpose of the present invention is achieved in that a kind of method for making stacking type multilayer board that is embedded with resistive element, and its step comprises:
(a) provide a substrate, the one side at least of this substrate has been formed with conductive layer;
(b) remove the described conductive layer of part, to form an open area;
(c) deposit a dielectric film and a resistive film in regular turn in this open area;
(d) form another conductive layer to cover this resistive film;
(e) electrode and the circuit pattern of formation resistive film.
Above-mentioned purpose of the present invention also can realize like this: a kind of method for making stacking type multilayer board that is embedded with resistive element, and its step comprises:
(a) provide a substrate, the one side at least of this substrate has been formed with conductive layer;
(b) form an oxide layer on the surface of this conductive layer;
(c) remove described conductive layer of part and oxide layer, to form an open area;
(d) deposit a dielectric film and a resistive film in regular turn in this open area;
(e) form another conductive layer to cover this resistive film;
(f) form via openings with laser radiation;
(g) form conductive through hole;
(h) electrode and the circuit pattern of formation resistive film.
Above-mentioned purpose perhaps of the present invention can also realize like this: a kind of method for making stacking type multilayer board that is embedded with resistive element, and its step comprises:
(a) provide a substrate, this substrate at least the one side on be formed with conductive layer;
(b) remove the described conductive layer of part, to form an open area;
(c) deposit a dielectric film and a resistive film in regular turn in this open area;
(d) form another conductive layer to cover this resistive film and described conductive layer;
(e) on conductive layer surface, form an oxide layer;
(f) form via openings with laser;
(g) form conductive through hole;
(h) electrode and the circuit pattern of formation resistive film.
The method for making stacking type multilayer board that is embedded with resistive element of the present invention, the surface that does not form this embedded resistive element of this substrate wherein can superimposed other circuit board.
Description of drawings
Fig. 1～Fig. 5 is for being embedded with the schematic diagram of the method for making stacking type multilayer board of film resistance in the embodiment of the invention;
Fig. 6～Figure 11 is for being embedded with the schematic diagram of the method for making stacking type multilayer board of film resistance in another embodiment of the present invention;
Figure 12 is for being embedded with the structural representation of the stacking type multilayer board of film resistance in another embodiment of the present invention.
Embodiment
The invention discloses a kind of multilayer circuit board fabrication method that is embedded with film resistance, according to manufacture method of the present invention, not only the size of resistive film can reasonably form, and the strong adherence between patterned conductive layer and insulating barrier still is being held.Though embodiments of the invention are illustrated with resistor, the present invention is not limited to the resistor manufacture method, so long as the passive device manufacture method is range of application of the present invention.
See also Fig. 1, it is preferred embodiment of the present invention.One organic substrate 1 at first is provided, this substrate 1 can be used as single layer board, the superimposed substrate that stacked multilayer circuit board or inner layer core circuit board are required, this organic substrate 1 is constituted by an organic dielectric material, as epoxy resin (epoxy resin), policapram (polyimide), two butadiene dilute acid acid imides/three nitrogen trap (bismaleimidetriazine-based) resins, hydrocyanic ester (cyanate ester), compositions such as the composite material of polyphenyl and cyclobutane (polybenzocyclobutene) or its glass fiber-reinforced (glass fiber reinforced) or its homologue.On this substrate 1 and/or lower surface be provided with the conductive layer 2 of patternable, this conductive layer 2 is made up of electric conducting material, as metal, conducting polymer (conductive polymer), metal paste (metal paste) or carbon pastes (carbonpaste) etc., and be preferable with metal material, as copper, silver, aluminium etc., and the manufacture method of this formation conductive layer 2 can be finished easily by general technology.Below 20 μ m, the preferably is below 10 μ m usually for the thickness of this conductive layer 2, and the best is between 4～6 μ m.Select the open area 3 on the conductive layer 2, remove the conductive layer part of this open area 3, with zone as follow-up formation resistive film.
See also Fig. 2, a dielectric film 4 and a resistive film 5 can utilize modes such as silk screen process or photoresistance etching, are deposited in the open area 3.Wherein the area of the comparable resistive film 5 of the area of dielectric film 4 is big.Before deposition resistive film 5, described dielectric film 4 can heat earlier or the ultraviolet radiation mode is solidified, and can carry out little alligatoring step to increase the adherence to described resistive film 5 to dielectric film 4.The mode that another embodiment can the photoresistance etching forms dielectric film 4 and resistive film 5 as shown in Figure 3, it is deposition one insulating barrier 6 and a resistive layer 7 earlier, deposits a photoresistance pattern 8 then, this photoresistance pattern 8 is the size of this dielectric film 4 of decision and resistive film 5.After etching step, promptly form as shown in Figure 2 dielectric film 4 and resistive film 5.An embodiment can select to form the mode of dielectric film 4 and resistive film 5 again, be that insulating barrier 6 is light video picture (photoimageable) with resistive layer 7, like this, promptly can general little shadow mode form as shown in Figure 2 dielectric film 4 and resistive film 5, and need not use photoresistance pattern 8.
Wherein said dielectric film 4 is made up of organic material, as compositions such as the composite material of epoxy resin, policapram, two butadiene dilute acid acid imide/three nitrogen traps, hydrocyanic ester, polyphenyl and cyclobutane or particle strengthening or its homologues, and it is preferably liquid condition, as being dissolved in the solvent with monomer or high molecular polymer, the preferably is light video picture resin (photoimageable resin).Described liquid organic material can provide good flat surfaces in deposition process, so that the size of resistive film 5 is obtained control fully.And the method that forms described resistive film 5 includes plating, sputter, roller spin coating or printing etc.This resistive film 5 is made up of nickel chromium triangle (Ni-Cr), nickel phosphorus (Ni-P), nickel tin (Ni-Sn), chromium aluminium (Cr-Al) or titanium nitride (Ta-N) alloy, and forms with electro-deposition or sputter-deposited mode; Or with carbon pastes, silver paste with printing or roller spin coating method deposition, wherein said carbon pastes, silver paste are the material in resin (can be light dominance) with carbon or silver-colored particulate dispersion.Yet above-mentioned print film needed with curing mode it to be solidified earlier before follow-up manufacture method.
Please consult Fig. 4 again, deposit a conductive layer 9 and cover resistive film 5, this conductive layer 9 is a conductive material, as metal, conducting polymer, metal paste or carbon pastes etc.
Then form an electrical guide hole 10, as via.Form electrical weld pad 11 and electrode 12 with this resistive film 5 collocation simultaneously with photolithography techniques, its all generally known technology finish easily.Described conductive layer 9 is as covering this resistive film 5 just like the protective layer effect in the manufacture method that forms guide hole 10.Therefore after etching, the method for making stacking type multilayer board that is embedded with film resistance 13 and guide hole 10 is promptly accused and is finished.
See also Fig. 6, it is an another embodiment of the present invention.One organic substrate 1 at first also is provided, this organic substrate 1 is constituted by an organic dielectric material, as epoxy resin, policapram, two butadiene dilute acid acid imide/three nitrogen trap resins, hydrocyanic ester, polyphenyl and cyclobutane or composition such as glass reinforced composite material or its homologue.On this substrate 1 and/or lower surface be provided with the circuit layer 7 of patternable, this circuit layer 7 is made up of electric conducting material, as metal, conducting polymer, metal paste or carbon pastes etc.Then an insulating barrier 14 and a conductive layer 15 are layered on this organic substrate 1.Described insulating barrier 14 is with roller spin coating, printing or uses insulation paste or use the direct lay-up method general fashions such as (promptly being commonly called as dry process) of preimpregnation material to cover; Wherein said insulating paste 14 is as particle strengthening organic resin of high adhesion etc.Described conductive layer 15 is preferably a metal forming, and as copper or aluminium etc., itself and insulating barrier 14 stacked faying faces are matsurface.And finish that superimposed process can be accompanied by heating, ultraviolet radiation or fixed pressing action and finishing by insulating barrier 14 materials, it is known general pressing technology.The thickness of this conductive layer 15 below 20 μ m, is preferably below 10 μ m usually, and the best is below 6 μ m.
Then see also Fig. 7, described conductive layer 15 is carried out oxidation to form an oxide layer 16, its thickness can be between 1～2 μ m.Choose an open area 17, and the partially conductive layer 15 of this open area 17 is removed with oxide layer 16, form part as follow-up resistive film.
Then form a dielectric film 18 and a resistive film 19, as shown in Figure 8.Described dielectric film 18 covers with resistive film 19 and with a conduction material 20, and this conduction material 20 is metal, carbon pastes, silver paste etc., and the preferably more can be copper or aluminium.It is noted that wherein before deposition resistive film 19, the surface of this dielectric film 18 can be carried out slight alligatoring earlier, is to adopt as physics or chemical roughen etc.Another embodiment also can cover conductive layer 15 and resistive film 19 as electro-coppering with conduction material 20, forms oxide layer 16 again.
See also Fig. 9, an opening 21 is to form with the carbon dioxide laser bore mode.After opening 21 has been cleaned, carry out the so-called slag manufacture method of removing photoresist (desmear process), form a conductive layer 22 again, as metal, carbon pastes, silver paste etc., the preferably more can be copper or aluminium, and via 23 also forms as shown in figure 10.Relend auxiliary by photolithography techniques, finish circuit 24 and electrode 25 with resistive film 19 collocation.Therefore, finish the stacking type multilayer board that is embedded with film resistance 26 and guide hole 27, as shown in figure 11.
Yet, select correctly as the deposition technique that forms conductive layer 22, as the electro-coppering mode, this opening 21 can the complete filling electric conducting material, and becomes the through hole 28 of another form, as shown in figure 12.
And if use neodymium-YBAG ytterbium aluminum garnet (Nd:YAG) laser but not carbon dioxide laser boring formation through hole, just then the step of oxidation formation oxide layer 16 can be omitted.Because the high-octane Nd:YAG laser of tool can not need to drill metal level by oxide layer.
After treating that the aforementioned electric resistance element completes, form an organic insulator and a conductive layer thereon again, repeat above step, can form a lamination that is embedded with resistive element again.In addition, can not form a surface of embedded resistive element at aforesaid base plate yet, superimposed in other circuit board.
Wherein in the manufacture method of similar described resistive element, helical coil also can form in conductive layer 9 or 22, can be used for making inductor whereby.
In sum, the invention discloses a kind of multilayer circuit board fabrication method that has membranaceous passive device, the passive device that the excellent electrically accuracy of tool can be provided is in multilayer circuit board, and provide the size of resistive film between circuit layer reasonably to form, and the strong adherence between patterned conductive layer and insulating barrier is still keeping.
Certainly, the above only is the preferred embodiment that the present invention makes, and is not in order to limiting practical range of the present invention, anyly has the knack of the modification that this operator makes without prejudice to spirit of the present invention, all should belong to scope of the present invention.
Claims (4)
1. method for making stacking type multilayer board that is embedded with resistive element, its step comprises: a substrate (a) is provided, and the one side at least of this substrate has been formed with conductive layer; (b) remove the described conductive layer of part, to form an open area; (c) deposit a dielectric film and a resistive film in regular turn in this open area; (d) form another conductive layer to cover this resistive film; (e) electrode and the circuit pattern of formation resistive film.
2. method for making stacking type multilayer board that is embedded with resistive element, its step comprises: a substrate (a) is provided, and the one side at least of this substrate has been formed with conductive layer; (b) form an oxide layer on the surface of this conductive layer; (c) remove described conductive layer of part and oxide layer, to form an open area; (d) deposit a dielectric film and a resistive film in regular turn in this open area; (e) form another conductive layer to cover this resistive film; (f) form via openings with laser radiation; (g) form conductive through hole; (h) electrode and the circuit pattern of formation resistive film.
3. method for making stacking type multilayer board that is embedded with resistive element, its step comprises: a substrate (a) is provided, this substrate be formed with conductive layer on the one side at least; (b) remove the described conductive layer of part, to form an open area; (c) deposit a dielectric film and a resistive film in regular turn in this open area; (d) form another conductive layer to cover this resistive film and described conductive layer; (e) on conductive layer surface, form an oxide layer; (f) form via openings with laser; (g) form conductive through hole; (h) electrode and the circuit pattern of formation resistive film.
4. as claim 1, the 2 or 3 described method for making stacking type multilayer board that are embedded with resistive element, the surface that does not form this embedded resistive element of this substrate wherein can superimposed other circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02102489 CN1434675A (en) | 2002-01-21 | 2002-01-21 | Method for making stacking type multilayer board with inner embeded film shape resistor element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02102489 CN1434675A (en) | 2002-01-21 | 2002-01-21 | Method for making stacking type multilayer board with inner embeded film shape resistor element |
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| CN1434675A true CN1434675A (en) | 2003-08-06 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781277A (en) * | 2012-10-24 | 2014-05-07 | 昆山华扬电子有限公司 | PCB circuit board structure and manufacturing technology thereof |
| CN104319448A (en) * | 2014-10-24 | 2015-01-28 | 中国电子科技集团公司第四十一研究所 | Multi-layer power distribution network of high-frequency printed boards based on accessory resistive films |
| CN108598259A (en) * | 2018-04-09 | 2018-09-28 | 上海集成电路研发中心有限公司 | A kind of preparation method of film resistor |
| CN113131291A (en) * | 2021-03-11 | 2021-07-16 | 东莞市晟合科技有限公司 | Connecting wire carrying electronic component and manufacturing method thereof |
-
2002
- 2002-01-21 CN CN 02102489 patent/CN1434675A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781277A (en) * | 2012-10-24 | 2014-05-07 | 昆山华扬电子有限公司 | PCB circuit board structure and manufacturing technology thereof |
| CN104319448A (en) * | 2014-10-24 | 2015-01-28 | 中国电子科技集团公司第四十一研究所 | Multi-layer power distribution network of high-frequency printed boards based on accessory resistive films |
| CN108598259A (en) * | 2018-04-09 | 2018-09-28 | 上海集成电路研发中心有限公司 | A kind of preparation method of film resistor |
| CN113131291A (en) * | 2021-03-11 | 2021-07-16 | 东莞市晟合科技有限公司 | Connecting wire carrying electronic component and manufacturing method thereof |
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