CN1195332A - 用于基底携带装置和装载锁定装置的门驱动机构 - Google Patents

用于基底携带装置和装载锁定装置的门驱动机构 Download PDF

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Publication number
CN1195332A
CN1195332A CN96196791A CN96196791A CN1195332A CN 1195332 A CN1195332 A CN 1195332A CN 96196791 A CN96196791 A CN 96196791A CN 96196791 A CN96196791 A CN 96196791A CN 1195332 A CN1195332 A CN 1195332A
Authority
CN
China
Prior art keywords
carrying device
load lock
door
wafer
import
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN96196791A
Other languages
English (en)
Chinese (zh)
Inventor
R·S·慕卡
M·W·皮品斯
M·A·德鲁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/498,859 external-priority patent/US5607276A/en
Priority claimed from US08/498,597 external-priority patent/US5609459A/en
Priority claimed from US08/499,069 external-priority patent/US5613821A/en
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of CN1195332A publication Critical patent/CN1195332A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN96196791A 1995-07-06 1996-07-02 用于基底携带装置和装载锁定装置的门驱动机构 Pending CN1195332A (zh)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US49898795A 1995-07-06 1995-07-06
US08/498,859 US5607276A (en) 1995-07-06 1995-07-06 Batchloader for substrate carrier on load lock
US08/498,597 1995-07-06
US08/498,597 US5609459A (en) 1995-07-06 1995-07-06 Door drive mechanisms for substrate carrier and load lock
US08/499,069 1995-07-06
US08/498,859 1995-07-06
US08/498,987 1995-07-06
US08/499,069 US5613821A (en) 1995-07-06 1995-07-06 Cluster tool batchloader of substrate carrier

Publications (1)

Publication Number Publication Date
CN1195332A true CN1195332A (zh) 1998-10-07

Family

ID=27504398

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96196791A Pending CN1195332A (zh) 1995-07-06 1996-07-02 用于基底携带装置和装载锁定装置的门驱动机构

Country Status (7)

Country Link
EP (1) EP0886617A1 (fr)
JP (1) JP4306798B2 (fr)
KR (1) KR19990028767A (fr)
CN (1) CN1195332A (fr)
AU (1) AU6408996A (fr)
TW (1) TW278200B (fr)
WO (1) WO1997002199A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101986208B (zh) * 2003-03-11 2011-09-28 Asml荷兰有限公司 一种光刻设备中的支承结构
CN102130034B (zh) * 2003-11-12 2013-02-06 周星工程股份有限公司 装载锁及使用其的装载锁腔室
CN109786280A (zh) * 2017-11-14 2019-05-21 台湾积体电路制造股份有限公司 装载设备和其操作方法
CN114777490A (zh) * 2022-06-21 2022-07-22 上海陛通半导体能源科技股份有限公司 可实现自动全向开合的半导体设备

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG47226A1 (en) * 1996-07-12 1998-03-20 Motorola Inc Method and apparatus for transporting and using a semiconductor substrate carrier
US6280134B1 (en) 1997-06-17 2001-08-28 Applied Materials, Inc. Apparatus and method for automated cassette handling
DE19805624A1 (de) * 1998-02-12 1999-09-23 Acr Automation In Cleanroom Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen
US6610150B1 (en) * 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
JP4628530B2 (ja) * 2000-08-25 2011-02-09 株式会社ライト製作所 搬送容器の蓋着脱装置
JP4748816B2 (ja) 2008-11-28 2011-08-17 Ｔｄｋ株式会社 密閉容器の蓋開閉システム
JP5279576B2 (ja) * 2009-03-27 2013-09-04 大日本スクリーン製造株式会社 基板処理装置
JP4919123B2 (ja) 2010-03-08 2012-04-18 Ｔｄｋ株式会社 処理基板収納ポッド及び処理基板収納ポッドの蓋開閉システム
US10741432B2 (en) * 2017-02-06 2020-08-11 Applied Materials, Inc. Systems, apparatus, and methods for a load port door opener
KR102247183B1 (ko) * 2020-05-29 2021-05-04 주식회사 싸이맥스 효율적인 설치면적을 갖는 웨이퍼 공정 장치
KR102200250B1 (ko) * 2020-05-29 2021-01-11 주식회사 싸이맥스 풉 로드락 도어가 구비된 로드포트모듈 및 로드포트모듈 도어와 풉 로드락 도어의 개폐방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4550242A (en) * 1981-10-05 1985-10-29 Tokyo Denshi Kagaku Kabushiki Kaisha Automatic plasma processing device and heat treatment device for batch treatment of workpieces
JPH0461146A (ja) * 1990-06-22 1992-02-27 Mitsubishi Electric Corp 半導体ウエハ移替装置
JPH04206547A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 装置間搬送方法
JP3275390B2 (ja) * 1992-10-06 2002-04-15 神鋼電機株式会社 可搬式密閉コンテナ流通式の自動搬送システム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101986208B (zh) * 2003-03-11 2011-09-28 Asml荷兰有限公司 一种光刻设备中的支承结构
CN102130034B (zh) * 2003-11-12 2013-02-06 周星工程股份有限公司 装载锁及使用其的装载锁腔室
CN109786280A (zh) * 2017-11-14 2019-05-21 台湾积体电路制造股份有限公司 装载设备和其操作方法
CN109786280B (zh) * 2017-11-14 2022-11-15 台湾积体电路制造股份有限公司 装载设备和其操作方法
CN114777490A (zh) * 2022-06-21 2022-07-22 上海陛通半导体能源科技股份有限公司 可实现自动全向开合的半导体设备

Also Published As

Publication number Publication date
KR19990028767A (ko) 1999-04-15
TW278200B (en) 1996-06-11
WO1997002199A1 (fr) 1997-01-23
EP0886617A1 (fr) 1998-12-30
AU6408996A (en) 1997-02-05
JP4306798B2 (ja) 2009-08-05
JPH11513006A (ja) 1999-11-09

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